CN207783247U - One kind can improve the unmatched lamination HDI wiring boards of characteristic impedance - Google Patents
One kind can improve the unmatched lamination HDI wiring boards of characteristic impedance Download PDFInfo
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- CN207783247U CN207783247U CN201721538341.XU CN201721538341U CN207783247U CN 207783247 U CN207783247 U CN 207783247U CN 201721538341 U CN201721538341 U CN 201721538341U CN 207783247 U CN207783247 U CN 207783247U
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Abstract
The utility model discloses one kind can improving the unmatched lamination HDI wiring boards of characteristic impedance, belongs to wiring board art.Including the first signals layer and second signal layer, the first protrusion is arranged in first signals layer, second signal layer corresponds to the second protrusion of setting at first protrusion, third signals layer corresponds to setting third protrusion at second protrusion, first insulating layer is set between the first signals layer and second signal layer, first earth conductor is set in the first insulating layer, second insulating layer is set between second signal layer and third signals layer, second earth conductor is set in second insulating layer, it is electrically connected by conductive hole between first earth conductor and the second earth conductor, first earth conductor is connected with ground plane, and then it can be effectively improved because characteristic impedance mismatches the harmful effects such as the distorted signals brought.
Description
Technical field
The utility model is related to wiring board arts, more particularly to one kind can improve the unmatched lamination of characteristic impedance
HDI wiring boards.
Background technology
As the equipment such as smart mobile phone, tablet computer popularity rate constantly increases, functions of the equipments are stronger and stronger, overall volume
More and more frivolous, power consumption ideas of energy-saving becomes more and more popular, this makes relatively limited pcb board need to carry more electronics members
Part, common PCB production technologies have been difficult to meet the needs of era development, and HDI wiring board technologies come into being.
However, with the improvement of living standards, people are in vision, the sense of hearing etc., more stringent requirements are proposed.This is just needed
Want HDI wiring boards can be undistorted in signal transmission.And characteristic impedance mismatches, then can form reflection, energy transmission is only
It goes, reduces efficiency；Standing wave can be formed on the transmission line, and the effective power capacity of transmission line is caused to reduce；Power emission is not gone out,
Transmitting equipment even can be damaged.When being mismatched with load impedance if it is the HW High Way on circuit board, concussion, spoke will produce
Blackberry lily is disturbed.
In conclusion solving the problems, such as that the impedance mismatch of lamination HDI wiring boards is more and more important, therefore, it is necessary to design
The unmatched lamination HDI wiring boards of characteristic impedance can be improved.
Utility model content
In order to overcome the deficiencies of existing technologies, the technical problem to be solved by the utility model is to propose that one kind can improve
The unmatched lamination HDI wiring boards of characteristic impedance, the utility model in the first signals layer by being arranged the first protrusion, the second letter
Number floor corresponds to the second protrusion of setting at first protrusion, and third signals layer, which corresponds to, is arranged third at second protrusion
Protrusion is arranged the first insulating layer, the first earth conductor is arranged in the first insulating layer between the first signals layer and second signal layer,
Second insulating layer is set between second signal layer and third signals layer, the second earth conductor is set in second insulating layer, first connects
It is electrically connected by conductive hole between earthed conductor and the second earth conductor, the first earth conductor is connected with ground plane, and then can be had
Effect improves because characteristic impedance mismatches the harmful effects such as the distorted signals brought.
For this purpose, the utility model uses following technical scheme：
The utility model, which provides one kind, can improve the unmatched lamination HDI wiring boards of characteristic impedance, including ground plane,
One signals layer, the first insulating layer, second signal layer, second insulating layer and third signals layer；
First signals layer is located above the ground plane, and the upper surface of first signals layer has the first protrusion
Portion；
First insulating layer is located above first signals layer, and first insulating layer corresponds to first protrusion
The position in portion opens up fluted；
The second signal layer is located above first insulating layer, and the upper and lower surface of the second signal layer all has
Second protrusion, second protrusion are corresponding with the position of the first protrusion；
The second insulating layer is located above the second signal layer, and the second insulating layer corresponds to second protrusion
The position in portion opens up fluted；
The third signals layer, is located at the top of the second insulating layer, and the lower surface of the third signals layer has the
The position of three protrusions, the third protrusion is corresponding with the position for stating the second protrusion；
First insulating layer is internally provided with the first earth conductor；
The second insulating layer is internally provided with the second earth conductor；
It is equipped with the first conductive hole between first earth conductor and second earth conductor to be electrically connected, described first leads
Metal is coated on electric hole；
It is equipped with the second conductive hole between first earth conductor and the ground plane to be electrically connected, on second conductive hole
Coated with metal.
Optionally, first protruding parts is in the both ends of first signals layer upper surface, and first protrusion
Cross section be rectangle；
Second protruding parts is in the second signal layer both ends upper and lower surfaces of, and the cross of second protrusion
Section is rectangle, and the width of second protrusion is as the width of first protrusion；
The third protruding parts is in the both ends of third signals layer lower surface, and the cross section of the third protrusion
For rectangle, the width of the third protrusion is as the width of second protrusion.
Optionally, first earth conductor is located at first signals layer and the second signal layer in the vertical direction
Between centre position, first earth conductor in the horizontal direction be located at left and right two first protrusions centre
Position, and the projection of first earth conductor will not be fallen on first protrusion；
Second earth conductor is in the vertical direction between the second signal layer and the third signals layer
Centre position, second earth conductor are located at the interposition of described two second protrusions on same surface in the horizontal direction
It sets, and the projection of second earth conductor will not be fallen on second protrusion；
First conductive hole is located at the left end of first earth conductor, runs through the second signal layer, and partly
In first insulating layer and the second insulating layer；
Second conductive hole is located at the right side of first conductive hole, is connect through first signals layer and described first
Stratum, and partial it is located at the interior of first insulating layer.
Optionally, first conductive hole is circle, and inner surface is coated with conducting resinl.
Optionally, second conductive hole is circle, and inner surface is coated with conducting resinl.
Optionally, first earth conductor is the thin metallic plate of rectangle, is embedded in the second insulating layer；
Second earth conductor is the thin metallic plate of rectangle, is embedded in first insulating layer.
Optionally, first signals layer corresponds to the position of second conductive hole and offers first through hole, and described first
Through-hole surfaces are equipped with the first insulation wall, and the surface of first insulation wall is equipped with the first conductive wall；
The position that the second signal layer corresponds to first conductive hole offers the second through-hole, second through-hole surfaces
Equipped with the second insulation wall, the surface of second insulation wall is equipped with the second conductive wall.
Optionally, first insulation wall and second insulation wall are formed by filling insulating cement, and described first leads
Electric wall and second conductive wall are formed by filling conducting resinl.
Optionally, first signals layer and the second signal layer are differential signal layer.
Optionally, first insulating layer and the material of the second insulating layer are glass fibre.
The beneficial effects of the utility model are：
One kind provided by the utility model can improve the unmatched lamination HDI wiring boards of characteristic impedance, and the utility model is logical
It crosses and the first protrusion is set in the first signals layer, second signal layer corresponds to the second protrusion of setting at first protrusion, the
Three signals layers correspond to setting third protrusion at second protrusion, are arranged first between the first signals layer and second signal layer
Insulating layer, the first insulating layer is interior to be arranged the first earth conductor, and second insulating layer is arranged between second signal layer and third signals layer,
Second earth conductor is set in second insulating layer, is electrically connected by conductive hole between the first earth conductor and the second earth conductor,
First earth conductor is connected with ground plane, and then can be effectively improved because distorted signals that characteristic impedance mismatch is brought etc. is bad
It influences.
Description of the drawings
Fig. 1, which is one kind that specific embodiment of the present invention provides, can improve the unmatched lamination HDI lines of characteristic impedance
The structural schematic diagram of road plate；
Fig. 2, which is one kind that specific embodiment of the present invention provides, can improve the unmatched lamination HDI lines of characteristic impedance
Partial enlarged view at first conductive hole of road plate；
Fig. 3, which is one kind that specific embodiment of the present invention provides, can improve the unmatched lamination HDI lines of characteristic impedance
Partial enlarged view at second conductive hole of road plate.
In figure：
1, ground plane；2, the first signals layer；21, the first protrusion；22, first through hole；221, the first insulation wall；222,
One conductive wall；3, the first insulating layer；4, second signal layer；41, the second protrusion；42, the second through-hole；421, the first insulation wall；
422, the first conductive wall；5, second insulating layer；6, third signals layer；61, third protrusion；7, the first earth conductor；8, second
Earth conductor；9, the first conductive hole；10, the second conductive hole.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Show to Fig. 1 exemplaries that one kind provided by the utility model can improve the unmatched lamination HDI lines of characteristic impedance
The structural schematic diagram of road plate, as shown in Figure 1, one kind can improve the unmatched lamination HDI wiring boards of characteristic impedance, including ground connection
The 1, first signals layer 2 of layer, the first insulating layer 3, second signal layer 4, second insulating layer 5 and third signals layer 6；
First signals layer 2, is located at 1 top of the ground plane, and the upper surface of first signals layer 2 has the first protrusion
21, the first insulating layer 3 is located at first signals layer, 2 top, and first insulating layer 3 corresponds to first protrusion 21
Position opens up fluted, second signal layer 4, is located at first insulating layer, 3 top, the upper and lower surface of the second signal layer 4
The second protrusion 41 is all had, second protrusion 41 is corresponding with the position of first protrusion 21, second insulating layer 5,
Above the second signal layer 4, the second insulating layer 5 correspond to second protrusion 41 position open up it is fluted,
Third signals layer 6, is located at the top of the second insulating layer 5, and the lower surface of the third signals layer 6 has third protrusion
61, the position of the third protrusion 61 is corresponding with the position for stating the second protrusion 41, and first insulating layer 3 is internally provided with
One earth conductor 7, the second insulating layer 5 are internally provided with the second earth conductor 8, first earth conductor 7 and described second
It is equipped with the first conductive hole 9 between earth conductor 8 to be electrically connected, metal is coated on first conductive hole 9 and realizes conduction, it is described
It is equipped with the second conductive hole 10 between first earth conductor 7 and the ground plane 1 to be electrically connected, is coated on second conductive hole 10
Metal is realized conductive.
When signal is when signals layer transmits, using generated parasitic capacitance between the protrusion and insulating layer of signals layer
Effect is come the unmatched phenomenon of characteristic impedance that improves signal layer conductor.
First earth conductor 7 is connect with the ground plane 1, then constitutes matching capacitance with first signals layer 2, from
And improve the unmatched problem of characteristic impedance.
Optionally, first protrusion 21 is located at the both ends of 2 upper surface of the first signals layer, and first protrusion
The cross section in portion 21 is rectangle, and second protrusion 41 is located at 4 both ends upper and lower surfaces of of the second signal layer, and institute
The cross section for stating the second protrusion 41 is rectangle, the width of the width of second protrusion 41 and first protrusion 21
Equally, the third protrusion 61 is located at the both ends of 6 lower surface of third signals layer, and the third protrusion 61 is transversal
Face is rectangle, and the width of the third protrusion 61 is as the width of second protrusion 41.
Optionally, first earth conductor 7 is located at first signals layer 2 and the second signal in the vertical direction
Centre position between layer 4, first earth conductor 7 are located at left and right two first protrusions 21 in the horizontal direction
Centre position, and the projection of first earth conductor 7 will not be fallen on first protrusion 21,
Second earth conductor 8 is in the vertical direction between the second signal layer 4 and the third signals layer 6
Centre position, second earth conductor 8 is located at described two second protrusions 41 on same surface in the horizontal direction
Centre position, and the projection of second earth conductor 8 will not be fallen on second protrusion 41, first conductive hole 9
Positioned at the left end of first earth conductor 7, run through the second signal layer 4, and be positioned partially at 3 He of the first insulating layer
In the second insulating layer 5, second conductive hole 10 is located at the right side of first conductive hole 9, runs through first signal
Layer 2 and first ground plane 1, and partial it is located at the interior of first insulating layer 3.
Optionally, first conductive hole 9 is circle, and inner surface is coated with conducting resinl.
Optionally, second conductive hole 10 is circle, and inner surface is coated with conducting resinl.
Optionally, first earth conductor 7 is the thin metallic plate of rectangle, is embedded in the second insulating layer 5,
Second earth conductor 8 is the thin metallic plate of rectangle, is embedded in first insulating layer 3.
Optionally, first signals layer 2 and the second signal layer 4 are differential signal layer, and differential signal has stronger
Do electromagnetic interference performance.
Optionally, first insulating layer 3 and the material of the second insulating layer 5 are glass fibre.
Fig. 2, which is one kind that specific embodiment of the present invention provides, can improve the unmatched lamination HDI lines of characteristic impedance
Partial enlarged view at first conductive hole 9 of road plate；As shown in Fig. 2, the second signal layer 4 corresponds to first conductive hole 9
Position offer the second through-hole 42,42 surface of the second through-hole is equipped with the second insulation wall 421, second insulation wall 421
Surface be equipped with the second conductive wall 422.
Fig. 3, which is one kind that specific embodiment of the present invention provides, can improve the unmatched lamination HDI lines of characteristic impedance
Partial enlarged view at second conductive hole of road plate, as shown in figure 3, first signals layer 2 corresponds to second conductive hole 10
Position offer first through hole 22,22 surface of the first through hole is equipped with the first insulation wall 221, first insulation wall 221
Surface be equipped with the first conductive wall 222；
Optionally, first insulation wall 221 and second insulation wall 421 are formed by filling insulating cement, described
First conductive wall 222 and second conductive wall 422 are formed by filling conducting resinl.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case of with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (10)
1. one kind can improve the unmatched lamination HDI wiring boards of characteristic impedance, including ground plane (1), the first signals layer (2),
One insulating layer (3), second signal layer (4), second insulating layer (5) and third signals layer (6)；
It is characterized in that：
First signals layer (2) is located above the ground plane (1), and the upper surface of first signals layer (2) has first
Protrusion (21)；
First insulating layer (3) is located above first signals layer (2), first insulating layer (3) corresponding described first
The position of protrusion (21) opens up fluted；
The second signal layer (4) is located above first insulating layer (3), and the upper and lower surface of the second signal layer (4) is equal
With the second protrusion (41), second protrusion (41) is corresponding with the position of the first protrusion (21)；
The second insulating layer (5) is located above the second signal layer (4), the second insulating layer (5) corresponding described second
The position of protrusion (41) opens up fluted；
The third signals layer (6) is located at the top of the second insulating layer (5), the following table mask of the third signals layer (6)
There are third protrusion (61), the position of the third protrusion (61) corresponding with the position for stating the second protrusion (41)；
First insulating layer (3) is internally provided with the first earth conductor (7)；
The second insulating layer (5) is internally provided with the second earth conductor (8)；
The first conductive hole (9) is equipped between first earth conductor (7) and second earth conductor (8) to be electrically connected, it is described
Metal is coated on first conductive hole (9)；
It is equipped with the second conductive hole (10) between first earth conductor (7) and the ground plane (1) to be electrically connected, described second leads
Metal is coated on electric hole (10).
2. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
First protrusion (21) is located at the both ends of the first signals layer (2) upper surface, and first protrusion (21)
Cross section be rectangle；
Second protrusion (41) is located at the second signal layer (4) both ends upper and lower surfaces of, and second protrusion
(41) cross section is rectangle, and the width of second protrusion (41) is as the width of first protrusion (21)；
The third protrusion (61) is located at the both ends of third signals layer (6) lower surface, and the third protrusion (61)
Cross section be rectangle, the width of the third protrusion (61) is as the width of second protrusion (41).
3. one kind as claimed in claim 2 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
First earth conductor (7) be located in the vertical direction first signals layer (2) and the second signal layer (4) it
Between centre position, first earth conductor (7) is located at left and right two first protrusions (21) in the horizontal direction
Centre position, and the projection of first earth conductor (7) will not be fallen on first protrusion (21)；
Second earth conductor (8) be located in the vertical direction the second signal layer (4) and the third signals layer (6) it
Between centre position, second earth conductor (8) in the horizontal direction be located at same surface described two second protrusions
(41) centre position, and the projection of second earth conductor (8) will not be fallen on second protrusion (41)；
First conductive hole (9) is located at the left end of first earth conductor (7), runs through the second signal layer (4), and portion
Ground is divided to be located in first insulating layer (3) and the second insulating layer (5)；
Second conductive hole (10) is located at the right side of first conductive hole (9), through first signals layer (2) and described
First ground plane (1), and partial it is located at the interior of first insulating layer (3).
4. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
First conductive hole (9) is circle, and inner surface is coated with conducting resinl.
5. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
Second conductive hole (10) is circle, and inner surface is coated with conducting resinl.
6. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
First earth conductor (7) is the thin metallic plate of rectangle, is embedded in the second insulating layer (5)；
Second earth conductor (8) is the thin metallic plate of rectangle, is embedded in first insulating layer (3).
7. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
The position of corresponding second conductive hole (10) of first signals layer (2) offers first through hole (22), and described first
Through-hole (22) surface is equipped with the first insulation wall (221), and the surface of first insulation wall (221) is equipped with the first conductive wall (222)；
The position of corresponding first conductive hole (9) of the second signal layer (4) offers the second through-hole (42), and described second is logical
Hole (42) surface is equipped with the second insulation wall (421), and the surface of second insulation wall (421) is equipped with the second conductive wall (422).
8. one kind as claimed in claim 7 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
First insulation wall (221) and second insulation wall (421) are formed by filling insulating cement, and described first is conductive
Wall (222) and second conductive wall (422) are formed by filling conducting resinl.
9. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
First signals layer (2) and the second signal layer (4) are differential signal layer.
10. one kind as described in claim 1 can improve the unmatched lamination HDI wiring boards of characteristic impedance, it is characterised in that：
The material of first insulating layer (3) and the second insulating layer (5) is glass fibre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721538341.XU CN207783247U (en) | 2017-11-16 | 2017-11-16 | One kind can improve the unmatched lamination HDI wiring boards of characteristic impedance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721538341.XU CN207783247U (en) | 2017-11-16 | 2017-11-16 | One kind can improve the unmatched lamination HDI wiring boards of characteristic impedance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783247U true CN207783247U (en) | 2018-08-28 |
Family
ID=63233399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721538341.XU Active CN207783247U (en) | 2017-11-16 | 2017-11-16 | One kind can improve the unmatched lamination HDI wiring boards of characteristic impedance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783247U (en) |
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2017
- 2017-11-16 CN CN201721538341.XU patent/CN207783247U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A multilayer HDI circuit board with improved characteristic impedance mismatch Effective date of registration: 20210120 Granted publication date: 20180828 Pledgee: Bank of Communications Ltd. Ji'an branch Pledgor: JIANGXI JINGCHAO TECHNOLOGY Co.,Ltd. Registration number: Y2021360000002 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220127 Granted publication date: 20180828 Pledgee: Bank of Communications Ltd. Ji'an branch Pledgor: JIANGXI JINGCHAO TECHNOLOGY CO.,LTD. Registration number: Y2021360000002 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |