CN207770129U - A kind of resin glue spray equipment of semiconductor components and devices packaging technology section - Google Patents
A kind of resin glue spray equipment of semiconductor components and devices packaging technology section Download PDFInfo
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- CN207770129U CN207770129U CN201721884845.7U CN201721884845U CN207770129U CN 207770129 U CN207770129 U CN 207770129U CN 201721884845 U CN201721884845 U CN 201721884845U CN 207770129 U CN207770129 U CN 207770129U
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- resin glue
- spot printing
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- printing needle
- needle
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Abstract
The utility model is related to a kind of resin glue spray equipments of semiconductor components and devices packaging technology section, including resin glue spot printing needle, and are set to resin glue storage barrel and high-pressure pump at the top of resin glue spot printing needle；Metering-type resin glue transfer valve is set on the transfer pipeline between resin glue storage barrel and resin glue spot printing needle, resin glue storage barrel and metering-type resin glue transfer valve and between pipeline on booster pump is set；The utility model helps to improve resin glue efficiency, ensures point resin glue precision, so that the resin glue of spot printing is placed in chip and accepts the corresponding point of substrate, avoids the occurrence of leakage resin glue and resin glue spot printing position shift phenomenon, improve packaging efficiency.
Description
Technical field
The utility model is related to semiconductor components and devices encapsulation technology fields, especially encapsulate work with a kind of semiconductor components and devices
The resin glue spray equipment of skill section is related.
Background technology
Semiconductor components and devices packaging technology section needs to accept carrying out pinpointing glue of resinizing on substrate in chip, to complete
Chip and the bonding for accepting substrate, to ensure that epoxide-resin glue is combined closely with plastic-sealed body and chip, the prior art is being determined
When spot printing resin glue, artificial spot printing, inefficiency are relied on mostly, and be susceptible to leak source and shift phenomenon, affect encapsulation effect
Rate.
Utility model content
The utility model provides a kind of resin glue spray equipment of semiconductor components and devices packaging technology section, improves resin glue point
Efficiency is applied, ensures resin glue spot printing precision, so that the resin glue of spot printing is placed in chip and accepts the corresponding point of substrate, avoid the occurrence of
Leak source and shift phenomenon improve packaging efficiency.
In order to realize the purpose of this utility model, intend using following technical scheme：
A kind of resin glue spray equipment of semiconductor components and devices packaging technology section, including resin glue spot printing needle（1）, Yi Jishe
It is placed in resin glue spot printing needle（1）The resin glue storage barrel at top（2）And high-pressure pump（3）；The resin glue storage barrel（2）With tree
Fat glue point applies needle（1）Between transfer pipeline on be arranged metering-type resin glue transfer valve（210）, resin glue storage barrel（2）With meter
Amount formula resin glue transfer valve（210）Booster pump is set on pipeline between（21）；
The resin glue storage barrel（2）It is internally provided with vertical agitating shaft（201）, resin glue storage barrel（2）Top is arranged
It is useful for driving vertical agitating shaft（201）The driving motor of rotation（202）, resin glue storage barrel（2）Bottom is provided with honeycomb fashion
Electrical heating pipe sleeve（203）；
The high-pressure pump（3）With resin glue spot printing needle（1）Between gas transmission official road on be provided with pneumatic operated valve（31）, pneumatically
Valve（31）External pneumatic operated valve control switch（310）；
The resin glue spot printing needle（1）Underface setting to chip for accepting substrate（100）It carries out and accepts and transfer
Positioning plate（4）, positioning plate（4）On be provided with for accepting the substrate fitting groove that is assembled of substrate to chip（41）, positioning
Plate（4）It is assemblied in piston type pneumatic push rod（5）On；Chip accepts substrate（100）On be provided with resin glue spot printing position（1001）；
The substrate fitting groove（41）With resin glue spot printing needle（1）Just it is oppositely arranged；
The resin glue spot printing needle（1）It is laid in array, the resin glue spot printing needle that array is laid（1）It is accepted with chip
Substrate（100）The resin glue spot printing position of upper setting（1001）It corresponds；
The positioning plate（4）Right-hand end set-point resin glue substrate input terminal conveyer belt（6）, positioning plate（4）Left-hand end is set
Set a resin glue substrate output end conveyer belt（7）；
The piston type pneumatic push rod（5）It is assemblied in pedestal（10）On, pedestal（10）On be additionally provided with PLC controller（8）,
PLC controller（8）It controls and switchs with pneumatic operated valve（310）, booster pump（21）And piston type pneumatic push rod（5）It is separately connected.
Further, the high-pressure pump（3）Box electric heating chamber is arranged in lower section（9）, metering-type resin glue transfer valve
（210）, pneumatic operated valve（31）, pneumatic operated valve control switch（310）And resin glue spot printing needle（1）It is placed in box electric heating chamber（9）It is interior
Portion, resin glue spot printing needle（1）The point resin glue mouth of bottom end passes through box electric heating chamber（9）Bottom face extends downwardly 2 ~ 3cm high
Degree.
Further, the positioning plate（4）Removably it is assemblied in piston type pneumatic push rod（5）On.
The utility model has the beneficial effects that：
1, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, resin glue storage barrel
（2）It is internally provided with vertical agitating shaft（201）, resin glue storage barrel（2）Top is provided with for driving vertical agitating shaft（201）
The driving motor of rotation（202）, resin glue storage barrel（2）Bottom is provided with cellular electrical heating pipe sleeve（203）；Above-mentioned design,
Contribute to resin glue via resin glue storage barrel（2）Smooth output improves the continuity of resin glue conveying.
2, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, including resin glue point
Apply needle（1）, and it is set to resin glue spot printing needle（1）The resin glue storage barrel at top（2）And high-pressure pump（3）；Resin glue stores up
Deposit bucket（2）With resin glue spot printing needle（1）Between transfer pipeline on be arranged metering-type resin glue transfer valve（210）, resin glue storage
Deposit bucket（2）With metering-type resin glue transfer valve（210）Booster pump is set on pipeline between（21）；Above-mentioned design, using tree
Fat glue storage barrel（2）, booster pump（21）And metering-type resin glue transfer valve（210）With resin glue spot printing needle（1）It is used cooperatively, it is real
The quantitative output for having showed resin glue improves an accuracy for resin glue process section resin glue dosage.
3, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, high-pressure pump（3）
With resin glue spot printing needle（1）Between gas transmission official road on be provided with pneumatic operated valve（31）, pneumatic operated valve（31）External pneumatic operated valve control is opened
It closes（310）；Above-mentioned design, using high-pressure pump（3）, pneumatic operated valve（31）And pneumatic operated valve control switch（310）With resin glue spot printing
Needle（1）Cooperation, contribute to enter resin glue spot printing needle（1）In resin glue be thoroughly discharged, improve a resin glue amount
Precision keeps the actual point resin glue amount of resin glue consistent with design value, ensures packaging effect.
4, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, resin glue spot printing needle
（1）Underface setting to chip for accepting substrate（100）The positioning plate for carrying out and accepting and transferring（4）, positioning plate（4）On set
It is equipped with for accepting the substrate fitting groove that substrate is assembled to chip（41）, positioning plate（4）It is assemblied in piston type pneumatic push rod
（5）On；Chip accepts substrate（100）On be provided with resin glue spot printing position（1001）；Substrate fitting groove（41）With resin glue spot printing
Needle（1）Just it is oppositely arranged；Resin glue spot printing needle（1）It is laid in array, the resin glue spot printing needle that array is laid（1）With chip
Accept substrate（100）The resin glue spot printing position of upper setting（1001）It corresponds；Above-mentioned design, convenient for improving resin glue point resin
The precision of glue avoids the occurrence of leakage resin glue and resin glue spot printing position shift phenomenon.
5, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, positioning plate（4）It is right
Side set-point resin glue substrate input terminal conveyer belt（6）, positioning plate（4）The resin glue substrate output end conveying of left-hand end set-point
Band（7）；Above-mentioned design, during putting resin glue, entire chip accepts substrate（100）It is realized, is improved by transmission belt
Point resin glue efficiency.
6, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, piston type pneumatic pushes away
Bar（5）It is assemblied in pedestal（10）On, pedestal（10）On be additionally provided with PLC controller（8）, PLC controller（8）It is controlled with pneumatic operated valve
Switch（310）, booster pump（21）And piston type pneumatic push rod（5）It is separately connected；Above-mentioned design, convenient for entirely putting resin glue work
Skill carries out intelligent control, improves point resin glue efficiency, ensures point resin glue precision, the resin glue of spot printing is made to be placed in chip undertaking
The corresponding point of substrate avoids the occurrence of leakage resin glue and resin glue spot printing position shift phenomenon, improves packaging efficiency.
7, the utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, high-pressure pump（3）
Box electric heating chamber is arranged in lower section（9）, metering-type resin glue transfer valve（210）, pneumatic operated valve（31）, pneumatic operated valve control switch
（310）And resin glue spot printing needle（1）It is placed in box electric heating chamber（9）Inside, resin glue spot printing needle（1）The point resin of bottom end
Jiao Zui passes through box electric heating chamber（9）Bottom face extends downwardly 2 ~ 3cm height；Above-mentioned design can effectively avoid resin glue in point
It is applied to resin glue spot printing position（1001）Condensation phenomenon, the smoothness of holding point resin glue occur before.
Description of the drawings
Fig. 1 shows the structural representation of the resin glue spray equipment of the utility model semiconductor components and devices packaging technology section
Figure.
Specific implementation mode
As shown in Figure 1, a kind of resin glue spray equipment of semiconductor components and devices packaging technology section, including resin glue spot printing needle
（1）, and it is set to resin glue spot printing needle（1）The resin glue storage barrel at top（2）And high-pressure pump（3）；The resin glue storage
Deposit bucket（2）With resin glue spot printing needle（1）Between transfer pipeline on be arranged metering-type resin glue transfer valve（210）, resin glue storage
Deposit bucket（2）With metering-type resin glue transfer valve（210）Booster pump is set on pipeline between（21）；
The resin glue storage barrel（2）It is internally provided with vertical agitating shaft（201）, resin glue storage barrel（2）Top is arranged
It is useful for driving vertical agitating shaft（201）The driving motor of rotation（202）, resin glue storage barrel（2）Bottom is provided with honeycomb fashion
Electrical heating pipe sleeve（203）；
The high-pressure pump（3）With resin glue spot printing needle（1）Between gas transmission official road on be provided with pneumatic operated valve（31）, pneumatically
Valve（31）External pneumatic operated valve control switch（310）；
The resin glue spot printing needle（1）Underface setting to chip for accepting substrate（100）It carries out and accepts and transfer
Positioning plate（4）, positioning plate（4）On be provided with for accepting the substrate fitting groove that is assembled of substrate to chip（41）, positioning
Plate（4）It is assemblied in piston type pneumatic push rod（5）On；Chip accepts substrate（100）On be provided with resin glue spot printing position（1001）；
The substrate fitting groove（41）With resin glue spot printing needle（1）Just it is oppositely arranged；
The resin glue spot printing needle（1）It is laid in array, the resin glue spot printing needle that array is laid（1）It is accepted with chip
Substrate（100）The resin glue spot printing position of upper setting（1001）It corresponds；
The positioning plate（4）Right-hand end set-point resin glue substrate input terminal conveyer belt（6）, positioning plate（4）Left-hand end is set
Set a resin glue substrate output end conveyer belt（7）；
The piston type pneumatic push rod（5）It is assemblied in pedestal（10）On, pedestal（10）On be additionally provided with PLC controller（8）,
PLC controller（8）It controls and switchs with pneumatic operated valve（310）, booster pump（21）And piston type pneumatic push rod（5）It is separately connected.
Further, the high-pressure pump（3）Box electric heating chamber is arranged in lower section（9）, metering-type resin glue transfer valve
（210）, pneumatic operated valve（31）, pneumatic operated valve control switch（310）And resin glue spot printing needle（1）It is placed in box electric heating chamber（9）It is interior
Portion, resin glue spot printing needle（1）The point resin glue mouth of bottom end passes through box electric heating chamber（9）Bottom face extends downwardly 2 ~ 3cm high
Degree.
Further, the positioning plate（4）Removably it is assemblied in piston type pneumatic push rod（5）On.
Compared with prior art, the utility model is related to semiconductor components and devices packaging technology section resin glue spray dress
It sets, resin glue storage barrel（2）It is internally provided with vertical agitating shaft（201）, resin glue storage barrel（2）Top is provided with for driving
Vertical agitating shaft（201）The driving motor of rotation（202）, resin glue storage barrel（2）Bottom is provided with cellular electrical heating pipe sleeve
（203）；Above-mentioned design, increased honeycomb fashion electrical heating pipe sleeve（203）Help that resin glue is maintained to be in fluid state, contributes to
Resin glue is via resin glue storage barrel（2）Smooth output improves the continuity of resin glue conveying.
The utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, including resin glue spot printing
Needle（1）, and it is set to resin glue spot printing needle（1）The resin glue storage barrel at top（2）And high-pressure pump（3）；Resin glue stores
Bucket（2）With resin glue spot printing needle（1）Between transfer pipeline on be arranged metering-type resin glue transfer valve（210）, resin glue storage
Bucket（2）With metering-type resin glue transfer valve（210）Booster pump is set on pipeline between（21）；Above-mentioned design, using resin
Glue storage barrel（2）, booster pump（21）And metering-type resin glue transfer valve（210）With resin glue spot printing needle（1）It is used cooperatively, realizes
The quantitative output of resin glue, improves an accuracy for resin glue process section resin glue dosage.
The utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, high-pressure pump（3）With
Resin glue spot printing needle（1）Between gas transmission official road on be provided with pneumatic operated valve（31）, pneumatic operated valve（31）External pneumatic operated valve control switch
（310）；Above-mentioned design, using high-pressure pump（3）, pneumatic operated valve（31）And pneumatic operated valve control switch（310）With resin glue spot printing needle
（1）Cooperation, contribute to enter resin glue spot printing needle（1）In resin glue be thoroughly discharged, improve an essence for resin glue amount
Accuracy keeps the actual point resin glue amount of resin glue consistent with design value, ensures packaging effect.
The utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, resin glue spot printing needle
（1）Underface setting to chip for accepting substrate（100）The positioning plate for carrying out and accepting and transferring（4）, positioning plate（4）On set
It is equipped with for accepting the substrate fitting groove that substrate is assembled to chip（41）, positioning plate（4）It is assemblied in piston type pneumatic push rod
（5）On；Chip accepts substrate（100）On be provided with resin glue spot printing position（1001）；Substrate fitting groove（41）With resin glue spot printing
Needle（1）Just it is oppositely arranged；Resin glue spot printing needle（1）It is laid in array, the resin glue spot printing needle that array is laid（1）With chip
Accept substrate（100）The resin glue spot printing position of upper setting（1001）It corresponds；Above-mentioned design, convenient for improving resin glue point resin
The precision of glue avoids the occurrence of leakage resin glue and resin glue spot printing position shift phenomenon.
The utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, positioning plate（4）Right side
Hold set-point resin glue substrate input terminal conveyer belt（6）, positioning plate（4）Left-hand end set-point resin glue substrate output end conveyer belt
（7）；Above-mentioned design, during putting resin glue, entire chip accepts substrate（100）It is realized, is improved a little by transmission belt
Resin glue efficiency.
The utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, piston type pneumatic push rod
（5）It is assemblied in pedestal（10）On, pedestal（10）On be additionally provided with PLC controller（8）, PLC controller（8）It is opened with pneumatic operated valve control
It closes（310）, booster pump（21）And piston type pneumatic push rod（5）It is separately connected；Above-mentioned design, convenient for entirely putting resin adhesive process
Intelligent control is carried out, point resin glue efficiency is improved, ensures point resin glue precision, so that the resin glue of spot printing is placed in chip and accepts base
The corresponding point of plate avoids the occurrence of leakage resin glue and resin glue spot printing position shift phenomenon, improves packaging efficiency.
The utility model is related to semiconductor components and devices packaging technology section resin glue spray equipment, high-pressure pump（3）Under
Box electric heating chamber is arranged in side（9）, metering-type resin glue transfer valve（210）, pneumatic operated valve（31）, pneumatic operated valve control switch（310）
And resin glue spot printing needle（1）It is placed in box electric heating chamber（9）Inside, resin glue spot printing needle（1）The point resin glue mouth of bottom end
Across box electric heating chamber（9）Bottom face extends downwardly 2 ~ 3cm height；Above-mentioned design can effectively avoid resin glue and is applied in point
Resin glue spot printing position（1001）Condensation phenomenon, the smoothness of holding point resin glue occur before.
When the utility model is used, chip accepts substrate（100）Via a resin glue substrate input terminal conveyer belt（6）It is defeated
Enter and enters substrate fitting groove（41）, due to substrate fitting groove（41）Substrate is accepted with chip（100）Size is consistent, and substrate fills
Slot allocation（41）With with resin glue spot printing needle（1）Just it is oppositely arranged；Resin glue spot printing needle（1）It is laid in array, array is laid
Resin glue spot printing needle（1）Substrate is accepted with chip（100）The resin glue spot printing position of upper setting（1001）It corresponds；Work as piston
Formula air-leg（5）Move up promotion positioning plate（4）Resin glue spot printing position when moving up（1001）The resin glue point laid with array
Apply needle（1）It corresponds, PLC controller（8）Control booster pump（21）, metering-type resin glue transfer valve（210）And resin glue point
Apply needle（1）Operation, while controlling high-pressure pump（3）, pneumatic operated valve（31）And pneumatic operated valve control switch operation, complete site-directed quantitative point
Resin glue, after completing point resin glue point resin glue technique, chip is accepted substrate by operating personnel（100）It is placed in a resin glue substrate
Output end conveyer belt（7）On, into packaging technology section subsequent processing.
Claims (3)
1. a kind of resin glue spray equipment of semiconductor components and devices packaging technology section, including resin glue spot printing needle（1）, and setting
In resin glue spot printing needle（1）The resin glue storage barrel at top（2）And high-pressure pump（3）；The resin glue storage barrel（2）With resin
Glue point applies needle（1）Between transfer pipeline on be arranged metering-type resin glue transfer valve（210）, resin glue storage barrel（2）With metering
Formula resin glue transfer valve（210）Booster pump is set on pipeline between（21）；
The high-pressure pump（3）With resin glue spot printing needle（1）Between gas transmission official road on be provided with pneumatic operated valve（31）, pneumatic operated valve
（31）External pneumatic operated valve control switch（310）；
The resin glue spot printing needle（1）Underface setting to chip for accepting substrate（100）It carries out and accepts and that transfers determines
Position plate（4）, positioning plate（4）On be provided with for accepting the substrate fitting groove that is assembled of substrate to chip（41）, positioning plate（4）
It is assemblied in piston type pneumatic push rod（5）On；Chip accepts substrate（100）On be provided with resin glue spot printing position（1001）；
The substrate fitting groove（41）With resin glue spot printing needle（1）Just it is oppositely arranged；
The resin glue spot printing needle（1）It is laid in array, the resin glue spot printing needle that array is laid（1）Substrate is accepted with chip
（100）The resin glue spot printing position of upper setting（1001）It corresponds；
The positioning plate（4）Right-hand end set-point resin glue substrate input terminal conveyer belt（6）, positioning plate（4）Left-hand end set-point
Resin glue substrate output end conveyer belt（7）；
The piston type pneumatic push rod（5）It is assemblied in pedestal（10）On, pedestal（10）On be additionally provided with PLC controller（8）, PLC
Controller（8）It controls and switchs with pneumatic operated valve（310）, booster pump（21）And piston type pneumatic push rod（5）It is separately connected.
2. the resin glue spray equipment of semiconductor components and devices packaging technology section according to claim 1, which is characterized in that institute
State high-pressure pump（3）Box electric heating chamber is arranged in lower section（9）, metering-type resin glue transfer valve（210）, pneumatic operated valve（31）, it is pneumatic
Valve control switch（310）And resin glue spot printing needle（1）It is placed in box electric heating chamber（9）Inside, resin glue spot printing needle（1）Bottom end
The point resin glue mouth in portion passes through box electric heating chamber（9）Bottom face extends downwardly 2 ~ 3cm height.
3. the resin glue spray equipment of semiconductor components and devices packaging technology section according to claim 1, which is characterized in that institute
State positioning plate（4）Removably it is assemblied in piston type pneumatic push rod（5）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721884845.7U CN207770129U (en) | 2017-12-29 | 2017-12-29 | A kind of resin glue spray equipment of semiconductor components and devices packaging technology section |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721884845.7U CN207770129U (en) | 2017-12-29 | 2017-12-29 | A kind of resin glue spray equipment of semiconductor components and devices packaging technology section |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207770129U true CN207770129U (en) | 2018-08-28 |
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ID=63225476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721884845.7U Active CN207770129U (en) | 2017-12-29 | 2017-12-29 | A kind of resin glue spray equipment of semiconductor components and devices packaging technology section |
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| Country | Link |
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| CN (1) | CN207770129U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461679A (en) * | 2018-10-22 | 2019-03-12 | 曾瑞宜 | A kind of diode package molding machine with clearing function |
-
2017
- 2017-12-29 CN CN201721884845.7U patent/CN207770129U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461679A (en) * | 2018-10-22 | 2019-03-12 | 曾瑞宜 | A kind of diode package molding machine with clearing function |
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