CN207422711U - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
- Publication number
- CN207422711U CN207422711U CN201721528157.7U CN201721528157U CN207422711U CN 207422711 U CN207422711 U CN 207422711U CN 201721528157 U CN201721528157 U CN 201721528157U CN 207422711 U CN207422711 U CN 207422711U
- Authority
- CN
- China
- Prior art keywords
- copper
- radiating fin
- aluminum radiating
- negative pressure
- axle center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of semiconductor cooling devices, including copper facing aluminum radiating fin group, the hot face of copper facing aluminum radiating fin group is bonded to each other with several negative pressure copper coolant heat conducting pipe one end, copper facing aluminum radiating fin group is rearranged by multi-disc aluminum radiating fin, and each negative pressure copper coolant heat conducting pipe runs through per a piece of aluminum radiating fin；Intensive wind page aerofoil fan is installed in copper facing aluminum radiating fin group, the negative pressure copper coolant heat conducting pipe other end is connected with Archimedian screw coiling semiconductor chilling plate, Archimedian screw coiling semiconductor chilling plate fits with nested copper axle center type heat conduction aluminium block, and nested copper axle center type heat conduction aluminium block center is equipped with the copper axle center of multi-turn nesting aluminium block.The beneficial effects of the utility model are to reduce cooling piece hot-side temperature to greatest extent, can improve the work efficiency of cooling piece.
Description
Technical field
The utility model belongs to technical field of semiconductors, is related to a kind of semiconductor cooling device.
Background technology
With the popularization of semiconductor technology, semiconductor refrigerating technology becomes a kind of low cost, the solutions for refrigeration of small size.It
It can be used for accurate laser lens heat dissipation, it can also be used to the portable mini-bar of family, it may also be used for Cord blood but long-distance
Express delivery of transport etc..But current semiconductor technology is because of refrigerating efficiency problem, refrigeration minimum temperature problem, refrigeration radiating problem
Deng so that its utilization rate cannot be widely popularized.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor cooling devices, solve current semiconductor refrigerating cooling piece
The problem of hot-side temperature is high, and refrigerating efficiency is low.
Technical solution is to include copper facing aluminum radiating fin group used by the utility model, copper facing aluminum radiating fin group
Hot face be bonded to each other with several negative pressure copper coolant heat conducting pipe one end, copper facing aluminum radiating fin group is dissipated by multi-disc aluminum
Hot fin arrangement composition, each negative pressure copper coolant heat conducting pipe run through per a piece of aluminum radiating fin；Copper facing aluminum radiates
Intensive wind page aerofoil fan is installed, the negative pressure copper coolant heat conducting pipe other end is coiled with Archimedian screw in fins set
Semiconductor chilling plate connects, and Archimedian screw coiling semiconductor chilling plate fits with nested copper axle center type heat conduction aluminium block, embedding
Cover the copper axle center that copper axle center type heat conduction aluminium block center is equipped with multi-turn nesting aluminium block.
Further, the wind page of intensive wind page aerofoil fan is 13 or more, and fan-shaped is designed to grey dome type, lower part
There is support to fix.
The beneficial effects of the utility model are to reduce cooling piece hot-side temperature to greatest extent, can improve the work of cooling piece
Make efficiency.
Description of the drawings
Fig. 1 is the utility model semiconductor cooling device structure diagram；
Fig. 2 is lost pressure cooling liquid heat conducting pipe and copper facing aluminum fin-stock radiator；
Fig. 3 is intensive blade axial-flow fan.
In figure, 1. copper facing aluminum radiating fin groups, 2. negative pressure copper coolant heat conducting pipes, 3. intensive wind page axis streams
Fan, 4. Archimedian screws coiling semiconductor chilling plate, 5. nested copper axle center type heat conduction aluminium blocks, 6. multi-turn nesting aluminium blocks
Copper axle center.
Specific embodiment
The utility model is described in detail With reference to embodiment.
The utility model includes copper facing aluminum radiating fin group 1 as shown in Figure 1 to Figure 3, copper facing aluminum radiating fin group 1
Hot face is bonded to each other with several 2 one end of negative pressure copper coolant heat conducting pipe and is applied in the contact surface being bonded Nano carbon silicone grease
Smear the gap between filling contacting surface.Copper facing aluminum radiating fin group 1 is rearranged by multi-disc aluminum radiating fin, each negative pressure copper
Coolant heat conducting pipe 2 processed runs through per a piece of aluminum radiating fin；Negative pressure copper coolant heat conducting pipe 2 is to enter it in coolant filling
After be pumped into negative pressure sealing, gas-liquid two-phase positive/negative-pressure automatic conversion high efficiency flow heat conduction can be formed.
Intensive wind page aerofoil fan 3 is installed, intensive wind page aerofoil fan 3 is adopted in copper facing aluminum radiating fin group 1
It is attached to blowing mode in copper facing aluminum radiating fin group 1 so that wind blows to opposite side from the one side of radiating fin group, intensive
The wind page of wind page aerofoil fan 3 is 13 or more, prevents hot gas re-flow, is inhaled so that wind fan is efficiently pressed to form efficient semiconductor
General mood stream, fan-shaped are designed to grey dome type, and lower part has support to fix.2 other end of negative pressure copper coolant heat conducting pipe and Ah
Base Mead coiled coil semiconductor chilling plate 4 connects, and Archimedian screw coiling semiconductor chilling plate 4 is by semiconductor chilling plate
Both arms side's Archimedian screw shape is lined up, temperature is allowed to form gradient, improves efficiency, anti-backflow.
Archimedian screw coils semiconductor chilling plate 4 and fits with nested copper axle center type heat conduction aluminium block 5, is bonded contact surface
The gap between Nano carbon silicone grease filling contact surface is smeared, nested 5 center of copper axle center type heat conduction aluminium block is equipped with multi-turn nesting aluminium block
Copper axle center 6.Because laterally heat reflux is bigger for solid aluminium block, makes nested mode and coil semiconductor system with Archimedian screw
Cold 4 correspondence, outer ring gap is big, and inner ring gap is small, separates transverse refluxing.The aluminium that hydrogel is applied to multi-turn nesting also can be used
In block and aluminium block periphery.
The utility model reduces cooling piece hot-side temperature to greatest extent, while prevents the hot backflow phenomenon of working clearance,
Cooling piece is enabled to continue to keep optimal working condition, to improve the work efficiency of cooling piece so that cooling piece can reach
To lower temperature.
The above is only the better embodiment to the utility model, not makees any form to the utility model
On limitation, it is every according to the technical essence of the utility model to any simple modification made for any of the above embodiments, equivalent variations
With modification, belong in the range of technical solutions of the utility model.
Claims (2)
1. a kind of semiconductor cooling device, it is characterised in that：Including copper facing aluminum radiating fin group (1), copper facing aluminum radiating fin
The hot face of piece group (1) is bonded to each other with several negative pressure copper coolant heat conducting pipe (2) one end, copper facing aluminum radiating fin group
(1) rearranged by multi-disc aluminum radiating fin, each negative pressure copper coolant heat conducting pipe (2) is run through to be radiated per a piece of aluminum
Fin；Intensive wind page aerofoil fan (3), negative pressure copper coolant heat conducting pipe are installed in copper facing aluminum radiating fin group (1)
(2) other end is connected with Archimedian screw coiling semiconductor chilling plate (4), Archimedian screw coiling semiconductor chilling plate
(4) fit with nested copper axle center type heat conduction aluminium block (5), nested copper axle center type heat conduction aluminium block (5) center is equipped with multi-turn nesting aluminium
The copper axle center (6) of block.
2. according to a kind of semiconductor cooling device described in claim 1, it is characterised in that：It is described
The wind page of intensive wind page aerofoil fan (3) is 13 or more, and fan-shaped is designed to grey dome type, and there is support in lower part admittedly
It is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721528157.7U CN207422711U (en) | 2017-11-16 | 2017-11-16 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721528157.7U CN207422711U (en) | 2017-11-16 | 2017-11-16 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207422711U true CN207422711U (en) | 2018-05-29 |
Family
ID=62305093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721528157.7U Expired - Fee Related CN207422711U (en) | 2017-11-16 | 2017-11-16 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207422711U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110917642A (en) * | 2019-12-16 | 2020-03-27 | 江西辙炜新材料科技有限公司 | Environment-friendly multifunctional solvent recovery processing device |
-
2017
- 2017-11-16 CN CN201721528157.7U patent/CN207422711U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110917642A (en) * | 2019-12-16 | 2020-03-27 | 江西辙炜新材料科技有限公司 | Environment-friendly multifunctional solvent recovery processing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180529 Termination date: 20201116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |