CN207573753U - Hot buffer unit and wireless access point device - Google Patents
Hot buffer unit and wireless access point device Download PDFInfo
- Publication number
- CN207573753U CN207573753U CN201721267060.5U CN201721267060U CN207573753U CN 207573753 U CN207573753 U CN 207573753U CN 201721267060 U CN201721267060 U CN 201721267060U CN 207573753 U CN207573753 U CN 207573753U
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- Prior art keywords
- heat
- phase
- buffer unit
- storage body
- hot buffer
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Abstract
The utility model embodiment discloses hot buffer unit and wireless access point device.The hot buffer unit (10) includes：Phase-transition heat-storage body (11), the phase-transition heat-storage body (11) has the first surface (12) of flat condition and concavo-convex second surface (13), wherein, the second surface (13) is positioned at the opposite side of the first surface (12)；And heat-conduction component (14), the heat-conduction component (14) run through the phase-transition heat-storage body (11) between the first surface (12) and the second surface (13).The utility model embodiment proposes a kind of by energy storage form, the hot buffer unit for providing overheat to be arranged in outdoor electronic equipment and protection mechanism being subcooled.
Description
Technical field
The utility model is related to technical field of heat exchange, more particularly to hot buffer unit and wireless access point device.
Background technology
In wireless subway train control system, vehicle is via multiple wireless access point including being disposed along track
(Access Point, AP) or the wireless network infrastructure of base station communicate with signaling system.AP generally includes one group of electricity gas-to-electric
Subassembly, such as power supply changeover device, the network switch, CPU board and radio module, etc..AP is typically mounted on by stainless steel
Into in the simultaneously sealed rigid cabinet of dustproof and waterproof.
Some AP need to be placed on outside tunnel.These AP are exposed under direct sunlight, and sunlight may cause in AP cabinets
Temperature significantly increases.Moreover, during AP works, the electronic component sustained release heat in AP cabinets further results in AP machines
In-cabinet temperature increases.Equally, when external environment cold, the temperature in AP cabinets may also significantly reduce.
However, electronic component reliability service only within the scope of specified temperature.Therefore, how to prevent AP from overheating or being subcooled is
One significant challenge work.
Utility model content
The utility model embodiment can at least solve the problems, such as above-mentioned and/or other technologies, and propose hot buffer unit
With AP equipment.
The technical solution of the utility model embodiment is as follows：
Hot buffer unit, the hot buffer unit include：
Phase-transition heat-storage body, the phase-transition heat-storage body have the first surface of flat condition and concavo-convex second surface, wherein,
The second surface is located at the opposite side of the first surface；And
Heat-conduction component, the heat-conduction component run through the phase transformation between the first surface and the second surface
Heat storage.
As it can be seen that the utility model embodiment proposes one kind by energy storage form, the electronics to be arranged in outdoor is set
The standby hot buffer unit that overheat supercooling protection mechanism is provided.The second surface of phase-transition heat-storage body have it is concavo-convex, contribute to week
Surrounding environment performs heat exchange.The first surface of phase-transition heat-storage body has flat condition, arrangement is contributed to install hot buffer unit, also
Help hot buffer unit and perform heat exchange with installation contact position.Moreover, the heat-conduction component through phase-transition heat-storage body contributes to
Good heat is generated between first surface and second surface to transmit.
In one embodiment, the second surface has fin；
The heat-conduction component is from the bottom of the fin through the phase-transition heat-storage body to the first surface.
As it can be seen that the utility model embodiment increases the surface area of second surface by fin, contribute to hot buffer unit
Heat exchange is performed via second surface and surrounding enviroment.
In one embodiment, it further includes：
The stress release portion that the stress for preventing the phase-transition heat-storage body expansion is weakened, wherein the phase-transition heat-storage body is swollen
Swollen direction is the direction for being located remotely from each other the first surface and the second surface.
The utility model embodiment is weakened the stress that phase-transition heat-storage body is prevented to expand by arranging stress release portion,
Therefore hot buffer unit has the geometric properties that can adapt to own vol variation.
In one embodiment, the phase-transition heat-storage body further has in the first surface and the second surface
Between around the phase-transition heat-storage body peripheral surface, the stress release portion is arranged in the peripheral surface.
In one embodiment, the stress release portion along the peripheral surface it is continuously distributed or along the peripheral surface from
Dissipate distribution.
As it can be seen that the stress release portion of the utility model embodiment has a variety of distribution patterns, application mode is flexible.
In one embodiment, the stress release portion includes groove, and the width of the groove is in the depth of the groove
Degree is gradually reduced on direction.
Therefore, stress release portion is implemented by groove, the hot buffer unit of the utility model embodiment, which also has, easily to be added
The advantages of work.
In one embodiment, the phase-transition heat-storage body is the heat conduction to form the first surface and the second surface
Container is filled with phase-transition heat-storage substance in the thermal conductive container.
A kind of AP equipment, including：
Cabinet, including the first wall and the second wall of relatively described first wall；
Hot buffer unit, the hot buffer unit are installed in the inner surface of first wall and including phase-transition heat-storage body and heat
Transport element；The phase-transition heat-storage body has the first surface of flat condition and concavo-convex second surface；Wherein, first table
Facing towards the inner surface of first wall, towards the inner surface of second wall, the heat-conduction component exists the second surface
Run through the phase-transition heat-storage body between the first surface and the second surface；
AP elements are arranged in the inner surface of second wall.
Therefore, the hot buffer unit storage heat of AP equipment utilizations that the utility model embodiment proposes, can prevent AP
Equipment occurs being subcooled or overheat, and good supercooling overheating protection is provided for AP equipment.
In one embodiment, the first surface is contacted via heat-conducting layer with the inner surface of first wall.
As it can be seen that the heat that the utility model embodiment is promoted by heat-conducting layer between cabinet wall surface and hot buffer unit passes
It leads.
In one embodiment, first wall is the wall where the cabinet door of the cabinet.
As it can be seen that hot buffer unit is arranged in the more sufficient cabinet door place wall of space surface by the utility model embodiment,
Arrangement is simpler.
Description of the drawings
Fig. 1 is the sectional view according to the hot buffer unit of the utility model embodiment.
Fig. 2 is schematic diagram of the hot buffer unit 10 after phase-transition heat-storage body expanded by heating in Fig. 1.
Fig. 3 is the structure chart according to the AP equipment of the utility model embodiment.
Wherein, reference numeral is as follows：
| Label | Meaning |
| 10 | Hot buffer unit |
| 11 | Phase-transition heat-storage body |
| 12 | First surface |
| 13 | Second surface |
| 14 | Heat-conduction component |
| 15 | Fin |
| 16 | Stress release portion |
| 17 | Peripheral surface |
| 36 | Stress release portion after deformation |
| 34 | Heat-conduction component after deformation |
| 20 | Wireless access point device |
| 21 | Cabinet |
| 22 | First wall |
| 23 | Second wall |
| 24 | First wall inner surface |
| 25 | Second wall inner surface |
| 26 | Heat-conducting layer |
| 271 | Power supply changeover device |
| 272 | The network switch |
| 273 | Radio module |
Specific embodiment
In order to which the technical solution of the utility model and advantage is more clearly understood, below in conjunction with drawings and the embodiments,
The present invention is further described in detail.It should be appreciated that the specific embodiments described herein are only used to illustrate
Property illustrate the utility model, be not used to limit the scope of protection of the utility model.
It is succinct and intuitive in order to what is described, hereafter by describing several representative embodiments come to the utility model
Scheme be illustrated.A large amount of details is only used for helping to understand the embodiment of the utility model in embodiment.However, it will be apparent that
The technical solution of the utility model can be not limited to these details when realizing.It is new in order to avoid unnecessarily having obscured this practicality
The scheme of type, some embodiments are not described meticulously, but only give frame.Hereinafter, " comprising " refers to " packet
Include but be not limited to ", " according to ... " refer to " according at least to ..., but be not limited to according only to ... ".Since the language of Chinese is practised
It is used, when being hereinafter not specifically stated the quantity of ingredient, it is meant that the ingredient is either one or more or can
It is interpreted as at least one.
The utility model embodiment proposes a kind of hot buffer unit.The hot buffer unit can pass through energy storage shape
Formula provides overheat supercooling protection mechanism to be arranged in outdoor electronic equipment.
Fig. 1 is the sectional view according to the hot buffer unit of the utility model embodiment.
As shown in Figure 1, hot buffer unit 10 includes：
Phase-transition heat-storage body 11 has the first surface 12 of flat condition and concavo-convex second surface 13, wherein, second surface
13 are located at the opposite side of first surface 12；And
Heat-conduction component 14 runs through phase-transition heat-storage body 11 between first surface 12 and second surface 13.
Phase-transition heat-storage body 11 is used to implement the storage of energy, is preferably implemented as being formed first surface 12 and second surface 13
Thermal conductive container is filled with phase-transition heat-storage substance in the thermal conductive container.The thermal conductive container can be made of metal, preferably copper or
Aluminium.Preferably, the phase-transition heat-storage substance being filled in thermal conductive container has the thermal expansion properties similar with thermal conductive container.At one
In optional embodiment, which can also be embodied as the foil-type plastic bag of sealing, so as to cost-effective.
Phase-transition heat-storage substance is to change its coherent condition at a temperature of restriction and absorb or distribute during the variation
A large amount of thermal energy and itself there is no the substance of considerable temperature variation.When phase-transition heat-storage substance is undergone phase transition, it can absorb or release
Heat is to realize the storage of energy.Phase-transition heat-storage substance can be specifically embodied as solid-solid phase-change heat storage material, solid-liquid phase change stores
Hot substance, liquid-gas phase-transition heat-storage substance or solid-gas phase transformation heat storage material.Moreover, phase-transition heat-storage substance can also be embodied as
Organic phase-transition heat-storage substance, inorganic phase-transition heat-storage substance and mixing class phase transformation heat storage material.Wherein, paraffin class, resin acid class
It is the typical phase-transition heat-storage substance in organic；Crystalline hydrate salt, fuse salt and metal and alloy etc. are the typical cases in inorganic
Phase-transition heat-storage substance.
More than the exemplary representative instance for describing phase-transition heat-storage substance, it will be appreciated by those of skill in the art that this
Description is only exemplary, is not used to limit the protection domain of the utility model embodiment.
The second surface 13 of phase-transition heat-storage body 11 have it is concavo-convex, and thus have large surface area, contribute to hot buffering
Component 10 performs heat exchange via second surface 13 and the ambient air environment where hot buffer unit 10.Phase-transition heat-storage body 11
First surface 12 has flat condition, and arrangement is contributed to install hot buffer unit 10, hot buffer unit 10 is additionally aided and is connect with installation
It touches position and performs heat exchange.
Between first surface 12 and second surface 13, the heat-conduction component 14 through phase-transition heat-storage body 11 is included.Heat passes
Guiding element 14 helps to generate good heat transfer between first surface 12 and second surface 13.Heat-conduction component 14 can be real
It applies as metal wire or metal strip.Preferably, heat-conduction component 14 has curved shape, so as to adapt to phase-transition heat-storage body 11
Volume change.
In one embodiment, second surface 13 has one or more fins 15；Heat-conduction component 14 is from fin 15
Bottom is through phase-transition heat-storage body 11 to first surface 12.Fin 15 can significantly increase the surface area of second surface 13, so as to promote
Heat exchange is performed into hot buffer unit 10 and ambient air environment.
In one embodiment, hot buffer unit 10 further includes：The stress that phase-transition heat-storage body 11 is prevented to expand is weakened
Stress release portion 16, the expansion direction of wherein phase-transition heat-storage body 11 is located remotely from each other first surface 12 and second surface 13
Direction.Phase-transition heat-storage body 11 is further had between first surface 12 and second surface 13 around the outer of phase-transition heat-storage body 10
Circumferential surface 17, stress release portion 16 are arranged in peripheral surface 17.Wherein, stress release portion 16 can circumferentially face 17 it is continuously distributed,
It can circumferentially 17 discrete distribution of face.
When phase-transition heat-storage 11 expanded by heating of body, the expansion direction of phase-transition heat-storage body 11 is makes 12 and second table of first surface
The direction that face 13 is located remotely from each other.Due to the presence in stress release portion 16, hot buffer unit 10, which has, allows adaptation to phase change material
The geometric properties of volume change (due to thermal expansion/contraction).Stress release portion 16 can be specifically embodied as folding means, so as to permit
Perhaps extension of the hot buffer unit 10 on dimension direction.It is (or other compressible that hot buffer unit 10 can also include some air
Gas) and overvoltage/low pressure valve system, to discharge internal pressure in expanded by heating.Preferably, stress release portion 16 includes recessed
Slot.It is furthermore preferred that the width of groove is gradually reduced on the depth direction of groove.
Fig. 2 is schematic diagram of the hot buffer unit 10 after phase-transition heat-storage body expanded by heating in Fig. 1.
From Figure 2 it can be seen that when phase-transition heat-storage 11 expanded by heating of body in hot buffer unit 10, the slot as stress release portion
16 are stretched, and shape becomes the slot 36 that depth shallower and width become larger, so as to weaken the stress for preventing 11 expansion of phase-transition heat-storage body.
Moreover, heat-conduction component 14 is also stretched, shape becomes the heat-conduction component 34 that length becomes larger and tortuosity becomes smaller.
Above-mentioned hot buffer unit 10 can be applied in the application environment that heat exchange is arbitrarily realized by hot buffering method,
For example, AP equipment is can be applied to, such as the AP equipment in wireless subway train control system.
Fig. 3 is the structure chart according to the AP equipment of the utility model embodiment.
As shown in figure 3, AP equipment 20, including：
Cabinet 21, the second wall 23 including the first wall 22 and opposite first walls 22；
One or more are installed in the inner surface 25 of the first wall 22 and wrap such as the hot buffer unit 10 of Fig. 1, hot buffer unit 10
Include phase-transition heat-storage body 11；Phase-transition heat-storage body 11 has the first surface 12 of flat condition and concavo-convex second surface 13；Wherein,
One surface 12 is towards the inner surface 25 of the first wall 22, and second surface 13 is towards the inner surface 24 of the second wall 22；
AP elements are arranged in the inner surface 24 of the second wall 23.Exemplary, AP elements include：Power supply changeover device 271, net
Network interchanger 272 and radio module 273, etc..
In one embodiment, first surface 22 is contacted via heat-conducting layer 26 with the inner surface 25 of the first wall 22.It is preferred that
, heat-conducting layer 26 includes at least one of following：Heat-conducting cream；Heat-conducting glue；Silicagel pad, etc..
The first wall 22 that hot buffer unit 10 is attached to can be the arbitrary wall surface of cabinet.Preferably, the first wall 22 is
Wall where the cabinet door of cabinet 21.Wall where hot buffer unit is arranged in the more sufficient cabinet door of space surface, arrangement is more
Add simple.
Phase-transition heat-storage body 11 is embodied as being formed the thermal conductive container of first surface 12 and second surface 13, is filled out in the thermal conductive container
Filled with phase-transition heat-storage substance.
When AP equipment 20 does not work, AP equipment 20 is not exposed under external sunlight, the phase transformation in hot buffer unit 10
Heat storage material is in lower state (for example, solid).
When AP equipment 20 puts and/or is exposed to the external environment of sunlight strong into operation, the AP elements in AP equipment 20
The external sunlight heat that the heat and/or cabinet 21 of generation absorb will be transmitted to hot buffer unit 10.Wherein, AP elements are slow to heat
The heat for rushing component 10 transmits the convective air circulation depended in AP equipment 20, and concavo-convex second surface 13 contributes to AP members
The heat that part generates is transmitted to hot buffer unit 10 from air, and heat-conduction component 14 contributes to the second table from hot buffer unit 10
The heat of face 13 to phase-transition heat-storage substance is transmitted.Moreover, the external sunlight that cabinet 21 absorbs, via heat-conducting cream since the first wall 22
Heat-conducting layers 26 is waited to reach the first surface 12 of hot buffer unit 10, and heat-conduction component 14 contributes to from hot buffer unit 10
The heat of first surface 12 to phase-transition heat-storage substance is transmitted.
When the phase-transition heat-storage material absorbing heat in hot buffer unit 10, phase-transition heat-storage substance gradually rises to phase alternating temperature
Degree (preferred, phase transition temperature is 50 degrees Celsius).Once reaching phase transition temperature, phase-transition heat-storage substance will gradually change it and assemble shape
State (such as melting).Phase-transition heat-storage substance can absorb more heats, and the temperature without leading to phase-transition heat-storage substance is significant
Increase, that is, thermal energy is stored in phase-transition heat-storage substance.
Only after all phase-transition heat-storage substances are all undergone phase transition, the temperature of phase-transition heat-storage substance can just increase.It is preferable
In the case of, if there are the phase-transition heat-storage substance of sufficient amount or there are enough hot buffer units 10 in hot buffer unit 10,
It then will not this thing happens.
In night, winter or external time, hot buffer unit 10 will pass through opposite process (such as phase-transition heat-storage
The curing of substance) release heat, heat will be transferred to the first colder wall 22 from hot buffer unit 10, in hot buffer unit 10
Phase-transition heat-storage substance is restored to low-energy state (such as solid).
Above by taking AP equipment as an example, the concrete application of hot buffer unit 10 is described.Those skilled in the art will be appreciated that
Arrive, the hot buffer unit 10 of the utility model embodiment is not to be only applicable to AP equipment, and apply to be arranged in it is outdoor,
Need the arbitrary electronic equipment with supercooling overheating protection mechanism.
The preferred embodiment of the above, only the utility model is not intended to limit the protection of the utility model
Range.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should be included in
Within the scope of protection of the utility model.
Claims (10)
1. hot buffer unit (10), which is characterized in that the hot buffer unit (10) includes：
Phase-transition heat-storage body (11), the phase-transition heat-storage body (11) have the first surface (12) of flat condition and the second concavo-convex table
Face (13), wherein, the second surface (13) is positioned at the opposite side of the first surface (12)；And
Heat-conduction component (14), the heat-conduction component (14) is between the first surface (12) and the second surface (13)
Through the phase-transition heat-storage body (11).
2. hot buffer unit (10) as claimed in claim 1, which is characterized in that the second surface (13) has fin (15)；
The heat-conduction component (14) is from the bottom of the fin (15) through the phase-transition heat-storage body (11) to first table
Face (12).
3. hot buffer unit (10) as claimed in claim 1, which is characterized in that further include：
The stress release portion (16) of the stress reduction of phase-transition heat-storage body (11) expansion will be prevented, wherein the phase-transition heat-storage body
(11) expansion direction is the direction for being located remotely from each other the first surface (12) and the second surface (13).
4. hot buffer unit (10) as claimed in claim 3, which is characterized in that the phase-transition heat-storage body (11) further has in institute
It states around the peripheral surface (17) of the phase-transition heat-storage body (11) between first surface (12) and the second surface (13), it is described to answer
Power release portion (16) is arranged in the peripheral surface (17).
5. hot buffer unit (10) as claimed in claim 4, which is characterized in that the stress release portion (16) is along the peripheral surface
(17) it is continuously distributed or along the peripheral surface (17) discrete distribution.
6. hot buffer unit (10) as claimed in claim 4, which is characterized in that the stress release portion (16) includes groove, described
The width of groove is gradually reduced on the depth direction of the groove.
7. such as the hot buffer unit (10) of any one of claim 1-6, which is characterized in that
The phase-transition heat-storage body (11) is the thermal conductive container for forming the first surface (12) and the second surface (13), described
Phase-transition heat-storage substance is filled in thermal conductive container.
8. wireless access point device (20), which is characterized in that including：
Cabinet (21), including the first wall (22) and the second wall (23) of relatively described first wall (22)；
Hot buffer unit (10), the hot buffer unit (10) are installed in the inner surface (25) of first wall (22) and including phases
Become heat storage (11) and heat-conduction component (14)；The phase-transition heat-storage body (11) has the first surface (12) and bumps of flat condition
The second surface (13) of shape；Wherein, the first surface (12) towards first wall (22) inner surface (25), described second
Surface (13) towards second wall (23) inner surface (24), the heat-conduction component (14) the first surface (12) with
Run through the phase-transition heat-storage body (11) between the second surface (13)；
Wireless access point element is arranged in the inner surface (24) of second wall (23).
9. wireless access point device (20) as claimed in claim 8, which is characterized in that the first surface (12) is via heat-conducting layer
(26) inner surface (25) with first wall (22) contacts.
10. wireless access point device (20) as claimed in claim 8, which is characterized in that first wall (22) is the cabinet
(21) the wall where cabinet door.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721267060.5U CN207573753U (en) | 2017-09-28 | 2017-09-28 | Hot buffer unit and wireless access point device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721267060.5U CN207573753U (en) | 2017-09-28 | 2017-09-28 | Hot buffer unit and wireless access point device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207573753U true CN207573753U (en) | 2018-07-03 |
Family
ID=62694725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721267060.5U Expired - Fee Related CN207573753U (en) | 2017-09-28 | 2017-09-28 | Hot buffer unit and wireless access point device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207573753U (en) |
-
2017
- 2017-09-28 CN CN201721267060.5U patent/CN207573753U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180703 Termination date: 20210928 |
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| CF01 | Termination of patent right due to non-payment of annual fee |