CN207521842U - A kind of vacuum furnace chamber of heating furnace - Google Patents
A kind of vacuum furnace chamber of heating furnace Download PDFInfo
- Publication number
- CN207521842U CN207521842U CN201721393830.0U CN201721393830U CN207521842U CN 207521842 U CN207521842 U CN 207521842U CN 201721393830 U CN201721393830 U CN 201721393830U CN 207521842 U CN207521842 U CN 207521842U
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- wall
- furnace wall
- furnace
- heating
- layer furnace
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Abstract
The utility model discloses a kind of vacuum furnace chambers of heating furnace, belong to heating furnace internally heated oven chamber technical field, including the double furnace wall structure being made of inside and outside layer furnace wall, camera probe is installed on the inner wall of outer layer furnace wall, it is located in internal layer furnace wall on probe visiting regional location and opens up aperture, heating unit is arranged in internal layer furnace wall, and the connecting line of circuit needed for the heating unit is guided to internal layer furnace wall, outer layer furnace wall across the aperture and is connected on outer layer furnace wall.The utility model uses double furnace wall, aperture is equipped with above inner wall, camera probe above outer wall can easily absorb situation image in heating furnace, control between the circuit of heating unit is pulled out to two layers of furnace wall by the aperture concentration on inner wall, can prevent damage of the high temperature of heating to circuit.
Description
Technical field
The utility model is related to heating furnace internally heated oven chamber design field, more particularly to a kind of vacuum drying oven of heating furnace
Chamber.
Background technology
The welding of pcb board has critical role in the industry, with the development of industry with people to pcb board processing efficiency and
The raising of required precision, people begin to use Reflow Soldering heating furnace to weld workpiece or pcb board.Welding process is by workpiece
It is placed in heating furnace, solder(ing) paste, which is placed on workpiece or pcb board surface, to be needed on the position welded, when temperature rise is extremely welded in heating furnace
During tin fusing point, scolding tin thawing is covered on the point for needing to weld, and rapid cooling again, makes scolding tin quickly solidify, can reach at this time
The welding effect of high-efficiency high-precision.
But in hot-working industry actual production, the process that the Reflow Soldering heating furnace that uses at present is welded exists such as
Lower defect：First, bubble or stomata are easily generated in heating and melting by the scolding tin of heating workpiece surface in Reflow Soldering heating furnace,
In cooling solidification, these bubbles or stomata cause scolding tin that the point that needs weld can not be completely covered, and cause circuit that short circuit occurs
Or it is breaking, influence the normal function of workpiece and pcb board；Second is that need the workpiece welded and electronic component in heating furnace
Hot environment under can accelerated oxidation, influence the function of normal circuit.
Utility model content
The purpose of this utility model is to provide a kind of vacuum furnace chamber of heating furnace, to be welded to workpiece or pcb board
When connecing, high temperature is avoided to be damaged caused by circuit.
In order to achieve the above object, the technical solution adopted in the utility model is：Including the bilayer being made of inside and outside layer furnace wall
Protecting wall structure installs camera probe on the inner wall of outer layer furnace wall, probe is located in internal layer furnace wall visits and open up aperture on regional location,
Heating unit is arranged in internal layer furnace wall, and the connecting line of circuit needed for the heating unit opens up close across internal layer furnace wall side
Sealing of hole is guided between internal layer furnace wall, outer layer furnace wall and is connected on outer layer furnace wall.
Wherein, the camera probe is opened in the outer layer furnace wall inner wall midline position, and the aperture is opened in camera shooting and visits
On internal layer furnace wall immediately below head.
Wherein, the aperture is sealed with heat-protecting glass.
Wherein, air is filled between the internal layer furnace wall and outer layer furnace wall, is vacuum in internal layer furnace wall.
Compared with prior art, there are following technique effects for the utility model：The utility model uses double furnace wall, inner wall
Top is equipped with aperture, and the camera probe above outer wall can easily absorb situation image in heating furnace, control heating dress
Between the circuit put is pulled out to two layers of furnace wall by aperture on inner wall concentration, damage of the high temperature of heating to circuit can be prevented.
Description of the drawings
Below in conjunction with the accompanying drawings, specific embodiment of the present utility model is described in detail：
Fig. 1 is a kind of structure diagram of the vacuum furnace chamber of heating furnace in the utility model.
Specific embodiment
In order to illustrate further the feature of the utility model, please refer to detailed description below in connection with the utility model with
Attached drawing.Institute's attached drawing is only for reference and purposes of discussion, is not used for limiting the scope of protection of the utility model.
As shown in Figure 1, present embodiment discloses a kind of vacuum furnace chamber of heating furnace, including by internal layer furnace wall 1, outer layer furnace wall
The 2 double furnace wall structures formed, camera probe 3 is installed on 2 inner wall of outer layer furnace wall, is located at camera probe 3 in internal layer furnace wall 1 and visits
Aperture 4 is opened up on regional location, heating unit is arranged in internal layer furnace wall 1, and the connecting line of circuit needed for heating unit, which passes through, to be added
The sealing hole 6 of hot stove inner wall side is guided between internal layer furnace wall 1, outer layer furnace wall 2 and is connected on outer layer furnace wall 2.Wherein, it will take the photograph
As popping one's head in 3 mounted on 2 top of outer layer furnace wall, it can prevent high temperature from being damaged to camera probe.Heating plate 5 and heating tube are in
In interior stove, the circuit systems such as heating plate 5 and heating tube and the unified sealing hole 6 by inner wall of connecting line 8 is controlled to prevent through outer layer
Only high temperature damages circuit.
It should be noted that heating unit includes heating plate 5, heating tube, pcb board 7 is placed in heating plate 5, is imaged
Probe 3 can carry out image capture by this heat-protecting glass to situation in heating furnace.Heating plate 5 and heating tube are in interior stove, control
The circuit systems such as heating plate 5 and heating tube processed and the unified sealing hole 6 by inner wall of connecting line 8 prevent high temperature pair through outer layer
Circuit damages.
Further, the camera probe 3 is opened in the 2 inner wall midline position of outer layer furnace wall, and the aperture 4 is opened in
On internal layer furnace wall 1 immediately below camera probe 3.It wherein, can on camera probe 3, aperture 4 and pcb board 7 and same straight line
Ensure the welding situation that pcb board 7 in heating plate 5 is recorded in the range of the maximum visual of camera probe 3.
Further, aperture 4 is sealed with heat-protecting glass.Camera probe 3 can be by this heat-protecting glass to situation in heating furnace
Carry out image capture.
Further, air is filled between internal layer furnace wall 1 and outer layer furnace wall 2, is vacuum in internal layer furnace wall 1.
It should be noted that it is air between inside and outside layer furnace wall 2, interior stove is heating region, in vacuum state, is compared
Compared with traditional heating furnace, an effect is that prevent when weld pcb board 7 scolding tin generation bubble that pcb board 7 is caused to weld imperfect
Generation short circuit or breaking phenomena, another effect are that related component exposure when preventing heating pcb board 7 on plate adds in air
Oxidation is led to the problem of when hot and influences device performance and circuit effect.
The present embodiment carries out pcb board 7 reflow soldering, tool by the design of vacuum combination in double furnace wall and heating furnace
There is the advantages of service life is long, welding is stablized, quality is high, anti-oxidation.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all in this practicality
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (4)
1. a kind of vacuum furnace chamber of heating furnace, it is characterised in that：Including the double furnace wall structure being made of inside and outside layer furnace wall, outside
Camera probe is installed on the inner wall of layer furnace wall, is located in internal layer furnace wall on probe visiting regional location and opens up aperture, heating unit is set
It puts in internal layer furnace wall, the sealing hole that the connecting line of circuit needed for heating unit passes through internal layer furnace wall side to open up guides to internal layer stove
Between wall, outer layer furnace wall and it is connected on outer layer furnace wall.
2. the vacuum furnace chamber of heating furnace as described in claim 1, it is characterised in that：The camera probe is opened in the outer layer
Furnace wall inner wall midline position, the aperture are opened on the internal layer furnace wall immediately below camera probe.
3. the vacuum furnace chamber of heating furnace as described in claim 1, it is characterised in that：The aperture is sealed with heat-protecting glass.
4. the vacuum furnace chamber of heating furnace as described in claim 1, it is characterised in that：Between the internal layer furnace wall and outer layer furnace wall
Air is filled, is vacuum in internal layer furnace wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721393830.0U CN207521842U (en) | 2017-10-25 | 2017-10-25 | A kind of vacuum furnace chamber of heating furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721393830.0U CN207521842U (en) | 2017-10-25 | 2017-10-25 | A kind of vacuum furnace chamber of heating furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207521842U true CN207521842U (en) | 2018-06-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721393830.0U Active CN207521842U (en) | 2017-10-25 | 2017-10-25 | A kind of vacuum furnace chamber of heating furnace |
Country Status (1)
| Country | Link |
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| CN (1) | CN207521842U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107755842A (en) * | 2017-10-25 | 2018-03-06 | 合肥埃科光电科技有限公司 | A kind of vacuum furnace chamber of heating furnace |
-
2017
- 2017-10-25 CN CN201721393830.0U patent/CN207521842U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107755842A (en) * | 2017-10-25 | 2018-03-06 | 合肥埃科光电科技有限公司 | A kind of vacuum furnace chamber of heating furnace |
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210107 Address after: 230088 room a400, University Science Park, 602 Huangshan Road, high tech Zone, Hefei City, Anhui Province Patentee after: Hefei Anxin Precision Technology Co.,Ltd. Address before: 230088 a208, University Science Park, 602 Huangshan Road, high tech Zone, Hefei City, Anhui Province Patentee before: HEFEI ITEK PHOTOELECTRICS TECHNOLOGY Co.,Ltd. |