CN207497303U - Buffer component - Google Patents

Buffer component Download PDF

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Publication number
CN207497303U
CN207497303U CN201721530016.9U CN201721530016U CN207497303U CN 207497303 U CN207497303 U CN 207497303U CN 201721530016 U CN201721530016 U CN 201721530016U CN 207497303 U CN207497303 U CN 207497303U
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China
Prior art keywords
buffer component
plate body
face
assembly
assemblies
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Active
Application number
CN201721530016.9U
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Chinese (zh)
Inventor
赵张莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Link Electronic Technology (zhongshan) Co Ltd
Wistron Corp
Original Assignee
Link Electronic Technology (zhongshan) Co Ltd
Wistron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Link Electronic Technology (zhongshan) Co Ltd, Wistron Corp filed Critical Link Electronic Technology (zhongshan) Co Ltd
Priority to CN201721530016.9U priority Critical patent/CN207497303U/en
Priority to TW106218093U priority patent/TWM558780U/en
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Abstract

A kind of buffer component.The buffer component includes a plate body and multiple first assemblies;The plate body has multiple first assembling groves;Those first assemblies correspond respectively to those the first assembling groves;Wherein, those first assemblies selectively fit on plate body and protrude from the plate body or be respectively charged into those first assembling groves and the buffer component is enabled to be selectively in a packaging material state or a load cushion state, when the buffer component is in the packaging material state, the plate body surrounds out a cushion space jointly with those first assemblies, when the buffer component is in the load cushion state, which spells one buffering of composition with those first assemblies and carries pad jointly.The buffer component of the utility model can provide product impact resistance and resist the ability for falling and falling, and convenient for collecting, save space.

