CN207441683U - A kind of patch-type electronic device - Google Patents
A kind of patch-type electronic device Download PDFInfo
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- CN207441683U CN207441683U CN201721564813.9U CN201721564813U CN207441683U CN 207441683 U CN207441683 U CN 207441683U CN 201721564813 U CN201721564813 U CN 201721564813U CN 207441683 U CN207441683 U CN 207441683U
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- chip
- electrode slice
- patch
- insulation crust
- electronic device
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Abstract
The utility model discloses a kind of patch-type electronic device, patch-type electronic device, electrode slice includes powering on pole piece and lower electrode slice, and is fixed in the upper and lower surface of chip by conducting medium respectively；Chip, electrode slice are limited in the one-side gaining of insulation crust, and are passed through electronic isolation sealing and be encapsulated in fluting；The free end for powering on pole piece and lower electrode slice extends to outside insulation crust and forms a buckle, and is fastened on the shell side of insulation crust.The utility model manufacture craft is simple, it is versatile, suitable for the encapsulation of high-power or small-power surface-mounted device, it is suitble to different shape, the chip package of thickness, is suitble to multi-chip package, it also is adapted for more pin product encapsulation, the product appearance of manufacture is beautiful, occupies little space, after tape package, convenient for automating on upper printed circuit board (PCB), printed circuit plate efficiency is improved.
Description
Technical field
The utility model is related to patch type technical field of electronic devices, particularly a kind of patch-type electronic device.
Background technology
With the development and update of electronic technology, power electronic product integrated level is higher and higher, semiconductor element and
The operating voltage of IC is more and more lower, and the requirement to reliability and security increasingly improves.Electrical leakage in life, host computer are burnt
It ruins, the problems such as mobile phone explodes annoyings how many user, and how many product lists because could not be tested by safety to postpone.
The variation and complication of problem cause the high speed development of circuit protecting element, of today that device is protected to have evolved into a product
The various new electronic member arts of class, and over-voltage protector is to protect a branch important in device.
With the fast development of electronic product demand, the raising of production automation degree, the structure of over-voltage protector
Also progressively developed from original lead type to surface patch formula.
Overvoltage protection surface mount elements at present mainly seal the pattern of molding for epoxy resin, but the thermoplastic of this pattern with thermoplastic
It is of high cost to seal mold die sinking, hot-forming middle briquetting pressure, which exists, the large chip such as damages by pressure reasons, and it is powerful can not to do some
Patch over-voltage protection element.
With reference to above 3 points, a kind of new overvoltage protection patch-type device and its method for packing are developed, in security protection at this stage
SMD components technical field is particularly important.
Utility model content
The technical problems to be solved in the utility model is in view of the above shortcomings of the prior art, to provide a kind of patch-type electronics
Device.
In order to solve the above technical problems, technical solution adopted in the utility model is：A kind of patch-type electronic device,
Including chip, electrode slice, electronic isolation sealing and insulation crust；The electrode slice includes powering on pole piece and lower electrode slice, and divides
The upper and lower surface of chip is not fixed in by conducting medium；The chip, electrode slice are limited in the single side of insulation crust
In fluting, and it is encapsulated in by the electronic isolation sealing in fluting；The free end extension for powering on pole piece and lower electrode slice
Outside to insulation crust and a buckle is formed, and is fastened on the shell side of insulation crust；Pole piece and lower electrode slice are powered on described
Fixed connecting end be provided with location hole, the central point of location hole, the central point of chip, the central point three of fluting overlap.
In above-mentioned technical proposal, the chip is Transient Suppression Diode chip, semiconductor discharge tube chip, ceramic gas
Discharge tube, glass discharge vessel, Thermal Cutoffs chip, resettable fuse chip, voltage dependent resistor chip, resistance chip, capacitance
A formation single-chip or several combinations in chip, inductance chip form chipset.
In above-mentioned technical proposal, the conducting medium is solder, and the solder is tin, tin silver copper, silver-bearing copper, tin-lead are silver-colored or tin
Lead；Alternatively, the conducting medium is conducting resinl.
In above-mentioned technical proposal, the electronic isolation sealing can be single glue or epoxy glue.
In above-mentioned technical proposal, the fluting includes the central channel positioned at center and two cards symmetrical on central channel
Slot, it is described to power on pole piece and lower electrode slice is limited in the card slot.
In above-mentioned technical proposal, the insulation crust is one or more of ceramics, glass, plastic cement.
The beneficial effects of the utility model are：
First, the patch varistors thus made, the product appearance of manufacture is beautiful, occupies little space, after tape package, just
In on the upper printed circuit board (PCB) of automation, printed circuit plate efficiency is improved.
2nd, thus method can do the patch varistors of 5D, can also do the different pressures such as 7D, 10D, 14D, 20D, 32D
The varistor of quick Chip scale size.
3rd, during the method, no clubfoot molding procedure reduces production procedure, reduces stress of the clubfoot to product chips,
So that properties of product are relatively reliable.
Description of the drawings
Fig. 1 is the structure diagram of the utility model insulation crust；
Fig. 2 is the assembling structure schematic diagram before the utility model filling electronic isolation sealing；
Fig. 3 is the cross section structure schematic diagram of A-A in Fig. 2；
Fig. 4 is the finished product structure schematic diagram after the utility model filling；
Fig. 5 is the structure diagram that the utility model powers on pole piece；
Fig. 6 is the structure diagram of electrode slice under the utility model.
In figure, 1, chip；2nd, pole piece is powered on；3rd, lower electrode slice；4th, electronic isolation sealing；5th, insulation crust；6th, slot；
61st, central channel；62nd, card slot；63rd, shell side；7th, conducting medium；31st, first horizontal segment；32nd, the first location hole；33rd, circular arc falls
Angle；34th, the first vertical section；35th, the first U-shaped is buckled；21st, the second horizontal segment；22nd, the second location hole；23rd, circular arc chamfering；24th,
Two vertical sections；25th, the second U-shaped is buckled.
Specific embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings.
As shown in figures 1 to 6, a kind of patch-type electronic device, including chip 1, electrode slice, electronic isolation sealing 4 and insulation
Shell 5；The electrode slice includes powering on pole piece 2 and lower electrode slice 3, and is fixed in the upper table of chip 1 by conducting medium 7 respectively
Face and lower surface；The chip 1, electrode slice are limited in the one-side gaining 6 of insulation crust 5, and are passed through the electronic isolation and sealed
Glue 4 is encapsulated in fluting 6；It is outer and form a card that the free end for powering on pole piece 2 and lower electrode slice 3 extends to insulation crust 5
Button, and be fastened on the shell side 63 of insulation crust 5；The fixed connecting end for powering on pole piece 2 and lower electrode slice 3 is provided with positioning
Hole, the central point of location hole, the central point of chip 1, the central point three of fluting 6 overlap, and the meaning that three overlaps is to meet
It is aligned when automated production for automating.The buckle is U-shaped or the buckle of hook-shaped structure.Location hole can be it is circular,
It is square, oval etc..The material of electrode slice is conducting metals or the alloy materials such as copper, copper steel, iron, the iron nickel of metal conductive materials
Material, surface can be through surface treatments such as tin, silver, nickel.
As seen in figs. 5-6, lower electrode slice 3 includes first horizontal segment 31, and it is fixed to be equipped with first in the front end of first horizontal segment 31
Position hole 32, and the front end corner of first horizontal segment 31 is circular arc chamfering 33, the edge extent beyond chip 1 is avoided, first
The rear end of horizontal segment 31 is vertically equipped with the first vertical section 34, and the first vertical section 34 is located in the range of card slot 62, vertical first
The top of section 34 is provided with the first L-shaped section, which forms the first U-shaped buckle 35, the first U-shaped buckle with the first vertical section 34
35 bore and the thickness on shell side 63 match so that buckle can be fastened on shell side 63 more stablely.Similarly, power on
Pole piece 2 includes the second horizontal segment 21, and the second location hole 22, and second horizontal segment 21 are equipped in the front end of the second horizontal segment 21
Front end corner is circular arc chamfering 23, avoids the edge extent beyond chip 1, and second is vertically equipped in the rear end of the second horizontal segment 21
Vertical section 24, the second vertical section 24 are located in the range of card slot 62, and the top of the second vertical section 24 is provided with the second L-shaped section,
The second L-shaped section forms the second U-shaped buckle 25, the bore of the second U-shaped buckle 25 and the thickness on shell side 63 with the first vertical section 34
Degree matches so that buckle can be fastened on shell side 63 more stablely.Sideline hole is equipped in the bending part of L-shaped section.
Wherein, the chip 1 is Transient Suppression Diode chip, semiconductor discharge tube chip, ceramic gas discharge tube, glass
Glass discharge tube, Thermal Cutoffs chip, resettable fuse chip, voltage dependent resistor chip, resistance chip, electric capacity chip, inductance
A formation single-chip or several combinations in chip form chipset.It is same between adjacent single-chip and single-chip in chipset
Sample is carried out affixed using conducting medium 7.
Wherein, the conducting medium 7 is solder, and the solder is tin, tin silver copper, silver-bearing copper, tin-lead are silver-colored or tin-lead, the solder
It is cured solder sheet before thawing, makes to weld between electrode slice and chip 1 after melting；Alternatively, the conducting medium 7 is
Conducting resinl, the conducting resinl are cured conductive blob of viscose before thawing, make to be glued between electrode slice and chip 1 after melting.
Wherein, the electronic isolation sealing 4 can be single glue or epoxy glue.Epoxy glue can be two or three glue etc.
It is obtained by mixing.
As shown in Figure 1, the fluting 6 includes the central channel 61 positioned at center and two cards symmetrical on central channel 61
Slot 62, it is described to power on pole piece 2 and lower electrode slice 3 is limited in the card slot 62.The width phase of the width of card slot 62 and electrode slice
Match somebody with somebody, electrode slice is made just to be limited in card slot 62 and is held in position.In embodiment, central channel 61 is circle, and card slot 62 is square groove,
Card slot 62 is connected with central channel 61 to be integrated.
Wherein, the material of the insulation crust 5 is one or more of ceramics, glass, plastic cement.
A kind of method for packing of patch-type electronic device, comprises the following steps：
Step 1, it is using automation equipment that the direction of insulation crust 5 is unified, keep the opening up of fluting 6；Using shaking
Moving plate can continuously export insulation crust 5, substantially increase feeding efficiency.
Insulation crust 5 is sent to localization tool and positioned by step 2；Localization tool is arranged on transmitting device.
Step 3, the central point of identification fluting 6, according to the central point of location hole, the central point of conducting medium 7, chip 1
The rule that central point overlaps respectively with the central point of fluting 6, successively by lower electrode slice 3, conducting medium 7, chip 1, conducting medium
7th, pole piece 2 is powered on to be assembled in fluting 6；Wherein, lower electrode slice 3 is fastened on the shell side 63 of insulation crust 5, is powered on
Pole piece 2 is fastened on the shell side 63 of insulation crust 5；It can be conducive to fix by being fastened on shell side 63
The position of electrode slice.
Step 4 provides certain temperature so that conducting medium 7 melts by stove, so as to by lower electrode slice 3,1 and of chip
It is conductive affixed to power on pole piece 2；The stove is Reflow Soldering stove or tunnel.
Step 5 fills electronic isolation sealing 4 in the clearance position in fluting 6, and it is exhausted by electronics to pass through certain temperature
Edge sealing 4 cures, and obtains patch-type electronic device as the aforementioned.
Wherein, the automation equipment includes, by the unified feed device of 5 auto-sequencing of insulation crust and direction, to insulate
Shell 5 move to the first manipulator on localization tool, the identification device of the central point of identification fluting 6, by lower electrode slice 3,
Conducting medium 7, chip 1, conducting medium 7, power on pole piece 2 be assembled to successively fluting 6 in the second manipulator, by insulation crust 5
The transmitting device and the glue filling device of filling electronic isolation sealing 4 moved together together with assembly parts.The feed device is to shake
Moving plate, screening installation or gauge.
Above embodiment simply indicates that rather than limits the utility model, therefore all according to the utility model patent application
The equivalent change or modification that method described in scope is done is included in the utility model patent application range.
Claims (6)
1. a kind of patch-type electronic device, it is characterised in that：Including chip, electrode slice, electronic isolation sealing and insulation crust；Institute
Stating electrode slice includes powering on pole piece and lower electrode slice, and is fixed in the upper and lower surface of chip by conducting medium respectively；
The chip, electrode slice are limited in the one-side gaining of insulation crust, and are encapsulated in by the electronic isolation sealing in fluting；
It is outer and form a buckle that the free end for powering on pole piece and lower electrode slice extends to insulation crust, and is fastened on insulation crust
On shell side；The fixed connecting end for powering on pole piece and lower electrode slice is provided with location hole, in the central point of location hole, chip
Heart point, the central point three of fluting overlap.
2. a kind of patch-type electronic device according to claim 1, it is characterised in that：The chip inhibits two poles for transient state
Tube chip, semiconductor discharge tube chip, ceramic gas discharge tube, glass discharge vessel, Thermal Cutoffs chip, resettable fuse
One in chip, voltage dependent resistor chip, resistance chip, electric capacity chip, inductance chip forms single-chip or several combination formation
Chipset.
3. a kind of patch-type electronic device according to claim 1, it is characterised in that：The conducting medium is solder, and
The solder is tin, tin silver copper, silver-bearing copper, tin-lead are silver-colored or tin-lead；Alternatively, the conducting medium is conducting resinl.
4. a kind of patch-type electronic device according to claim 1, it is characterised in that：The electronic isolation sealing can be
Single glue or epoxy glue.
5. a kind of patch-type electronic device according to claim 1, it is characterised in that：The fluting is included positioned at center
Central channel and two card slots symmetrical on central channel, it is described to power on pole piece and lower electrode slice is limited in the card slot.
6. a kind of patch-type electronic device according to claim 1, it is characterised in that：The insulation crust is ceramics, glass
One or more of glass, plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721564813.9U CN207441683U (en) | 2017-11-21 | 2017-11-21 | A kind of patch-type electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721564813.9U CN207441683U (en) | 2017-11-21 | 2017-11-21 | A kind of patch-type electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207441683U true CN207441683U (en) | 2018-06-01 |
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ID=62286645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721564813.9U Active CN207441683U (en) | 2017-11-21 | 2017-11-21 | A kind of patch-type electronic device |
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| Country | Link |
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| CN (1) | CN207441683U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742619A (en) * | 2017-11-21 | 2018-02-27 | 深圳市硕凯电子股份有限公司 | A kind of patch-type electronic device and its method for packing |
-
2017
- 2017-11-21 CN CN201721564813.9U patent/CN207441683U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742619A (en) * | 2017-11-21 | 2018-02-27 | 深圳市硕凯电子股份有限公司 | A kind of patch-type electronic device and its method for packing |
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