CN207457912U - A kind of notebook mainboard of dust and moisture - Google Patents
A kind of notebook mainboard of dust and moisture Download PDFInfo
- Publication number
- CN207457912U CN207457912U CN201721515377.6U CN201721515377U CN207457912U CN 207457912 U CN207457912 U CN 207457912U CN 201721515377 U CN201721515377 U CN 201721515377U CN 207457912 U CN207457912 U CN 207457912U
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- Prior art keywords
- dust
- circuit board
- main circuit
- electrostatic rod
- hot line
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Abstract
The utility model discloses a kind of notebook mainboards of dust and moisture, including main circuit board, equal hot line, electrostatic rod, corner is provided with mounting hole on the main circuit board, corner is provided with beam under the main circuit board, the main circuit board is arranged with the equal hot line, CPU slots are provided on the main circuit board, CPU module is provided in the CPU slots, heat sink is provided in the CPU module, thermal conductive wire is provided on the heat sink, power supply slot is provided with by the CPU slots, rack is provided with before the power supply slot, placing groove is provided on the rack, the electrostatic rod is provided in the placing groove, dust suction hair is provided in the electrostatic rod.Advantageous effect is：The heat lift notebook mainboard own temperature that the utility model is distributed using each component on notebook mainboard, heat dissipation is accelerated to prevent from making moist again, energy utilization rate is improved, while dust is adsorbed using easy-to-mount electrostatic rod, ensure that strick precaution of the notebook mainboard to fine dust.
Description
Technical field
The utility model is related to notebook mainboard fields, and in particular to a kind of notebook mainboard of dust and moisture.
Background technology
Notebook mainboard is various hardware transport data in laptop, information " viaduct ", it connects and incorporates
The various hardware such as video card, memory, CPU make it organically be combined together again independently of each other, and Each performs its own functions, maintains computer jointly
Normal operation.Notebook pursues portability, and volume and weight has stringenter control, therefore, pen different with desktop computer
Remember that this mainboard integrated level is very high, layout is also very accurate compact.Notebook mainboard is that the core on laptop is matched somebody with somebody
Part, the mainboard of the machine of different type of machines is also different, and the machine of even same model is also possible to some differences, than
More one or less one such as interface above, cause this machine that cannot be compatible with this machine.The producer of notebook mainboard
Have very much, brand also has very much, and the general manufacturer for manufacturing laptop is owned by the mainboard and its series of oneself.The pen
Serious consequence can be caused by remembering the damage of this mainboard.
But radiator in the prior art, is only equipped on general notebook mainboard, seldom considers dust and moisture, it is easy because
Largely assembling for dust triggers Damage by Short Circuit or humidity that condensation vapor is caused to cause Damage by Short Circuit between circuit.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of notebook mainboard of dust and moisture.
The utility model is achieved through the following technical solutions above-mentioned purpose：
The notebook mainboard of a kind of dust and moisture, including main circuit board, equal hot line, electrostatic rod, four on the main circuit board
Angle is provided with mounting hole, and corner is provided with beam under the main circuit board, and the main circuit board is arranged with the equal hot line,
CPU slots are provided on the main circuit board, CPU module is provided in the CPU slots, is provided in the CPU module scattered
Hot plate is provided with thermal conductive wire on the heat sink, power supply slot is provided with by the CPU slots, is set before the power supply slot
There is rack, placing groove is provided on the rack, the electrostatic rod is provided in the placing groove, is set in the electrostatic rod
Dust suction hair is equipped with, electrostatic charge is provided on the dust suction hair, handle is provided with after the dust suction hair, is provided on the handle anti-
Line is slided, memory bank is provided with before the rack, memory bar is provided in the memory bank, the memory bank both sides are set
Memory buckle is equipped with, data-interface is provided with before the memory bank.
In said structure, the CPU module is inserted into the CPU slots and covers the heat sink, by the memory
Item is inserted into the memory bank and connects the thermal conductive wire, and the electrostatic rod is inserted into the placing groove, connects the electricity
Source slot, the CPU module and memory bar work distribute heat, and the heat sink and the thermal conductive wire transfer heat to
The equal hot line, the equal hot line distribute heat under the main circuit board, and preventing the master from integrating, plate temperature is too low to cause water
Vapour condensation is made moist, and when there is dust to pass through the main circuit board, the electrostatic charge on the dust suction hair is due to Electrostatic Absorption
Effect reaches dust-proof purpose prior to the main circuit board absorption dust.
In order to further improve the dust and moisture performance of notebook mainboard, the equal hot line is made of copper metal material,
The equal hot line is in rectangular-ambulatory-plane, and the soaking line mosaic is under the main circuit board.
In order to further improve the dust and moisture performance of notebook mainboard, the rack is made of wood materials, institute
Rack is stated to be bolted with the main circuit board use.
In order to further improve the dust and moisture performance of notebook mainboard, the electrostatic rod is made of metal material, institute
Electrostatic rod is stated to be connected using transition with the placing groove.
In order to further improve the dust and moisture performance of notebook mainboard, the handle is made of insulating rubber material,
The handle is pasted onto the electrostatic rod afterbody.
In order to further improve the dust and moisture performance of notebook mainboard, the beam uses foam sponge material system
Make, the beam is pasted onto corner under the main circuit board.
In order to further improve the dust and moisture performance of notebook mainboard, the equal hot line is welded on one with the thermal conductive wire
It rises, the thermal conductive wire is welded on the heat sink, and the heat sink is made of aluminum metallic material.
Advantageous effect is：The heat lift notebook master that the utility model is distributed using each component on notebook mainboard
Plate own temperature is accelerated heat dissipation to prevent from making moist again, improves energy utilization rate, while adsorbed using easy-to-mount electrostatic rod
Dust ensure that strick precaution of the notebook mainboard to fine dust.
Description of the drawings
Fig. 1 is a kind of structure diagram of the notebook mainboard of dust and moisture described in the utility model；
Fig. 2 is a kind of bottom view of the notebook mainboard of dust and moisture described in the utility model；
Fig. 3 is a kind of electrostatic rod schematic diagram of the notebook mainboard of dust and moisture described in the utility model.
The reference numerals are as follows：
1st, main circuit board；2nd, CPU slots；3rd, CPU module；4th, heat sink；5th, mounting hole；6th, power supply slot；7th, electrostatic rod；
8th, placing groove；9th, rack；10th, memory bank；11st, memory bar；12nd, thermal conductive wire；13rd, data-interface；14th, handle；15th, it is anti-skidding
Line；16th, beam；17th, equal hot line；18th, memory is buckled；19th, dust suction hair；20th, electrostatic charge.
Specific embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1-Figure 3, the notebook mainboard of a kind of dust and moisture, including main circuit board 1, equal hot line 17, electrostatic rod
7, corner is provided with mounting hole 5 on main circuit board 1, is mounted on convenient for main circuit board 1 in notebook, main 1 time corner of circuit board is set
Beam 16 is equipped with, prevents the main vibrations of circuit board 1 damage, main circuit board 1 is arranged with equal hot line 17, and Homogeneouslly-radiating improves main collection
Into 1 temperature of plate, CPU slots 2 are provided on main circuit board 1, CPU module 3 is installed, CPU module 3, pen are provided in CPU slots 2
Remember this computing module, heat sink 4 is provided in CPU module 3, accelerate CPU module 3 and radiate, thermal conductive wire is provided on heat sink 4
12, the heat on heat loss through conduction plate 4 is provided with power supply slot 6 by CPU slots 2, is powered to main circuit board 1, before power supply slot 6
Rack 9 is provided with, electrostatic rod 7 is supported, placing groove 8 is provided on rack 9, electrostatic rod 7 is fixed, is provided in placing groove 8
Electrostatic rod 7 adsorbs dust, reaches dust-proof, is provided with dust suction hair 19 in electrostatic rod 7, increases dust adsorption area, on dust suction hair 19
Electrostatic charge 20 is provided with, electrostatic adsorption is generated, is provided with handle 14 after dust suction hair 19, gripping is facilitated to take, on handle 14
It is provided with anti-skid chequer 15, increases frictional force, memory bank 10 is provided with before rack 9, memory bar 11 is installed, in memory bank 10
Memory bar 11 is provided with, notebook stores the part of information, and 10 both sides of memory bank are provided with memory buckle 18, fixed memory item
11, data-interface 13 is provided with before memory bank 10, main circuit board 1 transmits the interface of data.
In said structure, CPU module 3 is inserted into CPU slots 2 and covers heat sink 4, memory bar 11 is inserted into memory and is inserted
In slot 10 and thermal conductive wire 12 is connected, electrostatic rod 7 is inserted into placing groove 8, power on slot 6, CPU module 3 and memory bar 11
Work distributes heat, and heat sink 4 and thermal conductive wire 12 transfer heat to equal hot line 17, and equal hot line 17 distributes under main circuit board 1
Heat prevents main 1 temperature of circuit board is too low from condensation vapor being caused to make moist, when there is dust to pass through main circuit board 1, on dust suction hair 19
Electrostatic charge 20 due to Electrostatic Absorption effect prior to main circuit board 1 adsorb dust, reach dust-proof purpose.
In order to further improve the dust and moisture performance of notebook mainboard, equal hot line 17 is made of copper metal material, is increased
Add thermal conductivity, equal hot line 17 is in rectangular-ambulatory-plane, increases the heat dissipation area on main circuit board 1, equal hot line 17 is embedded in main circuit board 1
Under, it does not loosen securely, rack 9 is made of wood materials, prevents the main circuit board 1 of electrostatic damage, rack 9 and main circuit board
1 use is bolted, easy disassembly, electrostatic rod 7 using metal material make, be uniformly distributed convenient for electrostatic charge 20, electrostatic rod 7 with
Placing groove 8 is connected using transition, and replacement electrostatic rod 7 easy to disassemble, handle 14 is made of insulating rubber material, prevents from holding
Electrostatic charge 20 is discharged when holding, handle 14 is pasted onto 7 afterbody of electrostatic rod, solid and reliable, and beam 16 uses foam sponge material
It makes, increases damping effect, beam 16 is pasted onto main 1 time corner of circuit board, and not easily to fall off, equal hot line 17 is welded with thermal conductive wire 12
It is connected together, thermal conductive wire 12 is welded on heat sink 4, increases heat conductivity, and heat sink 4 is made of aluminum metallic material, is increased
Heat-sinking capability.
It should be noted that above example is only to illustrate technical solutions of the utility model rather than restriction technologies scheme,
Although applicant is explained in detail the utility model with reference to preferred embodiment, those of ordinary skill in the art should manage
Solution, those to technical solutions of the utility model carry out modification or equivalent substitution, it is impossible to depart from the technical program objective and
Scope should all cover among the utility model claims scope.
Claims (7)
1. a kind of notebook mainboard of dust and moisture, it is characterised in that：Including main circuit board（1）, equal hot line（17）, electrostatic rod
（7）, the main circuit board（1）Upper corner is provided with mounting hole（5）, the main circuit board（1）Lower corner is provided with beam
（16）, the main circuit board（1）It is arranged with the equal hot line（17）, the main circuit board（1）On be provided with CPU slots（2）,
The CPU slots（2）Inside it is provided with CPU module（3）, the CPU module（3）On be provided with heat sink（4）, the heat sink
（4）On be provided with thermal conductive wire（12）, the CPU slots（2）Side is provided with power supply slot（6）, the power supply slot（6）Preceding setting
There is rack（9）, the rack（9）On be provided with placing groove（8）, the placing groove（8）Inside it is provided with electrostatic rod（7）, institute
State electrostatic rod（7）On be provided with dust suction hair（19）, the dust suction hair（19）On be provided with electrostatic charge（20）, the dust suction hair（19）
After be provided with handle（14）, the handle（14）On be provided with anti-skid chequer（15）, the rack（9）Before be provided with memory bank
（10）, the memory bank（10）Inside it is provided with memory bar（11）, the memory bank（10）Both sides are provided with memory buckle
（18）, the memory bank（10）Before be provided with data-interface（13）.
2. a kind of notebook mainboard of dust and moisture according to claim 1, it is characterised in that：The equal hot line（17）It adopts
It is made of copper metal material, the equal hot line（17）In rectangular-ambulatory-plane, the equal hot line（17）It is embedded in the main circuit board（1）
Under.
3. a kind of notebook mainboard of dust and moisture according to claim 2, it is characterised in that：The rack（9）It adopts
It is made of wood materials, the rack（9）With the main circuit board（1）Using being bolted.
4. a kind of notebook mainboard of dust and moisture according to claim 3, it is characterised in that：The electrostatic rod（7）It adopts
It is made of metal material, the electrostatic rod（7）With the placing groove（8）It is connected using transition.
5. a kind of notebook mainboard of dust and moisture according to claim 4, it is characterised in that：The handle（14）Using
Insulating rubber material makes, the handle（14）It is pasted onto the electrostatic rod（7）Afterbody.
6. a kind of notebook mainboard of dust and moisture according to claim 5, it is characterised in that：The beam（16）It adopts
It is made of foam sponge material, the beam（16）It is pasted onto the main circuit board（1）Lower corner.
7. a kind of notebook mainboard of dust and moisture according to claim 6, it is characterised in that：The equal hot line（17）With
The thermal conductive wire（12）Weld together, the thermal conductive wire（12）It is welded on the heat sink（4）On, the heat sink（4）It adopts
It is made of aluminum metallic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721515377.6U CN207457912U (en) | 2017-11-14 | 2017-11-14 | A kind of notebook mainboard of dust and moisture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721515377.6U CN207457912U (en) | 2017-11-14 | 2017-11-14 | A kind of notebook mainboard of dust and moisture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207457912U true CN207457912U (en) | 2018-06-05 |
Family
ID=62279505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721515377.6U Active CN207457912U (en) | 2017-11-14 | 2017-11-14 | A kind of notebook mainboard of dust and moisture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207457912U (en) |
-
2017
- 2017-11-14 CN CN201721515377.6U patent/CN207457912U/en active Active
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