CN207719228U - A kind of silicon chip inserted sheet silicon wafer buffer device - Google Patents
A kind of silicon chip inserted sheet silicon wafer buffer device Download PDFInfo
- Publication number
- CN207719228U CN207719228U CN201820010492.6U CN201820010492U CN207719228U CN 207719228 U CN207719228 U CN 207719228U CN 201820010492 U CN201820010492 U CN 201820010492U CN 207719228 U CN207719228 U CN 207719228U
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- CN
- China
- Prior art keywords
- silicon chip
- module
- silicon wafer
- silicon
- wafer buffer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The utility model is related to a kind of silicon chip inserted sheet silicon wafer buffer devices.During pervious inserted sheet, there is no silicon wafer buffer device so that be easy when silicon chip is inserted into piece basket and the inner wall of piece basket touches, situations such as causing disintegrating tablet, scribing, expendable damage is caused to silicon chip, greatly reduces the qualification rate of silicon chip, causes the loss of time and property.The utility model is related to a kind of silicon chip inserted sheet silicon wafer buffer devices, wherein：Side is equipped with silicon chip conveyer belt in plug-in sheet machine rack, and silicon chip conveyer belt side, which is equipped with, promotes module, promotes module and is fixed in plug-in sheet machine rack, promotes module and is made of lifting motor, screw rod transmission module, promotion platform.The present apparatus makes silicon chip inject in piece basket and is first contacted with the rubber pad in buffer unit by the way of increasing silicon wafer buffer device, and rubber pad can absorb kinetic energy when silicon chip is inserted into piece basket well, be effectively protected silicon chip, improve the qualification rate of silicon chip.
Description
Technical field
The utility model is related to silicon chip inserting machine technical field, especially a kind of silicon chip inserted sheet silicon wafer buffer device.
Background technology
Silicon chip by plug-in sheet machine by being inserted into piece basket again after wafer separator fragment, during pervious inserted sheet, without silicon chip
Buffer unit so that situations such as being easy to touch with the inner wall of piece basket, cause disintegrating tablet, scribing when silicon chip is inserted into piece basket is made to silicon chip
At expendable damage, the qualification rate of silicon chip is greatly reduced, causes the loss of time and property, Shortcomings.
Invention content
The purpose of this utility model is to provide a kind of silicon chip inserted sheet silicon wafer buffer device, above-mentioned to overcome the shortcomings of, adopts
With the mode for increasing silicon wafer buffer device, so that silicon chip is injected in piece basket and first contacted with the rubber pad in buffer unit, rubber pad energy
Kinetic energy when silicon chip is inserted into piece basket is absorbed well, removes buffer unit after the kinetic energy of silicon chip largely releases, this time slice basket
Minimum is just reduced to the damage caused by silicon chip, silicon chip disintegrating tablet and scribing situation also reduce the probability of generation, effectively
Protect silicon chip, improve the qualification rate of silicon chip.
To solve the above-mentioned problems, the utility model is achieved through the following technical solutions：
A kind of silicon chip inserted sheet silicon wafer buffer device, including plug-in sheet machine rack, silicon chip conveyer belt, promotion module, lifting electricity
Machine, promotes platform, piece basket, silicon wafer buffer module at screw rod transmission module；Wherein：It is defeated to be equipped with silicon chip for side in plug-in sheet machine rack
Band is sent, silicon chip conveyer belt side, which is equipped with, promotes module, promotes module and is fixed in plug-in sheet machine rack, promotes module by lifting electricity
Machine, screw rod transmission module, promoted platform composition, lifting motor and screw rod transmission module are coaxially connected, screw rod transmission module with carry
Peaceful connection, piece basket, which is fixed on, to be promoted on platform, is promoted module side and is equipped with silicon wafer buffer module, the installation of silicon wafer buffer module
In in plug-in sheet machine rack.
A kind of silicon chip inserted sheet silicon wafer buffer device, the silicon wafer buffer module include holder, cylinder block, mounting plate, delay
Rush pad support, the first cushion pad, connecting plate, limited block, the second cushion pad, sliding rail, cylinder；Wherein：Cylinder is solid by cylinder block
Due on holder, the piston rod in cylinder is connect with connecting plate one end, and the connecting plate other end is connect with mounting plate, and holder is equipped with
Sliding rail, mounting plate are flexibly connected with sliding rail, and sliding rail one end is equipped with limited block, and limited block is fixed on holder, is installed on limited block
There are the second cushion pad, buffering pad support to be installed on mounting plate, buffers and the first cushion pad is installed on pad support.
A kind of silicon chip inserted sheet silicon wafer buffer device, wherein：First cushion pad surface is with horizontal plane at 95 degree of angles.
The utility model has the advantage of：The present apparatus makes silicon chip inject piece basket by the way of increasing silicon wafer buffer device
Middle elder generation contacts with the rubber pad in buffer unit, and rubber pad can absorb kinetic energy when silicon chip is inserted into piece basket well, wait for silicon chip
Kinetic energy removes buffer unit after largely releasing, this time slice basket is just reduced to minimum, silicon chip to the damage caused by silicon chip
Disintegrating tablet and scribing situation also reduce the probability of generation, are effectively protected silicon chip, improve the qualification rate of silicon chip.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model.
Fig. 2 is the silicon wafer buffer modular structure schematic diagram in the utility model.
Reference numeral：Plug-in sheet machine rack 1, promotes module 3, lifting motor 301, screw rod transmission module at silicon chip conveyer belt 2
302, platform 303, piece basket 4, silicon wafer buffer module 5, holder 501, cylinder block 502, mounting plate 503, buffering pad support are promoted
504, the first cushion pad 505, connecting plate 506, limited block 507, the second cushion pad 508, sliding rail 509, cylinder 510.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Embodiment 1 please refers to Fig.1-2, and a kind of silicon chip inserted sheet silicon wafer buffer device, including plug-in sheet machine rack 1, silicon chip are defeated
Band 2 is sent, module 3 is promoted, lifting motor 301, screw rod transmission module 302, promotes platform 303, piece basket 4, silicon wafer buffer module 5；
Wherein：Side is equipped with silicon chip conveyer belt 2 in plug-in sheet machine rack 1, and 2 side of silicon chip conveyer belt, which is equipped with, promotes module 3, promotes module
3 are fixed in plug-in sheet machine rack 1, promote module 3 and are made of lifting motor 301, screw rod transmission module 302, promotion platform 303,
Lifting motor 301 and screw rod transmission module 302 are coaxially connected, and screw rod transmission module 302 is connect with platform 303 is promoted, and piece basket 4 is solid
Due to being promoted on platform 303, promotes 3 side of module and be equipped with silicon wafer buffer module 5, silicon wafer buffer module 5 is installed on plug-in sheet machine machine
On frame 1.
Embodiment 2, a kind of silicon chip inserted sheet silicon wafer buffer device, the silicon wafer buffer module 5 include holder 501, cylinder
Seat 502, mounting plate 503, buffering pad support 504, the first cushion pad 505, connecting plate 506, limited block 507, the second cushion pad
508, sliding rail 509, cylinder 510；Wherein：Cylinder 510 is fixed on by cylinder block 502 on holder 501, the piston in cylinder 510
Bar is connect with 506 one end of connecting plate, and 506 other end of connecting plate is connect with mounting plate 503, and holder 501 is equipped with sliding rail 509, peace
Loading board 503 is flexibly connected with sliding rail 509, and 509 one end of sliding rail is equipped with limited block 507, and limited block 507 is fixed on holder 501, is limited
Second cushion pad 508 is installed, buffering pad support 504 is installed on mounting plate 503, buffers and pacify on pad support 504 on the block 507 of position
Equipped with the first cushion pad 505.Remaining is the same as embodiment 1.
Embodiment 3, a kind of silicon chip inserted sheet silicon wafer buffer device, wherein：First cushion pad, 505 surface and horizontal plane
At 95 degree of angles, prevent silicon chip with piece basket 4 when up moving, silicon chip is stopped by the first cushion pad 505, leads to silicon chip
The case where disintegrating tablet occur occurs.Remaining is the same as embodiment 1.
Operation principle：
When after the completion of inserted sheet, lifting motor 301 starts a upper lattice in piece basket 4, lifting motor 301 drives screw rod transmission
Lead screw rotation in module 302, lead screw drive promotion platform 303 to move upwards, and promote platform 303 and ramp up one with movable plate basket 4
Silicon chip is transported to progress inserted sheet work in 4 grid of piece basket parallel with silicon chip conveyer belt 2 by lattice, then, silicon chip conveyer belt 2,
During inserted sheet, start cylinder 510, the piston rod in cylinder 510 is made to extend, piston rod pushes connecting plate 506 to move, connection
Plate 506 pushes mounting plate 503 to be moved along sliding rail 509, and mounting plate 503 drives buffering pad support 504 to move, and buffers pad support
504 drive the movement of the first cushion pad 505, and silicon chip is made to inject first the first cushion pad 505 with silicon wafer buffer module 5 in piece basket 4
Contact, the first cushion pad 505 using rubber as material, the first cushion pad 505 can absorb well silicon chip insertion piece basket 4 when
Kinetic energy plays cushioning effect, and after the kinetic energy of silicon chip largely releases, the piston rod retraction in cylinder 510 makes the first buffering
Pad 505 is returned, and for silicon chip when being contacted with piece basket 4, piece basket 4 is just reduced to minimum, silicon chip to the damage caused by silicon chip at this time
Disintegrating tablet and scribing situation also reduce the probability of generation, are effectively protected silicon chip, improve the qualification rate of silicon chip.
Claims (3)
1. a kind of silicon chip inserted sheet silicon wafer buffer device, including plug-in sheet machine rack（1）, silicon chip conveyer belt（2）, promoted module（3）、
Lifting motor（301）, screw rod transmission module（302）, promoted platform（303）, piece basket（4）, silicon wafer buffer module（5）；Its feature
It is：Plug-in sheet machine rack（1）Upper side is equipped with silicon chip conveyer belt（2）, silicon chip conveyer belt（2）Side, which is equipped with, promotes module（3）,
Promote module（3）It is fixed on plug-in sheet machine rack（1）On, promote module（3）By lifting motor（301）, screw rod transmission module
（302）, promoted platform（303）Composition, lifting motor（301）With screw rod transmission module（302）It is coaxially connected, screw rod transmission module
（302）With promotion platform（303）Connection, piece basket（4）It is fixed on promotion platform（303）On, promote module（3）Side is equipped with silicon chip
Buffer module（5）, silicon wafer buffer module（5）It is installed on plug-in sheet machine rack（1）On.
2. a kind of silicon chip inserted sheet silicon wafer buffer device according to claim 1, the silicon wafer buffer module（5）Including branch
Frame（501）, cylinder block（502）, mounting plate（503）, buffering pad support（504）, the first cushion pad（505）, connecting plate（506）、
Limited block（507）, the second cushion pad（508）, sliding rail（509）, cylinder（510）；It is characterized in that：Cylinder（510）Pass through cylinder
Seat（502）It is fixed on holder（501）On, cylinder（510）Interior piston rod and connecting plate（506）One end connects, connecting plate（506）
The other end and mounting plate（503）Connection, holder（501）It is equipped with sliding rail（509）, mounting plate（503）With sliding rail（509）Activity is even
It connects, sliding rail（509）One end is equipped with limited block（507）, limited block（507）It is fixed on holder（501）On, limited block（507）Upper peace
Equipped with the second cushion pad（508）, buffer pad support（504）It is installed on mounting plate（503）On, buffer pad support（504）Upper installation
There is the first cushion pad（505）.
3. a kind of silicon chip inserted sheet silicon wafer buffer device according to claim 2, it is characterised in that：First cushion pad
（505）Surface is with horizontal plane at 95 degree of angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820010492.6U CN207719228U (en) | 2018-01-04 | 2018-01-04 | A kind of silicon chip inserted sheet silicon wafer buffer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820010492.6U CN207719228U (en) | 2018-01-04 | 2018-01-04 | A kind of silicon chip inserted sheet silicon wafer buffer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719228U true CN207719228U (en) | 2018-08-10 |
Family
ID=63054660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820010492.6U Expired - Fee Related CN207719228U (en) | 2018-01-04 | 2018-01-04 | A kind of silicon chip inserted sheet silicon wafer buffer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719228U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113629173A (en) * | 2021-10-11 | 2021-11-09 | 江苏泰明易自动化设备有限公司 | Quartz boat inserting piece device |
-
2018
- 2018-01-04 CN CN201820010492.6U patent/CN207719228U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113629173A (en) * | 2021-10-11 | 2021-11-09 | 江苏泰明易自动化设备有限公司 | Quartz boat inserting piece device |
| CN113629173B (en) * | 2021-10-11 | 2021-12-07 | 江苏泰明易自动化设备有限公司 | Quartz boat inserting piece device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180810 Termination date: 20200104 |