CN207474463U - A kind of COB - Google Patents
A kind of COB Download PDFInfo
- Publication number
- CN207474463U CN207474463U CN201721607749.8U CN201721607749U CN207474463U CN 207474463 U CN207474463 U CN 207474463U CN 201721607749 U CN201721607749 U CN 201721607749U CN 207474463 U CN207474463 U CN 207474463U
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- Prior art keywords
- luminescence
- substrate
- adjacent
- vertically arranged
- chips
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Abstract
A kind of COB, including substrate, several luminescence chips are equipped on substrate, luminescence chip is arranged in array format, two adjacent in a longitudinal direction luminescence chips are vertically arranged, two adjacent in a lateral direction luminescence chips are vertically arranged, because two adjacent in a longitudinal direction luminescence chips are vertically arranged, two adjacent in a lateral direction luminescence chips are vertically arranged, spacing of the luminescence chip between vertical and horizontal is made to shorten in this way, so that substrate central areas luminescence chip is when lateral heat conducts, can the path shorter than existing LED wafer distribution path quickly conducted, be conducive to the heat dissipation of luminescence chip, prevent from influencing the service life of luminescence chip due to the accumulation of heat, the stability for ensureing the quality of LED light and using.
Description
Technical field
The utility model is related to a kind of COB.
Background technology
LED light is made of LED wafer, substrate, fluorescent adhesive layer etc., since it has the characteristics that energy saving, service life is long,
It has been more and more widely used in illuminating industry.In order to ensure the control of the brightness of LED light, often set in LED light more
A LED wafer.In order to which the light sent out to luminous zone carries out later-stage utilization, existing LED light is generally shining multiple LED wafers
Layout in area with circular arrangement, it is multiple it is round form concentric structures, this LED wafer arrangement architecture in a circular manner,
So that the distance up and down between each LED wafer and adjacent chip is longer, and when Center Wafer is by laterally conducting heat, conduction
Access is long, and the heat of substrate center's area's chip is caused to be assembled, influences the overall quality of LED light.
Invention content
The technical problem to be solved by the present invention is to provide a kind of reasonable in design, uniform in light emission, good heat dissipation effects
COB.
In order to solve the above-mentioned technical problem, the utility model includes substrate, several luminescence chips, hair are equipped on substrate
Optical chip is arranged in array format, and adjacent in a longitudinal direction two luminescence chips are vertically arranged, adjacent in a lateral direction
Two luminescence chips be vertically arranged.
As further improvement of the utility model, the substrate is ceramic substrate.
As further improvement of the utility model, the luminescence chip is used with substrate and is welded to connect.
The beneficial effects of the utility model：Because two adjacent in a longitudinal direction luminescence chips are vertically arranged, in horizontal stroke
Two adjacent luminescence chips are vertically arranged on direction, and spacing of the luminescence chip between vertical and horizontal is made to shorten in this way,
So that substrate central areas luminescence chip is when lateral heat conducts, path that can be shorter than existing LED wafer distribution path into
The quick conduction of row, is conducive to the heat dissipation of luminescence chip, prevents from influencing due to the accumulation of heat the service life of luminescence chip, ensure LED
The quality of lamp and the stability used.Two adjacent simultaneously luminescence chips are vertically arranged so that mutual distance is more stepped up
It gathers, light extraction is more uniform.
Description of the drawings
It is next with reference to the accompanying drawings and detailed description that the utility model is described in more detail.
Fig. 1 is the schematic diagram of the utility model first embodiment.
Fig. 2 is the schematic diagram of the utility model second embodiment.
Specific embodiment
As shown in Figure 1, the utility model includes substrate 1, and the die bond bonding wire region on substrate 1 is circle, is set on substrate 1
There are several luminescence chips 2, luminescence chip 2 is arranged in the form of an array according to the shape in die bond bonding wire region on substrate 1, in longitudinal direction
Two adjacent luminescence chips 2 are vertically arranged on direction, and adjacent in a lateral direction two luminescence chips 2 are vertically arranged, institute
Luminescence chip 2 is stated with substrate 1 using being welded to connect, the substrate 1 is ceramic substrate 1.
As shown in Figure 2, the utility model includes substrate 1, and the die bond bonding wire region on substrate 1 is rectangular, is set on substrate 1
There are several luminescence chips 2, luminescence chip 2 is arranged in the form of an array according to the shape in die bond bonding wire region on substrate 1, in longitudinal direction
Two adjacent luminescence chips 2 are vertically arranged on direction, and adjacent in a lateral direction two luminescence chips 2 are vertically arranged, institute
Luminescence chip 2 is stated with substrate 1 using being welded to connect, the substrate 1 is ceramic substrate 1.
Because two adjacent in a longitudinal direction luminescence chips 2 are vertically arranged, adjacent in a lateral direction two hairs
Optical chip 2 is vertically arranged, and spacing of the luminescence chip 2 between vertical and horizontal is made to shorten in this way so that is sent out 1 central area of substrate
Optical chip 2 when lateral heat conducts, can the path shorter than existing LED wafer distribution path quickly conducted, be conducive to
The heat dissipation of luminescence chip 2 prevents from influencing the service life of luminescence chip 2 due to the accumulation of heat, ensures quality and the use of LED light
Stability.Two adjacent simultaneously luminescence chips 2 are vertically arranged so that mutual distance is compacter, and light extraction is more uniform.
The material of the substrate 1 be with aluminium nitride ceramics similar in LED chip CTEs, improve the heat-sinking capability of COB.Institute
Substrate 1 is stated with luminescence chip 2 using being welded to connect, to ensure that 2 positive and negative anodes of luminescence chip connect with 1 power positive cathode end of incoming cables of substrate
The fastness connect is welded to connect between luminescence chip 2 using gold thread 3.
Claims (3)
1. a kind of COB, including substrate, it is characterised in that：Several luminescence chips are equipped on substrate, luminescence chip is in array shape
Formula is arranged, and adjacent in a longitudinal direction two luminescence chips are vertically arranged, adjacent in a lateral direction two luminescence chips
It is vertically arranged.
2. COB as described in claim 1, it is characterised in that：The substrate is ceramic substrate.
3. COB as described in claim 1, it is characterised in that：The luminescence chip is used with substrate and is welded to connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721607749.8U CN207474463U (en) | 2017-11-27 | 2017-11-27 | A kind of COB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721607749.8U CN207474463U (en) | 2017-11-27 | 2017-11-27 | A kind of COB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207474463U true CN207474463U (en) | 2018-06-08 |
Family
ID=62259819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721607749.8U Active CN207474463U (en) | 2017-11-27 | 2017-11-27 | A kind of COB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207474463U (en) |
-
2017
- 2017-11-27 CN CN201721607749.8U patent/CN207474463U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |