CN206098359U - A device that is used for bulb type semiconductor components and devices to encapsulate - Google Patents
A device that is used for bulb type semiconductor components and devices to encapsulate Download PDFInfo
- Publication number
- CN206098359U CN206098359U CN201621047120.8U CN201621047120U CN206098359U CN 206098359 U CN206098359 U CN 206098359U CN 201621047120 U CN201621047120 U CN 201621047120U CN 206098359 U CN206098359 U CN 206098359U
- Authority
- CN
- China
- Prior art keywords
- dictyosome
- support
- utility
- model
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model provides a device that is used for bulb type semiconductor components and devices to encapsulate, including support, dictyosome, the support is equipped with a plurality of reflecting cavity, the during operation, the holing position of dictyosome with the reflecting cavity's of support position corresponds, the support is located dictyosome below, the device still including be used for with glue scrape into reflecting cavity with the scraper of the trompil of dictyosome. The beneficial effects of the utility model are that: use the utility model discloses a device is processed, and the bulb lens uniformity of encapsulation is fine, and the yield is high, is fit for large -scale production.
Description
Technical field
This utility model is related to semiconductor components and devices processing technique field, more particularly to a kind of for bulb-shaped semiconductor element
The device of device encapsulation.
Background technology
As shown in figure 1, in existing packaged type, the encapsulation of bulb-shaped semiconductor components and devices needs twice to encapsulate work
Skill, first on the support with chip, using point gum machine glue is dripped, and reflection cavity is filled up, and this is chip Protection glue, then will be fixed
The bulb lens of system are placed in top device center using suction nozzle, finally enter high temperature roaster, make glue reaction solidification.
Current technology has the disadvantage that：
1. need twice technique to be just encapsulated into bulb-shaped device, efficiency is very slow；
2. second technique adds a cover bulb lens, and bubble is easily produced between lens and bottom glue；
3. the technique for adding a cover bulb lens, bulb lens are susceptible to displacement, cause chip center to produce with bulb center
Position deviation；
4. chip protection glue is different from bulb lens colloid material, and life-time service easily produces layering.
Utility model content
This utility model provides a kind of device for the encapsulation of bulb-shaped semiconductor components and devices, including support, dictyosome, institute
State support and be provided with multiple reflection cavities, during work, the position of opening of the dictyosome is corresponding with the position of the reflection cavity of the support, institute
Support is stated positioned at dictyosome lower section, the device is also included for glue to be scraped the perforate into the reflection cavity and the dictyosome
Scraper.
Used as further improvement of the utility model, the device also includes the baking box for toasting the support.
Used as further improvement of the utility model, the device is also included for driving what the scraper was moved left and right
Drive mechanism.
Used as further improvement of the utility model, the device is also included for by the evacuation of the bubble removal in glue
Mechanism.
Used as further improvement of the utility model, the support coordinates with the dictyosome for removable connection, the net
The perforate of body is arranged in array, and the dictyosome is made using Steel material.
The beneficial effects of the utility model are：It is processed using device of the present utility model, the bulb lens one of encapsulation
Very well, yield is high for cause property, is adapted to large-scale production.
Description of the drawings
Fig. 1 is the apparatus structure of current technology and packaging technology schematic diagram.
Fig. 2 is apparatus structure of the present utility model and packaging technology schematic diagram.
Specific embodiment
As shown in Fig. 2 the utility model discloses it is a kind of for bulb-shaped semiconductor components and devices encapsulation device, including
Frame 10, dictyosome 20, the support 1 is provided with multiple reflection cavities 11, during work, the position of perforate 21 and the support of the dictyosome 20
The position correspondence of 10 reflection cavity 11, the support 10 is located at the lower section of the dictyosome 20, and the device is also included for glue to be scraped
Enter the scraper 30 of the perforate 21 of the reflection cavity 11 and the dictyosome 20.
The device also includes the baking box for toasting the support 10.
The device also includes the drive mechanism for driving the scraper 30 to be moved left and right.
The device is also included for by the vacuum device of the bubble removal in glue 40.
The support 10 coordinates with the dictyosome 20 for removable connection, and the perforate 21 of the dictyosome 20 is arranged in array,
The dictyosome 20 is made using Steel material.
The support 10 is referred to the dictyosome 20 for removable connection cooperation：Support 10 may be mounted under dictyosome 20
Side, when disassembly is desired, support 10 can also be separated with dictyosome 20.
The invention also discloses a kind of method for the encapsulation of bulb-shaped semiconductor components and devices, comprises the steps：
A. chip 50 is placed in the reflection cavity 11 of support 10, makes the support 10 be located at the lower section of dictyosome 20, make described
The position of reflection cavity 11 of frame 10 is corresponding with the position of perforate 21 of the dictyosome 20；
B. quantitative glue 40 is put on the dictyosome 20；
C. glue 40 is made to fill up the perforate 21 of the reflection cavity 11 of the support 10 and the dictyosome 20；
D. the support 10 is separated with the dictyosome 20, at the top of the support 10 bulb lens is formed；
E. the support 10 is put into into oven cooking cycle, solidifies glue 40, complete packaging technology.
Before step d, evacuation is carried out, so as to the bubble in glue 40 be removed.
In step c, moved left and right by scraper 30 and glue 40 is brushed in the perforate 21 of the dictyosome 20, by institute
The perforate 21 of the reflection cavity 11 and the dictyosome 20 of stating support 10 is filled up.
The glue 40 is high-viscosity glue, and the viscosity of the glue 40 declines with the lifting of mixing speed, viscosity
In 10Pa.s（25 DEG C, 20rpm）More than, thixotropic factor（2rpm/20rpm）More than 2.5.
This utility model has following technical advantage：
1. compared with original packaged type, one technique can complete the encapsulation of bulb lens to this utility model, and efficiency is very
Height, is printed using the mode of dictyosome, and very well, yield is high for the bulb lens concordance of encapsulation, is adapted to large-scale production；
2. in this utility model, chip protecting colloid and bulb lens colloid are one, and component reliability is protected
Card；
3. this utility model is packaged using vacuum printer, is operated under vacuum state, can be made in high-viscosity glue
The bubble in portion is removed, it is ensured that glue obtains complete wetting with support, chip, contributes to lifting the reliability of components and parts.
Above content is to combine specific preferred implementation further detailed description of the utility model, it is impossible to
Identification is of the present utility model to be embodied as being confined to these explanations.For the ordinary skill of this utility model art
For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be regarded
To belong to protection domain of the present utility model.
Claims (7)
1. it is a kind of for bulb-shaped semiconductor components and devices encapsulation device, it is characterised in that：Including support, dictyosome, the support
Multiple reflection cavities are provided with, during work, the position of opening of the dictyosome is corresponding with the position of the reflection cavity of the support, the support
Positioned at dictyosome lower section, the device also includes the scraper for glue to be scraped the perforate into the reflection cavity and the dictyosome.
2. device according to claim 1, it is characterised in that：The device also includes the baking box for toasting the support.
3. device according to claim 1, it is characterised in that：The device is also included for driving the scraper to carry out left and right
Mobile drive mechanism.
4. device according to claim 1, it is characterised in that：The device is also included for by the bubble removal in glue
Vacuum device.
5. device according to claim 1, it is characterised in that：The support coordinates with the dictyosome for removable connection.
6. device according to claim 1, it is characterised in that：The perforate of the dictyosome is arranged in array.
7. device according to claim 1, it is characterised in that：The dictyosome is made using Steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621047120.8U CN206098359U (en) | 2016-09-09 | 2016-09-09 | A device that is used for bulb type semiconductor components and devices to encapsulate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621047120.8U CN206098359U (en) | 2016-09-09 | 2016-09-09 | A device that is used for bulb type semiconductor components and devices to encapsulate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206098359U true CN206098359U (en) | 2017-04-12 |
Family
ID=58476433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621047120.8U Expired - Fee Related CN206098359U (en) | 2016-09-09 | 2016-09-09 | A device that is used for bulb type semiconductor components and devices to encapsulate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206098359U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252243A (en) * | 2016-09-09 | 2016-12-21 | 深圳连硕三悠自动化科技有限公司 | A kind of device and method for the encapsulation of bulb-shaped semiconductor components and devices |
-
2016
- 2016-09-09 CN CN201621047120.8U patent/CN206098359U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252243A (en) * | 2016-09-09 | 2016-12-21 | 深圳连硕三悠自动化科技有限公司 | A kind of device and method for the encapsulation of bulb-shaped semiconductor components and devices |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103109361B (en) | Primer fill method in a kind of semiconductor packages and equipment | |
| CN105599942B (en) | A kind of facial mask automatic filling device | |
| CN108109533A (en) | A kind of method for packing for realizing LED display modules | |
| EP3025838A1 (en) | Molded article production system and molded article production method | |
| CN206098359U (en) | A device that is used for bulb type semiconductor components and devices to encapsulate | |
| CN110286498A (en) | 3D-LED mould group preparation facilities and method | |
| CN101533786A (en) | Method for eliminating air bubble in chip adhesion rubber layer encapsulated by semiconductor | |
| CN203982928U (en) | Glass insulator sintering mold | |
| CN107887492A (en) | LED encapsulation method, LED module and its LED component | |
| JP2005303251A (en) | Packaging method of integrated circuit | |
| CN109216532A (en) | A kind of ultraviolet LED quartz lens assembling structure and method | |
| CN108598254A (en) | Filter package method and encapsulating structure | |
| JP2013043329A (en) | Method and device for manufacturing substrate with reflector | |
| CN105014975B (en) | A kind of three-dimensional printing machine and the three-dimensional printing machine and its method for microgravity environment | |
| CN106252243A (en) | A kind of device and method for the encapsulation of bulb-shaped semiconductor components and devices | |
| CN104600008B (en) | Material stripping aggregate plant based on dither | |
| CN104617002A (en) | Semiconductor packaging method and structure | |
| CN203254606U (en) | DIP (dual-in-line package) lead frame plastic package mold | |
| CN106816387B (en) | A kind of semiconductor structure laser-stripping method | |
| CN107919426A (en) | UV LED inorganic encapsulated base of ceramic and preparation method thereof | |
| CN110034024A (en) | The manufacturing method of package substrate | |
| US20150214075A1 (en) | Manufacturing method of selective electronic packaging device | |
| CN104658925B (en) | Method for preventing cavity cleaning after singulation of packaging tube shell product | |
| CN105845584B (en) | A kind of semiconductor diode framework quick assembling technique and its aid | |
| CN103356388B (en) | Spherical shell fastening machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 C, 2nd Floor, 10th Building, Xialang Industrial Zone, Heshui Community, Matian Street, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Kemi Sanyou Technology Co.,Ltd. Address before: 518109 No. 301, Lougang Avenue, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN LIANSHUO SANYOU AUTOMATION TECHNOLOGY CO.,LTD. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 Termination date: 20210909 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |