CN207491150U - Sound equipment - Google Patents
Sound equipment Download PDFInfo
- Publication number
- CN207491150U CN207491150U CN201721535040.1U CN201721535040U CN207491150U CN 207491150 U CN207491150 U CN 207491150U CN 201721535040 U CN201721535040 U CN 201721535040U CN 207491150 U CN207491150 U CN 207491150U
- Authority
- CN
- China
- Prior art keywords
- metal
- mainboard
- leading note
- radiating block
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of sound equipment.The sound equipment includes chassis and the housing of inner cavity is formed with chassis assembling installation;Interior intracavitary is equipped with mainboard, metal mainboard radiating block, metal leading note cone, mainboard is fixedly installed on chassis, metal mainboard radiating block is fixedly installed on mainboard, metal leading note cone is fixedly installed in housing above metal mainboard radiating block, and metal leading note cone is connect by thermal interfacial material with metal mainboard radiating block, housing is equipped with heat emission hole around the side wall of metal leading note cone.Technical solutions of the utility model improve radiating efficiency, and while so that the radiating block is reached temperature increase requirement, casing rigidity will not be had an impact.
Description
Technical field
The utility model is related to sound technique field, more particularly to a kind of sound equipment.
Background technology
Since the output of audio can generate a large amount of heat inside sound equipment, if radiating not in time, it is easy to cause sound
It is excessively high to ring internal temperature, sound equipment is caused to damage.
The traditional heat-dissipating mode of sound equipment is to rely primarily on radiating block radiation in narrow confined space to carry out by housing
Heat dissipation.Since radiating block is closed in inside sound equipment, it is impossible to be in direct contact with external environment, the heat that heat loss through radiation goes out is also difficult and empty
Gas carries out directly effective heat exchange, causes radiating efficiency low, the heat of radiating block is excessively high, and temperature increase requirement is not achieved in radiating block.
Even if radiating block is made to reach temperature increase requirement, but casing rigidity can be caused to reduce by changing Standard or shell structure, from
And requirement is not achieved.
Utility model content
The main purpose of the utility model is to provide a kind of sound equipment, it is intended to improve radiating efficiency, radiating block is made to reach Wen Sheng
It is required that while, casing rigidity will not be had an impact.
To achieve the above object, the utility model proposes sound equipment, including chassis and with the chassis assemble installation shape
Into the housing of inner cavity;The interior intracavitary is equipped with mainboard, metal mainboard radiating block, metal leading note cone, and the mainboard is fixedly installed in
On the chassis, the metal mainboard radiating block is fixedly installed on the mainboard, and the metal leading note cone is in the metal master
The housing is fixedly installed in above plate radiating block, and metal leading note cone passes through thermal interfacial material and the metal mainboard
Radiating block connects, and the housing is equipped with heat emission hole around the side wall of metal leading note cone.
Optionally, the thermal interfacial material is bonding curing heat-conducting glue or elastic conducting hot body material.
Optionally, the bonding curing heat-conducting glue is heat-conducting silicone grease, and the elastic conducting hot body material is heat conductive silica gel or leads
Hot graphite flake or heat-conducting silica gel sheet.
Optionally, the housing is in reticular structure around the side wall of metal leading note cone.
Optionally, the metal mainboard radiating block is aluminium mainboard radiating block.
Optionally, the metal leading note cone is bored for aluminium leading note.
Optionally, the opening of metal leading note cone is towards the metal mainboard radiating block.
Technical solutions of the utility model are bored by using thermal interfacial material connection metal mainboard radiating block with metal leading note, are filled out
The microvoid being assembled to form between metal mainboard radiating block and metal leading note cone and the hole of its surface irregularity have been mended, has been led to
Cross the contact area that thermal interfacial material effectively increases metal mainboard radiating block and metal leading note cone.And thermal interfacial material thermal resistance compared with
It is small, there is high-termal conductivity so that the heat that mainboard generates is transferred to metal through thermal interfacial material by metal mainboard radiating block and leads
Sound is bored, and establishes effective thermal conduction path.Housing has heat emission hole on the side wall of metal leading note cone simultaneously, passes through heat dissipation
The thermal energy that hole bores metal leading note directly carries out heat exchange with extraneous air, the thermal energy of generation is made effectively to transmit rapidly, significantly
Improve radiating efficiency.While so that metal mainboard radiating block meets temperature increase requirement, and will not be to structure and housing mechanicalness
It can have an impact.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to the structure shown in these attached drawings.
Fig. 1 is the structure diagram of one embodiment of the utility model sound equipment;
Drawing reference numeral explanation:
Label | Title | Label | Title |
100 | Sound equipment | 110 | Chassis |
120 | Mainboard | 130 | Metal mainboard radiating block |
140 | Metal leading note is bored |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that described embodiment is only the part of the embodiment rather than whole of the utility model
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise
Lower all other embodiments obtained, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining relative position relation, motion conditions under a certain particular pose (as shown in drawings) between each component etc., such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description in " first ", " second " etc. involved in the utility model is only used for description purpose, without being understood that
To indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Define as a result, " first ",
At least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the technical side between each embodiment
Case can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical solution
Conflicting or can not realize when occur will be understood that the combination of this technical solution is not present, also not in the requires of the utility model
Protection domain within.
The utility model proposes a kind of sound equipments.
With reference to Fig. 1.
In the utility model embodiment, which includes chassis 110 and is assembled in installation formation with chassis 110
The housing (not shown) of chamber;Interior intracavitary is equipped with mainboard 120, metal mainboard radiating block 130, metal leading note cone 140, mainboard
120 are fixedly installed on chassis 110, and metal mainboard radiating block 130 is fixedly installed on mainboard 120, and metal leading note cone 140 is in gold
The top of owner's plate radiating block 130 is fixedly installed in housing, and metal leading note cone 140 passes through thermal interfacial material (not shown)
It is connect with metal mainboard radiating block 130, housing is equipped with heat emission hole (not shown) around the side wall of metal leading note cone 140.
Technical solutions of the utility model are bored by using thermal interfacial material connection metal mainboard radiating block 130 with metal leading note
140, fill up the microvoid and its concave-convex surface being assembled to form between metal mainboard radiating block 130 and metal leading note cone 140
Uneven hole effectively increases the contact surface of metal mainboard radiating block 130 and metal leading note cone 140 by thermal interfacial material
Product.And thermal interfacial material thermal resistance is smaller, has high-termal conductivity so that the heat that mainboard 120 generates passes through metal mainboard radiating block
130 are transferred to metal leading note cone 140 through thermal interfacial material, establish effective thermal conduction path.Housing is led around metal simultaneously
There is heat emission hole on the side wall of sound cone 140, the thermal energy for making metal leading note cone 140 by heat emission hole directly carries out heat with extraneous air
It exchanges, the thermal energy of generation is made effectively to transmit rapidly, significantly improves radiating efficiency.So that metal mainboard radiating block 130 meets
While temperature increase requirement, and structure and housing mechanical performance will not be had an impact.
Specifically, inner cavity is assembled to form by chassis 110 and housing, is equipped with mainboard 120 in the lumen, metal mainboard dissipates
Heat block 130, metal leading note cone 140.Mainboard 120 is made to be fixedly installed on chassis 110, metal mainboard radiating block 130 is fixedly mounted
In on mainboard 120, the thermal energy for being generated mainboard 120 by 130 heat conduction of metal mainboard radiating block transmits outward, reduces mainboard 120
Temperature.Metal leading note cone 140 is made to be set on the top of metal mainboard radiating block 130 and is fixedly installed in housing, on the one hand, passes through gold
Belong to leading note cone 140 and audio is subjected to transfer spreading, realize preferable result of broadcast;On the other hand, in metal mainboard radiating block 130
It is rough and uneven in surface due to surface after being assembled between metal leading note cone 140, generate many microvoids, metal mainboard radiating block
130 carry out heat by air to metal leading note cone 140 when transmitting, and since the thermal resistance of air is larger, thermal energy is more empty with sealing
Between air carry out heat exchange, cause to be transmitted to effective heat-energy losses of metal leading note cone 140, heat dissipation effect is poor.Due to heat
Boundary material thermal resistance is smaller, has high-termal conductivity and insulating properties, using thermal interfacial material by metal mainboard radiating block 130 and metal
140 connection of leading note cone, has filled up microvoid therebetween, has been effectively increased contact area therebetween, establishes effective heat transfer
Channel avoids heat loss, effectively improves radiating efficiency.In addition so that housing is equipped with around the outer wall of metal leading note cone 140 to be dissipated
Hot hole causes thermal energy directly to carry out heat exchange with external air by metal leading note cone 140 will pass through heat emission hole, realize compared with
Good heat dissipation effect.Simultaneously as radiating efficiency significantly improves so that the temperature of metal mainboard radiating block 130 rises to meet and use
It is required that and the assembling of structure and housing are not impacted.
In the present embodiment, thermal interfacial material employs bonding curing heat-conducting glue or elastic conducting hot body material, bonding curing
Heat-conducting glue uses heat-conducting silicone grease, and elastic conducting hot body material can be heat conductive silica gel or conductive graphite piece or heat-conducting silica gel sheet.When
So, in practical applications, other thermal interfacial materials for reaching heat dissipation effect can also be used.
Further, as shown in Figure 1, metal mainboard radiating block 130 employs aluminium mainboard radiating block made of aluminum material.For
Make to realize that best heat is transmitted between metal leading note cone 140 and metal mainboard radiating block 130, avoid between different metal because of thermal conductivity
Caused by heat loss, metal leading note cone 140 adopt be formed from aluminium aluminium leading note cone.In other embodiments, other gold can also be used
Belong to, metal mainboard radiating block 130 and metal leading note cone 140 as made of copper, albronze etc. are not specifically limited herein.
Further, as shown in Figure 1, the side wall that housing surrounds metal leading note cone 140 is in reticular structure (not shown).
By the way that housing is made to be equipped with several heat emission holes around the outer wall of metal leading note cone 140, reticular structure is formed, is led with increasing metal
The heat exchange area that sound cone 140 is contacted with extraneous air, increasing heat radiation area, rapid cooling realize preferable heat dissipation effect.
Further, as shown in Figure 1, the opening of metal leading note cone 140 is towards metal mainboard radiating block 130.Pass through metal
The opening of leading note cone 140 is diffused audio, to realize preferable result of broadcast, meets use of the people to high tone quality sound equipment
It is required that.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
It is every under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes or directly/is used in other related technical areas indirectly and is included in the scope of patent protection of the utility model.
Claims (7)
1. a kind of sound equipment, which is characterized in that the housing of inner cavity is formed including chassis and with chassis assembling installation;It is described
Interior intracavitary is equipped with mainboard, metal mainboard radiating block, metal leading note cone, and the mainboard is fixedly installed on the chassis, the gold
Owner's plate radiating block is fixedly installed on the mainboard, and the metal leading note cone is fixed in the top of the metal mainboard radiating block
The housing is installed on, and metal leading note cone is connect by thermal interfacial material with the metal mainboard radiating block, the shell
Body is equipped with heat emission hole around the side wall of metal leading note cone.
2. sound equipment as described in claim 1, which is characterized in that the thermal interfacial material is bonding curing heat-conducting glue or elastic conducting
Hot body material.
3. sound equipment as claimed in claim 2, which is characterized in that the bonding cures heat-conducting glue as heat-conducting silicone grease, the elasticity
Heat carrier material is heat conductive silica gel or conductive graphite piece or heat-conducting silica gel sheet.
4. sound equipment as described in claim 1, which is characterized in that the housing is in netted around the side wall of metal leading note cone
Structure.
5. sound equipment according to any one of claims 1 to 4, which is characterized in that the metal mainboard radiating block is aluminium mainboard
Radiating block.
6. sound equipment as claimed in claim 5, which is characterized in that the metal leading note cone is bored for aluminium leading note.
7. sound equipment as described in claim 1, which is characterized in that the opening of the metal leading note cone is dissipated towards the metal mainboard
Heat block.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721535040.1U CN207491150U (en) | 2017-11-16 | 2017-11-16 | Sound equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721535040.1U CN207491150U (en) | 2017-11-16 | 2017-11-16 | Sound equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207491150U true CN207491150U (en) | 2018-06-12 |
Family
ID=62473724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721535040.1U Expired - Fee Related CN207491150U (en) | 2017-11-16 | 2017-11-16 | Sound equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207491150U (en) |
-
2017
- 2017-11-16 CN CN201721535040.1U patent/CN207491150U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180612 Termination date: 20191116 |