CN207753017U - A kind of detachable stamp-mounting-paper diode - Google Patents
A kind of detachable stamp-mounting-paper diode Download PDFInfo
- Publication number
- CN207753017U CN207753017U CN201721927517.0U CN201721927517U CN207753017U CN 207753017 U CN207753017 U CN 207753017U CN 201721927517 U CN201721927517 U CN 201721927517U CN 207753017 U CN207753017 U CN 207753017U
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- welding ends
- packaging body
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model provides a kind of detachable stamp-mounting-paper diode,Including packaging body,Chip,First pin and second pin,First pin and second pin are equipped with welding ends and patch end,The welding ends of first pin is welded on the upper surface of chip,The welding ends of second pin is welded on the lower surface of chip,Packaging body is by chip,The welding ends of first pin and the welding ends sealed envelope of second pin,The patch end of first pin and the patch end of second pin are stretched out outside packaging body,Packaging body includes superstructure and substructure,The superstructure and substructure are separable,The patch end of first pin and welding ends are separable,The post-chip end of second pin and welding ends are separable,The welding ends of first pin is fixed on the superstructure of packaging body,The patch end of first pin and the post-chip end of second pin are each attached to the substructure of packaging body.
Description
Technical field
The utility model is related to stamp-mounting-paper diode, more particularly to a kind of detachable stamp-mounting-paper diode.
Background technology
With the development of science and technology, the application of stamp-mounting-paper diode is more and more extensive, in the prior art stamp-mounting-paper diode
Processing is to clamp chip with the welding ends of two pins to be welded, and is then packaged to chip, and the patch end of pin is stretched out
Outside packaging body, when using stamp-mounting-paper diode, directly on circuit boards by the patch end soldering of pin.Work as stamp-mounting-paper diode
Chip break down when needing replacing, generally require to heat the tin for connecting stamp-mounting-paper diode and circuit board, until should
Tin fusing could take out entire stamp-mounting-paper diode, then be replaced.In above-mentioned replacement process, if careless manipulation when heating tin
It is easily damaged circuit board, and needs after taking out stamp-mounting-paper diode to weld the stamp-mounting-paper diode of another needs, operating process again
It is complicated.
Utility model content
The technical problems to be solved in the utility model is how to simplify the replacement process of stamp-mounting-paper diode, and replacing
It is less likely to be damaged circuit board in journey.
In order to solve the above-mentioned technical problem, the utility model provides a kind of detachable stamp-mounting-paper diode comprising packaging body,
Chip, the first pin and second pin, the first pin and second pin are equipped with welding ends and patch end, the welding of the first pin
End is welded on the upper surface of chip, and the welding ends of second pin is welded on the lower surface of chip, and packaging body is by chip, the first pin
Welding ends and second pin welding ends sealed envelope, encapsulation is stretched out at the patch end of the patch end of the first pin and second pin
In vitro, packaging body includes superstructure and substructure, and the superstructure and substructure are separable, the patch end of the first pin
Separable with welding ends, the post-chip end of second pin and welding ends are separable, and the welding ends of the first pin is fixed on packaging body
Superstructure, the patch end of the first pin and the post-chip end of second pin are each attached to the substructure of packaging body.
Preferably, the vertical space where chip, the welding of the second pin are stretched into the patch end of first pin
The vertical space where chip is stretched out at end.
Preferably, the part of the welding ends of the first pin of patch end in contact of first pin is in tip-angled shape, the wedge angle
The vertical space where chip is stretched into shape part；The part at the post-chip end of the welding end in contact second pin of the second pin is in
The vertical space where chip is stretched out in tip-angled shape, the tip-angled shape part.
Preferably, one layer of tin, the second pin are welded between the welding ends and the upper surface of chip of first pin
Welding ends and the lower surface of chip between be welded with one layer of tin.
The upper and lower part structure of the packaging body of the utility model is separable, the welding ends of the first pin, chip, second pin
Welding ends this three weld together, the welding ends of the first pin is fixed on the superstructure of packaging body, the patch of the first pin
The post-chip end of bit end and second pin is each attached to the substructure of packaging body, when stamp-mounting-paper diode passes through the patch of two pins
When end is welded on circuit boards, if chip failure, the superstructure of packaging body is taken apart into i.e. replaceable break down
Chip, without heat for connect stamp-mounting-paper diode and circuit board tin until its fusing, avoid careless manipulation from leading to electricity
Road plate damage, and relative to replacing for entire stamp-mounting-paper diode, operating process is simpler.
Description of the drawings
Fig. 1 is the structural schematic diagram of the detachable stamp-mounting-paper diode of the utility model；
Fig. 2 is the structural schematic diagram of split circuit plate part after the detachable stamp-mounting-paper diode of the utility model is dismantled；
Fig. 3 is the structural schematic diagram that circuit board section is connected after the detachable stamp-mounting-paper diode of the utility model is dismantled；
Reference sign：The superstructure of 1- packaging bodies；The substructure of 2- packaging bodies；The welding of the first pins of 3-
End；The welding ends of 4- second pins；The patch end of the first pins of 5-；The patch end of 6- second pins；7- chips.
Specific implementation mode
The utility model is further described with the following Examples.
As shown in Figure 1, the stamp-mounting-paper diode of the utility model includes packaging body, the first pin, second pin and chip 7.
First pin is equipped with separable welding ends 3 and patch end 5, and second pin is equipped with separable welding ends 4 and patch end 6, the
The welding ends 3 of one pin is soldered to the upper surface of chip 7, and the welding ends 4 of second pin is soldered to the lower surface of chip 7, then and
There is one layer of tin to connect the two between the welding ends 3 of one pin and the upper surface of chip, similarly, the welding of second pin
Also there is one layer of tin to connect the two between end 4 and the lower surface of chip.Packaging body includes separable superstructure 1 under
Portion's structure 2, the superstructure 1 and substructure 2 of packaging body are separately molded, by the welding ends 3 of the first pin welded together,
Chip 7, second pin welding ends 5 be put into the superstructure 1 of die for molding packaging body, the welding ends of the first pin after molding
3, chip 7, second pin welding ends 5 be fixed on as a whole in the superstructure 1 of packaging body, as shown in Figure 2.First is drawn
The patch end 5 of foot and the patch end 6 of second pin are put into the substructure 2 of die for molding packaging body, the first pin after molding
Patch end 5 and second pin patch end 6 be separately fixed on packaging body substructure 2 both sides, as shown in Figure 3.
The part that the patch end 5 of first pin contacts the welding ends 3 of the first pin is in tip-angled shape, and the tip-angled shape part is the
The vertical space where chip 7, the welding of second pin are stretched into the patch end 5 of one pin when contacting the welding ends 3 of the first pin
The part at the patch end 6 of 4 contact second pin of end is also in tip-angled shape, which contacts in the welding ends 4 of second pin
The vertical space where chip 7 is stretched out when the patch end 6 of second pin, then in 2 knot of the superstructure of packaging body 1 and substructure
When conjunction, the superstructure 1 of packaging body is locked under packaging body by the patch end 5 of the first pin and the welding ends 4 of second pin
In portion's structure 2, keep the upper and lower part structure of packaging body not easily to fall off.
Above-mentioned packaging body superstructure 1 and substructure 2 are installed together to get to the detachable of the utility model
Stamp-mounting-paper diode.When the chip failure of the detachable stamp-mounting-paper diode of welding on circuit boards, due to the first pin
The tip-angled shape partial volume of the tip-angled shape part at patch end 5 and the welding ends 4 of second pin is small and can deform upon, and operator is only
A upward power need to be applied to the superstructure 1 of packaging body, you can take apart the superstructure 1 of packaging body, while core
Piece 7 together can be disassembled out with the superstructure 1 of packaging body, then operator can directly replace another be welded with it is intact
The superstructure 1 of the packaging body of chip 7, only need to be by its flicking into the substructure 2 of packaging body when installation.
Claims (4)
1. a kind of detachable stamp-mounting-paper diode, including packaging body, chip, the first pin and second pin, first pin and
Second pin is equipped with welding ends and patch end, and the welding ends of the first pin is welded on the upper surface of chip, the weldering of second pin
The lower surface that end is welded on chip is connect, the welding ends of chip, the welding ends of the first pin and second pin is sealed packet by packaging body
It wraps up in, the patch end of the first pin and the patch end of second pin are stretched out outside packaging body, characterized in that the packaging body includes top
Structure and substructure, the superstructure and substructure are separable, and the patch end of first pin and welding ends are separable,
The post-chip end of the second pin and welding ends are separable, and the welding ends of the first pin is fixed on the superstructure of packaging body, the
The patch end of one pin and the post-chip end of second pin are each attached to the substructure of packaging body.
2. detachable stamp-mounting-paper diode according to claim 1, characterized in that core is stretched at the patch end of first pin
Vertical space where piece, the welding ends of the second pin stretch out the vertical space where chip.
3. detachable stamp-mounting-paper diode according to claim 2, characterized in that the patch end in contact of first pin
The part of the welding ends of one pin is in tip-angled shape, which stretches into the vertical space where chip；The second pin
Welding end in contact second pin post-chip end part be in tip-angled shape, the tip-angled shape part stretch out chip where vertical sky
Between.
4. detachable stamp-mounting-paper diode according to claim 1, characterized in that the welding ends and chip of first pin
Upper surface between be welded with one layer of tin, one layer of tin is welded between the welding ends of the second pin and the lower surface of chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721927517.0U CN207753017U (en) | 2017-12-29 | 2017-12-29 | A kind of detachable stamp-mounting-paper diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721927517.0U CN207753017U (en) | 2017-12-29 | 2017-12-29 | A kind of detachable stamp-mounting-paper diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207753017U true CN207753017U (en) | 2018-08-21 |
Family
ID=63152267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721927517.0U Expired - Fee Related CN207753017U (en) | 2017-12-29 | 2017-12-29 | A kind of detachable stamp-mounting-paper diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207753017U (en) |
-
2017
- 2017-12-29 CN CN201721927517.0U patent/CN207753017U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180821 Termination date: 20201229 |