CN207699518U - A kind of adhesive tape for heat dissipation - Google Patents
A kind of adhesive tape for heat dissipation Download PDFInfo
- Publication number
- CN207699518U CN207699518U CN201721817300.4U CN201721817300U CN207699518U CN 207699518 U CN207699518 U CN 207699518U CN 201721817300 U CN201721817300 U CN 201721817300U CN 207699518 U CN207699518 U CN 207699518U
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- graphite linings
- base material
- metal mesh
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model belongs to tape technology field, disclose a kind of adhesive tape for heat dissipation, including the anti-fingerprint layer set gradually, heat conduction pressure-sensitive adhesive layer, insulating coating, artificial synthesized graphite linings, Adhesion enhancement graphite linings, metal mesh base material, high-temperature plastic adhesion coating, PET film layer, the anti-fingerprint layer is located at heat conduction pressure-sensitive adhesive layer top, the heat conduction pressure-sensitive adhesive layer is located at insulating coating top, the insulating coating is located at artificial synthesized graphite linings top, the artificial synthesized graphite linings are located at Adhesion enhancement graphite linings top, the Adhesion enhancement graphite linings are located at metal mesh base material top, the metal mesh base material is located at high-temperature plastic adhesion coating top, the high-temperature plastic adhesion coating is located at PET film layer top.It the adhesive tape good heat dissipation effect of the utility model, anti-fingerprint, antistatic, high temperature resistant and insulate.
Description
Technical field
The utility model belongs to tape technology field, and in particular to a kind of adhesive tape for heat dissipation.
Background technology
With modern microelectronic technology high speed development, electronic equipment（Such as laptop, mobile phone, tablet computer）Increasingly
Become ultra-thin, light, this structure makes electronic equipment internal power density significantly improve, and generated heat is not easy in operation
It is discharged, is easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity
Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently
It needs a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensures electronic equipment normal operation.
Heat dissipation adhesive tape is that a kind of intermediate thermal conductivity is viscous and body, for the electronic device of fever with radiating element it is viscous and, play
Conduct the effect of heat.It typically is the two-sided colloids with thermal conductive property.Traditional Heat dissipation adhesive tape uses plastics, paper, nothing
Woven fabric etc. is used as base material, but these heat-conductive characteristics are low, has the shortcomings that the heat dissipation effect of Heat dissipation adhesive tape reduces.
In addition, traditional Heat dissipation adhesive tape uses graphite material, although its heat conductivity is outstanding, graphite material itself is
Sheet, therefore when being assembled to constitute cooling mechanism, the problem being susceptible in the processing such as crushing and damage.In addition, according to
Thermal diffusion principle, heat transfer are to be constituted with horizontal direction, therefore there is a problem of that heat conduction efficiency is low.
Traditional Heat dissipation adhesive tape, because heat transfer is carried out according to horizontal direction, therefore, its thicker pyroconductivity of thickness
It is more outstanding.Because Heat dissipation adhesive tape thickness is thinner, its pyroconductivity is lower, therefore the electronic product for requiring sophistication
It is had certain limitations for exploitation.
On the other hand, electrostatic protection is always a subject being taken seriously in present high-tech industry, and product is manufacturing
Cause to damage with the influence of electrostatic is easily received during use, this respect is especially with semiconductor industry and LCD screen system
Make the deepest feelings of industry.
It is outstanding and have both the adhesive tape of multiple functions therefore, it is necessary to develop a kind of heat dissipation effect.
Invention content
The purpose of this utility model is to provide that a kind of heat dissipation effect is excellent, adhesive tapes with performances such as insulation high-temperature-resistants.
In order to achieve the above objectives, the utility model uses following technical scheme：
A kind of adhesive tape for heat dissipation, including the anti-fingerprint layer, heat conduction pressure-sensitive adhesive layer, insulating coating, artificial that sets gradually
Compound stone layer of ink, Adhesion enhancement graphite linings, metal mesh base material, high-temperature plastic adhesion coating, PET film layer, anti-fingerprint layer position
In heat conduction pressure-sensitive adhesive layer top, the heat conduction pressure-sensitive adhesive layer is located at insulating coating top, and the insulating coating is located at artificial synthesized
Graphite linings top, the artificial synthesized graphite linings are located at Adhesion enhancement graphite linings top, Adhesion enhancement graphite linings position
In metal mesh base material top, the metal mesh base material is located at high-temperature plastic adhesion coating top, and it is thin that the high-temperature plastic adhesion coating is located at PET
Film layer top.
Further, the heat conduction pressure-sensitive adhesive layer is the pressure sensitive adhesive containing conductive powder, and thickness is 30 ~ 55 μm.
Further, the insulating coating is the heat conduction copper foil of 8 ~ 12 μm of thickness.
Further, the thickness of the artificial synthesized graphite linings is 30 ~ 100 μm.
Further, the Adhesion enhancement graphite linings are to pass through high-voltage corona work in the lower surface of artificial synthesized graphite linings
It is formed after skill.
Further, the thickness of the Adhesion enhancement graphite linings is 5 ~ 10 μm.
Further, the metal mesh base material is fine copper net.
Further, a diameter of gold 2 ~ 20 μm, extended in the same direction through broadwise wire of the metal mesh base material
It is 200 ~ 500 μm to belong to the spacing between silk.
Further, the thickness of the high-temperature plastic adhesion coating is 2 ~ 5 μm.
Further, the thickness of the PET film layer is 20 ~ 40 μm.
The utility model has the advantages that：
1, the utility model is to have height in the horizontal direction by the way that metal mesh base material and graphite linings, artificial synthesized graphite is arranged
The heat sink material of heat conduction, metal mesh base material have high thermal conductivity in vertical direction, and therefore, the heat transfer of adhesive tape and dispersion are not only
It can carry out, can also be carried out in vertical direction in the horizontal direction, even heat, quickly export can be made, there is outstanding heat to pass
Conductance, and heat dissipation can be effectively performed using only the Heat dissipation adhesive tape of small area.
2, the wire of metal mesh base material simultaneously there is good electric conductivity and thermal conductivity, make adhesive tape had both heat transfer and
Electromagnetic shielding（It is antistatic）Function not only improves the thickness for reducing electronic product, can also reduce the manufacture complexity journey of electronic product
Degree contributes to electronic product manufacturer to improve production efficiency.
3, after the lower surface of artificial synthesized graphite linings is handled by high-voltage corona, surface roughening forms Adhesion enhancement stone
Layer of ink increases the contact area of metal mesh base material and artificial synthesized graphite, heat dissipation area is improved, to improve heat dissipation effect.
4, by the way that insulating layer is arranged, the insulation performance of adhesive tape is superior, can effectively reduce the radiation to human body, while corrosivity
It is low, the corrosion failure to metal device can be effectively reduced when being contacted with hardware.
Description of the drawings
Fig. 1 is the structural schematic diagram of adhesive tape provided by the utility model.
Specific implementation mode
Utility model will be further described in detail below with reference to the attached drawings and specific embodiments.
As shown in Figure 1, the adhesive tape of the utility model, including set gradually anti-fingerprint layer 1, heat conduction pressure-sensitive adhesive layer 2, insulation
Coating 3, artificial synthesized graphite linings 4, Adhesion enhancement graphite linings, 5 metal mesh base materials 6, high-temperature plastic adhesion coating 7, PET film layer 8,
The anti-fingerprint layer 1 is located at 2 top of heat conduction pressure-sensitive adhesive layer, and the heat conduction pressure-sensitive adhesive layer 2 is located at 3 top of insulating coating, described exhausted
Edge coating 3 is located at 4 top of artificial synthesized graphite linings, and the artificial synthesized graphite linings 4 are located at 5 top of Adhesion enhancement graphite linings,
The Adhesion enhancement graphite linings 5 are located at 6 top of metal mesh base material, and the metal mesh base material 6 is located on high-temperature plastic adhesion coating 7
Portion, the high-temperature plastic adhesion coating 7 are located at 8 top of PET film layer.
The design of anti-fingerprint layer makes adhesive tape have the function of anti-fingerprint.
Heat conduction pressure-sensitive adhesive layer is the pressure sensitive adhesive containing conductive powder, and thickness is 30 ~ 55 μm, in a specific embodiment
In, thickness is 40 μm.
Heat conduction and heat radiation effect can be played by increasing conductive powder in pressure sensitive adhesive.Conductive powder is aluminium oxide, aluminium nitride, magnesia or oxygen
Change zinc.
Insulating coating is the heat conduction copper foil of 8 ~ 12 μm of thickness, and in a specific embodiment, copper thickness is 10 μm.
By the way that insulating layer is arranged, the insulation performance of adhesive tape is superior, can effectively reduce the radiation to human body, while corrosivity
It is low, the corrosion failure to metal device can be effectively reduced when being contacted with hardware.
The thickness of artificial synthesized graphite linings is 30 ~ 100 μm, and in a specific embodiment, thickness is 50 μm.
Adhesion enhancement graphite linings are formed after high-voltage corona technique in the lower surface of artificial synthesized graphite linings.
The thickness of Adhesion enhancement graphite linings is 5 ~ 10 μm, and in a specific embodiment, thickness is 7 μm.
After the lower surface of artificial synthesized graphite linings is handled by high-voltage corona, surface roughening forms Adhesion enhancement graphite
Layer increases the contact area of metal mesh base material and artificial synthesized graphite, heat dissipation area is improved, to improve heat dissipation effect.
Metal mesh base material is fine copper net.
A diameter of 2 ~ 20 μm through broadwise wire of metal mesh base material, in a specific embodiment, thickness are 10 μ
m；If when 2 μm discontented, the advantage on metal net structure can not be embodied, when more than 20 μm, coating will be unable to smoothen, and lead to processability
Decline.The thickness of the metal mesh can be according to using the product of heat release adhesive tape properly select using.
Spacing between the wire extended in the same direction is 200 ~ 500 μm, and in a specific embodiment, thickness is 300 μ
m。
Metal mesh base material has reticulated structure, therefore while metal part carries out heat transfer according to heat-conduction principle,
Heat transfer is carried out by the gap section of net convenient for heat dissipation and according to thermal convection current and radiation theory.It is low using pyroconductivity with tradition
Under base material when, from pyrotoxin be conducted through come heat radiated in a horizontal manner and travel to pyrotoxin periphery principle drop
The temperature of low heating position is compared, when using metal mesh base material, be will from pyrotoxin be conducted through come heat with vertical direction into
Principle in row heat loss through conduction to air reduces the temperature of heating position.This vertical heat conduction principle has than horizontal conductive
Better heat dissipation effect.
In addition, the wire of metal mesh base material has good electric conductivity and thermal conductivity simultaneously, adhesive tape is made to have had both hot biography
It leads and is electromagnetically shielded（It is antistatic）Function not only improves the thickness for reducing electronic product, and the manufacture that can also reduce electronic product is multiple
Miscellaneous degree contributes to electronic product manufacturer to improve production efficiency.
Metal mesh can form film and completely cut off the contact with air when with heat radiation coating coating, therefore, do not have and get rusty
Misgivings.
By the way that metal mesh base material and graphite linings are arranged, artificial synthesized graphite is the heat dissipation material for having in the horizontal direction high heat conduction
Material, metal mesh base material have high thermal conductivity in vertical direction, and therefore, the heat transfer of adhesive tape and dispersion not only can be in level sides
It to progress, can also be carried out in vertical direction, even heat, quickly export can be made, there is outstanding pyroconductivity, and be used only
Heat dissipation can be effectively performed in the Heat dissipation adhesive tape of small area.
The thickness of high-temperature plastic adhesion coating is 2 ~ 5 μm, and in a specific embodiment, thickness is 3 μm.
High-temperature plastic adhesion coating makes adhesive tape be resistant to high temperature, avoids adhesive tape hot-spot, and support can also be played to graphite and is made
With can also prevent entry material from falling off, avoid short circuit, to improve performance and the service life of product.
The thickness of PET film layer is 20 ~ 40 μm, and in a specific embodiment, thickness is 30 μm.
In conclusion the adhesive tape of the utility model integrates the functions such as heat conduction, heat dissipation, finished product thickness is reduced, simultaneously
With excellent heat conduction and heat radiation performance, performance is better than traditional adhesive tape, is suitable for tablet computer, mobile phone, LCD display, LED light
Heat conduction, field of radiating etc. various consumer electronics products.
The description of the embodiments and the specification only illustrate the principle of the present utility model and most preferred embodiment, is not taking off
Under the premise of from the spirit and scope of the utility model, the utility model also has various changes and improvements, these changes and improvements
It both falls in claimed the scope of the utility model.
Claims (10)
1. a kind of adhesive tape for heat dissipation, which is characterized in that including the anti-fingerprint layer, heat conduction pressure-sensitive adhesive layer, insulation set gradually
Coating, artificial synthesized graphite linings, Adhesion enhancement graphite linings, metal mesh base material, high-temperature plastic adhesion coating, PET film layer, it is described anti-
Finger print layer is located at heat conduction pressure-sensitive adhesive layer top, and the heat conduction pressure-sensitive adhesive layer is located at insulating coating top, and the insulating coating is located at
Artificial synthesized graphite linings top, the artificial synthesized graphite linings are located at Adhesion enhancement graphite linings top, the Adhesion enhancement
Graphite linings are located at metal mesh base material top, and the metal mesh base material is located at high-temperature plastic adhesion coating top, the high-temperature plastic adhesion coating
Positioned at PET film layer top.
2. adhesive tape according to claim 1, which is characterized in that the heat conduction pressure-sensitive adhesive layer is to contain the pressure-sensitive of conductive powder
Glue, thickness are 30 ~ 55 μm.
3. adhesive tape according to claim 1, which is characterized in that the insulating coating is the heat conduction copper foil of 8 ~ 12 μm of thickness.
4. adhesive tape according to claim 1, which is characterized in that the thickness of the artificial synthesized graphite linings is 30 ~ 100 μm.
5. adhesive tape according to claim 1, which is characterized in that the Adhesion enhancement graphite linings are in artificial synthesized graphite
The lower surface of layer is formed after high-voltage corona technique.
6. adhesive tape according to claim 1, which is characterized in that the thickness of the Adhesion enhancement graphite linings is 5 ~ 10 μm.
7. adhesive tape according to claim 1, which is characterized in that the metal mesh base material is fine copper net.
8. adhesive tape according to claim 1, which is characterized in that the metal mesh base material through a diameter of of broadwise wire
2 ~ 20 μm, the spacing between the wire extended in the same direction is 200 ~ 500 μm.
9. adhesive tape according to claim 1, which is characterized in that the thickness of the high-temperature plastic adhesion coating is 2 ~ 5 μm.
10. adhesive tape according to claim 1, which is characterized in that the thickness of the PET film layer is 20 ~ 40 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721817300.4U CN207699518U (en) | 2017-12-22 | 2017-12-22 | A kind of adhesive tape for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721817300.4U CN207699518U (en) | 2017-12-22 | 2017-12-22 | A kind of adhesive tape for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207699518U true CN207699518U (en) | 2018-08-07 |
Family
ID=63027800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721817300.4U Active CN207699518U (en) | 2017-12-22 | 2017-12-22 | A kind of adhesive tape for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207699518U (en) |
-
2017
- 2017-12-22 CN CN201721817300.4U patent/CN207699518U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101248328B (en) | Thermal lamination module | |
| JP3122382U (en) | Thermal conduction member, heat dissipation structure, and electronic equipment | |
| KR101796206B1 (en) | thermal dissipation pad | |
| KR101043346B1 (en) | Organo-inorganic hybrid composition with excellent thermal radiation and thermal radiation sheet of thin layer type which uses this | |
| CN207942773U (en) | A kind of heat dissipation graphite flake | |
| KR20170080096A (en) | Radiating sheet | |
| WO2017045232A1 (en) | Natural graphite/aluminum composite heat sink | |
| CN207699518U (en) | A kind of adhesive tape for heat dissipation | |
| KR101361105B1 (en) | Heat radiation tape having excellent thermal conductivity | |
| CN208317104U (en) | The two-sided PCB circuit board radiator structure of multi-layered high-density | |
| CN207294673U (en) | A kind of heat conduction and heat radiation adhesive tape | |
| JP4075481B2 (en) | Metal-graphite sheet composite and electronic device | |
| WO2017045233A1 (en) | Natural graphite/copper composite heatsink | |
| EP3209102B1 (en) | Communication system and communication device therefor | |
| KR20190016417A (en) | Thermally conductive Sheet and Method for making the same | |
| CN209627789U (en) | A kind of multi-layer PCB board with shielding radiator structure | |
| CN114437644A (en) | Composite heat dissipation shielding adhesive tape and preparation method thereof | |
| CN202738247U (en) | Circuit board provided with improved heat dissipation performance | |
| CN107306489A (en) | The manufacture method of fin and fin | |
| CN210075914U (en) | Heat-dissipation copper foil for mobile phone | |
| CN207491316U (en) | A kind of high efficiency and heat radiation covers copper aluminum substrate | |
| CN111218230A (en) | Graphite heat conduction and dissipation adhesive tape | |
| CN104320925A (en) | Manufacture method of novel embedded type circuit board | |
| CN204810786U (en) | Radiating device and electronic device | |
| CN217306486U (en) | Double-sided heat dissipation aluminum substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |