CN207816146U - Wafer thickness measuring device - Google Patents
Wafer thickness measuring device Download PDFInfo
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- CN207816146U CN207816146U CN201721274721.7U CN201721274721U CN207816146U CN 207816146 U CN207816146 U CN 207816146U CN 201721274721 U CN201721274721 U CN 201721274721U CN 207816146 U CN207816146 U CN 207816146U
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- scale
- frame
- thickness measuring
- wafer thickness
- measuring device
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The utility model is related to a kind of wafer thickness measuring devices, belong to LED sapphire substrate sheet processing technique fields.The utility model includes pedestal, fixed frame and scale frame, and fixed frame and scale frame are vertically fixed on pedestal, and fixed frame is equipped with chip holder, scale is housed on scale frame, scale probe and chip holder are in the same horizontal line；The utility model is by converting traditional point-to-area measurement to point-to-point measurement, the spring in chip holder and scale on vertical rack keeps chip hanging vertically, it is measured by chip holder and the clamping of scale probe, contact portion with chip is all dotted, reduces conventional method error caused by due to surface wear.
Description
Technical field
The utility model is related to a kind of wafer thickness measuring devices, belong to LED sapphire substrate sheet processing technique fields.
Background technology
Third generation semi-conducting material gallium nitride base light emitting semiconductor (LED) is component crucial in dynamic display.
It in the manufacturing process of gallium nitride based LED, needs to carry out epitaxial growth on a sapphire substrate, therefore, obtains accurate sapphire
The thickness parameter of substrate is particularly significant to the homoepitaxial of gallium nitride.
The method for measuring thickness of sapphire substrate wafer is horizontal fixation at present, is by a smooth plane
Chip is placed on the plane by zero, and scale is vertically-mounted above chip, and scale probe leans on gravity fall, is parked in wafer surface,
Wafer thickness is measured, point-to-area measurement method is belonged to.This measurement can make chip when measuring in stable state, but
It is constantly to be worn in use because of the plane as zero, and each dot thickness of chip itself also has different, gently
Micro- deformation can all influence the accuracy measured, so the thickness error measured is larger.
Utility model content
The utility model is that chip is measured traditional point-to-area measurement method to be changed into point-to-point measurement method.It is logical
The spring crossed in chip holder and scale on vertical rack keeps chip hanging vertically, passes through chip holder and scale probe
Clamping measures, and the contact portion with chip is all dotted, reduces conventional method error caused by due to surface wear.
The utility model is related to a kind of wafer thickness measuring devices, including pedestal, fixed frame and scale frame, fixed frame and amount
Dial framework is vertically fixed on pedestal, and fixed frame is equipped with chip holder, and scale is housed on scale frame, and scale probe and chip are protected
Gripping member is in the same horizontal line.Ensure chip being clamped in same point vertically by scale probe and chip holder.
Chip holder rear end is fixed on fixed frame, and front end is bright and clean cambered surface.Ensure chip holder and contact wafers
For point contact.Chip holder can also be bolted with fixed frame.
Chip holder front end is metal balls.Avoid the front end of abrasion chip holder.
Scale includes dial plate and probe, and spring and axle sleeve are cased with successively outside probe.It is cased with spring outside scale probe, spring exists
Axial force can be generated under the reaction force of spring when compression, play the role of resisting chip.Dial plate is connected with axle sleeve.
Scale frame is equipped with mounting hole, and scale axle sleeve is corresponding with mounting hole to be detachably connected.Scale frame can be with scale
Axle sleeve is detachably connected, and can replace scale type as needed.
Scale frame top is equipped with threaded hole, and axle sleeve passes through screw connection with mounting hole.
Scale is electronic dial gauge.Thickness value is more accurately read, measurement result is more accurate.
Metal balls are stainless shot.Chip holder front end is stainless shot, avoids influencing the service life because of metal rusting
And measurement accuracy.
Fixed frame and scale frame are connect with tube chamber welds with base respectively.The loosening because of dismountable connecting component is avoided to cause to fix
The displacement or offset of frame and scale frame, lead to measurement result deviation.
The utility model has the beneficial effects that：
(1) the point-to-area mode of traditional wafer thickness measuring is changed into point-to-point mode by the utility model, more
It accurately determines the thickness between 2 chips of clamping, avoids leading to measured deviation due to the surface wear as zero.
(2) fixed frame and scale frame are welded on pedestal by the utility model, are avoided because the loosening of connecting component causes
Measurement point on a horizontal line, does not influence measurement result.
(3) mounting hole of scale frame is detachably connected with scale axle sleeve, can be needed replacing according to measurement different types of
Scale.
(4) the utility model is more in line with LED sapphire substrate sheet processing technology needs, can be with large batch of quick survey
Amount, reduces unnecessary step, and operation is more convenient, quick.
(5) the utility model can be realized without adding prover and accurately point-to-point be maintained at same level measurement point
On, production cost is reduced, marketing application is conducive to.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the utility model scale probe front structural schematic diagram.
In figure：1. pedestal；2. fixed frame；3. scale frame；4. chip holder；5. dial plate；6. probe；7. axle sleeve；8. bullet
Spring；9. chip；10. operating parts；11. mounting hole；12. threaded hole.
Specific implementation mode
With reference to specific embodiment, the utility model is described in further detail.
As shown in Figs. 1-2, the utility model is related to a kind of wafer thickness measuring devices, including pedestal 1, fixed frame 2 and amount
Dial framework 3, fixed frame 2 and scale frame 3 are vertically welded on pedestal 1, and fixed frame 2 is equipped with chip holder 4, is filled on scale frame 3
There is scale, scale probe 6 and chip holder 4 are in the same horizontal line.4 rear end of chip holder is fixed on fixed frame 2, brilliant
4 front end of piece holder is stainless shot.Scale is electronic dial gauge, including dial plate 5 and probe 6, probe 6 is cased with spring successively outside
8 and axle sleeve 7.Scale frame 3 is equipped with mounting hole 11, and 3 top of scale frame is equipped with threaded hole 12, and scale axle sleeve 7 and mounting hole 11 are right
Answer screw connection.
In use, the type of the chip 9 measured as needed selects suitable scale model.By scale axle sleeve 7
Threaded hole 12 is passed through by screw, coordinates with mounting hole 11 and installs.The operating parts 10 being connected with probe 6 can stretch control probe
6 contraction.6 front end outer side of scale probe is cased with spring 8, and 8 one end of spring is fixedly connected with probe 6, and the other end is solid with axle sleeve 7
Fixed connection.Spring 8 is in compressive state when normal placement, and in pressure of the probe 6 by axial retraction, spring 8 can compress production
The axially extended power of raw confrontation, has the function of clamping.
When measurement, the chip 9 of thickness to be measured is placed between chip holder 4 and scale probe 6, hand control operation
Part 10, the control contact of probe 6 resist chip 9, and at this moment spring 8 is in compressive state, generates pressure axially outward.When probe 6
When ensureing to keep vertical stationary state with 4 common holding chip 9 of chip holder, read the reading on scale dial plate 5 to get to
Desired 9 thickness value of chip, it is easy to operate, improve efficiency.
Claims (8)
1. a kind of wafer thickness measuring device, which is characterized in that including pedestal (1), fixed frame (2) and scale frame (3), fixed frame
(2) it is vertically fixed on pedestal (1) with scale frame (3), fixed frame (2) is equipped with chip holder (4), and scale frame fills on (3)
There is scale, the probe (6) and chip holder (4) of scale are in the same horizontal line；
Chip holder (4) rear end is fixed on fixed frame (2), and front end is bright and clean cambered surface.
2. wafer thickness measuring device according to claim 1, which is characterized in that chip holder (4) front end is
Metal balls.
3. wafer thickness measuring device according to claim 1, which is characterized in that the scale includes dial plate (5) and visits
Needle (6), probe (6) are cased with spring (8) and axle sleeve (7) successively outside.
4. wafer thickness measuring device according to claim 3, which is characterized in that the scale frame (3) is equipped with installation
Hole (11), axle sleeve (7) is corresponding with mounting hole (11) to be detachably connected.
5. wafer thickness measuring device according to claim 4, which is characterized in that scale frame (3) top is equipped with spiral shell
Pit (12), axle sleeve (7) pass through screw connection with mounting hole (11).
6. wafer thickness measuring device according to claim 3, which is characterized in that the scale is electronic dial gauge.
7. wafer thickness measuring device according to claim 2, which is characterized in that the metal balls are stainless shot.
8. wafer thickness measuring device according to claim 1, which is characterized in that the fixed frame (2) and scale frame (3)
It is welded to connect with pedestal (1) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721274721.7U CN207816146U (en) | 2017-09-30 | 2017-09-30 | Wafer thickness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721274721.7U CN207816146U (en) | 2017-09-30 | 2017-09-30 | Wafer thickness measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207816146U true CN207816146U (en) | 2018-09-04 |
Family
ID=63336352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721274721.7U Active CN207816146U (en) | 2017-09-30 | 2017-09-30 | Wafer thickness measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207816146U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114234820A (en) * | 2021-12-08 | 2022-03-25 | 苏州肯美特设备集成有限公司 | Detection device for detecting thickness of semiconductor wafer |
-
2017
- 2017-09-30 CN CN201721274721.7U patent/CN207816146U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114234820A (en) * | 2021-12-08 | 2022-03-25 | 苏州肯美特设备集成有限公司 | Detection device for detecting thickness of semiconductor wafer |
| CN114234820B (en) * | 2021-12-08 | 2024-05-14 | 苏州肯美特设备集成股份有限公司 | Detection device for detecting thickness of semiconductor wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210126 Address after: 266114 no.383 Hedong Road, high tech Zone, Qingdao City, Shandong Province Patentee after: QINGDAO XINJIAXING ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: No.10 torch Branch Road, high tech Zone, Qingdao, Shandong 266114 Patentee before: QINGDAO ISTARWAFER TECHNOLOGY Co.,Ltd. |