CN201136909Y - Electroplating system - Google Patents
Electroplating system Download PDFInfo
- Publication number
- CN201136909Y CN201136909Y CNU2007200767381U CN200720076738U CN201136909Y CN 201136909 Y CN201136909 Y CN 201136909Y CN U2007200767381 U CNU2007200767381 U CN U2007200767381U CN 200720076738 U CN200720076738 U CN 200720076738U CN 201136909 Y CN201136909 Y CN 201136909Y
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- electroplating
- ingress pipe
- dashpot
- electroplating solution
- solution
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Abstract
The utility model relates to a plating system which comprises an ingress pipe, a buffer slot, a leading-in pipe, a plating chamber and an eduction tube. Plating solution enters the ingress pipe through the upper port of the ingress pipe and enters the buffer slot through the lower port of the ingress pipe; the plating solution in the buffer slot enters the plating chamber through the leading-in pipe to carry out the plating reaction; the reacted solution is discharged through the eduction tube; the buffer slot, the leading-in pipe and the plating chamber are all loaded with the plating solution; the lower port of the ingress pipe is arranged below the fluid level of the plating solution in the buffer slot. A plating film layer with reduced point defect is formed by utilizing the plating system.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly a kind of electroplating system.
Background technology
Plating is always paid attention to by industry the optimization of its process and equipment as the important metallization operations in the manufacture of semiconductor.
As shown in Figure 1, usually, electroplating system comprises: ingress pipe 10, dashpot 20, inlet tube 30, electroplating chamber 40 and fairlead 50; Electroplating solution enters described ingress pipe 10 via the upper port 12 of described ingress pipe 10, and enters described dashpot 20 via the lower port 14 of described ingress pipe 10; Electroplating solution in the described dashpot 20 enters described electroplating chamber 40 via described inlet tube 30, to carry out electroplating reaction; Reacted solution is discharged via described fairlead 50; All carry electroplating solution in described dashpot 20, inlet tube 30 and the electroplating chamber 40.
Described electroplating chamber 40 also comprises positive plate 42 and negative plate 44, and described positive plate 42 and negative plate 44 place described electroplating chamber 40 both sides symmetrically; The electroplating solution that has pole plate place of electric charge obtains to electroplate rete by electroplating reaction takes place.
In the practice, the chip sucking with conductive surface (Seed Layer) invests on the described negative plate, and is immersed in the electroplating solution, and wafer and Seed Layer form with external power as electronegative negative electrode and be electrically connected; Solid-plated plate is immersed in the electroplating solution and is constituted positively charged anode; In the electroplating process, the metal ion in the electroplating solution is reduced into the plated metal atom in the negative electrode wafer surface, simultaneously in anode generation oxidizing reaction, with the balance cathodic current.After electroplating reaction is finished, the wafer surface of being immersed in the electroplating solution will form the plating rete.
Yet as shown in Figure 2, actual production is found, plating rete 70 surfaces that are positioned on the wafer 60 easily have point defect (pit) 72, promptly in the regional area thickness attenuation of described plating rete 70, when serious, even form the disappearance of described plating rete 70 at described regional area; Inhomogeneous or the local disappearance of described plating rete 70 thickness easily influences successive process.The point defect that how to reduce the electroplating film laminar surface becomes those skilled in the art's problem demanding prompt solution.
Current, industry generally believes, the reason that forms above-mentioned point defect is: wafer and Seed Layer are immersed in its interior electroplating solution and are had foam (foaming), and the reason that described foam produces is: produce foam when electroplating solution enters dashpot via described ingress pipe, then, the foam of generation enters electroplating chamber by inlet tube, and then, described foamy existence makes in its residing cathode zone reduction reaction insufficient, and forms above-mentioned point defect.How to reduce the foam that produces when electroplating solution enters dashpot via described ingress pipe and become the direction that reduces above-mentioned point defect generation.
On December 21st, 2005, disclosed publication number provided tuyere arrangement in the Chinese patent application of " CN1711140 ", described tuyere arrangement comprises a housing (2) longitudinally, this housing (2) has at least one and is used to import the fluid importing opening that treatment solution is handled workpiece (as printed circuit board (PCB)), and preferably a plurality of slit fluid outlet opening (8) that is used to discharge treatment solution.In housing (2), be formed with a fluid channel (5), be used for that treatment solution is imported opening from fluid and deliver to fluid outlet opening (8).In order to locate to obtain isostatic treatment solution flow velocity as far as possible at fluid outlet opening (8), (a) be used for treatment solution fluid channel (5) pass through flow along vertically the reducing continuously of housing (2) from fluid feed-in opening, and/or (b) before fluid outlet opening (8) output, be provided with a storage chamber at fluid.
Yet, be positioned at described ingress pipe and longitudinally reduce continuously by making from opening part, though, can reduce the flow velocity of described electroplating solution, but, still cause contacting of electroplating solution with certain speed and gas inevitably, electroplating solution with certain speed contacts with gas and easily causes foamy to produce, promptly use the said nozzle device and make ingress pipe, with described storage chamber as dashpot, jointly to enter passage before the electroplating chamber as electroplating solution, produce though can reduce foamy, the effect that reduces is limited.
The utility model content
The utility model provides a kind of electroplating system, utilizes described electroplating system can form the plating rete of the point defect with minimizing.
A kind of electroplating system that the utility model provides comprises: ingress pipe, dashpot, inlet tube, electroplating chamber and fairlead; Electroplating solution enters described ingress pipe via the upper port of described ingress pipe, and enters described dashpot via the lower port of described ingress pipe; Electroplating solution in the described dashpot enters described electroplating chamber via described inlet tube, to carry out electroplating reaction; Reacted solution is discharged via described fairlead; All carry electroplating solution in described dashpot, inlet tube and the electroplating chamber; The lower port of described ingress pipe is positioned at the liquid level below of described dashpot electroplating solution.
Alternatively, described ingress pipe has at least one break between the electroplating solution liquid level in port and the described dashpot thereon; Alternatively, described ingress pipe has pleated structure between the electroplating solution liquid level in port and the described dashpot thereon; Alternatively, described ingress pipe has arcuate structure between the electroplating solution liquid level in port and the described dashpot thereon; Alternatively, described ingress pipe inwall is bonded with the nethike embrane structure, and the viscosity factor of described nethike embrane structure is greater than the viscosity factor of described ingress pipe inwall; Alternatively, the lower port of described ingress pipe is positioned at the middle part of described dashpot; Alternatively, described electroplating solution comprises reaction soln and tensio-active agent; Alternatively, described ingress pipe comprises at least one and imports arm, utilizes different importing arms to import described reaction soln and tensio-active agent to described dashpot.
Compared with prior art, the utlity model has following advantage:
The electroplating system that the utility model provides, be positioned at described dashpot electroplating solution liquid level below by the lower port that makes described ingress pipe, can reduce contacting of described electroplating solution and gas, then reduce the content of the gas that described electroplating solution carries, can reduce the foam that produces when described electroplating solution enters described dashpot, and then can make and reduce the plating rete point defects of utilizing described electroplating solution to form and become possibility;
The optional mode of the electroplating system that the utility model provides, by selecting the described ingress pipe structure between the electroplating solution liquid level in port and the described dashpot thereon, as has at least one break, have pleated structure or have arcuate structure, with electroplating solution liquid level in keeping described ingress pipe upper port and described dashpot when constant, increase electroplating solution and enter the distance of flowing through before the dashpot, slow down so that flow into the speed of the electroplating solution of dashpot, prevent to enter in the described electroplating solution owing to the gas that advances to spatter to cause of electroplating solution, can reduce the foam that produces when described electroplating solution enters described dashpot, and then can make and reduce the plating rete point defects of utilizing described electroplating solution to form and become possibility;
The optional mode of the electroplating system that the utility model provides, be positioned at the middle part of described dashpot by the lower port of adjusting described ingress pipe, being beneficial to the gas that advances to spatter to cause that prevents owing to electroplating solution enters in the described electroplating solution, can reduce the foam that produces when described electroplating solution enters described dashpot, and then can make and reduce the plating rete point defects of utilizing described electroplating solution to form and become possibility.
Description of drawings
Fig. 1 is the structural representation of electroplating system in the explanation prior art;
Fig. 2 for explanation utilize point defect in the plating rete that prior art obtains structural representation;
Fig. 3 is the structural representation of the electroplating system of explanation the utility model first embodiment;
Fig. 4 is the structural representation of the electroplating system of explanation the utility model second embodiment;
Fig. 5 is the structural representation of the electroplating system of explanation the utility model the 3rd embodiment;
Fig. 6 is the structural representation of the electroplating system of explanation the utility model the 4th embodiment.
Embodiment
Although below with reference to accompanying drawings the utility model is described in more detail, wherein represented preferred embodiment of the present utility model, be to be understood that those skilled in the art can revise the utility model described here and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensive instruction for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development may be complicated and time-consuming, but only be routine work to those skilled in the art.
In the following passage, with way of example the utility model is described more specifically with reference to accompanying drawing.Will be clearer according to following explanation and claims advantage of the present utility model and feature.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Actual production is found, utilizes electroplating reaction to form when electroplating rete, the electroplating film laminar surface of formation easily has point defect, and described point defect is considered to cause owing to following reason usually: produce foam when electroplating solution enters dashpot via described ingress pipe; Then, the foam of generation enters electroplating chamber by inlet tube; And then described foamy exists, and makes that the reduction reaction of electroplating solution is reacted insufficiently in wafer and the residing cathode zone of Seed Layer.Designer of the present utility model thinks after analyzing how to reduce the foam that produces when electroplating solution enters dashpot via described ingress pipe and become the direction of using the utility model minimizing plating rete point defect; How to reduce electroplating solution and become the starting point that reduces the foam generation with contacting of gas.
After designer's undergoing analysis of the present utility model and the practice, provide a kind of electroplating system, can reduce contacting of electroplating solution and gas, can reduce foamy then and produce, and then can make the generation of minimizing point defect become possibility.
As first embodiment of the present utility model, as shown in Figure 3, the electroplating system that the utility model provides comprises: ingress pipe 100, dashpot 120, inlet tube 140, electroplating chamber 160 and fairlead 180; Electroplating solution enters described ingress pipe 100 via the upper port 102 of described ingress pipe 100, and enters described dashpot 120 via the lower port 104 of described ingress pipe 100; Electroplating solution in the described dashpot 120 enters described electroplating chamber 160 via described inlet tube 140, to carry out electroplating reaction; Reacted solution is discharged via described fairlead 180; All carry electroplating solution in described dashpot 120, inlet tube 140 and the electroplating chamber 160; Especially, the lower port 104 of described ingress pipe 100 is positioned at the liquid level of described dashpot 120 electroplating solutions below 122.
Described electroplating chamber 160 also comprises positive plate 162 and negative plate 164, and described positive plate 162 and negative plate 164 place described electroplating chamber 160 both sides symmetrically; The electroplating solution that has pole plate place of electric charge obtains to electroplate rete by electroplating reaction takes place.
In the practice, the chip sucking with conductive surface (Seed Layer) invests on the described negative plate, and is immersed in the electroplating solution, and wafer and Seed Layer form with external power as electronegative negative electrode and be electrically connected; Solid-plated plate is immersed in the electroplating solution and is constituted positively charged anode; In the electroplating process, the metal ion in the electroplating solution is reduced into the plated metal atom in the negative electrode wafer surface, simultaneously in anode generation oxidizing reaction, with the balance cathodic current.After electroplating reaction is finished, the wafer surface of being immersed in the electroplating solution will form the plating rete.
The lower port 104 of described ingress pipe 100 is positioned at described dashpot 120 electroplating solution liquid levels 122 belows, can reduce contacting of described electroplating solution and gas, then reduce the content of the gas that described electroplating solution carries, can reduce the foam that produces when described electroplating solution enters described dashpot, and then can make and reduce the plating rete point defects of utilizing described electroplating solution to form and become possibility.
In addition, lower port 104 by described ingress pipe 100 is positioned at described dashpot 120 electroplating solution liquid levels 122 belows, promptly when keeping described ingress pipe upper port 102 and electroplating solution liquid level 122 distances constant, need to increase the length of described ingress pipe 100, the distance that causes described electroplating solution to be flowed through before entering described dashpot 120 increases, the viscous resistance that causes described electroplating solution to be subjected in described ingress pipe 100 increases, can slow down the flow velocity of the described electroplating solution that enters described dashpot 120, then, can reduce owing to advancing to spatter effect producing the foamy possibility, can optimize and reduce the effect that foamy produces.
In addition, owing to can reducing owing to advancing to spatter effect, the flow velocity that slows down described electroplating solution produces the foamy possibility, foamy is produced becomes possibility, and then can further make to reduce and utilize the generation of the plating rete point defects that described electroplating solution forms to become possibility.
Thus, for slowing down the flow velocity of described electroplating solution, the structure of described ingress pipe can be selected.Can increase described electroplating solution by the structure of selecting described ingress pipe and enter the distance of flowing through before the described dashpot, then, increase the viscous resistance that described electroplating solution is subjected in described ingress pipe, can slow down the flow velocity of the described electroplating solution that enters described dashpot, then, can reduce owing to advancing to spatter effect producing the foamy possibility, can optimize and reduce the effect that foamy produces.
As second embodiment of the present utility model, as shown in Figure 4, when the lower port 204 of described ingress pipe 200 is positioned at described dashpot 120 electroplating solution liquid levels 122 belows, described ingress pipe 200 has at least one break 220 between the electroplating solution liquid levels 122 in port 202 and the described dashpot 120 thereon, the number N of described break 220 determines that according to processing requirement N is a natural number; As example, the number that comprises break is 1 or 2.
As the 3rd embodiment of the present utility model, as shown in Figure 5, when the lower port 304 of described ingress pipe 300 was positioned at described dashpot 120 electroplating solution liquid levels 122 belows, described ingress pipe 300 had pleated structure 320 between the electroplating solution liquid levels 122 in port 302 and the described dashpot 120 thereon.
As the 4th embodiment of the present utility model, as shown in Figure 6, when the lower port 404 of described ingress pipe 400 was positioned at described dashpot 120 electroplating solution liquid levels 122 belows, described ingress pipe 400 had arcuate structure 420 between the electroplating solution liquid levels 122 in port 402 and the described dashpot 120 thereon.
In the above-described embodiments, the cross section of described ingress pipe can be applicable arbitrary graphic in the actual production, as circular, square etc.Described electroplating solution can comprise reaction soln and tensio-active agent; Described ingress pipe can comprise at least one and import arm, utilizes different importing arms to import described reaction soln and tensio-active agent to described dashpot; The upper port of described ingress pipe and the distance between the lower port are greater than the distance between the electroplating solution liquid level in the upper port of described ingress pipe and the described dashpot.
By selecting the described ingress pipe structure between the electroplating solution liquid level in port and the described dashpot thereon, as has at least one break, have pleated structure or have arcuate structure, with electroplating solution liquid level in keeping described ingress pipe upper port and described dashpot when constant, increase electroplating solution and enter the distance of flowing through before the dashpot, slow down so that flow into the speed of the electroplating solution of dashpot, prevent to enter in the described electroplating solution owing to the gas that advances to spatter to cause of electroplating solution, can reduce the foam that produces when described electroplating solution enters described dashpot, and then can make and reduce the plating rete point defects of utilizing described electroplating solution to form and become possibility.
Especially, when the lower port of described ingress pipe is positioned at the middle part of described dashpot, being beneficial to the gas that advances to spatter to cause that prevents owing to electroplating solution enters in the described electroplating solution, can reduce the foam that produces when described electroplating solution enters described dashpot, and then can make and reduce the plating rete point defects of utilizing described electroplating solution to form and become possibility.
As other embodiment of the present invention, when the lower port of described ingress pipe is positioned at described dashpot electroplating solution liquid level below, by in described ingress pipe inwall adhesive net membrane structure, the viscosity factor of described nethike embrane structure is greater than the viscosity factor of described ingress pipe inwall, still can increase the viscous resistance that described electroplating solution is subjected in described ingress pipe, can slow down the flow velocity of the described electroplating solution that enters described dashpot, then, can reduce owing to advancing to spatter effect producing the foamy possibility, can optimize and reduce the effect that foamy produces.
What need emphasize is that not elsewhere specified structure and composition all can adopt traditional technology, and the concrete processing parameter that relates to is determined according to product requirement and processing condition.
Although the utility model has been described and has enough described embodiment in detail although describe by the embodiment at this, the applicant does not wish by any way the scope of claims is limited on this details.Other to those skilled in the art advantage and improvement are conspicuous.Therefore, be not limited to represent and the specific detail of describing, equipment and the method and the illustrative example of expression at the utility model of relative broad range.Therefore, can depart from these details and do not break away from the spirit and scope of the total utility model notion of applicant.
Claims (8)
1. an electroplating system comprises: ingress pipe, dashpot, inlet tube, electroplating chamber and fairlead; Electroplating solution enters described ingress pipe via the upper port of described ingress pipe, and enters described dashpot via the lower port of described ingress pipe; Electroplating solution in the described dashpot enters described electroplating chamber via described inlet tube, to carry out electroplating reaction; Reacted solution is discharged via described fairlead; All carry electroplating solution in described dashpot, inlet tube and the electroplating chamber; It is characterized in that: the lower port of described ingress pipe is positioned at the liquid level below of described dashpot electroplating solution.
2. electroplating system according to claim 1 is characterized in that: described ingress pipe has at least one break between the electroplating solution liquid level in port and the described dashpot thereon.
3. electroplating system according to claim 1 is characterized in that: described ingress pipe has pleated structure between the electroplating solution liquid level in port and the described dashpot thereon.
4. electroplating system according to claim 1 is characterized in that: described ingress pipe has arcuate structure between the electroplating solution liquid level in port and the described dashpot thereon.
5. electroplating system according to claim 1 is characterized in that: described ingress pipe inwall is bonded with the nethike embrane structure, and the viscosity factor of described nethike embrane structure is greater than the viscosity factor of described ingress pipe inwall.
6. electroplating system according to claim 1 is characterized in that: the lower port of described ingress pipe is positioned at the middle part of described dashpot.
7. electroplating system according to claim 1 is characterized in that: described electroplating solution comprises reaction soln and tensio-active agent.
8. electroplating system according to claim 7 is characterized in that: described ingress pipe comprises at least one and imports arm, utilizes different importing arms to import described reaction soln and tensio-active agent to described dashpot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200767381U CN201136909Y (en) | 2007-10-25 | 2007-10-25 | Electroplating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200767381U CN201136909Y (en) | 2007-10-25 | 2007-10-25 | Electroplating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201136909Y true CN201136909Y (en) | 2008-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200767381U Expired - Lifetime CN201136909Y (en) | 2007-10-25 | 2007-10-25 | Electroplating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201136909Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110561631A (en) * | 2018-06-06 | 2019-12-13 | 隆基绿能科技股份有限公司 | Cutting fluid supply device and method |
-
2007
- 2007-10-25 CN CNU2007200767381U patent/CN201136909Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110561631A (en) * | 2018-06-06 | 2019-12-13 | 隆基绿能科技股份有限公司 | Cutting fluid supply device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20121120 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20121120 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CX01 | Expiry of patent term |
Granted publication date: 20081022 |
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| CX01 | Expiry of patent term |