CN207427571U - A kind of stability Anti-dislocation integrated circuit board fixing structure - Google Patents
A kind of stability Anti-dislocation integrated circuit board fixing structure Download PDFInfo
- Publication number
- CN207427571U CN207427571U CN201721174604.3U CN201721174604U CN207427571U CN 207427571 U CN207427571 U CN 207427571U CN 201721174604 U CN201721174604 U CN 201721174604U CN 207427571 U CN207427571 U CN 207427571U
- Authority
- CN
- China
- Prior art keywords
- card slot
- fixed
- integrated circuit
- pin
- fixed card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of stability Anti-dislocation integrated circuit board fixing structure, including：Bottom plate, fixed card slot, energization lead, integrated circuit plate, pin, welding block, the bottom plate is existing common pcb board, multiple square grooves are uniformly provided on bottom plate, square groove proper alignment, square groove surround one it is square, the fixed card slot is semiclosed can, wherein openend is upward, fixed card slot is fixed in bottom plate square groove, the pin is fixed on integrated circuit plate, and Pin locations are corresponding with fixed card slot position, pin is located in fixed card slot, the welding block is welded on the junction of pin and fixed card slot, there are one horizontal segment and a vertical sections for the pin tool, wherein horizontal segment is fixed in fixed card slot, vertical section is fixed on integrated circuit plate, the fixed card slot section is terraced to fall.The utility model have the function of it is simple in structure, quick for installation, have Anti-dislocation.
Description
Technical field
The utility model is related to integrated circuit plate package technique fields, are specially a kind of stability Anti-dislocation integrated circuit plate
Fixed structure.
Background technology
Integrated circuit is a kind of microelectronic device or component.Using certain technique, brilliant needed for a circuit
The elements such as body pipe, resistance, capacitance and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function；Wherein all elements are in structure
On formed a whole, electronic component is made to have strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step.
The pin of integrated circuit plate when mounted, is welded on pcb board by integrated circuit plate by the way of welding mostly,
Existing mode is the surface that pin is located at welding point, and this welding manner is in welding, it is necessary to which integrated circuit plate is fixed
It to suitable position, is welded again after fixed, due to integrated circuit plate small volume, many times in welding, existing structure
Mistake is easily welded, product quality is caused to decline, even results in scrapping for material, leverages the benefit of enterprise.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of stability Anti-dislocation integrated circuit board fixing structure
The problem of being proposed in background technology.
To achieve the above object, the utility model provides following technical solution：A kind of stability Anti-dislocation integrated circuit plate
Fixed structure, including：Bottom plate, fixed card slot, energization lead, integrated circuit plate, pin, welding block, the bottom plate are existing
Common pcb board, be uniformly provided with multiple square grooves, square groove proper alignment on bottom plate, square groove surround one it is square, it is described
Fixed card slot is semiclosed can, and wherein upward, fixed card slot is fixed in bottom plate square groove for openend, and the pin is consolidated
It is connected on integrated circuit plate, and Pin locations are corresponding with fixed card slot position, pin is located in fixed card slot, the welding block
It is welded on the junction of pin and fixed card slot.
Further, horizontal segment and a vertical section, wherein horizontal segment to be fixed on fixing card there are one pin tools
In slot, vertical section is fixed on integrated circuit plate.
Further, the fixed card slot section is terraced to fall.
Compared with prior art, the beneficial effects of the utility model are：
It is 1. simple in structure, cheap；
It is 2. quick for installation, easy to use；
3. having Anti-dislocation during installation, using effect is good.
The utility model have the function of it is simple in structure, quick for installation, have Anti-dislocation.
Description of the drawings
Fig. 1 is the utility model overall structure diagram；
In figure：1- bottom plates；2- fixed card slots；3- energization leads；4- integrated circuit plates；5- pins；6- welding blocks.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Referring to Fig. 1, the utility model provides a kind of stability Anti-dislocation integrated circuit board fixing structure, including：Bottom
Plate 1, fixed card slot 2, energization lead 3, integrated circuit plate 4, pin 5, welding block 6, the bottom plate 1 are existing common PCB
Plate is uniformly provided with multiple square grooves, square groove proper alignment on bottom plate 1, and square groove surrounds square, a described fixed card slot
2 be semiclosed can, and wherein upward, fixed card slot 2 is fixed in 1 square groove of bottom plate for openend, and the pin 5 is fixed in
On integrated circuit plate 4, and 5 position of pin is corresponding with 2 position of fixed card slot, and pin 5 is located in fixed card slot 2, the welding
Block 6 is welded on the junction of pin 5 and fixed card slot 2.
Further, horizontal segment and a vertical section, wherein horizontal segment to be fixed on fixing card there are one the pin 5 tools
In slot 2, vertical section is fixed on integrated circuit plate 4.
Further, 2 section of fixed card slot is terraced to fall.Facilitate the insertion of pin 5.
