CN207674379U - PCB substrate LED module - Google Patents
PCB substrate LED module Download PDFInfo
- Publication number
- CN207674379U CN207674379U CN201721742156.2U CN201721742156U CN207674379U CN 207674379 U CN207674379 U CN 207674379U CN 201721742156 U CN201721742156 U CN 201721742156U CN 207674379 U CN207674379 U CN 207674379U
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- CN
- China
- Prior art keywords
- pcb substrate
- led lamp
- lamp bead
- mount led
- bead string
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of PCB substrate LED module, including PCB substrate, the Surface-mount LED lamp bead string being set in PCB substrate, the fluorescent adhesive layer being coated in PCB substrate and Surface-mount LED lamp bead string；Surface-mount LED lamp bead string both ends are connect with two electrodes respectively, and Surface-mount LED lamp bead string includes the Surface-mount LED lamp pearl that several are sequentially connected in series.The utility model has thermal diffusivity good, the feature that illumination effect is good, luminous efficiency is high.
Description
Technical field
The utility model is related to LED device technical fields, good more particularly, to a kind of thermal diffusivity, and illumination effect is good, luminous
Efficient PCB substrate LED module.
Background technology
LED module is that wider product is applied in LED product, and there is also prodigious differences in terms of configuration aspects and electronics
It is different, it is that wiring board and shell equipped with LED just make LED at a LED module, constant-current source and relevant radiating treatment with one
Service life and luminous intensity are more preferable.
It is mainly used for showing the night effect of advertisement font (acryl, plastic uptake) and mark, with word or is identified as medium,
Mounted on building top or metope, mark effect on daytime can be showed and using LED as illuminating source, showed at night
Go out another effect.
The LED module encapsulating structure of the prior art needs to use holder, Surface-mount LED lamp pearl is arranged again on holder, holder
Size can influence the distribution of Surface-mount LED lamp pearl, to limit light emitting region, light emitting angle, illumination effect and the hair of LED module
Light efficiency, and thermal diffusivity is bad.
Invention content
The goal of the invention of the utility model is that LED module light emitting region in the prior art is small, light emitting angle in order to overcome
Difference, illumination effect is poor, luminous efficiency is low and the deficiency of poor radiation, and it is good to provide a kind of thermal diffusivity, and illumination effect is good, shines and imitates
The high PCB substrate LED module of rate.
To achieve the goals above, the utility model uses following technical scheme：
A kind of PCB substrate LED module, including PCB substrate, the Surface-mount LED lamp bead string being set in PCB substrate are coated in PCB
Fluorescent adhesive layer on substrate and Surface-mount LED lamp bead string；Surface-mount LED lamp bead string both ends are connect with two electrodes respectively, Surface-mount LED lamp
Bead string includes the Surface-mount LED lamp pearl that several are sequentially connected in series.
The chip of the utility model will not be limited by stent size, and luminous efficiency is unaffected.The effect of heat dissipation
Fruit is more preferable, can accomplish higher Ts temperature, the luminous efficiency higher of module.
Preferably, adjacent Surface-mount LED lamp pearl is connected by bonding line.
Preferably, Surface-mount LED lamp bead string is S-shaped, PCB substrate is equipped with recessed for accommodating the S-shaped of Surface-mount LED lamp bead string
Slot.
Preferably, PCB substrate is rectangular, 4 corners of PCB substrate are arc-shaped.
Preferably, PCB substrate is made of CEM materials or FR-4 materials.FR-4 and CEM is the material that wiring board uses
Material, FR-4 is glass fabric base, and CEM is composite base.
Preferably, 2 electrodes stretch out except PCB substrate, PCB substrate, which is equipped with, to be respectively used to accommodate 2 electrodes one
2 grooves at end.
Therefore, the utility model has the advantages that：Thermal diffusivity is good, and illumination effect is good, luminous efficiency is high.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of the utility model；
Fig. 2 is that the utility model removes a kind of structural schematic diagram after fluorescent adhesive layer.
In figure：PCB substrate 1, Surface-mount LED lamp bead string 2, fluorescent adhesive layer 3, electrode 4, Surface-mount LED lamp pearl 5, bonding line 6.
Specific implementation mode
The utility model is further described with reference to the accompanying drawings and detailed description.
Embodiment as shown in Figure 1 and Figure 2 is a kind of PCB substrate LED module, including PCB substrate 1, is set in PCB substrate
Surface-mount LED lamp bead string 2, be coated in PCB substrate and Surface-mount LED lamp bead string on fluorescent adhesive layer 3；Surface-mount LED lamp bead string both ends
It is connect respectively with two electrodes 4, Surface-mount LED lamp bead string includes 9 Surface-mount LED lamp pearls 5 being sequentially connected in series.Adjacent LED patches
Lamp bead is connected by bonding line 6.
Surface-mount LED lamp bead string is S-shaped, and PCB substrate is equipped with the S-shaped groove for accommodating Surface-mount LED lamp bead string.PCB bases
Plate is rectangular, and 4 corners of PCB substrate are arc-shaped.PCB substrate is made of CEM materials.2 electrodes stretch out PCB bases
Except plate, PCB substrate is equipped with 2 grooves for being respectively used to accommodate 2 electrode one end.
The assemble method of the utility model is as follows：
Formal dress die bond
By Surface-mount LED lamp pearl die bond in PCB substrate, it is sequentially connected in series by gold thread positive and negative anodes between Surface-mount LED lamp pearl, it is right
PCB substrate after die bond coats fluorescent glue.
Upside-down mounting die bond
It has arranged in PCB substrate in advance gold thread,
By Surface-mount LED lamp pearl die bond in corresponding position, gold thread is connected with the positive and negative anodes of chip respectively, after die bond
PCB substrate coat fluorescent glue.
The advantage of the utility model：
In the prior art, when encapsulating 3 1428 series chips and 3 1130 series chips respectively using 2835 holder,
Luminous flux and light efficiency difference unobvious, are primarily due to the limitation of holder, affect the illumination effect of more large chip.
Compared with the encapsulating structure of the prior art, the utility model will not be limited by stent size, and luminous efficiency is not
It can be affected, the effect of heat dissipation is more preferable, can accomplish higher Ts temperature, the luminous efficiency higher of module.
It should be understood that the present embodiment is merely to illustrate the utility model rather than limitation the scope of the utility model.In addition
It should be understood that after reading the content taught by the present invention, those skilled in the art can make the utility model various
Change or modification, these equivalent forms also fall within the scope of the appended claims of the present application.
Claims (6)
1. a kind of PCB substrate LED module, characterized in that including PCB substrate (1), the Surface-mount LED lamp bead string being set in PCB substrate
(2), the fluorescent adhesive layer (3) being coated in PCB substrate and Surface-mount LED lamp bead string；Surface-mount LED lamp bead string both ends respectively with two electricity
Pole (4) connects, and Surface-mount LED lamp bead string includes the Surface-mount LED lamp pearl (5) that several are sequentially connected in series.
2. PCB substrate LED module according to claim 1, characterized in that adjacent Surface-mount LED lamp pearl passes through bonding
Line (6) connects.
3. PCB substrate LED module according to claim 1, characterized in that Surface-mount LED lamp bead string is S-shaped, in PCB substrate
Equipped with the S-shaped groove for accommodating Surface-mount LED lamp bead string.
4. PCB substrate LED module according to claim 1, characterized in that PCB substrate is rectangular, 4 angles of PCB substrate
Portion is arc-shaped.
5. PCB substrate LED module according to claim 1, characterized in that PCB substrate uses mono- 4 material of CEM materials or FR
Material is made.
6. according to the PCB substrate LED module described in claims 1 or 2 or 3 or 4 or 5, characterized in that 2 electrodes stretch out PCB
Except substrate, PCB substrate is equipped with 2 grooves for being respectively used to accommodate 2 electrode one end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721742156.2U CN207674379U (en) | 2017-12-14 | 2017-12-14 | PCB substrate LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721742156.2U CN207674379U (en) | 2017-12-14 | 2017-12-14 | PCB substrate LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207674379U true CN207674379U (en) | 2018-07-31 |
Family
ID=62969458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721742156.2U Active CN207674379U (en) | 2017-12-14 | 2017-12-14 | PCB substrate LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207674379U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109253406A (en) * | 2018-11-06 | 2019-01-22 | 杭州明煜光电科技有限公司 | The production technology of LED filament, lamps and lanterns and LED filament |
| CN109882750A (en) * | 2019-04-08 | 2019-06-14 | 蚌埠学院 | A kind of LED light and its fix tool and restorative procedure |
-
2017
- 2017-12-14 CN CN201721742156.2U patent/CN207674379U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109253406A (en) * | 2018-11-06 | 2019-01-22 | 杭州明煜光电科技有限公司 | The production technology of LED filament, lamps and lanterns and LED filament |
| CN109882750A (en) * | 2019-04-08 | 2019-06-14 | 蚌埠学院 | A kind of LED light and its fix tool and restorative procedure |
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