CN207765406U - Semiconductor leads are bonded frock clamp - Google Patents
Semiconductor leads are bonded frock clamp Download PDFInfo
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- CN207765406U CN207765406U CN201820142284.1U CN201820142284U CN207765406U CN 207765406 U CN207765406 U CN 207765406U CN 201820142284 U CN201820142284 U CN 201820142284U CN 207765406 U CN207765406 U CN 207765406U
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- elongated
- flank
- wire bond
- frock clamp
- bonded
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Abstract
The utility model provides a kind of semiconductor leads bonding frock clamp, it includes heat block and pressing plate, it is formed with boss on the top surface of the heat block, the top formed boss is elongated plane, and the area of the elongated plane is more than row die wire bond area's occupied area and outlines die wire bond area and its surrounding flank occupied area less than one；The pressing plate has provided elongated window；The shape of the elongated window and the elongated plane matches；The elongated window for enabling the pressing plate is matched with the elongated plane involution of the heat block with bonded lead frame and chip, and the periphery of the elongated window is pressed on the flank around the row die wire bond area.Whereby, by forming boss at the top of heat block to realize single-row pressing, reduce the time that lead frame and copper wire are heated in high-temperature region, improve the problem of oxidation and product yield caused by the big windowing of pressing plate setting of existing frock clamp decline.
Description
Technical field
The utility model is related to the Wire Bonding Technology fields of semiconductor, relate in particular to the work of semiconductor leads bonding
Clamps.
Background technology
DFN (dual flat Lead-free in Electronic Packaging) is a kind of title of the packing forms of miniature electric component.Wherein, such as Fig. 1
Shown, the lead frame of model Tiny (Q) DFN is based on high density designs comprising lead frame 20 and is arranged in matrix
Row are arranged in the multiple row die wire bond area 201 on the lead frame 20, and each die wire bond area 201 is equipped with micro-
Small chip.The wire bonding processing procedure of Tiny (Q) the DFN lead frames is mainly carried out by frock clamp 10 as shown in Figure 1
Step is pressed, the frock clamp 10 includes pressing plate 11 and heat block 12, and the setting of the pressing plate 11 can summarize multiple row chip and draw
The large area windowing 13 in wire bonding area 201, the heat block 12 is top formed have it is matched with the large area 13 sizes that open a window
Large-area planar 14 realizes that one step press multiple row semiconductor product completes wire bonding, to shorten in wire bonding process whereby
Plant machinery clamping jaw index frame sortie number, is conducive to the production efficiency of lifting means.
It is worth noting that, as market steps up product reliability requirement, it is described to be equipped with large area windowing 13
Pressing plate 11 and top be equipped with the cooperation of heat block 12 of large-area planar 14 and complete the frock clamp 10 of wire bonding and design, exist
Birth defect caused by product quality risk increasingly highlight.Specifically, the large area windowing of frock clamp 10 shown in Fig. 1
Though 13 and large-area planar 14 can improve production efficiency, however, complete bonding wire product must the large area open a window 13
Place is appeared and is bonded with 180 DEG C~240 DEG C heating by heat block 12, causes semiconductor product to expose the aerial time very long
And then lead frame and copper wire degree of oxidation are aggravated, and then product reliability is affected, it remains to be further improved.
Utility model content
In view of the foregoing, the utility model provides a kind of semiconductor leads bonding frock clamp, by heat block top
Portion forms boss to realize single-row pressing, reduces the time that lead frame and copper wire are heated in high-temperature region, improves existing tooling folder
The problem of oxidation and product yield caused by the big windowing of pressing plate setting of tool decline.
To achieve the above object, the technical scheme adopted by the utility model is that providing a kind of semiconductor leads bonding tooling folder
Tool, is used for bonded lead frame and chip, matrix arrangement is disposed with multiple row die wire bond area, institute on the lead frame
Chip is stated in the die wire bond area, and formed with the lead frame between each row die wire bond area
Flank separates；Wherein, the frock clamp includes：Heat block has opposite top surface and bottom surface, is formed on the top surface convex
Platform, the top formed boss is elongated plane, and the area of the elongated plane is more than a row institute of die wire bond area
Account for area and less than the row die wire bond area and its surrounding flank occupied area；Pressing plate has provided elongated window；Institute
The shape for stating elongated window and the elongated plane matches；The elongated window of the pressing plate is enabled to be put down with the elongated of the heat block
In face of closing matching to be bonded the lead frame and the chip, the periphery of the elongated window is pressed on the row chip and draws
On flank around wire bonding area.
In the utility model embodiment, the lead frame forms between each die wire bond area and prolongs along longitudinal direction
The first flank stretched and the second flank extended transversely；Wherein, the elongated window is configured to rectangle, the elongated window
Two short sides that mouth has two opposite long sides and connects two long side and be oppositely arranged；Enable the periphery pressure of the elongated window
Together on the flank around a row chipset, the long side pressure is set on second flank, and the short side pressure is set to institute
It states on the first flank.
In the utility model embodiment, between the vertical range of the long side to the die wire bond area edge is first
Away from the width ratio of first spacing and second flank is 1：5 to 1：3；The short side is to the die wire bond
The vertical range of area edge is the second spacing, with the width ratio of first flank is 1 between described second：5 to 1：3.
In the utility model embodiment, described first is smaller than or is equal to second spacing.
In the utility model embodiment, it is described it is elongated it is planar-formed be rectangle, the elongated plane have opposite two
Long side and two short sides for connecting two long side and being oppositely arranged；The elongated window is configured to rectangle, the elongated window
Two short sides that mouth has two opposite long sides and connects two long side and be oppositely arranged；Between the long side of the elongated plane
Vertical range is more than vertical range between the long side of the elongated window；Vertical range is more than between the short side of the elongated plane
Vertical range between the short side of the elongated window.
In the utility model embodiment, vertical range is more than and close to described in a row between the long side of the elongated plane
The wide cut of the second flank of die wire bond area and its both sides is summed up.
In the utility model embodiment, the bottom of the pressing plate in intermediate region is formed with two inclined end faces and in two end regions
Two planar base surfaces are formed with, there is an inclined end face to connect between the edge and the edge of the elongated window of each planar base surface
It connects, the pressing plate is enabled to be configured to the thin plate body structure in thick middle, both ends.
The utility model makes it have following advantageous effect as a result of above technical scheme：
The utility model makes the window of pressing plate be configured to match with the boss by forming boss on heat block
Shape and size, realize single-row pressing, effectively reduce also contacts of the lead frame on heat block in wire bonding process
Area improves the oxidation states of lead frame.
The these and other objects, feature and advantage of the utility model, are obtained by following detailed descriptions and claim
To fully demonstrate, and can be achieved by means, device and the combination thereof specially pointed out in appended claims.
Description of the drawings
Fig. 1 is the three-dimensional appearance schematic diagram of existing frock clamp.
Fig. 2 is the schematic top plan view of existing frock clamp.
Fig. 3 is the schematic side view of existing frock clamp.
Fig. 4 is the three-dimensional appearance schematic diagram of the utility model frock clamp.
Fig. 5 is the schematic top plan view of the utility model frock clamp.
Fig. 6 is the schematic side view of the utility model frock clamp.
The correspondence of reference numeral and component is as follows：
Frock clamp 10；Pressing plate 11；Heat block 12；Large area windowing 13；Large-area planar 14；Lead frame 20；Chip
Wire bond pad areas 201；First flank 21；Second flank 22；Heat block 40；Top surface 41；Bottom surface 42；Boss 43；Plane 44；Long side
441；Short side 442；Pressing plate 50；Window 51；Long side 511；Short side 512；Inclined end face 52；Planar base surface 53；First space D 1；Between second
Away from D2；Wide cut sums up T.
Specific implementation mode
For the benefit of to the understanding of the utility model, illustrate with reference to the accompanying drawings and embodiments.
Fig. 4 to fig. 6 is please referred to, the utility model provides a kind of semiconductor leads bonding frock clamp comprising.Such as Fig. 4
Shown, the frock clamp is used for bonded lead frame 20 and chip (not shown), matrix arrangement cloth on the lead frame 20
It is equipped with multiple row die wire bond area 201, the chip and its pin and the die wire bond area 201 is set to by bonding
On, and the flank formed with the lead frame 20 between each row die wire bond area 201 separates.
