CN207587731U - A kind of more laminated packaging structures of storage dish chip - Google Patents
A kind of more laminated packaging structures of storage dish chip Download PDFInfo
- Publication number
- CN207587731U CN207587731U CN201721582283.0U CN201721582283U CN207587731U CN 207587731 U CN207587731 U CN 207587731U CN 201721582283 U CN201721582283 U CN 201721582283U CN 207587731 U CN207587731 U CN 207587731U
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- CN
- China
- Prior art keywords
- holding chamber
- chip
- packaging cartridge
- placing groove
- storage dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of more laminated packaging structures of storage dish chip, including packaging cartridge, placing groove is offered on the packaging cartridge upper table wall, the first chip is provided in the placing groove, the lower section side for being internally located at placing groove of the packaging cartridge is provided with the first holding chamber, and first holding chamber be internally provided with the second chip, the lower section side for being internally located at the first holding chamber of the packaging cartridge is provided with the second holding chamber, and second holding chamber is internally provided with third chip.In the utility model, packaging cartridge is provided with placing groove, the first holding chamber and the second holding chamber, the dislocation of first chip, the second chip and third chip is spaced at equal intervals in packaging cartridge, realize encapsulation, the dislocation spaced set of three chips so that be mutually not easy to impact between chip, next is got along after dislocation, the pin export metal wire of three chips also allows for being differentiated, so as to facilitate the connection for carrying out chip pin and terminal box.
Description
Technical field
The utility model is related to encapsulation technology field more particularly to a kind of more laminated packaging structures of storage dish chip.
Background technology
Encapsulation, Package, be integrated circuit assembling for chip final products process, briefly, be exactly
The integrated circuit die (Die) that Foundry is produced is placed on one piece of substrate for playing the role of carrying, and pin is extracted,
Then it is fixed to be packaged into as an entirety, because what is come out from factory is silicon chip that one piece of block is drawn from wafer, if not
Be packaged, it is both not convenient for transportation, keeping, also be inconvenient to weld, use, and be constantly exposed to the external world can be by air
The influence of impurity and moisture and ray causes damage so as to cause circuit malfunction or hydraulic performance decline.With " dual inline type is sealed
Dress " is for (Dual In-line Package, DIP), the bare die (Die) marked on wafer, after test passes, it is tight
Patch has been placed in the substrate of support fixed function and (has also had one layer of good material of radiating in substrate), then with more wires handles
Metal contact (Pad, pad) on Die, by being welded to connect, is then embedded to resin, uses plastic tube with external pin
Shell seals, and it is whole to form chip.
However there is some shortcomings, chips in use for the existing more laminated packaging structures of storage dish chip
Encapsulation is more troublesome, and may mutually be impacted between chip, the encapsulation of multi-chip, is differentiated when lead-foot-line connects also more numb
It is tired.
Utility model content
The purpose of this utility model is and a kind of storage dish chip proposed in order to solve shortcoming in the prior art
More laminated packaging structures.
To achieve these goals, the utility model employs following technical solution：A kind of more lamination envelopes of storage dish chip
Assembling structure including packaging cartridge, offers placing groove, the first chip is provided in the placing groove on the packaging cartridge upper table wall,
The top open part of the placing groove is rotatably connected to sealing cover by rotary shaft, and the packaging cartridge is internally located at placing groove
Lower section side is provided with the first holding chamber, and the first holding chamber is internally provided with the second chip, the first holding chamber side table
First convex block is set on wall, and the lower section side for being internally located at the first holding chamber of the packaging cartridge is provided with the second holding chamber, institute
That states the second holding chamber is internally provided with third chip, and the second convex block is provided on the second holding chamber side table wall, described
U-shaped elastic bracket is provided at the bottom centre of second holding chamber, sliding block is fixed with, and sliding block is set on the U-shaped elastic bracket
It puts on the table wall of packaging cartridge side in fixed sliding slot, the first holding chamber upper surface offers to place the second chip
Groove, the bottom of the groove are provided with insulating layer, and insulating layer bottom is set silicon substrate again.
As further describing for above-mentioned technical proposal：
Spacing is equal between any two for the placing groove, the first holding chamber and the second holding chamber.
As further describing for above-mentioned technical proposal：
U-shaped elastic bracket is also equipped at the first holding chamber bottom centre.
As further describing for above-mentioned technical proposal：
Symmetrically set on the packaging cartridge both sides table wall has pin terminal box again.
As further describing for above-mentioned technical proposal：
There are four the sliding block is set altogether, and four sliding blocks are divided into two groups, and every group two are symmetricly set on two U type bullets
On property bracket.
In the utility model, packaging cartridge is provided with placing groove, the first holding chamber and the second holding chamber first, by the first core
Piece, the second chip and the dislocation of third chip are spaced at equal intervals in packaging cartridge, realize encapsulation, the dislocation of three chips is equidistantly set
It puts so that be mutually not easy to impact between chip, next is got along after dislocation, and the pin export metal wire of three chips also allows for
It is differentiated, so as to facilitate the connection for carrying out chip pin and terminal box, then have the bottom of the first holding chamber and the second holding chamber
It is both provided with insulating layer and silicon substrate, the setting of insulating layer further reduced influencing each other for chip, the setting of silicon substrate,
The antistatic for being easy to implement chip integrates.
Description of the drawings
Fig. 1 be the utility model proposes a kind of more laminated packaging structures of storage dish chip structure diagram；
Fig. 2 is the structure diagram of the first holding chamber of the utility model；
Fig. 3 is the structure diagram of the utility model packaging cartridge.
Marginal data：
1- packaging cartridges, 2- placing grooves, the first chips of 3-, 4- rotary shafts, 5- sealing covers, the first holding chambers of 6-, the second cores of 7-
Piece, the first convex blocks of 8-, the second convex blocks of 9-, the second holding chambers of 10-, 11- thirds chip, 12-U types elastic bracket, 13- sliding blocks,
14- sliding slots, 15- grooves, 16- insulating layers, 17- silicon substrates, 18- pin terminal boxes.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.
With reference to Fig. 1-3, a kind of more laminated packaging structures of storage dish chip including packaging cartridge 1, are opened on 1 upper table wall of packaging cartridge
Equipped with placing groove 2, the first chip 3 is provided in placing groove 2, the top open part of placing groove 2 is rotatably connected to by rotary shaft 4
Sealing cover 5, the lower section side for being internally located at placing groove 2 of packaging cartridge 1 are provided with the first holding chamber 6, and inside the first holding chamber 6
The second chip 7 is provided with, the first convex block 8 is set on 6 side table wall of the first holding chamber, packaging cartridge 1 is internally located at the first placement
The lower section side of room 6 is provided with the second holding chamber 10, and the second holding chamber 10 is internally provided with third chip 11, the second holding chamber
The second convex block 9 is provided on 10 side table walls, U-shaped elastic bracket 12 is provided at the bottom centre of the second holding chamber 10, it is U-shaped
Sliding block 13 is fixed on elastic bracket 12, and sliding block 13 is arranged on 1 side table wall of packaging cartridge in fixed sliding slot 14, first puts
It puts 6 upper surface of room to offer for the groove 15 of the second chip 7 of placement, the bottom of groove 15 is provided with insulating layer 16, and insulate
16 bottom of layer, which are set again, silicon substrate 17.
Spacing is equal between any two for placing groove 2, the first holding chamber 6 and the second holding chamber 10, in 6 bottom of the first holding chamber
U-shaped elastic bracket 12 is also equipped at the heart, symmetrically set on 1 both sides table wall of packaging cartridge has pin terminal box 18 again, and sliding block 13 is set altogether
There are four putting, and it is two groups that four sliding blocks 13, which are divided to, and every group two are symmetricly set on two U-shaped elastic brackets 12.
Second holding chamber, 10 upper surface also offers the groove 15 for placing third chip 11, and the bottom of groove 15
It is also equipped with insulating layer 16 and silicon substrate 17.
Operation principle：In use, being first turned on sealing cover 5, the first chip 3 is placed into 2 in placing groove, is then passed through again
Sealing cover 5 fixes placing groove 2, at this time by pushing the slide downward in sliding slot 14 of sliding block 12, passes through the first convex block 8 and second
Convex block 9 extracts the first holding chamber 6 and the second holding chamber 10 out out of packaging cartridge 1, at this time again by the second chip 7 and third chip
11 are placed individually into the first holding chamber 6 and the second holding chamber 10, fix, and then will place the first holding chamber 6 and second
Room 10 is pushed in packaging cartridge 1, and envelope is fixed on to the first holding chamber 6 and the extruding of the second holding chamber 10 by U-shaped elastic bracket 12
Mounted box 1, the placement for just completing the first chip 3, the second chip 7 and third chip 11 at this time is fixed, in use, passing through packaging cartridge 1
On pin terminal box 18 carry out wiring connection, can use.
The preferable specific embodiment of the above, only the utility model, but the scope of protection of the utility model is not
This is confined to, in the technical scope that any one skilled in the art discloses in the utility model, according to this practicality
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
- A kind of 1. more laminated packaging structures of storage dish chip, including packaging cartridge (1), which is characterized in that packaging cartridge (1) upper table Placing groove (2) is offered on wall, the first chip (3), the open top of the placing groove (2) are provided in the placing groove (2) Place is rotatably connected to sealing cover (5), the lower section side for being internally located at placing groove (2) of the packaging cartridge (1) by rotary shaft (4) The first holding chamber (6) is provided with, and the first holding chamber (6) is internally provided with the second chip (7), first holding chamber (6) one First convex block (8) is set on the table wall of side, and the lower section side for being internally located at the first holding chamber (6) of the packaging cartridge (1) is provided with Second holding chamber (10), second holding chamber (10) are internally provided with third chip (11), second holding chamber (10) The second convex block (9) is provided on the table wall of side, U-shaped elastic bracket is provided at the bottom centre of second holding chamber (10) (12), sliding block (13) is fixed on the U-shaped elastic bracket (12), and sliding block (13) is arranged on the table wall of packaging cartridge (1) side In fixed sliding slot (14), the first holding chamber (6) upper surface offers the groove (15) for placing the second chip (7), The bottom of the groove (15) is provided with insulating layer (16), and insulating layer (16) bottom is set again silicon substrate (17).
- A kind of 2. more laminated packaging structures of storage dish chip according to claim 1, which is characterized in that the placing groove (2), spacing is equal between any two for the first holding chamber (6) and the second holding chamber (10).
- 3. a kind of more laminated packaging structures of storage dish chip according to claim 1, which is characterized in that described first places U-shaped elastic bracket (12) is also equipped at room (6) bottom centre.
- A kind of 4. more laminated packaging structures of storage dish chip according to claim 1, which is characterized in that the packaging cartridge (1) symmetrically set on both sides table wall has pin terminal box (18) again.
- A kind of 5. more laminated packaging structures of storage dish chip according to claim 1 or 3, which is characterized in that the sliding block (13) altogether there are four settings, and four sliding blocks (13) are divided into two groups, and every group two are symmetricly set on two U-shaped elastic brackets (12) On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721582283.0U CN207587731U (en) | 2017-11-23 | 2017-11-23 | A kind of more laminated packaging structures of storage dish chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721582283.0U CN207587731U (en) | 2017-11-23 | 2017-11-23 | A kind of more laminated packaging structures of storage dish chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207587731U true CN207587731U (en) | 2018-07-06 |
Family
ID=62733243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721582283.0U Expired - Fee Related CN207587731U (en) | 2017-11-23 | 2017-11-23 | A kind of more laminated packaging structures of storage dish chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207587731U (en) |
-
2017
- 2017-11-23 CN CN201721582283.0U patent/CN207587731U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180706 Termination date: 20191123 |