CN207381381U - Patch type TO packaging frames - Google Patents
Patch type TO packaging frames Download PDFInfo
- Publication number
- CN207381381U CN207381381U CN201721521093.8U CN201721521093U CN207381381U CN 207381381 U CN207381381 U CN 207381381U CN 201721521093 U CN201721521093 U CN 201721521093U CN 207381381 U CN207381381 U CN 207381381U
- Authority
- CN
- China
- Prior art keywords
- transverse bar
- patch type
- packaging frames
- chip carrier
- scraping blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Patch type TO packaging frames.It is related to field of semiconductor package, and in particular to a kind of patch type TO packaging frames.It provides a kind of by moving up transverse bar to reach the patch type TO packaging frames for effectively removing residue glue purpose.Include cooling fin, chip carrier and several pins successively from top to bottom, the cooling fin is equipped with mounting hole, and several pins are connected by transverse bar, and the nearest vertical range of the transverse bar and chip carrier is 3.80 3.95mm.The top surface of the transverse bar is equipped with the groove parallel with pin.The section of the groove is isosceles trapezoid.The outer surface of the transverse bar is equipped with and is tilted to transverse bar both sides and stretch out the scraping blade of transverse bar top surface, and the side of pin of the top of the scraping blade with closing on is concordant.The utility model will not destroy the mechanical strength of frame, therefore will not also exert an adverse impact to subsequent production and process.
Description
Technical field
The utility model is related to field of semiconductor package, and in particular to a kind of patch type TO packaging frames.
Background technology
For the plastic packaging of electronic component using the form of molding cast up and down, epoxy resin inevitably can be from the seam of upper and lower mold
It is oozed out in gap, generates pin residue glue, existing on product appearance quality influences, and can generate customer complaint.There is presently no effectively go
Except the method for residue glue.
Electronic component generally uses the frame of copper material in special shape at present, and the nearest vertical range of transverse bar and chip carrier is
5.5mm or so will finally resolve into separate type device by way of Trim Molding.The process of Trim Molding can use high rigidity
Cutter directly act on frame transverse bar, if residue glue formation when flowed at transverse bar, then during rib cutting
Take away residue glue of the part at the transverse bar, but it is distant due to transverse bar and chip carrier, so the amount of removing photoresist is limited.
Utility model content
The utility model effectively removes residue glue mesh in view of the above problems, providing one kind by moving up to reach transverse bar
Patch type TO packaging frames.
The technical solution of the utility model is：Include cooling fin, chip carrier and several pins successively from top to bottom, it is described
Cooling fin is equipped with mounting hole, and several pins are connected by transverse bar, the transverse bar and chip carrier it is nearest it is vertical away from
From for 3.80-3.95mm.
The top surface of the transverse bar is equipped with the groove parallel with pin.
The section of the groove is isosceles trapezoid.
The outer surface of the transverse bar is equipped with and is tilted to transverse bar both sides and stretch out the scraping blade of transverse bar top surface, the top of the scraping blade
The side of pin of the portion with closing on is concordant.
The beneficial effects of the utility model are：Coordinate the design of plastic package die, rib cutting cutter, the transverse bar on frame is upward
Mobile 1.6mm or so can thus act by rib cutting and take away residue glue, so as to reduce the residual quantity of residue glue, promote product
Exterior quality；Groove is set on transverse bar so that the epoxy resin of liquid is flowed in groove so that residue glue becomes one with transverse bar
Body, it is easier to remove；The utility model will not destroy the mechanical strength of frame, also therefore will not to it is subsequent production and it is processed
Journey exerts an adverse impact.
Description of the drawings
Fig. 1 is the structure diagram of the utility model,
Fig. 2 is the bottom view of Fig. 1,
Fig. 3 is the longitudinal sectional view of transverse bar in the utility model；
1 is cooling fin in figure, and 2 be chip carrier, and 3 be pin, and 4 be transverse bar, and 41 groove, 42 be scraping blade.
Specific embodiment
The utility model is illustrated below in conjunction with the accompanying drawings.
As shown in the figure, the utility model is from top to bottom（The direction being subject in the utility model in Fig. 1）Include dissipating successively
Backing 1, chip carrier 2 and several pins 3, the cooling fin 1 are equipped with mounting hole, and several pins 3 are connected by transverse bar 4
It connects, the nearest vertical range of the transverse bar 4 and chip carrier 2 is 3.80-3.95mm.Epoxy resin and transverse bar be most after encapsulation
Nearly vertical range is 0.80-0.95mm, and compared with traditional TO frames, the utility model moves transverse bar to chip carrier 2
1.67mm or so, during such rib cutting, rib cutting cutter can touch as far as possible more residue glues, and residue glue is taken away.This is to moving up
Dynamic 1.67mm is completed in the production process of frame, and will not generate harmful effect to the processes such as subsequently assembling and welding.
The top surface of the transverse bar 4（Top surface refers to the upper surface of transverse bar）Equipped with the groove 41 parallel with pin 3.During encapsulation
The epoxy resin of spilling is flowed into groove, reduces the accumulation outside transverse bar, and residue glue removal is more thorough during rib cutting.
The section of the groove 41 is isosceles trapezoid.Epoxy resin is made more, more smoothly to be flowed by gravity in groove.
The outer surface of the transverse bar 4（Outer surface refers to facing the one side of screen in Fig. 1）It is equipped with to 4 liang of inclinations of transverse bar
Tiltedly and stretch out the scraping blade 42 of 4 top surface of transverse bar, the side of pin 3 of the top of the scraping blade 42 with closing on is concordant, rib cutting cutter from
When the appearance of transverse bar 4 carries out rib cutting work, scraping blade 42 will be driven to act, in action scraping blade 42 into contact with residue glue band together
It walks, reduces residual silkgum content.
The utility model coordinates the design of plastic package die, rib cutting cutter, and the transverse bar on frame is moved up, thus may be used
Residue glue is taken away by rib cutting action, so as to reduce the residual quantity of residue glue, promote the exterior quality of product；It is set on transverse bar recessed
Slot so that the epoxy resin of liquid is flowed in groove so that residue glue is integrally formed with transverse bar, it is easier to be removed；Scraping blade can be by knife
The residue glue for having the place not reached also is wiped off together；The utility model will not destroy the mechanical strength of frame, also therefore will not
It exerts an adverse impact to subsequent production and process.
Claims (4)
1. patch type TO packaging frames, include cooling fin, chip carrier and several pins successively from top to bottom, on the cooling fin
Equipped with mounting hole, several pins are connected by transverse bar, which is characterized in that the transverse bar and chip carrier it is nearest it is vertical away from
From for 3.80-3.95mm.
2. patch type TO packaging frames according to claim 1, which is characterized in that the top surface of the transverse bar is equipped with and pin
Parallel groove.
3. patch type TO packaging frames according to claim 2, which is characterized in that the section of the groove is isosceles ladder
Shape.
4. patch type TO packaging frames according to claim 1, which is characterized in that the outer surface of the transverse bar be equipped with to
Transverse bar both sides tilt and stretch out the scraping blade of transverse bar top surface, and the side of pin of the top of the scraping blade with closing on is concordant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721521093.8U CN207381381U (en) | 2017-11-14 | 2017-11-14 | Patch type TO packaging frames |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721521093.8U CN207381381U (en) | 2017-11-14 | 2017-11-14 | Patch type TO packaging frames |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207381381U true CN207381381U (en) | 2018-05-18 |
Family
ID=62332660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721521093.8U Active CN207381381U (en) | 2017-11-14 | 2017-11-14 | Patch type TO packaging frames |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207381381U (en) |
-
2017
- 2017-11-14 CN CN201721521093.8U patent/CN207381381U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |