CN207696351U - The part flow arrangement of sapphire polishing liquid - Google Patents
The part flow arrangement of sapphire polishing liquid Download PDFInfo
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- CN207696351U CN207696351U CN201721928197.0U CN201721928197U CN207696351U CN 207696351 U CN207696351 U CN 207696351U CN 201721928197 U CN201721928197 U CN 201721928197U CN 207696351 U CN207696351 U CN 207696351U
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- regulating tank
- lye
- polishing fluid
- control valve
- polishing
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Abstract
The utility model is related to the part flow arrangements of sapphire polishing liquid,Including regulating tank,PH detection probes are equipped in the regulating tank to pop one's head in Concentration Testing,Both sides connect lye tank and polishing fluid bucket by lye inlet tube with polishing fluid inlet tube respectively at the top of the regulating tank,The regulating tank side connects scuttlebutt by water inlet pipe,The lye inlet tube,It is separately installed with lye control valve on polishing fluid inlet tube and water inlet pipe,Polish hydraulic control valve and inlet valve,The regulating tank side is connected with agitator by the first liquid-in pipe,The utility model is by being arranged regulating tank,And pH detection probes is set, the pH value of polishing fluid is detected with concentration with Concentration Testing probe,PH value is adjusted by the way that lye is added,Concentration is adjusted by the way that clear water is added and polishing fluid is added,It is stirred subsequently into agitator,Keep the polishing fluid into each isocon relatively uniform,Finally by be arranged shunting bottom of the barrel supervisor enter it is each be in charge of shunt.
Description
Technical field
The utility model is related to the part flow arrangements of sapphire polishing liquid, belong to sapphire processing and manufacturing field.
Background technology
Sapphire is a kind of alumina single crystal material, has very high hardness, is generally using for current LED industry
Substrate material, the matrix as the growth of gallium nitride homepitaxy is to produce the light emitting diodes such as blue light, and carrying out, sapphire is processed
It needing to carry out single-sided polishing in journey, traditional polishing fluid part flow arrangement is to be supplied polishing fluid to polishing cloth by single pipeline,
Polishing fluid distributivity and controlling on polishing cloth is poor, influences processing quality, so as to cause sapphire wafer consistency of thickness,
Flatness, surface quality are all poor.
Sapphire polishing liquid is mainly used for the polishing of Sapphire Substrate, is but also widely used for the nano level Gao Ping of multiple material
Smoothization polishes, such as：The polishing of silicon chip, compound crystal, precision optics, jewel etc., polishing fluid are a kind of Aluminum sols
Or Ludox material, and such material main component is the sol particles of Nano grade, the size of sol particle, pattern are shadows
The key factor of polishing fluid polishing efficiency is rung, in process, because by physics, chemical collective effect, sol particle meeting
Breakage directly translates into pH value decline, and polishing fluid concentration is also to influence the key factor of polishing fluid stability, and concentration reduces, and throws
Light liquid polishing effect is substantially reduced, and can influence to polish the temperature of disk, and excessive concentration, equipment frictional resistance is excessive, influences
Equipment runs well.
And since polishing fluid is suspended particulate shape liquid, each substance is easy layering, utilization is typically necessary before use
After blender is stirred.
Utility model content
It the utility model proposes the part flow arrangement of sapphire polishing liquid, solves in the prior art, traditional polishing fluid shunting
Device is to be supplied polishing fluid to polishing cloth by single pipeline, and polishing fluid distributivity and controlling on polishing cloth is poor,
Processing quality is influenced, so as to cause all poor problem of sapphire wafer consistency of thickness, flatness, surface quality, this reality
With novel by the way that regulating tank is arranged, and pH detection probes be set, the pH value of polishing fluid is examined with concentration with Concentration Testing probe
It surveys, pH value is adjusted by the way that lye is added, concentration is adjusted by the way that clear water is added and polishing fluid is added, subsequently into agitator pair
It is stirred, and keeps the polishing fluid into each isocon relatively uniform, is entered finally by the supervisor being arranged in shunting bottom of the barrel each
It is a be in charge of shunted.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution：
The part flow arrangement of the utility model sapphire polishing liquid, including regulating tank, the regulating tank is interior to be equipped with pH detection spies
Head is popped one's head in Concentration Testing, and both sides connect lye tank by lye inlet tube with polishing fluid inlet tube respectively at the top of the regulating tank
With polishing fluid bucket, the regulating tank side by water inlet pipe connect scuttlebutt, the lye inlet tube, polishing fluid inlet tube with into
It is separately installed with lye control valve, polishing hydraulic control valve and inlet valve, the regulating tank side on water pipe and passes through the first liquid-in pipe
It is connected with agitator, stirring motor is installed at the top of the agitator, the stirring motor bottom connects agitating shaft, the stirring
Paddle is connected on axis, the stirring bottom of the barrel connects shunting bucket, the shunting bottom of the barrel connection master by the second liquid-in pipe
Pipe, be connected on the outside of the supervisor it is multiple be in charge of, it is described be in charge of flow control valve is installed, the pH detection probes, concentration
Detection probe, lye control valve, polishing hydraulic control valve, inlet valve and flow control valve side are electrically connected controller.
As a kind of optimal technical scheme of the utility model, the controller is PLC controller.
As a kind of optimal technical scheme of the utility model, the output end of the agitating shaft and the stirring motor connects
It connects, and the agitating shaft is at the top of the agitator.
As a kind of optimal technical scheme of the utility model, the paddle is S-shaped shape paddle.
As a kind of optimal technical scheme of the utility model, the quantity at least two being in charge of, and between ring-type etc.
Away from setting.
As a kind of optimal technical scheme of the utility model, liquid inlet is connected at the top of the regulating tank.
The advantageous effect that the utility model is reached is：The utility model is arranged pH detections and visits by the way that regulating tank is arranged
Head is detected the pH value of polishing fluid with concentration with Concentration Testing probe, adjusts pH value by the way that lye is added, passes through addition
Clear water adjusts concentration with polishing fluid is added, and is stirred to it subsequently into agitator, makes the polishing fluid ratio into each isocon
It is more uniform, finally by be arranged shunting bottom of the barrel supervisor enter it is each be in charge of shunt.
Description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
Novel embodiment for explaining the utility model, does not constitute limitations of the present invention together.In the accompanying drawings：
Fig. 1 is the structure chart of the utility model；
Fig. 2 is the electric connection figure of the utility model.
In figure：1, regulating tank；2, pH detection probes；3, Concentration Testing is popped one's head in；4, lye inlet tube；5, polishing fluid feed liquor
Pipe；6, lye tank；7, polishing fluid bucket；8, water inlet pipe；9, scuttlebutt；10, lye control valve；11, hydraulic control valve is polished；12, into
Water valve；13, the first liquid-in pipe；14, agitator；15, stirring motor；16, agitating shaft；17, paddle；18, the second liquid-in pipe；
19, bucket is shunted；20, it is responsible for；21, it is in charge of；22, flow control valve；23, controller.
Specific implementation mode
The preferred embodiment of the utility model is illustrated below in conjunction with attached drawing, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Embodiment 1
As shown in Figs. 1-2, the utility model provides the part flow arrangement of sapphire polishing liquid, including regulating tank 1, the adjusting
Be equipped with pH detection probes 2 and Concentration Testing in slot 1 and pop one's head in 3,1 top both sides of the regulating tank respectively by lye inlet tube 4 with
Polishing fluid inlet tube 5 connects lye tank 6 and polishing fluid bucket 7, and 1 side of the regulating tank connects scuttlebutt 9, institute by water inlet pipe 8
State lye inlet tube 4, be separately installed on polishing fluid inlet tube 5 and water inlet pipe 8 lye control valve 10, polishing hydraulic control valve 11 with
Inlet valve 12,1 side of the regulating tank are connected with agitator 14,14 top installation of the agitator by the first liquid-in pipe 13
There are stirring motor 15,15 bottom of the stirring motor to connect agitating shaft 16, paddle 17, institute are connected on the agitating shaft 16
It states 14 bottom of agitator and shunting bucket 19,19 bottom of the shunting bucket connection supervisor 20, the master is connected by the second liquid-in pipe 18
The outside of pipe 20 be connected with it is multiple be in charge of 21, it is described be in charge of on 21 flow control valve 22 is installed, the pH detection probes 2, concentration
Detection probe 3, lye control valve 10, polishing hydraulic control valve 11, inlet valve 12 are electrically connected control with 22 side of flow control valve
Device 23 processed.
The controller 23 is PLC controller, is common industrial control unit (ICU), the agitating shaft 16 and the stirring motor
15 output end connection, and the agitating shaft 16, through 14 top of the agitator, stirring motor 15 drives agitating shaft 16 to stir,
Keep the polishing fluid into each isocon relatively uniform, the paddle 17 is S-shaped shape paddle, keeps stirring relatively uniform, institute
State be in charge of 21 quantity at least two, and cyclic annular spaced set, for shunting polishing fluid, 1 top connection of the regulating tank
There is liquid inlet, is used for into liquid.
When the utility model is used, by the way that regulating tank 1 is arranged, and pH detection probes 2 are set and are popped one's head in 3 pairs with Concentration Testing
The pH value of polishing fluid is detected with concentration, is controlled 10 addition lye of lye control valve to adjust pH value by controller 23, is led to
It crosses inlet valve 12 and clear water and polishing hydraulic control valve 11 addition polishing fluid is added to adjust concentration, it is stirred subsequently into agitator 14
It mixes, keeps the polishing fluid into each isocon relatively uniform, enter finally by the supervisor 20 being arranged in 19 bottom of shunting bucket each
It is a to be in charge of 21 and shunted.
Finally it should be noted that：The preferred embodiment that these are only the utility model, is not limited to this practicality
It is novel, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art,
It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc.
With replacement.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all include
It is within the protection scope of the utility model.
Claims (6)
1. the part flow arrangement of sapphire polishing liquid, including regulating tank (1), which is characterized in that be equipped with pH in the regulating tank (1) and examine
Probing head (2) is popped one's head in (3) with Concentration Testing, and both sides pass through lye inlet tube (4) and polishing fluid respectively at the top of the regulating tank (1)
Inlet tube (5) connects lye tank (6) and polishing fluid bucket (7), and regulating tank (1) side connects scuttlebutt by water inlet pipe (8)
(9), it is separately installed with lye control valve (10) on the lye inlet tube (4), polishing fluid inlet tube (5) and water inlet pipe (8), throws
Light hydraulic control valve (11) and inlet valve (12), regulating tank (1) side is connected with agitator by the first liquid-in pipe (13)
(14), stirring motor (15) is installed at the top of the agitator (14), stirring motor (15) bottom connects agitating shaft (16),
Paddle (17) is connected on the agitating shaft (16), agitator (14) bottom is connected by the second liquid-in pipe (18) and shunted
Bucket (19), shunting bucket (19) bottom connection supervisor (20), supervisor (20) outside be connected with it is multiple be in charge of (21), it is described
It is in charge of on (21) and flow control valve (22) is installed, the pH detection probes (2), Concentration Testing probe (3), lye control valve
(10), polishing hydraulic control valve (11), inlet valve (12) and flow control valve (22) side are electrically connected controller (23).
2. the part flow arrangement of sapphire polishing liquid according to claim 1, which is characterized in that the controller (23) is
PLC controller.
3. the part flow arrangement of sapphire polishing liquid according to claim 1, which is characterized in that the agitating shaft (16) and institute
The output end connection of stirring motor (15) is stated, and the agitating shaft (16) is at the top of the agitator (14).
4. the part flow arrangement of sapphire polishing liquid according to claim 1, which is characterized in that the paddle (17) is S
Shape paddle.
5. the part flow arrangement of sapphire polishing liquid according to claim 1, which is characterized in that the quantity for being in charge of (21)
At least two, and cyclic annular spaced set.
6. the part flow arrangement of sapphire polishing liquid according to claim 1, which is characterized in that at the top of the regulating tank (1)
It is connected with liquid inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721928197.0U CN207696351U (en) | 2017-12-21 | 2017-12-21 | The part flow arrangement of sapphire polishing liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721928197.0U CN207696351U (en) | 2017-12-21 | 2017-12-21 | The part flow arrangement of sapphire polishing liquid |
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| Publication Number | Publication Date |
|---|---|
| CN207696351U true CN207696351U (en) | 2018-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721928197.0U Active CN207696351U (en) | 2017-12-21 | 2017-12-21 | The part flow arrangement of sapphire polishing liquid |
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| CN (1) | CN207696351U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109434694A (en) * | 2018-12-26 | 2019-03-08 | 泰州泰亮金属科技有限公司 | Automation polishing wax spray system equipment |
| CN111390747A (en) * | 2020-04-23 | 2020-07-10 | 福建晶安光电有限公司 | Quantitative slurry pumping and replacing device in semiconductor wafer processing |
| CN111546214A (en) * | 2020-04-23 | 2020-08-18 | 福建晶安光电有限公司 | Dynamic replacement control method and system for slurry in semiconductor wafer processing |
-
2017
- 2017-12-21 CN CN201721928197.0U patent/CN207696351U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109434694A (en) * | 2018-12-26 | 2019-03-08 | 泰州泰亮金属科技有限公司 | Automation polishing wax spray system equipment |
| CN111390747A (en) * | 2020-04-23 | 2020-07-10 | 福建晶安光电有限公司 | Quantitative slurry pumping and replacing device in semiconductor wafer processing |
| CN111546214A (en) * | 2020-04-23 | 2020-08-18 | 福建晶安光电有限公司 | Dynamic replacement control method and system for slurry in semiconductor wafer processing |
| CN111546214B (en) * | 2020-04-23 | 2022-04-22 | 福建晶安光电有限公司 | Dynamic replacement control method and system for slurry in semiconductor wafer processing |
| CN111390747B (en) * | 2020-04-23 | 2022-07-19 | 福建晶安光电有限公司 | Quantitative slurry pumping and replacing device in semiconductor wafer processing |
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