CN207596995U - A kind of silicon chip heats diffusion furnace - Google Patents
A kind of silicon chip heats diffusion furnace Download PDFInfo
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- CN207596995U CN207596995U CN201721467033.2U CN201721467033U CN207596995U CN 207596995 U CN207596995 U CN 207596995U CN 201721467033 U CN201721467033 U CN 201721467033U CN 207596995 U CN207596995 U CN 207596995U
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- boiler tube
- fire door
- temperature
- stove tail
- furnace body
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Abstract
The utility model discloses a kind of silicon chips to heat diffusion furnace, including furnace body and more boiler tubes being set in furnace body, furnace body is equipped with switch board, and the spaced transverse direction of boiler tube is installed in furnace body, and the both ends of boiler tube are set as fire door and stove tail, and fire door and stove tail are equipped with fire door in furnace body.Heating element is respectively equipped in the middle part of the fire door of boiler tube, stove tail and boiler tube, is equipped with quartz layer in boiler tube, and the outer surface of the fire door of boiler tube and stove tail is arranged with asbestos pad and asbestos ring respectively, the temperature in switch board real time monitoring and control furnace body.The fire door of the utility model and the outer surface of stove tail are arranged with asbestos pad and asbestos ring respectively, and then it can reach the effect kept the temperature to fire door and stove tail, prevent its heat dissipation from leading to the inconsistent influence product quality of 3, middle part temperature of fire door, stove tail and boiler tube, therefore, the utility model can not only ensure product quality using the above structure, be also prevented from fire door and stove tail because heat dissipation leads to the excessively high situation for leading to deformation of temperature at fire door.
Description
Technical field
The utility model is related to technical field of semiconductors, and in particular to a kind of silicon chip heats diffusion furnace.
Background technology
Diffusion furnace is one of Chinese medicine process equipment of process before integrated circuit production line, it is mainly used for silicon chip
Anode is coated with boron, permeates under the high temperature conditions, so as to which the type, concentration and divide that impurity gap is adulterated in semiconductor be varied and controlled
Different electrical areas has been established in cloth.
For being used in 1000 DEG C~2000 DEG C of heating diffusion technique, wherein 1263 DEG C of best diffusion temperature as product
Degree, when heating in-furnace temperature is increased to 1263 DEG C, the fire door of boiler tube and the temperature sink at stove tail both ends are fast, and then lead to stove
Mouthful, the temperature difference at 3 points of the middle part of stove tail and boiler tube it is larger, and then the quality of product is influenced, simultaneously as fire door and stove tail dissipate
Heat, heat, which is transmitted, causes the metal parts on fire door to be deformed because expanding with heat and contract with cold, and fire door temperature is higher is not easy to open.
Utility model content
Against the above deficiency, the purpose of the utility model is to provide a kind of silicon chips to heat diffusion furnace, and tool passes through setting
In the fire door of the boiler tube and the outer surface asbestos pad and asbestos ring of stove tail, and then it can reach the work of the heat preservation to fire door and stove tail
With preventing its heat dissipation, make the consistency of 3 temperature in middle part of fire door, stove tail and boiler tube, ensure that product quality.
To achieve the above object, technical solution provided by the utility model is：
A kind of silicon chip heats diffusion furnace, and including furnace body and more boiler tubes being set in furnace body, the furnace body is equipped with control
Cabinet processed, the spaced transverse direction of the boiler tube is installed in the furnace body, and the both ends of boiler tube are set as fire door and stove tail, and described
Fire door and stove tail are equipped with fire door in the furnace body, and heating unit is respectively equipped in the middle part of the fire door of the boiler tube, stove tail and boiler tube
Part, the boiler tube is interior to be equipped with quartz layer, and the outer surface of the fire door of boiler tube and stove tail is arranged with asbestos pad and asbestos ring, institute respectively
State the temperature in switch board real time monitoring and control furnace body.
Preferably, the boiler tube is connected with nitrogen tube, prevents silicon chip from the feelings aoxidized occur for injecting nitrogen into boiler tube
Condition.
Preferably, the switch board is controlled by control system, and the control system is connected with power module, heated mould
The gentle flow control module of block, temperature control module, temperature compensation module, the heating module control it to add boiler tube by control system
Heat heating, and can temperature compensation module compensate the stability that heating adjusts temperature in boiler tube, the gas flow optimized module is used
Enter the air-flow size in boiler tube in control.
Preferably, temperature control module is equipped in the middle part of the fire door of the boiler tube, stove tail and boiler tube, for monitoring 3 temperature
Consistency.
Preferably, the asbestos pad and asbestos ring are sheathed on the fire door and stove tail, and the asbestos ring is equipped with and draws
Hand, in order to mount and dismount.
The beneficial effects of the utility model are：
A kind of fire door of silicon chip heating diffusion furnace boiler tube of the utility model and the outer surface of stove tail are arranged with asbestos pad respectively
And asbestos ring, and then the effect to fire door and the heat preservation of stove tail is can reach, prevent its heat dissipation from leading to the middle part of fire door, stove tail and boiler tube
The inconsistent influence product quality of 3 temperature, therefore, the utility model can not only ensure product quality using the above structure, also
It can prevent fire door and stove tail from leading to the excessively high situation for leading to deformation of temperature at fire door because of heat dissipation.
Below in conjunction with the accompanying drawings with embodiment, the utility model is further illustrated.
Description of the drawings
Attached drawing is to be used to provide a further understanding of the present invention, and a part for constitution instruction, and following
Specific embodiment together for explaining the utility model, but do not form the limitation to the utility model.In the accompanying drawings：
Fig. 1 is a kind of structure diagram of silicon chip heating diffusion furnace of the utility model；
Fig. 2 is the structure diagram at a kind of fire door of the feed mechanism of silicon chip heating diffusion furnace dress shown in Fig. 1；
Fig. 3 is a kind of principle modules figure of the control system of silicon chip heating diffusion furnace shown in Fig. 1.
It is each in figure that the reference numerals are as follows.
Furnace body -1, boiler tube -2, fire door -2a, stove tail -2b, switch board -3, fire door -4, heating element -5, quartz
Layer -6, asbestos pad -7, asbestos ring -8, knob -8a, nitrogen tube -9.
Specific embodiment
For the technology contents of the utility model, construction feature, the objects and the effects are described in detail, below in conjunction with implementation
Mode simultaneously coordinates attached drawing to be explained in detail.
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model part of the embodiment, instead of all the embodiments.Based on the embodiment in the utility model, sheet
Field those of ordinary skill all other embodiments obtained without making creative work, belong to this practicality
Novel protected range.In the description of the present invention, it should be noted that term " " center ", " on ", " under ", " left side ",
The orientation or position relationship of the instructions such as " right side ", " vertical ", " level ", " interior ", " outer " are based on orientation shown in the drawings or position
Relationship is for only for ease of description the utility model and simplifies description rather than instruction or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.
It please refers to Fig.1, Fig. 2 and Fig. 3, a kind of silicon chip heats diffusion furnace, including furnace body 1 and be set in furnace body 1 more
Boiler tube 2, the furnace body 1 are equipped with switch board 3, and the spaced transverse direction of the boiler tube 2 is installed in the furnace body 1, and boiler tube 2
Both ends be set as fire door 2a and stove tail 2b, and the fire door 2a and stove tail 2b is equipped with fire door 4 in the furnace body 1, it is described to be added
The silicon chip of thermal diffusion, which is sent at fire door 4 in boiler tube 2, carries out heating diffusion.Fire door 2a, stove tail 2b and the boiler tube of the boiler tube 2
2 middle part is respectively equipped with heating element 5, for be carried out at the same time with heating, ensures 3 raised consistency of temperature at 3 points.It is described
Quartz layer 6 is equipped in boiler tube 2, which has heat safe effect, and the outer surface of the fire door 2a of boiler tube 2 and stove tail 2b
It is arranged with asbestos pad 7 and asbestos ring 8 respectively, and then can reach the effect to fire door 2a and stove tail 2b heat preservations, prevents its heat dissipation from leading
3, the middle part temperature for causing fire door 2a, stove tail 2b and boiler tube 2 is inconsistent, when temperature difference is more than ± 0.5 DEG C, can lead to product matter
It measures unqualified.The switch board 3 monitors and controls the temperature in furnace body 1 in real time, and the temperature in furnace body 1 is compensated and is added
Heat.
Further, the boiler tube 2 is connected with nitrogen tube 9, prevents silicon chip from aoxidizing for injecting nitrogen into boiler tube 2
Situation.
The switch board 3 is controlled by control system, and the control system is connected with power module, heating module, temperature
Module, the gentle flow control module of temperature compensation module are controlled, the heating module controls it to heat boiler tube 2 and rises by control system
Temperature, and can temperature compensation module compensate the stability that heating adjusts temperature in boiler tube 2, the gas flow optimized module is for controlling
System enters the air-flow size in boiler tube 2.
During utility model works：The control system by heating module to being heated in boiler tube 2, when being heated to
Monitored in real time after 1263 DEG C by temperature control module, and pass through temperature compensation module and compensate heating, make fire door 2a, stove tail 2b and
3, the middle part temperature of boiler tube 2 is consistent.
In the present embodiment, the middle part of the fire door 2a of the boiler tube 2, stove tail 2b and boiler tube 2 is equipped with temperature control module, is used for
Monitor the consistency of 3 temperature.
In the present embodiment, the asbestos pad 7 and asbestos ring 8 are sheathed on the fire door 2a and stove tail 2b, and the stone
Cotton circle 8 is equipped with knob 8a, in order to mount and dismount.
In conclusion a kind of outer surface point of the fire door 2a and stove tail 2b of silicon chip heating diffusion furnace boiler tube 2 of the utility model
It is not arranged with asbestos pad 7 and asbestos ring 8, and then can reach the effect to fire door 2a and stove tail 2b heat preservations, prevents its heat dissipation from causing
The inconsistent influence product quality of 3, middle part temperature of fire door 2a, stove tail 2b and boiler tube 2, therefore, the utility model is using above-mentioned
Structure can not only ensure product quality, be also prevented from fire door 2a and stove tail 2b because heat dissipation leads at fire door 4 that temperature is excessively high to be led
The situation of mutagens shape.
According to the disclosure and teachings of the above specification, the utility model those skilled in the art can also be to above-mentioned reality
The mode of applying is changed and is changed.Therefore, the utility model is not limited to specific embodiment disclosed and described above, right
Some modifications and changes of the utility model should also be as falling into the scope of the claims of the utility model.In addition, to the greatest extent
Some specific terms are used in pipe this specification, but these terms are merely for convenience of description, not to the utility model
Any restrictions are formed, using same or similar other devices, in scope of protection of the utility model.
Claims (5)
1. a kind of silicon chip heats diffusion furnace, it is characterised in that：Including furnace body (1) and more boiler tubes being set in furnace body (1)
(2), the furnace body (1) is equipped with switch board (3), and the spaced transverse direction of the boiler tube (2) is installed in the furnace body (1),
And the both ends of boiler tube (2) are set as fire door (2a) and stove tail (2b), and the fire door (2a) and stove tail (2b) are on the furnace body (1)
Equipped with fire door (4), heating element (5) is respectively equipped in the middle part of the fire door (2a) of the boiler tube (2), stove tail (2b) and boiler tube (2),
Quartz layer (6) is equipped in the boiler tube (2), and the fire door (2a) of boiler tube (2) and the outer surface of stove tail (2b) are arranged with stone respectively
Cotton pad (7) and asbestos ring (8), the switch board (3) monitor and control the temperature in furnace body (1) in real time.
2. a kind of silicon chip heating diffusion furnace as described in claim 1, it is characterised in that：The boiler tube (2) is connected with nitrogen tube
(9), prevent silicon chip from situation about aoxidizing occur for injecting nitrogen into boiler tube (2).
3. a kind of silicon chip heating diffusion furnace as described in claim 1, it is characterised in that：The switch board (3) is by controlling system
System control, and the control system is connected with power module, heating module, temperature control module, temperature compensation module and gas flow optimized
Module, the heating module control it to boiler tube (2) heat temperature raising by control system, and can temperature compensation module compensate
Heating adjusts the stability of boiler tube (2) interior temperature, and the gas flow optimized module is big for controlling the air-flow entered in boiler tube (2)
It is small.
4. a kind of silicon chip heating diffusion furnace as claimed in claim 3, it is characterised in that：Fire door (2a), the stove of the boiler tube (2)
Temperature control module is equipped in the middle part of tail (2b) and boiler tube (2), for monitoring the consistency of 3 temperature.
5. a kind of silicon chip heating diffusion furnace as described in claim 1, it is characterised in that：The asbestos pad (7) and asbestos ring (8)
It is sheathed on the fire door (2a) and stove tail (2b), and the asbestos ring (8) is equipped with knob (8a), in order to pacify installation and dismantling
It unloads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721467033.2U CN207596995U (en) | 2017-11-06 | 2017-11-06 | A kind of silicon chip heats diffusion furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721467033.2U CN207596995U (en) | 2017-11-06 | 2017-11-06 | A kind of silicon chip heats diffusion furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207596995U true CN207596995U (en) | 2018-07-10 |
Family
ID=62758932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721467033.2U Active CN207596995U (en) | 2017-11-06 | 2017-11-06 | A kind of silicon chip heats diffusion furnace |
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| Country | Link |
|---|---|
| CN (1) | CN207596995U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604444A (en) * | 2017-11-06 | 2018-01-19 | 重庆长捷电子有限公司 | A kind of silicon chip heats diffusion furnace |
-
2017
- 2017-11-06 CN CN201721467033.2U patent/CN207596995U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604444A (en) * | 2017-11-06 | 2018-01-19 | 重庆长捷电子有限公司 | A kind of silicon chip heats diffusion furnace |
| CN107604444B (en) * | 2017-11-06 | 2023-07-18 | 重庆长捷电子有限公司 | Silicon wafer heating diffusion furnace |
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