Description

Buffer component
Technical field
It is more particularly to a kind of slow with multiple assembling groves and multiple assemblies the utility model is related to a kind of buffer component Rush component.
Background technology
Electronic product may be transported to sale hotel owner or customer after manufacture, no matter however why transport place, fortune Send one of subject that quality always paid attention to by manufacturer.Therefore in order to which product can be fully transported in user's hand, manufacturer Multiple fenders are often set around commodity, and fender is for example by common Poly Foam material, foam material or PU material institute shape Into.By fender around the setting products of commodity hit or dropped when strength be able to be absorbed, and then drop Low commodity damage probability.
However, being transported in user's hand and after dismantling in product, the function that fender is protected when product transports disappears It loses so that the fender person of being likely to be used removed is stacked on one side, and causes occupancy spatially.Or it is some uses Person simply directly abandons and does not continue to utilize, and in turn results in a kind of waste of resource.
Accordingly, it is desirable to provide a kind of buffer component solves the above problems.
Utility model content
The utility model lies in that providing a kind of buffer component, use and solve in prior art because fender is complete in transport task Other functions are had no after so that when fender becomes the burden in the storage of space when being contained or abandoned again Cause the waste in resource.
A kind of buffer component disclosed in one embodiment of the utility model, the buffer component include a plate body and multiple the One assembly;The plate body has multiple first assembling groves;Those first assemblies correspond respectively to those the first assembling groves;Its In, those first assemblies selectively fit in the plate body and protrude from the plate body or be respectively charged into those first assembling groves and The buffer component is enabled to be selectively in a packaging material state or a load cushion state, when the buffer component is in the packaging material state, The plate body surrounds out a cushion space jointly with those first assemblies, when the buffer component is in the load cushion state, the plate Body spells one buffering of composition with those first assemblies and carries pad jointly.
Buffer component according to above-described embodiment, because buffer component is in addition to can be at the first assembly protrusion plate body And surrounded out outside the packaging material state of a cushion space with plate body, it can also be at the load cushion that the first assembly is packed into the first assembling grove State.Thus, when buffer component is in packaging material state, product is placed in cushion space, product to be enabled to be able to by plate body and The circular protection of first assembly, and then product impact resistance is provided and resists the ability for falling and falling.In addition, when buffer component is not required to protect During product, the first assembly can spell back the assembling grove of plate body with convenient for collecting and saving space.
The explanation of explanation and implementation below above with respect to the utility model content is to demonstrate and explain this reality With novel principle, and the claims for providing the utility model are further explained.
Description of the drawings
Fig. 1 is the three-dimensional exploded view of the buffer component according to the utility model first embodiment.
Fig. 2 is the side view of Fig. 1.
Fig. 3 is that the buffer component of Fig. 1 is in the stereoscopic schematic diagram of packaging material state.
Fig. 4 is that the buffer component of Fig. 1 is in the stereoscopic schematic diagram for carrying cushion state.
Fig. 5 is the stereogram of the plate body of the buffer component according to the utility model second embodiment.
Fig. 6 is the sectional view along face line 6-6 of Fig. 5.
Primary clustering symbol description:
10 buffer components
100th, 100 ' plate body
110 first faces
110 ' first plates
111st, 211,311 first design layer
111 ' first faces
120 second faces
120 ' second plates
121 ' second faces
130th, 130 ' first assembling grove
140th, 140 ' second assembling grove
141 first buckle structures
200 first assemblies
210 third faces
220 fourth faces
230 first wall portions
240 second wall portions
300 second assemblies
310 the 5th faces
320 the 6th faces
330 second buckle structures
400 cushion spaces
500 cushion pads
600 first decorative pattern layers
Specific embodiment
It please refers to Fig.1 and Fig. 2.Fig. 1 is the solid point of the buffer component according to the utility model first embodiment Xie Tu.Fig. 2 is the sectional view of Fig. 1.
A kind of buffer component 10 of the present embodiment polyethylene foamed material for example, easy to process or Poly Foam are formed. In the present embodiment, buffer component 10 uses polyethylene foamed material, upper easy to process in order to subsequently use, and is said together after appearance It is bright.In addition, recovery of the buffer component 10 with anticollision and good stress after moulding, therefore buffer component 10 may be disposed at electricity Sub- product periphery is to provide anti-drop or impact resistant measure.In the present embodiment, buffer component 10 includes a plate body 100, more A first assembly 200 and multiple second assemblies 300.
Plate body 100 has one first face 110, one second face 120, multiple first assembling groves 130 and multiple second assembling groves 140.First face 110 is relative to the second face 120, and the first face 110 of plate body 100 has one first design layer 111.First pattern Layer 111 for example but is not limited to polyethylene for film and material, and the first design layer 111 is attached at the first face 110 of plate body 100.It is more A first assembling grove 130 and multiple second assembling groves 140 are through to the second face 120 from the first face 110 of plate body 100 respectively, and The periphery of these first assembling groves 130 and plate body 100 is kept for the week an of distance and these second assembling groves 140 and plate body 100 Edge is connected.The opposite end of every one second assembling grove 140 respectively has one first buckle structure 141.
In the present embodiment, the periphery of these first assembling groves 130 and plate body 100 keeps a distance, and these second group The setting that tankage 140 is connected with 100 periphery of plate body, is not limited to the utility model.It in other embodiments, can be by these First assembling grove is all set to far from periphery part with these second assembling groves or is all connected with the periphery of plate body.
Multiple first assemblies 200 correspond respectively to these the first assembling groves 130 in shape and dimensions, and every 1 the One assembly 200 has an opposite third face 210 and a fourth face 220, and third face 210 has one first design layer 211. These first design layers 211 for example but are not limited to polyethylene, and these first design layers 211 are attached at these for film and material The third face 210 of first assembly 200.In the present embodiment, the shape of the first assembly 200 is the shape of L-shaped, i.e. its shape For substantially mutually orthogonal one first wall portion 230 and one second wall portion 240.
The shape of each the second assembly 300 is in vertical bar shape, and every one second assembly 300 has one the 5th face 310 And one the 6th face 320.5th face 310 and the 6th face 320 are located at the opposite sides of every one second assembly 300 respectively.Every 1 5th face 310 of two assemblies 300 has one first design layer 311.In addition, there are two second for every one second assembly 300 tool Buckle structure 330, and two the second buckle structures 330 are located at the opposite end of every one second assembly 300.These second assemblings When body 300 is respectively charged into these second assembling groves 140, these second buckle structures 330 be detachably sticked in these These first buckle structures 141 of two assembling groves 140 so that these second assemblies 300 can more securely be installed in plate body 100。
In the present embodiment, plate body 100, these first assemblies 200 and these 300 respective first figures of the second assembly Sample layer 111,211,311 is, for example, the design for being printed on word, pattern or geometric figure.
In the present embodiment, there are two the first buckle structure 141 and only the second assemblies for only the second assembling grove 140 tool 300 tools are not limited thereto there are two the second buckle structure 330.In other embodiments, it also can be the first assembling grove and the Two assembling groves are all provided with the first buckle structure, and the first assembly and the second assembly are all equipped with the second buckle structure.
The buffer component 10 of the present embodiment, plate body 100, these first assemblies 200 and these second assemblies 300 Such as formed for the plate cutting of same polyethylene foamed material.Therefore, buffer component 10 is quite easy in making.
Also referring to Fig. 1 to Fig. 4, Fig. 3 is that the buffer component of Fig. 1 is in the stereoscopic schematic diagram of packaging material state, and Fig. 4 is figure 1 buffer component is in the stereoscopic schematic diagram for carrying cushion state.
In the present embodiment, these first assemblies 200 selectively fit in plate body with these second assemblies 300 It 100 and protrudes from plate body 100 or is selectively respectively charged into these first assembling groves 130 and these second assembling groves 140, And buffer component 10 is enabled to be in a packaging material state or a load cushion state.
Specifically, as shown in figure 3, when buffer component 10 is in packaging material state, the 4th of every one first assembly 200 the Face 220 is attached at first design layer 111 in the first face 110 of plate body 100, and the 6th face 320 of every one second assembly 300 is pasted Invest first design layer 111 in the first face 110 of plate body 100.First wall portion 230 and one second of every one first assembly 200 Wall portion 240 is located at 110 each corner of the first face of plate body 100 respectively, and the first wall portion 230 and the second wall portion 240 are substantial respectively It is parallel to the adjacent two sides of plate body 100 and these second assemblies 300 is located at each side of plate body 100 respectively, to enable Plate body 100, these first assemblies 200 and these second assemblies 300 surround out a cushion space 400 jointly.Cushion space 400 to supplied for electronic product or other intolerant to the storing article fallen, and by these first assemblies 200 and these second assembling Body 300 surrounds protection.
In the present embodiment, these first assemblies 200 and these second assemblies 300 are pasted by way of thermal-adhering Plate body 100 is invested, but is not limited thereto.In other embodiments, these first assemblings can be used with these second assemblies Glued mode attaches.
As shown in figure 4, when buffer component 10 is in and carries cushion state, these first assemblies 200 and these second assemblings Body 300 is respectively charged into the second of these first assembling groves 130 and these second assembling groves 140 and every one second assembly 300 Buckle structure 330 is combined with the first buckle structure 141 of every one second assembling grove 140, to enable the first face 110 of plate body 100, every 5th face 310 of the third face 210 of one first assembly 200 and every one second assembly 300 is substantially coplanar and forms one Cushion pad 500.When buffer component 10, which is in, carries cushion state, plate body 100, these first assemblies 200 and these second assemblings First design layer 111,211,311 of body 300 pieces together into one first decorative pattern layer 600 jointly.
From the point of view of two use states of above-mentioned buffer component 10, sold if the electronic equipment that manufacturer is intended to just to have dispatched from the factory is transported to , electronic product can be placed in buffer component 10 in the cushion space 400 under packaging material state by manufacturer, to enable electronic product simultaneously It is surrounded by four the first assemblies 200 positioned at corner and two the second assemblies 300 for being located therein opposite two edges. Accordingly, there can be the characteristic for absorbing impact force by four the first assemblies 200 and two the second assemblies 300, with absorbent The shock that product are born when accidentally dropping or being collided in transporting way.
After user takes out electronic product from cushion space 400, buffer component 10 then no longer needs to protect electronics production Product.Therefore, user can pull up four the first assemblies 200 and two the second assemblies 300, then be respectively charged into four One assembling grove 130 and two the second assembling groves 140 so that four the first assemblies 200 and two the second assemblies 300 are convex originally Buffer component 10 for plate body 100 becomes the plate buffer component 10 coplanar with plate body 100.Therefore, buffer component 10 exists It can be convenient user to be enabled to store compared to the space that storage can be more saved in packaging material state under cushion state in carrying.
In the present embodiment, these first assemblies 200 and these second assemblies 300 are adhered to by way of thermal-adhering In plate body 100 so that it is strong that these first assemblies 200 and these second assemblies 300 are fixed on the structure that plate body 100 is formed Degree can provide buffer component 10 and have a good anti-fall ability of falling, such as in falling and falling strength test, be loaded into buffer component 10 Electronic equipment fallen from least 20 meters of high height, electronic equipment still maintains good shape and function is normal.In addition, Under the premise of buffer component 10 meets the good anti-fall ability of falling, these first assemblies 200 and these second assemblies 300 The fixing intensity for fitting in plate body 100 is still designed as the characteristic that the strength of adult can be pulled up, buffer component 10 to be enabled not use It is removed when electronic product is protected.
When buffer component 10 is when carrying cushion state, because these second assembling groves 140 are connected with the periphery of plate body 100, therefore It can be combined by the second buckle structure 330 of these the second assemblies 300 with the first buckle structure 141 of the second assembling grove 140, Strengthen fixing intensity when these second assemblies 300 are respectively charged into these second assembling groves 140, and avoid these the second assemblings Body 300 comes off and loses.
In the present embodiment, because of the first pattern of plate body 100, these first assemblies 200 and these the second assemblies 300 Layer 111,211,311 is the design with word or pattern, therefore buffer component 10 is when carrying cushion state, these first design layers 111st, 211,311 the first decorative pattern layers 600 collectively formed are formed as complete word or pattern, to enable buffer component 10 have beautiful effect in appearance.In addition, these first design layers 111,211,311 collectively form the side of complete pattern Formula is similar to the design of picture mosaic so that user is operationally more rich in entertaining sense.
Furthermore these aforementioned first design layers 111,211,311 are attached at the plate body of polyethylene foamed material for film 100th, on these first assemblies 200 and these second assemblies 300 so that shaggy polyethylene foamed material originally The clear and good word of resolution ratio or pattern can be also presented in buffer component 10, to enable buffer component 10 visually further Promote ornamental value.
In the present embodiment, the word of complete first decorative pattern layer 600 or pattern be by plate body 100, these First design layer 111,211,311 of one assembly 200 and these the second assemblies 300 is the film institute with word or pattern Splicing composition, but be not limited thereto.In other embodiments, the first design layer of plate body, these first assemblies and these First design layer of the second design layer can be pigment, and be respectively coated on the first face of plate body and the third of these the first assemblies Face and form pattern or word.
In previous embodiment, in the case where carrying cushion state, only wherein side has the first decorative pattern layer 600 to buffer component 10, but It is not limited thereto.In other embodiments, second can be set again in the fourth face in the second face of plate body and these assemblies Design layer, and the second all design layers forms one second decorative pattern layer, i.e. the opposite sides of buffer component all has decoration Design layer.
In addition, in the aforementioned embodiment, these first assembling groves 130 are respectively through plate with these second assembling groves 140 The setting in the first face 110 and the second face 120 of body, but be not limited thereto.Please refer to Fig. 5 and Fig. 6.Fig. 5 is according to this practicality The stereogram of the plate body of buffer component disclosed in novel second embodiment.Fig. 6 is the sectional view along face line 6-6 of Fig. 5.
In the present embodiment, plate body 100 ' is also comprising the first plate 110 ' and the second plate 120 ' being stacked, the first plate 110 ' have one first face 111 ', and the second plate 120 ' has the second face 121 '.First face 111 ' is positioned at the first plate 110 ' Back to the side of the second plate 120 ', and the second face 121 ' positioned at the second plate 120 ' back to the side of the first plate 110 '.It is more A first assembling grove 130 ' is recessed respectively from the first face 111 ' with multiple second assembling groves 140 ' and extends towards the second face 121 ', but It is not through to the second face 121 '.I.e. in the plate body 100 ' of the present embodiment, these first assembling groves 130 ' and these the second assemblings Setting of the slot 140 ' for the second plate 120 ' of non-through, and the first plate 110 ', these first assemblies 200 (as shown in Figure 1) And these second assemblies 300 (as shown in Figure 1) are, for example, that the plate cutting of same polyethylene foamed material is formed.
According to the buffer component of above-described embodiment, because the first assembly and the second assembly are in addition to that can protrude plate body and surround It is formed outside the packaging material state of a cushion space, the first assembly is still packed into the first assembling grove and forms a buffering section with plate body Load cushion state so that buffer component not only has the form around protection electronic product, also has with plate body and into plank Form.Thus, when buffer component is not required to protection product, the first assembly can merge with plate body with convenient for collecting and saving Space.
In addition, in buffer component under packaging material state, these first assemblies pass through heat posted with these second assemblies The mode of conjunction is fixed on plate body, strong these first assemblies and these second assemblies to be enabled to be fixed on the structure that plate body formed Degree can provide buffer component and have the good anti-fall ability of falling.In addition, before buffer component meets the good anti-fall ability of falling It puts, the fixing intensity that the first assembly and these second assemblies fit in plate body is still designed as what the strength of adult can be pulled up Characteristic, buffer component to be enabled to be removed when not for protecting electronic product.
In addition, it is with word or pattern by the first design layer of plate body and the first design layer of these the first assemblies Film, buffer component to be enabled to may make up the first decorative pattern layer with complete word or pattern when carrying cushion state, and then So that buffer component has the effect of beautification in appearance.
Although the utility model is disclosed as above with aforementioned preferred embodiment, it is new to be not limited to this practicality Type, any those skilled in the art in the case where not departing from the spirit and scope of the utility model, should can make a little more Dynamic and retouching, thus the scope of patent protection of the utility model must regard this specification appended claims institute's defender as It is accurate.

Claims (11)

1. a kind of buffer component, which is characterized in that the buffer component includes:
One plate body, the plate body have multiple first assembling groves;And
Multiple first assemblies, multiple first assembly correspond respectively to multiple first assembling grove;
Wherein, multiple first assembly selectively fits on the plate body and protrudes from the plate body or be respectively charged into multiple First assembling grove and enable the buffer component be selectively in a packaging material state or one carry cushion state, when the buffer component be in should During packaging material state, which surrounds out a cushion space jointly with multiple first assembly, when the buffer component is in the load During cushion state, which spells one cushion pad of composition jointly with multiple first assembly.
2. buffer component as described in claim 1, which is characterized in that the plate body has opposite one first face and one second Face, multiple first assembling grove are all located at first face, and multiple first assembly respectively has an opposite third face and one the On four sides, when the buffer component is in the packaging material state, the fourth face of multiple first assembly is attached at being somebody's turn to do for the plate body First face, when the buffer component is in the load cushion state, first face of the plate body and multiple first assembly this Three faces are substantially coplanar.
3. buffer component as claimed in claim 2, which is characterized in that first assembling grove from first face be through to this second Face.
4. buffer component as claimed in claim 2, which is characterized in that first face of the plate body and multiple first assembly The third face respectively have one first design layer, when the buffer component is in the load cushion state, which spells jointly Form one first decorative pattern.
5. buffer component as claimed in claim 4, which is characterized in that first design layer is film, and is attached at this respectively First face of plate body and the third face of multiple first assembly.
6. buffer component as claimed in claim 4, which is characterized in that first design layer is pigment, and is respectively coated on this First face of plate body and the third face of multiple first assembly.
7. buffer component as claimed in claim 4, which is characterized in that second face of the plate body and multiple first assembly The fourth face respectively have one second design layer, when the buffer component is in the load cushion state, which spells jointly Form one second decorative pattern.
8. buffer component as claimed in claim 2, which is characterized in that first assembling grove first faces second face and prolong from this It stretches, but is not through to second face.
9. buffer component as described in claim 1, which is characterized in that the periphery of multiple first assembling grove and the plate body is kept One distance, each first assembly include one first wall portion and one second wall portion, the first wall portion and the second wall portion essence Upper mutually orthogonal, when the buffer component is in the packaging material state, multiple first assembly is located at each corner of the plate body respectively, And the first wall portion and the second wall portion be respectively substantially parallel to the adjacent two sides of the plate body, to enable the plate body and this more A first assembly surrounds out the cushion space jointly.
10. buffer component as claimed in claim 9, which is characterized in that the plate body also has multiple second assembling groves, multiple Second assembling grove is connected with the periphery of the plate body, which further includes multiple second assemblies, each multiple second group The shape of body is filled in vertical bar shape, when the buffer component is in the packaging material state, multiple second assembly is located at the plate respectively Each side of body, the plate body, multiple first assembly and multiple second assembly to be enabled to surround out the cushion space jointly.
11. buffer component as claimed in claim 10, which is characterized in that the opposite end of each second assembling grove respectively has One first buckle structure, the opposite end of each second assembly respectively have one second buckle structure, second buckle structure It is the concaveconvex structure that matches with first buckle structure, and second buckle structure is separably sticked in the first buckle knot Structure.
CN201721530016.9U 2017-11-15 2017-11-15 Buffer component Active CN207497303U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201721530016.9U CN207497303U (en) 2017-11-15 2017-11-15 Buffer component
TW106218093U TWM558780U (en) 2017-11-15 2017-12-06 Buffer member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721530016.9U CN207497303U (en) 2017-11-15 2017-11-15 Buffer component

Publications (1)

Publication Number Publication Date
CN207497303U true CN207497303U (en) 2018-06-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721530016.9U Active CN207497303U (en) 2017-11-15 2017-11-15 Buffer component

Country Status (2)

Country Link
CN (1) CN207497303U (en)
TW (1) TWM558780U (en)

Also Published As

Publication number Publication date
TWM558780U (en) 2018-04-21

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