CN207369390U - A kind of high-cooling property paper tinsel base circuit board - Google Patents
A kind of high-cooling property paper tinsel base circuit board Download PDFInfo
- Publication number
- CN207369390U CN207369390U CN201721299107.6U CN201721299107U CN207369390U CN 207369390 U CN207369390 U CN 207369390U CN 201721299107 U CN201721299107 U CN 201721299107U CN 207369390 U CN207369390 U CN 207369390U
- Authority
- CN
- China
- Prior art keywords
- outside
- radiator
- panel
- circuit board
- paper tinsel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of high-cooling property paper tinsel base circuit board, including panel and radiator, circuit line is installed outside the panel, and panel itself is provided with absorber, the circuit line is externally connected to circuit element, and it is provided with panel on the outside of circuit element, the radiator is externally connected to radiator connector, and heat insulation is provided with outside radiator, the radiator connector is externally connected to heat insulation, and it is provided with heat conducting pipe outside radiator connector, panel is provided with outside the heat insulation, panel is provided with outside the thermal insulation layer, and it is connected with heat conducting pipe on the inside of thermal insulation layer, and it is provided with bottom plate on the outside of thermal insulation layer, the base plate external is connected with absorber.The heat that paper tinsel base circuit board can be subject to by the heat conducting pipe of installation inside the high-cooling property paper tinsel base circuit board is distributed by radiator, can prevent the excessive caused aging phenomenon of temperature of paper tinsel base circuit board, adds the service life of whole paper tinsel base circuit board.
Description
Technical field
Paper tinsel base circuit board technical field is the utility model is related to, is specially a kind of high-cooling property paper tinsel base circuit board.
Background technology
Wiring board is called circuit board, circuit board mainly by pad, via, mounting hole, conducting wire, component, connector, fill out
Fill, the composition such as electrical boundary, circuit board makes circuit miniaturization, directly perceivedization, batch production for permanent circuit and optimizes electricity consumption
Device layout plays an important role.
During use, the conducting wire on paper tinsel base circuit board can be sent general paper tinsel base circuit board during energization
Heat, so will rise the temperature of paper tinsel base circuit board, can cause paper tinsel base circuit board aging, influence making for paper tinsel base circuit board
Use the service life.
Utility model content
The purpose of this utility model is to provide a kind of high-cooling property paper tinsel base circuit board, to solve to carry in above-mentioned background technology
The paper tinsel base circuit board currently on the market gone out easily by heat ageing the problem of.
To achieve the above object, the utility model provides following technical solution：A kind of high-cooling property paper tinsel base circuit board, including
Panel and radiator, are provided with circuit line outside the panel, and panel itself is provided with absorber, outside the circuit line
Circuit element is connected with, and panel is provided with the outside of circuit element, the radiator is externally connected to radiator connector,
And heat insulation is provided with outside radiator, the radiator connector is externally connected to heat insulation, and radiator connects
Heat conducting pipe is provided with outside part, panel is provided with outside the heat insulation, thermal insulation layer is provided with outside the absorber, and absorb heat
Heat conducting pipe is installed outside body, panel is provided with outside the thermal insulation layer, and heat conducting pipe is connected with the inside of thermal insulation layer, and it is heat-insulated
Layer outside is provided with bottom plate, and the base plate external is connected with absorber.
Preferably, the radiator surface is laminated structure, and the distance between its laminated structure is 0.1CM.
Preferably, the nearly panel end surfaces of the heat insulation are circular groove structure, and radiator connector groove structure
Inside diameter is equal with panel outer dia.
Preferably, the absorber outer shape is hemispherical, and it is on the distribution symmetrical above and below of heat conducting pipe center line.
Preferably, the thermal insulation layer surface is perforation structure, and is arcuate structure on the inside of its perforation structure, and thermal insulation layer
Arcuate structure radian matches with radian outside absorber.
Compared with prior art, the beneficial effects of the utility model are：Installation inside the high-cooling property paper tinsel base circuit board
The heat that paper tinsel base circuit board can be subject to by heat conducting pipe is distributed by radiator, can prevent the temperature of paper tinsel base circuit board
Aging phenomenon caused by excessive, adds the service life of whole paper tinsel base circuit board.The laminated structure of the radiator of the device,
The contact area with air can be increased, with the effect of increase heat dissipation, and heat insulation can be by radiator connector knead dough
Plate is kept apart, and prevents the temperature on radiator connector to be delivered on panel, and hemispheric absorber can be effectively by face
The heat absorption that plate is subject to is fallen and transfers heat to heat conducting pipe, and thermal insulation layer can separate panel and bottom plate and heat conducting pipe, this
Sample heat conducting pipe just will not transfer heat to panel and bottom plate.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model panel itself side structure schematic view.
In figure：1st, panel, 2, circuit line, 3, circuit element, 4, radiator, 5, radiator connector, 6, heat insulation,
7th, absorber, 8, thermal insulation layer, 9, heat conducting pipe, 10, bottom plate.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of high-cooling property paper tinsel base circuit board, including face
Plate 1 and radiator 4, are provided with circuit line 2 outside panel 1, and panel 1 is internally provided with absorber 7, connects outside circuit line 2
Circuit element 3 is connected to, and the outside of circuit element 3 is provided with panel 1, radiator 4 is externally connected to radiator connector 5,
And heat insulation 6 is provided with outside radiator 4,4 surface of radiator is laminated structure, and the distance between its laminated structure is
The contact area of 0.1CM, increase radiator 4 and air, improves the effect of heat dissipation, and radiator connector 5 is externally connected to
Heat insulation 6, and heat conducting pipe 9 is provided with outside radiator connector 5, panel 1,6 nearly face of heat insulation are provided with outside heat insulation 6
1 end surfaces of plate are circular groove structure, and 5 groove structure inside diameter of radiator connector is equal with 1 outer dia of panel,
Play the separated effect of radiator connector 5 and panel 1, prevent radiator connector 5 from transferring heat to panel 1,
Thermal insulation layer 8 is provided with outside absorber 7, and heat conducting pipe 9 is installed outside absorber 7,7 outer shape of absorber is hemispherical,
And it is on the distribution symmetrical above and below of 9 center line of heat conducting pipe, 7 endothermic effect of absorber is improved, panel 1 is provided with outside thermal insulation layer 8,
And the inner side of thermal insulation layer 8 is connected with heat conducting pipe 9, and the outside of thermal insulation layer 8 is provided with bottom plate 10, and 8 surface of thermal insulation layer is perforation structure,
And its perforation structure inner side is arcuate structure, and 8 arcuate structure radian of thermal insulation layer matches with 7 outside radian of absorber, will
Panel 1 and bottom plate 10 and heat conducting pipe 9 separate, and the heat on heat conducting pipe 9 just will not be passed on panel 1 and bottom plate 10, play protection
The effect of panel 1 and bottom plate 10, bottom plate 10 are externally connected to absorber 7.
Operation principle：When using the high-cooling property paper tinsel base circuit board, the electric current inside circuit element 3 on the device leads to
When oversampling circuit line 2, circuit line 2 can give off heat, and the heat that circuit line 2 is sent can be delivered on panel 1, then with face
Heat absorption on panel 1 and is transferred heat to heat conducting pipe 9 by the absorber 7 that plate 1 contacts, thermal insulation layer 8 by heat conducting pipe 9 with
Panel 1 and bottom plate 10 separate, and the heat on such heat conducting pipe 9 is just not transferred on panel 1 and bottom plate 10, afterwards heat conducting pipe 9
Radiator connector 5 is transferred heat to again, and radiator connector 5 transfers heat to radiator 4, finally radiates again
Device 4 is distributed heat by the laminated structure on surface, so lessens the temperature of the device, prevent the device because
Temperature is excessive and aging, so as to complete a series of work.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it can still modify the technical solution described in foregoing embodiments, or to which part technical characteristic into
Row equivalent substitution, where within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of high-cooling property paper tinsel base circuit board, including panel（1）And radiator（4）, it is characterised in that：The panel（1）
Outside is provided with circuit line（2）, and panel（1）It is internally provided with absorber（7）, the circuit line（2）It is externally connected to circuit
Element（3）, and circuit element（3）Outside is provided with panel（1）, the radiator（4）It is externally connected to radiator connection
Part（5）, and radiator（4）Outside is provided with heat insulation（6）, the radiator connector（5）It is externally connected to heat insulation
（6）, and radiator connector（5）Outside is provided with heat conducting pipe（9）, the heat insulation（6）Outside is provided with panel（1）, institute
State absorber（7）Outside is provided with thermal insulation layer（8）, and absorber（7）Outside is provided with heat conducting pipe（9）, the thermal insulation layer（8）Outside
Portion is provided with panel（1）, and thermal insulation layer（8）Inner side is connected with heat conducting pipe（9）, and thermal insulation layer（8）Outside is provided with bottom plate
（10）, the bottom plate（10）It is externally connected to absorber（7）.
A kind of 2. high-cooling property paper tinsel base circuit board according to claim 1, it is characterised in that：The radiator（4）Table
Face is laminated structure, and the distance between its laminated structure is 0.1CM.
A kind of 3. high-cooling property paper tinsel base circuit board according to claim 1, it is characterised in that：The heat insulation（6）Nearly face
Plate（1）End surfaces are circular groove structure, and radiator connector（5）Groove structure inside diameter and panel（1）It is exterior straight
Footpath is equal.
A kind of 4. high-cooling property paper tinsel base circuit board according to claim 1, it is characterised in that：The absorber（7）It is exterior
Shape is hemispherical, and it is on heat conducting pipe（9）Center line distribution symmetrical above and below.
A kind of 5. high-cooling property paper tinsel base circuit board according to claim 1, it is characterised in that：The thermal insulation layer（8）Surface
For perforation structure, and it is arcuate structure on the inside of its perforation structure, and thermal insulation layer（8）Arcuate structure radian and absorber（7）Outside
Portion's radian matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721299107.6U CN207369390U (en) | 2017-10-10 | 2017-10-10 | A kind of high-cooling property paper tinsel base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721299107.6U CN207369390U (en) | 2017-10-10 | 2017-10-10 | A kind of high-cooling property paper tinsel base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207369390U true CN207369390U (en) | 2018-05-15 |
Family
ID=62347899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721299107.6U Expired - Fee Related CN207369390U (en) | 2017-10-10 | 2017-10-10 | A kind of high-cooling property paper tinsel base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207369390U (en) |
-
2017
- 2017-10-10 CN CN201721299107.6U patent/CN207369390U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180515 Termination date: 20181010 |