Operation principle：The utility model provides a kind of stability Anti-dislocation integrated circuit board fixing structure, changes existing
4 welding structure of integrated circuit plate, suitable square groove is outputed on bottom plate 1 first, then fixing card is installed in square groove
Slot 2 then using welding, pin 5 is fixed in fixed card slot 2, is by means of which fixed integrated circuit plate 4, this
Fixed structure, when misplacing embedded, integrated circuit plate 4 smooth can not be put into, and can be adjusted before welding to correct position.To the greatest extent
The embodiment of the utility model has been shown and described in pipe, for the ordinary skill in the art, it is possible to understand that
Do not depart from the utility model principle and spirit in the case of can to these embodiments carry out it is a variety of variation, modification, replace and
Modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (3)
1. a kind of stability Anti-dislocation integrated circuit board fixing structure, including：Bottom plate (1), fixed card slot (2), energization lead
(3), integrated circuit plate (4), pin (5), welding block (6), it is characterised in that：The bottom plate (1) is existing common PCB
Plate is uniformly provided with multiple square grooves, square groove proper alignment on bottom plate (1), and square groove surrounds square, a described fixing card
Slot (2) is semiclosed can, and wherein upward, fixed card slot (2) is fixed in bottom plate (1) square groove, and described draws for openend
Foot (5) is fixed on integrated circuit plate (4), and pin (5) position is corresponding with fixed card slot (2) position, and pin (5), which is located at, to be fixed
In card slot (2), the welding block (6) is welded on the junction of pin (5) and fixed card slot (2).
2. a kind of stability Anti-dislocation integrated circuit board fixing structure according to claim 1, it is characterised in that：Described
There are one pin (5) tools horizontal segment and a vertical section, wherein horizontal segment are fixed in fixed card slot (2), and vertical section is fixed in
On integrated circuit plate (4).
3. a kind of stability Anti-dislocation integrated circuit board fixing structure according to claim 1, it is characterised in that：Described
Fixed card slot (2) section is terraced to fall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721174604.3U CN207427571U (en) | 2017-09-14 | 2017-09-14 | A kind of stability Anti-dislocation integrated circuit board fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721174604.3U CN207427571U (en) | 2017-09-14 | 2017-09-14 | A kind of stability Anti-dislocation integrated circuit board fixing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207427571U true CN207427571U (en) | 2018-05-29 |
Family
ID=62316207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721174604.3U Active CN207427571U (en) | 2017-09-14 | 2017-09-14 | A kind of stability Anti-dislocation integrated circuit board fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207427571U (en) |
-
2017
- 2017-09-14 CN CN201721174604.3U patent/CN207427571U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101160405B1 (en) | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | |
| KR101222755B1 (en) | Package on package using a bump-less build up layer(bbul) package | |
| CN105230132B (en) | Including reducing thermal coefficient of expansion (CTE) and reducing the substrate of the inorganic material of warpage | |
| CN102854343B (en) | For test structure and the method for testing of semiconductor devices | |
| WO2009120633A3 (en) | Semiconductor package with embedded magnetic component and method of manufacture | |
| TW201726350A (en) | Molding apparatus for semiconductor package fabrication and method of molding semiconductor package using the same | |
| CN103049588A (en) | Filling method for redundant graphs | |
| CN104241217A (en) | Fan-out-type packaging structure with exposed back side of chip and manufacturing method | |
| US20190006331A1 (en) | Electronics package devices with through-substrate-vias having pitches independent of substrate thickness | |
| CN107204293B (en) | The manufacturing method and semiconductor device of semiconductor device | |
| CN207427571U (en) | A kind of stability Anti-dislocation integrated circuit board fixing structure | |
| US10741480B2 (en) | Leadframe with sockets for solderless pins | |
| US20180228022A1 (en) | Implementing reworkable strain relief packaging structure for electronic component interconnects | |
| KR20100121679A (en) | Flip chip assembly process for ultra thin substrate and package on package assembly | |
| CN104241216A (en) | Fan-out type packaging structure with controllable packaging height and manufacturing method of fan-out type packaging structure with controllable packaging height | |
| Zhang et al. | Low cost high performance bare die PoP with embedded trace coreless technology and “coreless cored” build up substrate manufacture process | |
| CN108231696A (en) | Semiconductor device packages and its manufacturing method | |
| TW201631727A (en) | Electrical interconnect for an electronic package | |
| CN102699474A (en) | Wave crest welding support plate | |
| CN103354226A (en) | Stack packaging device | |
| CN102385656A (en) | Method for filling redundant metal into integrated circuit layout and integrated circuit | |
| US8957529B2 (en) | Power voltage supply apparatus for three dimensional semiconductor | |
| CN116137266A (en) | Electronic package assembly with stiffener | |
| Torok et al. | Large form factor hybrid LGA interconnects; Recent applications and technical learning | |
| CN208538815U (en) | A kind of chassis sapphire chip IC P ring structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Steadiness anti - misalignment integrated circuit board fixed knot constructs Effective date of registration: 20191209 Granted publication date: 20180529 Pledgee: Donglai Investment Development Co., Ltd. Pledgor: Tibet is the core cloud Mdt InfoTech Ltd Registration number: Y2019310000027 |