CN207706519U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
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- CN207706519U CN207706519U CN201820123462.6U CN201820123462U CN207706519U CN 207706519 U CN207706519 U CN 207706519U CN 201820123462 U CN201820123462 U CN 201820123462U CN 207706519 U CN207706519 U CN 207706519U
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- circuit board
- substrate
- printed circuit
- copper
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Abstract
The utility model is related to a kind of printed circuit board, multiple telltale holes are provided on substrate, telltale hole runs through the top and bottom of printed circuit board, and top and bottom are all covered with layers of copper, is located at whole layers of copper of bottom surface not covered with solder mask.Printed circuit board described in the utility model makes layers of copper be exposed by removing the solder mask covered in traditional circuit-board, then it can increase the contact area between optical device and circuit board ground plane, improve impedance so that impedance is then conducive to the transmission of signal closer to design requirement.
Description
Technical field
The utility model is related to field of circuit technology, more particularly to a kind of printed circuit board.
Background technology
It is disposed with telltale hole on the substrate of printed circuit board, for connecting circuit board and device pin.Only in optical module,
For flexible PCB for connecting optical device, there are 4 telltale holes, a respectively ground hole, a pair of of high speed on the substrate
Rate telltale hole, a signal string holes.As shown in figure 3, the entire top and bottom of the circuit board are covered with layers of copper, layers of copper outside
It is also covered with solder mask or strengthening course.Due to the setting of the solder mask (coating) so that the connection of circuit board and optical device is steady
Qualitative reduction is then unfavorable for the control of impedance, and impedance is difficult to match with design requirement, and there are larger differences.
Utility model content
The purpose of this utility model is to provide a kind of printed circuit boards, to reduce the difference of impedance and design requirement.
In order to realize that above-mentioned purpose of utility model, the utility model embodiment provide following technical scheme：
A kind of printed circuit board, including substrate, multiple telltale holes are provided on the substrate, and telltale hole runs through printed circuit
The top and bottom of the top and bottom of plate, substrate are all covered with layers of copper, are located at whole layers of copper of substrate bottom surface not covered with resistance
Layer.
As another embodiment, a kind of printed circuit board, including substrate is provided with multiple signals on the substrate
Hole, telltale hole run through the top and bottom of substrate, and the bottom surface of substrate is just coated with layers of copper, and the top surface of substrate is covered with layers of copper.
Above-mentioned printed circuit board makes layers of copper be exposed, works as light by removing the solder mask covered outside the whole layers of copper of bottom surface
After the signal pins of device are inserted into telltale hole, the contact area of optical device and circuit board ground plane can be increased, it then can be with
Improve impedance so that impedance is conducive to the transmission of signal closer to design requirement.
Preferably, in above-mentioned printed circuit board, multiple telltale holes include a ground hole, and the aperture of ground hole is more than it
The aperture of his telltale hole.Further, the aperture of ground hole is 0.8-1.2mm.
Usually, the grounding pin of optical device wants wider in endpoint there, by expanding the aperture of ground hole, when welding
Grounding pin can be made preferably to be contacted with circuit board, so that welding is more stable.
Preferably, in above-mentioned printed circuit board, the signal bore edges positioned at top surface are provided with weld-ring, are located at the signal of bottom surface
Weld-ring is not arranged for bore edges.
Traditional circuit board, telltale hole are both provided with weld-ring in board top surface and bottom surface, and signal stream can be through circuit board top
Face weld-ring flows to bottom surface weld-ring, then is flowed out from top surface weld-ring, can reduce the transmission rate of signal stream in this way.In foregoing circuit plate,
By the way that weld-ring only is arranged in top surface, signal stream directly flows out from the inflow of top surface weld-ring, eliminates and flow through bottom surface weld-ring and flow out again again
Process, thus reduce stub effects, improve signal transmission performance.
Preferably, the part layers of copper positioned at top surface is cladded with and is stamped solder mask, top surface surrounds the layers of copper of the multiple telltale hole
Not covered with solder mask.The solder mask covered outside the layers of copper of telltale hole is surrounded by removal, the layers of copper in part region is made to expose
Out, more convenient for welding.
The printed circuit board that the utility model embodiment provides is made by removing the solder mask covered outside the whole layers of copper of bottom surface
Layers of copper is exposed, and after the signal pins of optical device are inserted into telltale hole, can increase optical device and circuit board ground plane
Contact area can then improve impedance so that impedance is conducive to the transmission of signal closer to design requirement.
Description of the drawings
It, below will be to required use in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the bottom surface structure schematic diagram for the printed circuit board that the utility model embodiment provides.
Fig. 2 is the top surface structure schematic diagram for the printed circuit board that the utility model embodiment provides.
Fig. 3 is bottom surface (not covering solder mask) structural schematic diagram of printed circuit board in the prior art.
Description of symbols in figure
10- substrates；20- telltale holes；30- layers of copper；40- ground holes.
Specific implementation mode
Below in conjunction with attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu is fully described by, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole realities
Apply example.The component of the utility model embodiment being usually described and illustrated herein in the accompanying drawings can be come with a variety of different configurations
Arrangement and design.Therefore, the detailed description of the embodiments of the present invention to providing in the accompanying drawings is not intended to limit below
Claimed the scope of the utility model, but it is merely representative of the selected embodiment of the utility model.Based on the utility model
Embodiment, the every other embodiment that those skilled in the art are obtained without making creative work, all
Belong to the range of the utility model protection.
Embodiment 1
Please refer to Fig.1-2, the printed circuit board provided in the present embodiment, including substrate 10, on substrate 10 there are four settings
Telltale hole 20, telltale hole 20 run through the top and bottom of substrate 10, and the top and bottom of substrate 10 are all covered with layers of copper 30, are located at
Solder mask is covered with outside the part layers of copper 30 of top surface, top surface surrounds the layers of copper 30 of four telltale holes 20 not covered with solder mask, position
In bottom surface whole layers of copper 30 not covered with solder mask.
Printed circuit board described in the present embodiment, can be used for connecting TOSA, and four signal pins of TOSA are electric from printing
The bottom surface of road plate is pierced by after being inserted into corresponding four telltale holes 20 from top surface, then is welded using scolding tin.Due to the copper of bottom surface
Layer 30 is all exposed, and the contact area bigger of TOSA and circuit board ground plane can then increase impedance so that impedance is more
Close to design value, realizes better impedance matching, be more advantageous to signal transmission.In simulation model, pass through exposed circuits
Whole layers of copper 30 in board bottom face, impedance increases.
In addition, surrounding the solder mask covered outside the layers of copper 30 of telltale hole 20 by removal, the region layers of copper 30 is made to expose
Come, more convenient for welding.
Since the contact area of TOSA and circuit board is limited, the contact surface of TOSA and circuit board is less than the bottom surface face of circuit board
Product is not being helped not in contact with region overlay layers of copper 30 for improving impedance matching, therefore can be only in the part area of bottom surface
Domain covers layers of copper 30, as shown in Figure 1, layers of copper 30 surrounds telltale hole 20, i.e. layers of copper plane surrounds telltale hole 20.
Embodiment 2
- 2 are please referred to Fig.1, compared with Example 1, difference lies in four signals for printed circuit board described in the present embodiment
The aperture of ground hole 40 in hole 20 is more than the aperture of other three telltale holes 20.
Usually, the grounding pin for being inserted into ground hole 40 wants wider in endpoint there, traditional circuit board, ground hole 40
Size it is consistent with the size of other telltale holes 20, when grounding pin be inserted into ground hole 40 and weld after, the endpoint of grounding pin
Gap is formed between circuit board, the stability being unfavorable between optical device and circuit board.In the present embodiment, by that will be grounded
The borehole enlargement in hole 40 so that more scolding tin can be accommodated in ground hole 40, scolding tin can fill that after ground hole 40 is precipitated
The connection between TOSA and circuit board is better achieved so that welding is more stable in a gap.
Usually, a diameter of 1.0mm of the grounding pin endpoint of optical device, therefore the size of ground hole 40 can also use
1.0mm, but the size of ground hole 40 can also the slightly larger or slightly smaller grounding pin endpoint in optical device size, such as be grounded
The aperture in hole 40 is that 0.8-1.2mm is good selection.
Embodiment 3
- 2 are please referred to Fig.1, compared with Example 2, difference lies in be located at top surface to printed circuit board described in the present embodiment
20 edge of telltale hole be provided with weld-ring, positioned at 20 edge of telltale hole of bottom surface be not arranged weld-ring (in Fig. 1 outside telltale hole 20 one
Circle is the edge of layers of copper 30, rather than weld-ring).Four signal pins of TOSA are inserted into telltale hole 20 from the bottom surface of printed circuit board
It is pierced by from top surface, is welded by weld-ring in top surface afterwards.
Traditional circuit board, telltale hole 20 are both provided with weld-ring in board top surface and bottom surface, and signal stream can be through circuit board
Top surface weld-ring flows to bottom surface weld-ring, then is flowed out from top surface weld-ring, can reduce the transmission rate of signal stream in this way.The present embodiment provides
Printed circuit board, by only top surface be arranged weld-ring, signal stream directly from top surface weld-ring inflow flows out again, eliminate and flow through bottom
The process that face weld-ring flows out again, thus reduce stub effects, improve signal transmission performance.
It should be noted that in above-mentioned several embodiments, only for insertion into new to this practicality for the circuit board of TOSA
Type printed circuit board is described, and the scheme of any of the above-described embodiment is readily applicable to other flexible PCBs.
Above description is only a specific implementation of the present invention, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replace, it should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model is answered described with power
Subject to the protection domain that profit requires.
Claims (12)
1. a kind of printed circuit board, which is characterized in that including substrate, multiple telltale holes are provided on the substrate, telltale hole passes through
The top and bottom of substrate are worn, the top and bottom of substrate are all covered with layers of copper, and whole layers of copper positioned at substrate bottom surface do not cover
There is solder mask.
2. printed circuit board according to claim 1, which is characterized in that multiple telltale holes include a ground hole, are connect
The aperture in ground hole is more than the aperture of other telltale holes.
3. printed circuit board according to claim 2, which is characterized in that the aperture of ground hole is 0.8-1.2mm.
4. according to any printed circuit boards of claim 1-3, which is characterized in that be located at the signal bore edges of substrate top surface
It is provided with weld-ring, weld-ring is not arranged for the signal bore edges positioned at substrate bottom surface.
5. printed circuit board according to claim 4, which is characterized in that be cladded with and be stamped positioned at the part layers of copper of substrate top surface
Solder mask, substrate top surface surround the layers of copper of the multiple telltale hole not covered with solder mask.
6. printed circuit board according to claim 4, which is characterized in that the telltale hole is four, for being inserted into TOSA
Connection pin.
7. a kind of printed circuit board, which is characterized in that including substrate, multiple telltale holes are provided on the substrate, telltale hole passes through
The top and bottom of substrate are worn, the bottom surface of substrate is just coated with layers of copper, and the top surface of substrate is covered with layers of copper.
8. printed circuit board according to claim 7, which is characterized in that multiple telltale holes include a ground hole, are connect
The aperture in ground hole is more than the aperture of other telltale holes.
9. printed circuit board according to claim 7, which is characterized in that be covered with outside whole layers of copper of substrate top surface
Solder mask.
10. printed circuit board according to claim 7, which is characterized in that be located at the overcoating lid of part layers of copper of substrate top surface
There are solder mask, the layers of copper that substrate top surface surrounds the multiple telltale hole outer not covered with solder mask.
11. according to any printed circuit boards of claim 8-10, which is characterized in that be located at the signal hole edge of substrate top surface
Edge is provided with weld-ring, and weld-ring is not arranged for the signal bore edges positioned at substrate bottom surface.
12. printed circuit board according to claim 11, which is characterized in that the telltale hole is four, for being inserted into
The connection pin of TOSA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820123462.6U CN207706519U (en) | 2018-01-25 | 2018-01-25 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820123462.6U CN207706519U (en) | 2018-01-25 | 2018-01-25 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207706519U true CN207706519U (en) | 2018-08-07 |
Family
ID=63034329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820123462.6U Active CN207706519U (en) | 2018-01-25 | 2018-01-25 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207706519U (en) |
-
2018
- 2018-01-25 CN CN201820123462.6U patent/CN207706519U/en active Active
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