CN202804507U - Auxiliary conducting wire bracket conducting wire-soldering apparatus for semiconductor encapsulation - Google Patents
Auxiliary conducting wire bracket conducting wire-soldering apparatus for semiconductor encapsulation Download PDFInfo
- Publication number
- CN202804507U CN202804507U CN 201220439601 CN201220439601U CN202804507U CN 202804507 U CN202804507 U CN 202804507U CN 201220439601 CN201220439601 CN 201220439601 CN 201220439601 U CN201220439601 U CN 201220439601U CN 202804507 U CN202804507 U CN 202804507U
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- conducting wire
- wire
- pressing plate
- soldering
- lead frame
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Abstract
The utility model relates to the technical field of a semiconductor device, in particular to an auxiliary conducting wire bracket wire-soldering apparatus for semiconductor encapsulation. The auxiliary conducting wire bracket wire-soldering apparatus for the semiconductor encapsulation structurally comprises a pressing plate, wherein the pressing plate is used for tightly pressing a conducting wire bracket. The auxiliary conducting wire bracket wire-soldering apparatus for the semiconductor encapsulation not only enables the conducting wire bracket and the pressing plate to be located in a relatively stable state, but also enables the conducting wire bracket not to shake during wire soldering via a mode that pressing claws are arranged on the middle parts of the inner sides of an upper pressing plate and a lower pressing plate of the pressing plate in an extension way and used for tightly pressing the upper part and the lower part of a wire-soldering part of the conducting wire bracket; and therefore, the defect rate of wire-soldering failure at each soldering point is effectively decreased, the product yield is improved, and the human resource and the energy resource are saved.
Description
Technical field
The utility model relates to technical field of semiconductor device, particularly a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device.
Background technology
Semiconductor devices needs wire rod and product are welded in encapsulation process, general mode is to carry out bonding wire by auxiliary conductor frame wire-soldering device, auxiliary conductor frame wire-soldering device generally comprises pressing plate and hot plate, lead frame is put on the hot plate, re-uses and carry out bonding wire after pressing plate is fixed lead frame.
Prior art by auxiliary conductor frame wire-soldering device, as shown in Figure 2 because its design unreasonable, be in relative unsure state between normal so that lead frame and the pressing plate, thereby the fraction defective that causes solder joint not reached the standard grade is higher, and the defect rate of product is high, causes the waste of human resources and the energy.
Therefore, need improving by auxiliary conductor frame wire-soldering device prior art.
Summary of the invention
The purpose of this utility model is to avoid above-mentioned weak point of the prior art and a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device is provided, this semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device can be so that be in metastable state between lead frame and the pressing plate, lead frame does not rock when making bonding wire, effectively reduce the fraction defective that solder joint is not reached the standard grade, improve the yield of product, save human resources and the energy.
The purpose of this utility model is achieved through the following technical solutions:
A kind of auxiliary conductor frame wire-soldering device is provided, has comprised that pressing plate comprises top board and lower platen for the pressing plate that compresses lead frame, the middle inside of top board and the middle inside of lower platen are extended respectively the paw that is provided with the bonding wire section that compresses lead frame.
Preferably, paw is cuboid.
Another is preferred, also comprises the hot plate that is used to wire to erect support and conductive force.
Preferred, hot plate comprises that the pin that is used to lead frame plays the hot plate boss of support and conductive force, and the length of hot plate boss is set to 0.7 millimeter, and width is set to 0.7 millimeter.。
The beneficial effects of the utility model: be provided with paw by extending respectively in the middle inside of the top board of pressing plate and lower platen, the upper and lower that is used for the bonding wire section of compression lead frame, so that be in metastable state between lead frame and the pressing plate, lead frame does not rock when making bonding wire, effectively reduce the fraction defective that solder joint is not reached the standard grade, improve the yield of product, save human resources and the energy.
Description of drawings
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in the accompanying drawing does not consist of any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structural representation of the embodiment of a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device of the present utility model.
Fig. 2 is the structural representation of the auxiliary conductor frame wire-soldering device of prior art.
In Fig. 1 and Fig. 2, include:
1---pressing plate, 11---top board, 12---lower platen, 13---paw,
2---the hot plate boss,
3---lead frame, 31---bonding wire section, 32---pins.
The specific embodiment
With the following Examples the utility model is further described.
The specific embodiment of a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device of the present utility model, as shown in Figure 1, comprise for the pressing plate 1 that compresses lead frame 3, pressing plate 1 comprises top board 11 and lower platen 12, and the middle inside of the middle inside of top board 11 and lower platen 12 is extended respectively the paw 13 that is provided with the bonding wire section that compresses lead frame.
The utility model is provided with paw 13 by extending respectively in the middle inside of the top board 11 of pressing plate 1 and lower platen 12, the upper and lower that is used for the bonding wire section 31 of compression lead frame 3, so that be in metastable state between lead frame 3 and the pressing plate 1, lead frame 3 does not rock when making bonding wire, effectively reduce the fraction defective that solder joint is not reached the standard grade, improve the yield of product, save human resources and the energy.
Concrete, paw 13 is cuboid.The shape of paw 13 mainly is the shape that cooperates the bonding wire section 31 of lead frame 3, lead frame 3 compressions is not rocked and do not affect under the prerequisite of normal bonding wire realizing, the shape of paw 13 can arrange according to actual needs.
Concrete, also comprise the hot plate that is used to 3 supports of lead frame and conductive force, hot plate comprises 32 supports of pin of being used to lead frame 3 and the hot plate boss 2 of conductive force, and the length of hot plate boss 2 is set to 0.7 millimeter, and width is set to 0.7 millimeter.The hot plate boss 2 operated by rotary motion length L of prior art are 0.5 millimeter, and width W is 0.5 millimeter, and the pin 32 of lead frame 3 can not contact hot plate boss 2 fully, produce easily during bonding wire and rock, and the bonding wire effect is bad.After improving the size of hot plate boss 2, can so that the pin 32 of lead frame 3 contact fully with hot plate boss 2, be not easy during bonding wire to produce and rock the bonding wire better effects if.
The mentioned orientation (such as top 11 and the bottom 12 of pressing plate) of the utility model all view direction with Fig. 1 is as the criterion.
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of the utility model protection domain; although with reference to preferred embodiment the utility model has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (4)
1. semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device, comprise for the pressing plate that compresses lead frame, it is characterized in that: pressing plate comprises top board and lower platen, and the middle inside of top board and the middle inside of lower platen are extended respectively the paw that is provided with the bonding wire section that compresses lead frame.
2. a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device according to claim 1, it is characterized in that: paw is cuboid.
3. a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device according to claim 1 is characterized in that: also comprise the hot plate that is used to wire to erect support and conductive force.
4. a kind of semiconductor-sealing-purpose auxiliary conductor frame wire-soldering device according to claim 3, it is characterized in that: hot plate comprises that the pin that is used to lead frame plays the hot plate boss of support and conductive force, the length of hot plate boss is set to 0.7 millimeter, and width is set to 0.7 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220439601 CN202804507U (en) | 2012-08-31 | 2012-08-31 | Auxiliary conducting wire bracket conducting wire-soldering apparatus for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220439601 CN202804507U (en) | 2012-08-31 | 2012-08-31 | Auxiliary conducting wire bracket conducting wire-soldering apparatus for semiconductor encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202804507U true CN202804507U (en) | 2013-03-20 |
Family
ID=47863450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220439601 Expired - Fee Related CN202804507U (en) | 2012-08-31 | 2012-08-31 | Auxiliary conducting wire bracket conducting wire-soldering apparatus for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202804507U (en) |
-
2012
- 2012-08-31 CN CN 201220439601 patent/CN202804507U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20130831 |