CN207498506U - A kind of electroplanting device for having the function of to detect plating solution - Google Patents
A kind of electroplanting device for having the function of to detect plating solution Download PDFInfo
- Publication number
- CN207498506U CN207498506U CN201721535668.1U CN201721535668U CN207498506U CN 207498506 U CN207498506 U CN 207498506U CN 201721535668 U CN201721535668 U CN 201721535668U CN 207498506 U CN207498506 U CN 207498506U
- Authority
- CN
- China
- Prior art keywords
- plating solution
- detect
- function
- reservoir
- electroplanting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of electroplanting devices with detection plating solution function, belong to electroplanting device field.The technical problem to be solved by the utility model is to propose a kind of electroplanting device for having the function of to detect plating solution, the utility model is by increasing detect tank, plating solution analysis instrument and plating solution adjuster are set in detect tank, can effectively plating solution be detected and adjusted, the high quality plating solution supply electroplating bath for detecting qualified is electroplated, make the coating that plating comes out careful, close, so as to improve the quality of galvanization coating.
Description
Technical field
The utility model is related to electroplanting device field, more particularly to a kind of plating dress for having the function of to detect plating solution
It puts.
Background technology
Electroplating technology is a kind of technology developed for a long time, is widely applied in various different purposes and different field.Hair
Open up now, applied to high-tech industry, as semiconductor manufacture craft in, be indispensable in scientific and technological industry now one
Technology.
As the advantage of electroplanting device indispensable in electroplating process, electroplating effect is directly influenced whether.Thus, plating
The optimization of device also just becomes an important innovative content.
As the consumer electronics products such as smart mobile phone, tablet computer are constantly to the trend development of lighting, miniaturization, print
Circuit board processed inevitably moves towards high density, high-precision develops, therefore the requirement being electroplated is higher and higher, and it is good that this just needs plating solution to have
Good quality, makes plating reach better effect.
Such as application No. is 201220205791.8 Chinese utility model patent, it discloses a kind of electroplanting device, packet
Electroplating bath is included, cathode and anode are equipped in electroplating bath；Supersonic generator is equipped in electroplating bath.Though the electroplanting device in this application
So by the stirring action of supersonic generator, the exchange of electroplate liquid is promoted, makes electroplate liquid more uniform, but without further
Plating solution quality after detection stirring, it is impossible to ensure the high quality of the plating solution of defeated supply electroplating bath.
In conclusion existing electroplanting device does not have the problem of detection plating solution function, therefore, it is necessary to design effective side
Case come plating solution is detected adjusting and then supply electroplating bath, to improve galvanization coating quality.
Utility model content
It is the defects of in order to overcome the prior art, a kind of with inspection the technical problem to be solved by the utility model is to propose
The electroplanting device of plating solution function is surveyed, the utility model sets plating solution analysis instrument and plating solution by increasing detect tank in detect tank
Adjuster effectively can be detected plating solution and adjust, and the high quality plating solution of passed examination is supplied electroplating bath, and then improve
Galvanization coating quality.
For this purpose, the utility model uses following technical scheme：
The utility model provides a kind of electroplanting device for having the function of to detect plating solution, including electroplating bath, detect tank, is located at
The upper left input pipe of electroplating bath, connects the electroplating bath and the output duct of the detect tank,
Controller is further included, the input pipe is equipped with first flow control valve, and the output duct is equipped with electric pump
And second flow control valve, the electric pump are located at the lower right of the detect tank, plating solution analysis instrument are equipped with outside the detect tank
With plating solution adjuster, the controller is electrically connected by the first data line with the plating solution analysis instrument, and the controller passes through
Two data lines are electrically connected with the plating solution adjuster, and the controller is controlled by third data line and the first flow
Valve electrical connection connection, the controller are electrically connected by the 4th data line with the second flow control valve.
Optionally, the plating solution analysis instrument includes thermometer, the thermometer and the plating solution analysis instrument electric connection line；Institute
It states in some or all plating solutions positioned inside the detect tank of thermometer.
Optionally, viscosimeter is further included；The viscosimeter is electrically connected with the plating solution analysis instrument.The viscosimeter part
Or it is entirely located in the plating solution inside the detect tank.
Optionally, the first reservoir is further included, first reservoir is located inside the plating solution adjuster, and described first
The first regulation pipe is connected with below reservoir.