Specifically, as shown in Figure 5, Figure 6, the frock clamp includes heat block 40 and pressing plate 50, and the heat block 40 has
There are opposite top surface 41 and bottom surface 42, boss 43 is formed on the top surface 41, the boss 43 is configured to trapezium structure and top
Portion is configured to elongated plane 44, both sides are configured to inclined-plane；The area of the elongated plane 44 is more than the row chip lead weldering
Connect 201 occupied area of area and less than the row die wire bond area 201 and its surrounding flank occupied area.The pressing plate 50
On provided elongated window 51；The elongated window 51 and the shape of the elongated plane 44 match；Whereby, the pressing plate is enabled
50 elongated window 51 is matched with 44 pairing of elongated plane of the heat block 40 to be bonded the lead frame 20 and the core
Piece 30, the periphery of the elongated window 51 is pressed on the flank around the row die wire bond area 201, to realize
Single-row pressing lead frame 20 avoids lead frame, chip and its pin (copper wire) in bonding process, long-time and large area
Ground exposes to the open air in the case where being heated at high temperature environment, and realizing effectively reduces oxidizability and improve product yield.
In the utility model embodiment, as shown in figure 5, the lead frame 20 is configured to rectangle, define along lead
The direction of 20 length of frame is longitudinal, is laterally that the lead frame 20 is in each core along the direction of 20 width of lead frame
The second flank 22 for forming the first flank 21 extended longitudinally between piece wire bond pad areas 201 and extending transversely.It is described
The elongated window 51 of pressing plate 50 is configured to rectangle, and the elongated window 51 has described in two opposite long sides 511 and connection
Two long sides 511 and two short sides 512 being oppositely arranged；The periphery of the elongated window 51 is enabled to be pressed on the row chip lead weldering
It connects on the flank around area 201, the pressure of the long side 511 is set on second flank 22, and the pressure of the short side 512 is set to described the
On one flank 21.
More specifically, as shown in figure 5, defining the long side 511 of the window 51 to 201 edge of die wire bond area
Vertical range be the first space D 1, the width ratio of first space D 1 and second flank 22 is preferably 1：5 to 1：
3；The vertical range for defining the short side 512 to 201 edge of die wire bond area is the second space D 2, between described second
The width ratio of D2 and first flank 21 are preferably 1：5 to 1：3；To enable the periphery of window 51 is close to be pressed on described in a row
The side in die wire bond area 201, in the state that reduction exposes area to the open air, ensure window 51 not with die wire bond area
201 contacts avoid influencing bonding work.In addition, in the utility model embodiment, first space D 1 is preferably less than or waits
In second space D 2.
In the utility model embodiment, as shown in figure 5, the elongated plane 44 at 40 boss of the heat block, 43 top shapes
For rectangle, the elongated plane 44 there are two opposite long sides 441 and connection two long side 441 and be oppositely arranged two
Short side 442；Vertical range is hung down between being more than the long side 511 of the elongated window 51 between the long side 441 of the elongated plane 44
Straight distance；Vertical range is more than between the short side 512 of the elongated window 51 vertically between the short side 442 of the elongated plane 44
Distance.More specifically, vertical range is more than and arranges the chip lead close to one between the long side 441 of the elongated plane 44
The wide cut of welding section 201 and its second flank of both sides 22 sums up T, with to the row die wire bond area for carrying out bonding work
201 play good bottom supporting role, and by pressing portions in the row die wire bond area 201 for carrying out bonding work
Opposite sides 201 edge of Liang Lie die wire bonds area on, can ensure the smooth of die wire bond area 201, will not
Because below the both ends of lead frame 20 without support, and in the both sides the in the row die wire bond area 201 for carrying out bonding work
Bend relief at two flanks 22.
As shown in figs. 4 and 6, the bottom of the pressing plate 50 in intermediate region is formed with two inclined end faces 52 and in two end regions
Two planar base surfaces 53 are formed with, there is a wedged bottom between the edge and the edge of the elongated window 51 of each planar base surface 53
Face 52 connects, and the pressing plate 50 is enabled to be configured to the thin plate body structure in thick middle, both ends.
In the utility model embodiment, the top formed of the pressing plate 50 is flat surfaces, the bottom of the pressing plate 50
It is formed with two inclined end faces 52 in intermediate region and has two planar base surfaces 53, the planar base surface 53 and the top in both ends drape forming
Flat surfaces it is parallel, and between the edge and the edge of the elongated window 51 of each planar base surface 53 have a wedged bottom
Face 52 connects；The pressing plate 50 is enabled to be configured to the thin plate body structure in thick middle, both ends.
The utility model is described in detail above in association with accompanying drawings and embodiments, those skilled in the art can
Many variations example is made to the utility model according to the above description.Thus, certain details in embodiment should not be constituted to this reality
With novel restriction, the utility model will be using the range that the appended claims define as the scope of protection of the utility model.
Claims (7)
1. a kind of semiconductor leads are bonded frock clamp, it to be used for bonded lead frame and chip, matrix on the lead frame
It is arranged with multiple row die wire bond area, the chip is set in the die wire bond area, and each row chip lead
The flank formed with the lead frame between welding section separates；It is characterized in that, the frock clamp includes：
Heat block has opposite top surface and bottom surface, boss is formed on the top surface, the top formed boss is elongated flat
The area in face, the elongated plane is more than a row die wire bond area occupied area and less than a row chip lead
Welding section and its surrounding flank occupied area；
Pressing plate has provided elongated window；The shape of the elongated window and the elongated plane matches；
The elongated window of the pressing plate is enabled to be matched with the elongated plane involution of the heat block to be bonded the lead frame and institute
Chip is stated, the periphery of the elongated window is pressed on the flank around the row die wire bond area.
2. semiconductor leads according to claim 1 are bonded frock clamp, the lead frame is in each chip lead
The second flank for forming the first flank extended longitudinally between welding section and extending transversely；It is characterized in that：
The elongated window is configured to rectangle, the elongated window have two opposite long sides and connection two long side and
Two short sides being oppositely arranged；
The periphery of the elongated window is enabled to be pressed on the flank around the row die wire bond area, the long side pressure is set
In on second flank, the short side pressure is set on first flank.
3. semiconductor leads according to claim 2 are bonded frock clamp, it is characterised in that：
The vertical range of the long side to the die wire bond area edge is the first spacing, first spacing and described the
The width ratio of two flanks is 1：5 to 1：3；
The vertical range of the short side to the die wire bond area edge is the second spacing, with described first between described second
The width ratio of flank is 1：5 to 1：3.
4. semiconductor leads according to claim 3 are bonded frock clamp, it is characterised in that：
Described first is smaller than or is equal to second spacing.
5. semiconductor leads according to claim 1 are bonded frock clamp, it is characterised in that：
It is described it is elongated it is planar-formed be rectangle, the elongated plane have opposite two long sides and connection two long side and
Two short sides being oppositely arranged；
The elongated window is configured to rectangle, the elongated window have two opposite long sides and connection two long side and
Two short sides being oppositely arranged；
Vertical range is more than vertical range between the long side of the elongated window between the long side of the elongated plane；It is described elongated
Vertical range is more than vertical range between the short side of the elongated window between the short side of plane.
6. semiconductor leads according to claim 5 are bonded frock clamp, it is characterised in that：
Vertical range is more than and arranges the die wire bond area and its both sides close to one between the long side of the elongated plane
The wide cut of second flank is summed up.
7. semiconductor leads according to claim 1 are bonded frock clamp, it is characterised in that：
The bottom of the pressing plate is formed with two inclined end faces in intermediate region and has two planar base surfaces in both ends drape forming, each described flat
There is an inclined end face connection between the edge of bottom surface and the edge of the elongated window, the pressing plate is enabled to be configured to centre
Plate body structure thick, both ends are thin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820142284.1U CN207765406U (en) | 2018-01-29 | 2018-01-29 | Semiconductor leads are bonded frock clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820142284.1U CN207765406U (en) | 2018-01-29 | 2018-01-29 | Semiconductor leads are bonded frock clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207765406U true CN207765406U (en) | 2018-08-24 |
Family
ID=63182222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820142284.1U Active CN207765406U (en) | 2018-01-29 | 2018-01-29 | Semiconductor leads are bonded frock clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207765406U (en) |
-
2018
- 2018-01-29 CN CN201820142284.1U patent/CN207765406U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai Puchuang Longke Finance Leasing Co.,Ltd. Assignor: TRS MICROELECTRONICS Co.,Ltd. Contract record no.: X2020980003143 Denomination of utility model: Semiconductor lead bonded frock clamp Granted publication date: 20180824 License type: Exclusive License Record date: 20200616 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semiconductor lead bonded frock clamp Effective date of registration: 20200616 Granted publication date: 20180824 Pledgee: Shanghai Puchuang Longke Finance Leasing Co.,Ltd. Pledgor: TRS MICROELECTRONICS Co.,Ltd. Registration number: Y2020980003144 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Shanghai Puchuang Longke Finance Leasing Co.,Ltd. Assignor: TRS MICROELECTRONICS Co.,Ltd. Contract record no.: X2020980003143 Date of cancellation: 20210709 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210709 Granted publication date: 20180824 Pledgee: Shanghai Puchuang Longke Finance Leasing Co.,Ltd. Pledgor: TRS MICROELECTRONICS Co.,Ltd. Registration number: Y2020980003144 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |