CN207783266U - A kind of printed circuit board that can improve conducting efficiency - Google Patents
A kind of printed circuit board that can improve conducting efficiency Download PDFInfo
- Publication number
- CN207783266U CN207783266U CN201820027952.6U CN201820027952U CN207783266U CN 207783266 U CN207783266 U CN 207783266U CN 201820027952 U CN201820027952 U CN 201820027952U CN 207783266 U CN207783266 U CN 207783266U
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- component side
- printed circuit
- hole
- circuit board
- conducting efficiency
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Abstract
The utility model discloses a kind of printed circuit boards that can improve conducting efficiency, including via and component side, the via is through the inside of component side, the lower end outer surface of the via is provided with welding surface, the upper end outer surface of the component side is provided with top layer plurality of copper traces, the lower end outer surface of the component side is provided with inner plating, and the lower end outer surface of the inner plating is provided with bus plane.A kind of printed circuit board that can improve conducting efficiency described in the utility model, equipped with separator, top transmission line, internal transmission line and insulation glue-line, the conductive interference that can be generated in isolation circuit, prevent the signal of wire spread from generating crosstalk effect, and conducting efficiency can be improved, enhance transporting, cap bore can also be prevented incomplete or chemical agent residual and lead to the risk corroded, prevent part and via accidentally short circuit and generate quality problem, it is convenient for people to use, brings better prospect of the application.
Description
Technical field
The utility model is related to art of printed circuit boards, more particularly to a kind of printed circuit board that can improve conducting efficiency.
Background technology
Printed circuit board is important electronic unit, is the supporter of electronic component, is electronic component electrical connection
Carrier, be widely used in every field, develop to two-sided, multilayer and flexibility from single layer, and remain on respective hair
Exhibition trend；There are certain drawbacks when in use in existing printed circuit board, first, the conduction that can not be generated in isolation circuit
Property interference, not can effectively prevent wire spread signal generate crosstalk effect, secondly, conducting efficiency cannot be improved, transporting is not
By force, in addition, cap bore can not be prevented incomplete or chemical agent residual and lead to the risk corroded, part and via cannot be prevented
Accidentally short circuit and generate quality problem, certain influence is brought using process to people, for this purpose, it is proposed that a kind of energy
Improve the printed circuit board of conducting efficiency.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies of existing technologies, and provides a kind of can improve and efficiency is connected
Printed circuit board.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution：
A kind of printed circuit board that can improve conducting efficiency of the utility model, including via and component side, the via pass through
It is through at the inside of component side, the lower end outer surface of the via is provided with welding surface, the upper end outer surface setting of the component side
There are top layer plurality of copper traces, the lower end outer surface of the component side to be provided with inner plating, the lower end outer surface setting of the inner plating
There are bus plane, the lower end of the bus plane to be provided with signals layer, the lower end of the signals layer is provided with prepreg, and described half is solid
The lower end for changing plate is provided with ground plane, and the inside of the bus plane and ground plane is both provided with band-like copper wire, the welding surface
Lower end outer surface is provided with bottom plurality of copper traces, and a side external surface of the band-like copper wire is provided with buried via hole and through-hole, described to bury
Each layer junction of the hole between component side and welding surface, the through-hole be located at component side and welding surface surface and between it is each
Layer junction, the both ends outer surface of the via are both provided with via pad, and the center outer surface of the via is provided with isolation
Disk, the via pad are internally provided with plate through-hole, and the upper end outer surface of the via is provided with top transmission line, and top
Transmission line is located at the inside center of component side, and the center outer surface of the via is provided with internal transmission line, and internal transmission
Line is located at the inside center of signals layer, and the circumferential outer surface of the via pad is provided with insulation glue-line and green paint, and insulate
Glue-line is located at the inside of green paint.
Preferably, the quantity of the via is several groups, and several groups via is through inner layers.
Preferably, the quantity of the buried via hole and through-hole is several groups, is fixed with through-hole by several groups buried via hole between each layer
Connection.
Preferably, the quantity of the separator is several groups, and several groups separator is located at the interior of bus plane and ground plane
Portion.
Preferably, the shape of the top layer plurality of copper traces is band-like, and the shape of the bottom plurality of copper traces is also band-like.
Preferably, the quantity of the band-like copper wire is several groups, and the band-like copper wire of several groups is distributed between each layer.
The advantageous effect that the utility model is reached is：This can improve the printed circuit board of conducting efficiency, pass through setting
Separator, the conductive interference that can be generated in isolation circuit prevent the signal of wire spread from generating crosstalk effect, pass through setting
Top transmission line and internal transmission line, can improve conducting efficiency, enhance transporting, pass through the insulation glue-line of setting, Neng Goufang
Only cap bore is not complete or chemical agent remains and leads to the risk corroded, and prevents part accidentally short-circuit with via and generates quality
Problem, entire printed circuit board arrangement is simple, easy to operate, and the effect used is more preferable relative to traditional approach.
Description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
Novel embodiment for explaining the utility model, does not constitute limitations of the present invention together.In the accompanying drawings：
Fig. 1 is a kind of overall structure diagram for the printed circuit board that can improve conducting efficiency of the utility model；
Fig. 2 is a kind of partial structural diagram for the printed circuit board that can improve conducting efficiency of the utility model；
Fig. 3 is the sectional view of A in a kind of printed circuit board Fig. 2 that can improve conducting efficiency of the utility model；
Fig. 4 is the enlarged drawing of B in a kind of printed circuit board Fig. 2 that can improve conducting efficiency of the utility model.
In figure：1, via；2, component side；3, welding surface；4, top layer plurality of copper traces；5, inner plating；6, bus plane；7, half is solid
Change plate；8, ground plane；9, band-like copper wire；10, bottom plurality of copper traces；11, buried via hole；12, through-hole；13, via pad；14, plate is logical
Hole；15, separator；16, top transmission line；17, internal transmission line；18, signals layer；19, insulate glue-line；20, green paint.
Specific implementation mode
The preferred embodiment of the utility model is illustrated below in conjunction with attached drawing, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Embodiment 1
As shown in Figs 1-4, a kind of printed circuit board that can improve conducting efficiency, including via 1 and component side 2, via 1 pass through
It is through at the inside of component side 2, the lower end outer surface of via 1 is provided with welding surface 3, and the upper end outer surface of component side 2 is provided with top
Layer plurality of copper traces 4, the lower end outer surface of component side 2 are provided with inner plating 5, and the lower end outer surface of inner plating 5 is provided with bus plane
6, the lower end of bus plane 6 is provided with signals layer 18, and the lower end of signals layer 18 is provided with prepreg 7, and the lower end of prepreg 7 is set
It is equipped with ground plane 8, bus plane 6 and the inside of ground plane 8 are both provided with band-like copper wire 9, and the lower end outer surface of welding surface 3 is provided with
Bottom plurality of copper traces 10, a side external surface of band-like copper wire 9 are provided with buried via hole 11 and through-hole 12, buried via hole 11 be located at component side 2 with
Each layer junction between welding surface 3, through-hole 12 be located at component side 2 and 3 surface of welding surface and between each layer junction, via
1 both ends outer surface is both provided with via pad 13, and the center outer surface of via 1 is provided with separator 15, and separator 15 can
The conductive interference generated in isolation circuit prevents the signal of wire spread from generating crosstalk effect, and the inside of via pad 13 is set
It is equipped with plate through-hole 14, the upper end outer surface of via 1 is provided with top transmission line 16, and top transmission line 16 is located at component side 2
At inside center, the center outer surface of via 1 is provided with internal transmission line 17, and internal transmission line 17 is located at the interior of signals layer 18
At portion center, top transmission line 16 and internal transmission line 17 can improve conducting efficiency, enhance transporting, the circumference of via pad 13
Outer surface is provided with insulation glue-line 19 and green paint 20, and the glue-line 19 that insulate is located at the inside of green paint 20, and insulation glue-line 19 can be prevented
Only cap bore is not complete or chemical agent remains and leads to the risk corroded, and prevents part accidentally short-circuit with via and generates quality
Problem.
The quantity of via 1 is several groups, and several groups via 1 is through inner layers；The quantity of buried via hole 11 and through-hole 12
For several groups, it is fixedly connected with through-hole 12 by several groups buried via hole 11 between each layer；The quantity of separator 15 is several groups, and if
Dry group separator 15 is located at the inside of bus plane 6 and ground plane 8；The shape of top layer plurality of copper traces 4 is band-like, bottom plurality of copper traces
10 shape is also band-like；The quantity of band-like copper wire 9 is several groups, and the band-like copper wire of several groups 9 is distributed between each layer.
It should be noted that the utility model is a kind of printed circuit board that can improve conducting efficiency, in use, first,
Element is attached on component side 2, pin is welded on the via pad 13 on welding surface 3 by plate through-hole 14, and pin runs through via 1
It is connect with bus plane 6, signals layer 18, ground plane 8, forms it into an access, top layer plurality of copper traces 4 plays the transmission of connection top
The effect of line 16, inner plating 5 and prepreg 7 play the role of the internal band-like copper wire 9 of isolation and are fixedly connected, buried via hole 11 with lead to
Hole 12 be used for connecting and the two or more layers of turning circuit plate between band-like copper wire 9, separator 15 being capable of isolation circuit
The conductive interference of middle generation prevents the signal of wire spread from generating crosstalk effect, top transmission line 16 and internal transmission line 17
Conducting efficiency can be improved, transporting is enhanced, insulation glue-line 19 can prevent cap bore incomplete or chemical agent residual and lead to corruption
The risk of erosion prevents part accidentally short-circuit with via and generates quality problem, and green paint 20 can also prevent short circuit, more in fact
With.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it still can be with technical scheme described in the above embodiments is modified, or to which part technical characteristic
Carry out equivalent replacement.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of printed circuit board that can improve conducting efficiency, including via (1) and component side (2), it is characterised in that：The mistake
Through the inside of component side (2), the lower end outer surface of the via (1) is provided with welding surface (3), the component side in hole (1)
(2) upper end outer surface is provided with top layer plurality of copper traces (4), and the lower end outer surface of the component side (2) is provided with inner plating
(5), the lower end outer surface of the inner plating (5) is provided with bus plane (6), and the lower end of the bus plane (6) is provided with signals layer
(18), the lower end of the signals layer (18) is provided with prepreg (7), and the lower end of the prepreg (7) is provided with ground plane
(8), the bus plane (6) and the inside of ground plane (8) are both provided with band-like copper wire (9), the lower end appearance of the welding surface (3)
Face is provided with bottom plurality of copper traces (10), and a side external surface of the band-like copper wire (9) is provided with buried via hole (11) and through-hole (12),
The buried via hole (11) is located at each layer junction between component side (2) and welding surface (3), and the through-hole (12) is located at component side
(2) and welding surface (3) surface and between each layer junction, the both ends outer surface of the via (1) is both provided with via pad
(13), the center outer surface of the via (1) is provided with separator (15), and the plate that is internally provided with of the via pad (13) leads to
The upper end outer surface in hole (14), the via (1) is provided with top transmission line (16), and top transmission line (16) is located at component side
(2) inside center, the center outer surface of the via (1) is provided with internal transmission line (17), and internal transmission line (17)
At the inside center of signals layer (18), the circumferential outer surface of the via pad (13) be provided with insulation glue-line (19) with it is green
It paints (20), and the glue-line (19) that insulate is located at the inside of green paint (20).
2. a kind of printed circuit board that can improve conducting efficiency according to claim 1, it is characterised in that：The via
(1) quantity is several groups, and several groups via (1) is through inner layers.
3. a kind of printed circuit board that can improve conducting efficiency according to claim 1, it is characterised in that：The buried via hole
(11) it is several groups with the quantity of through-hole (12), is fixedly connected with through-hole (12) by several groups buried via hole (11) between each layer.
4. a kind of printed circuit board that can improve conducting efficiency according to claim 1, it is characterised in that：The separator
(15) quantity is several groups, and several groups separator (15) is located at the inside of bus plane (6) and ground plane (8).
5. a kind of printed circuit board that can improve conducting efficiency according to claim 1, it is characterised in that：The top layer copper
The shape of film conducting wire (4) is band-like, and the shape of the bottom plurality of copper traces (10) is also band-like.
6. a kind of printed circuit board that can improve conducting efficiency according to claim 1, it is characterised in that：The band-like copper
The quantity of line (9) is several groups, and the band-like copper wire of several groups (9) is distributed between each layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820027952.6U CN207783266U (en) | 2018-01-08 | 2018-01-08 | A kind of printed circuit board that can improve conducting efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820027952.6U CN207783266U (en) | 2018-01-08 | 2018-01-08 | A kind of printed circuit board that can improve conducting efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783266U true CN207783266U (en) | 2018-08-28 |
Family
ID=63223806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820027952.6U Active CN207783266U (en) | 2018-01-08 | 2018-01-08 | A kind of printed circuit board that can improve conducting efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783266U (en) |
-
2018
- 2018-01-08 CN CN201820027952.6U patent/CN207783266U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191225 Address after: 215000 room 2, No.26, Shanpu West Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshan Weiya Intelligent Technology Co., Ltd Address before: 215300 room 4, 26 Shan Pu Road, Kunshan, Suzhou, Jiangsu. Patentee before: Kunshan weya Electronic Technology Co., Ltd. |