Optionally, the second reservoir is further included, first reservoir is located inside the plating solution adjuster, and described second
The second regulation pipe is connected with below reservoir.
Optionally, third reservoir is further included, the third reservoir is located inside the plating solution adjuster, the third
Third regulation pipe is connected with below reservoir.
Optionally, start button and pause button are further included, the start button and the pause button are respectively positioned on described
Outside electroplating bath, the start button is electrically connected by the 5th data line with the controller, and the pause button passes through the 6th
Data line is electrically connected with the controller.
Optionally, the plating solution analysis instrument has the first display screen.
Optionally, the controller has second display screen.
Optionally, a button is equipped with outside the electric pump, the button is electrically connected by the 7th data line with the controller
It connects.
The beneficial effects of the utility model are：
A kind of electroplanting device for having the function of to detect plating solution provided by the utility model, the utility model are detected by increasing
Slot sets plating solution analysis instrument and plating solution adjuster in detect tank, can effectively plating solution is detected and adjusted, and is closed checking
The high quality plating solution supply electroplating bath of lattice is electroplated, and makes the coating that plating comes out careful, close, so as to improve galvanization coating
Quality.
Description of the drawings
Fig. 1 is the structure of a kind of electroplanting device for having the function of to detect plating solution that specific embodiment of the present invention provides
Schematic diagram.
In figure：
1st, electroplating bath；2nd, detect tank；3rd, input pipe；4th, output duct；5th, first flow control valve；6th, second flow control
Valve processed；7th, electric pump；71st, button；8th, plating solution analysis instrument；9th, controller；91st, second display screen；10th, plating solution adjuster；11st, it opens
Dynamic button；12nd, pause button；13rd, the first data line；14th, the second data line；15th, third data line；16th, the 4th data line；
17th, the 5th data line；18th, the 6th data line；19th, the 7th data line；81st, thermometer；82nd, viscosimeter；83rd, the first display screen；
101st, the first regulation pipe；102nd, the second regulation pipe；103rd, third regulation pipe；104th, the first reservoir；105th, the second reservoir；
106th, third reservoir.
Specific embodiment
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Show to Fig. 1 exemplaries a kind of structure of electroplanting device for having the function of to detect plating solution provided by the utility model
Schematic diagram, as shown in Figure 1, a kind of electroplanting device for having the function of to detect plating solution, including electroplating bath 1, detect tank 2, positioned at described
1 upper left input pipe 3 of electroplating bath, connects the electroplating bath 1 and the output duct 4 of the detect tank 2,
Controller 9 is further included, the input pipe 3 is equipped with first flow control valve 5, and the output duct 4 is equipped with
Electric pump 7 and second flow control valve 6, the electric pump 7 are located at the lower right of the detect tank 2, and 2 outside of detect tank is equipped with one
8 and one plating solution adjuster 10 of plating solution analysis instrument, the controller 9 are electrically connected by the first data line 13 and the plating solution analysis instrument 8
It connects, the controller 9 is electrically connected by the second data line 14 with the plating solution adjuster 10, and the controller 9 passes through
Three data lines 15 are electrically connected with the first flow control valve 5, and the controller 9 passes through the 4th data line 16 and the second
Control valve 6 is electrically connected.The controller 9 is intelligent computerized control system, can be received by the first data line 13 from plating
The data of liquid analyzer 8, real-time prosecution plating solution quality.When plating solution is unqualified, is suspended by the 6th data line 18 and be electroplated, simultaneously
Instruction is sent out by third data line 15, closes first flow control valve 5, sending out instruction by the 4th data line 16 closes second
Flow control valve 6；Data are transmitted by the second data line 14 simultaneously and send out instruction, plating solution adjuster 10 is allowed to export suitable tune
Liquid is saved, such as the concentrated sulfuric acid, hydrochloric acid or brightener.When plating solution analysis instrument 8 detect plating solution qualification, controller 9 will be issued instructions to, plate
Liquid analytical equipment 9 will issue instructions to start button 11, first flow control valve 5 and second flow control valve 6, start to be electroplated.
Optionally, the plating solution analysis instrument 8 includes thermometer 81, and the thermometer is electrically connected with the plating solution analysis instrument 8
Line；In some or all plating solutions positioned inside the detect tank 2 of the thermometer 81.
Optionally, viscosimeter 82 is further included；The viscosimeter 82 is electrically connected with the plating solution analysis instrument 8.The viscosimeter
In some or all plating solutions positioned inside the detect tank 2.
Optionally, the first reservoir 104 is further included, first reservoir 104 is located in the plating solution adjuster 10
Portion, 104 lower section of the first reservoir are connected with the first regulation pipe 101.
Optionally, the second reservoir 105 is further included, first reservoir 105 is located in the plating solution adjuster 10
Portion, 105 lower section of the second reservoir are connected with the second regulation pipe 102.
Optionally, third reservoir 106 is further included,
The third reservoir 106 is located inside the plating solution adjuster 10, and 106 lower section of the third reservoir is connected with the
Three regulation pipes 103.
First reservoir 104, is stored with the concentrated sulfuric acid, and the storage of the second reservoir 105 has hydrochloric acid, the third storage
The storage of storage 106 has brightener.The concentrated sulfuric acid in first reservoir 104 can be imported detect tank by first regulation pipe 101
Plating solution quality is adjusted in 2.Hydrochloric acid in second reservoir 105 can be imported in detect tank 2 and adjusted by second regulation pipe 102
Plating solution quality.Brightener in third reservoir 106 can be imported in detect tank 2 and adjust plating solution by the third regulation pipe 103
Quality.This three can be imported in detect tank 2 simultaneously according to a certain percentage, this ratio is by detecting at that time by controller 9
Then plating solution is compared with required plating solution standard, then calculated what is come out later, is that a kind of intelligent plating solution adjusting is set
It is standby.
Optionally, start button 11 and pause button 12 are further included, the start button 11 and the pause button 12 are equal
Outside the electroplating bath 1, the start button 11 is electrically connected by the 5th data line 17 with the controller 9, described temporary
Stop button 12 to be electrically connected with the controller 9 by the 6th data line 18.
Optionally, the plating solution analysis instrument 8 has the first display screen 83.
Optionally, the controller 9 has second display screen 91.
Optionally, 7 outside of electric pump is equipped with a button 71, and the button 71 passes through the 7th data line 19 and the control
Device 9 processed is electrically connected.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case of with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (10)
1. a kind of electroplanting device for having the function of to detect plating solution, it is characterised in that：
Including electroplating bath (1), detect tank (2), positioned at the electroplating bath (1) upper left input pipe (3), the connection plating
The output duct (4) of slot (1) and the detect tank (2)；
Further include controller (9)；
The input pipe (3) is equipped with first flow control valve (5), and the output duct (4) is equipped with electric pump (7) and second
Flow control valve (6), the electric pump (7) is positioned at the lower right of the detect tank (2)；
Plating solution analysis instrument (8) and plating solution adjuster (10) are equipped with outside the detect tank (2)；
The controller (9) is electrically connected by the first data line (13) with the plating solution analysis instrument (8), and the controller (9) is logical
The second data line (14) is crossed to be electrically connected with the plating solution adjuster (10), the controller (9) by third data line (15) with
First flow control valve (5) electrical connection, the controller (9) are controlled by the 4th data line (16) and the second flow
Valve (6) is electrically connected.
2. a kind of electroplanting device for having the function of to detect plating solution as described in claim 1, it is characterised in that：
The plating solution analysis instrument (8) includes thermometer (81)；
The thermometer (81) and plating solution analysis instrument (8) electric connection line；
In some or all plating solutions internal positioned at the detect tank (2) of the thermometer (81).
3. a kind of electroplanting device for having the function of to detect plating solution as claimed in claim 2, it is characterised in that：
Further include viscosimeter (82)；
The viscosimeter (82) is electrically connected with the plating solution analysis instrument (8)；
In some or all plating solutions internal positioned at the detect tank (2) of the viscosimeter (82).
4. a kind of electroplanting device for having the function of to detect plating solution as described in claim 1, it is characterised in that：
Further include the first reservoir (104)；
First reservoir (104) is internal positioned at the plating solution adjuster (10)；
The first regulation pipe (101) is connected with below first reservoir (104).
5. a kind of electroplanting device for having the function of to detect plating solution as claimed in claim 4, it is characterised in that：
Further include the second reservoir (105)；
Second reservoir (105) is internal positioned at the plating solution adjuster (10), is connected with below second reservoir (105)
Second regulation pipe (102).
6. a kind of electroplanting device for having the function of to detect plating solution as claimed in claim 5, it is characterised in that：
Further include third reservoir (106)；
The third reservoir (106) is internal positioned at the plating solution adjuster (10)；
Third regulation pipe (103) is connected with below the third reservoir (106).
7. a kind of electroplanting device for having the function of to detect plating solution as described in claim 1, it is characterised in that：
Further include start button (11) and pause button (12)；
It is external that the start button (11) and the pause button (12) are respectively positioned on the electroplating bath (1)；
The start button (11) is electrically connected by the 5th data line (17) with the controller (9)；
The pause button (12) is electrically connected by the 6th data line (18) with the controller (9).
8. a kind of electroplanting device for having the function of to detect plating solution as claimed in claim 3, it is characterised in that：
The plating solution analysis instrument (8) has the first display screen (83).
9. a kind of electroplanting device for having the function of to detect plating solution as claimed in claim 3, it is characterised in that：
The controller (9) has second display screen (91).
10. a kind of electroplanting device for having the function of to detect plating solution as described in claim 1, it is characterised in that：
Button (71) is equipped with outside the electric pump (7)；
The button (71) is electrically connected by the 7th data line (19) with the controller (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721535668.1U CN207498506U (en) | 2017-11-16 | 2017-11-16 | A kind of electroplanting device for having the function of to detect plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721535668.1U CN207498506U (en) | 2017-11-16 | 2017-11-16 | A kind of electroplanting device for having the function of to detect plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207498506U true CN207498506U (en) | 2018-06-15 |
Family
ID=62505034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721535668.1U Active CN207498506U (en) | 2017-11-16 | 2017-11-16 | A kind of electroplanting device for having the function of to detect plating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207498506U (en) |
-
2017
- 2017-11-16 CN CN201721535668.1U patent/CN207498506U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209702903U (en) | A kind of electroplating line for circuit boards with automatic liquid-feeding function | |
| CN204550715U (en) | Regeneration system of acid etching liquid | |
| CN207498506U (en) | A kind of electroplanting device for having the function of to detect plating solution | |
| CN106786978A (en) | A kind of charging system and mobile terminal | |
| CN205000002U (en) | Perpendicular continuous electroplating equipment of moduleization | |
| CN207487579U (en) | wall thickness monitoring device and system | |
| CN109537001A (en) | A kind of detection device and method of the short circuit of nonferrous smelting electrolytic pole board | |
| CN205171008U (en) | Plating bath liquid level control system | |
| CN103213822A (en) | Assembly line conveying device based on personal information modules and controlling method thereof | |
| CN102866079A (en) | Testing method of electrotinning uniform plating capacity | |
| CN203199600U (en) | Assembly line conveying device based on personal information modules | |
| CN208743872U (en) | A kind of low-temperature welding equipment | |
| CN206479561U (en) | A kind of testing needle with thread | |
| CN207811918U (en) | Circuit board electroplating production system | |
| TWM537336U (en) | Electroplating power supply equipment of printed circuit board and real-time monitoring system thereof | |
| CN206328487U (en) | A kind of plating line electroplate liquid is automatically replenished feeding device | |
| CN203339174U (en) | Device for continuously producing silver powder for solar energy | |
| CN201937980U (en) | Device for automatically adding liquid medicine into chemical copper jar | |
| CN205702896U (en) | Current converter station tubular mother connects the detection device of gold utensil welding quality | |
| CN110031042A (en) | The three-stage detection method and device of PCBA manufacture | |
| CN209167931U (en) | Signal generation apparatus and electronic equipment | |
| CN207489008U (en) | A kind of high speed, programmable data interface arrangement | |
| CN201136909Y (en) | Electroplating system | |
| CN203247327U (en) | Electrode system used for cathode electrophoresis | |
| CN213596398U (en) | IC support plate is with heating device of accurate chemical copper plating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An electroplating device with the function of detecting plating solution Effective date of registration: 20210120 Granted publication date: 20180615 Pledgee: Bank of Communications Ltd. Ji'an branch Pledgor: JIANGXI JINGCHAO TECHNOLOGY Co.,Ltd. Registration number: Y2021360000002 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220127 Granted publication date: 20180615 Pledgee: Bank of Communications Ltd. Ji'an branch Pledgor: JIANGXI JINGCHAO TECHNOLOGY CO.,LTD. Registration number: Y2021360000002 |