CN207358323U - A kind of reflow machine for lowering temperature stress - Google Patents
A kind of reflow machine for lowering temperature stress Download PDFInfo
- Publication number
- CN207358323U CN207358323U CN201721435221.7U CN201721435221U CN207358323U CN 207358323 U CN207358323 U CN 207358323U CN 201721435221 U CN201721435221 U CN 201721435221U CN 207358323 U CN207358323 U CN 207358323U
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- China
- Prior art keywords
- air
- sealing
- air valve
- temperature sensor
- temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of reflow machine for lowering temperature stress, air inlet is arranged at the upper top of body, and air intake blower fan is set on air inlet；Internal body is arranged between sealing, and body inner wall is fixedly connected on by strut；First air valve is arranged at the upper top surface between sealing, and inside and outside between the first air valve communication seals；Second air valve is arranged at the bottom surface between sealing, and inside and outside between the second air valve communication seals；First temperature sensor is arranged at the upper top surface between sealing, and second temperature sensor is arranged at the bottom surface between sealing；Control device is arranged at outer wall between sealing, and the first air valve, the second air valve, the first temperature sensor and second temperature sensor are electrically connected to control device.A kind of reflow machine for lowering temperature stress of the utility model, by being detected temperature exterior sealing, realizes and pcb board is evenly heated, avoid the generation of temperature stress, effectively reduce the defect rate of pcb board.
Description
Technical field
It the utility model is related to electronics field, and in particular to a kind of reflow machine for lowering temperature stress.
Background technology
Solder reflow techniques are not strange in electronic manufacturing field, and the element on various boards that we use in computer is all
It is welded to by this technique on wiring board, there is a heater circuit in the inside of this equipment, and air or nitrogen are heated to
Sufficiently high temperature after-blow allows the solder of elements on either side to be bonded after melting with mainboard to the wiring board for having posted element.It is this
The advantage of technique is that temperature is easily controllable, and oxidation is also avoided that in welding process, and manufacture cost is also easier to control.
But in existing solder reflow techniques, when pcb board is welded, both sides be heated it is often uneven, so as to cause PCB
There is temperature stress and deformation in plate, improves the defect rate of pcb board.
Utility model content
Technical problem to be solved in the utility model is in existing solder reflow techniques, when pcb board is welded, both sides
It is heated often uneven, so as to cause pcb board temperature stress and deformation occur, improve the defect rate of pcb board, it is therefore intended that carry
For a kind of reflow machine for lowering temperature stress, solve the above problems.
The utility model is achieved through the following technical solutions：
It is a kind of lower temperature stress reflow machine, including body, air inlet, air outlet, air intake blower fan, air-out blower fan,
Between sealing, the first air valve, the second air valve, strut, the first temperature sensor, second temperature sensor and control device；It is described into
Air port is arranged at the upper top of body, and air intake blower fan is set on air inlet；The air outlet is arranged at the lower bottom part of body, and
Air-out blower fan is set on air outlet；Internal body is arranged between the sealing, and body inner wall is fixedly connected on by strut；Institute
The upper top surface that the first air valve is arranged between sealing is stated, and it is inside and outside between the first air valve communication seals；Second air valve
The bottom surface being arranged between sealing, and it is inside and outside between the second air valve communication seals；First temperature sensor is set
Upper top surface between sealing, the second temperature sensor are arranged at the bottom surface between sealing；The control device is arranged at close
Outer wall between envelope, and the first air valve, the second air valve, the first temperature sensor and second temperature sensor are electrically connected to control device.
In the prior art, in existing solder reflow techniques, when pcb board is welded, both sides be heated it is often uneven so that
Cause pcb board temperature stress and deformation occur, improve the defect rate of pcb board.The utility model in application, when to pcb board into
During row welding, by top and bottom temperature between the first temperature sensor and second temperature sensor inspection sealing, when between sealing
When top and bottom temperature difference is less than threshold value, that is, think that temperature at this time will not cause a large amount of temperature stresses, Ran Houtong
Cross control device and open the first air valve and the second air valve, thermal current, which enters in sealing, to be welded.It is right that the utility model passes through
Exterior temperature is detected between sealing, realizes and pcb board is evenly heated, avoid the generation of temperature stress, effectively
Reduce the defect rate of pcb board.
Further, the control device includes control module；The control module be used in the first temperature sensor and
When the temperature signal difference that second temperature sensor detects is less than threshold value, is sent to the first air valve and the second air valve and open letter
Number；First air valve and the second air valve are opened when receiving open signal.
Further, the control module uses 51 microcontrollers.
Further, the first air valve and the second air valve use solenoid valve.
Further, the interior setting pcb board of the sealing.
Control module described above is the prior art, and the utility model is combined, and is realized new
Technique effect.
The utility model compared with prior art, has the following advantages and advantages：
A kind of reflow machine for lowering temperature stress of the utility model, by being detected temperature exterior sealing,
Realize and pcb board is evenly heated, avoid the generation of temperature stress, effectively reduce the defect rate of pcb board.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the utility model embodiment, forms the one of the application
Part, does not form the restriction to the utility model embodiment.In the accompanying drawings：
Fig. 1 is the utility model structure diagram.
Mark and corresponding parts title in attached drawing：
1- bodies, 2- air inlets, 3- air outlets, 4- air intake blower fans, 5- air-out blower fans, between 6- sealings, 7-PCB plates, 8- the
One air valve, the second air valves of 9-, 10- struts, the first temperature sensors of 11-, 12- second temperature sensors, 13- control devices.
Embodiment
For the purpose of this utility model, technical solution and advantage is more clearly understood, with reference to embodiment and attached drawing,
The utility model is described in further detail, and the exemplary embodiment and its explanation of the utility model are only used for explaining this
Utility model, is not intended to limit the scope of the present invention.
Embodiment
As shown in Figure 1, a kind of reflow machine for lowering temperature stress of the utility model, including body 1, air inlet 2, outlet air
Mouthfuls 3, the 6, first air valve 8 between air intake blower fan 4, air-out blower fan 5, sealing, the second air valve 9, strut 10, the first temperature sensor 11,
Second temperature sensor 12 and control device 13；The air inlet 2 is arranged at the upper top of body 1, and set on air inlet 2 into
Wind wind turbine 4；The air outlet 3 is arranged at the lower bottom part of body, and air-out blower fan 5 is set on air outlet 3；6 set between the sealing
It is placed in inside body 1, and 1 inner wall of body is fixedly connected on by strut 10；First air valve 8 be arranged at sealing between 6 it is upper
Top surface, and between 8 communication seals of the first air valve 6 it is inside and outside；Second air valve 9 is arranged between sealing 6 bottom surface, and
Between second air valve, 9 communication seals 6 it is inside and outside；First temperature sensor 11 is arranged between sealing 6 upper top surface, institute
State the bottom surface that second temperature sensor 12 is arranged between sealing 6；The control device 13 is arranged at 6 outer walls between sealing, and the
One air valve 8, the second air valve 9, the first temperature sensor 11 and second temperature sensor 12 are electrically connected to control device 13.The control
Device 13 processed includes control module；The control module is used to detect in the first temperature sensor 11 and second temperature sensor 12
When the temperature signal difference arrived is less than threshold value, open signal is sent to the first air valve 8 and the second air valve 9；First air valve, 8 He
Second air valve 9 is opened when receiving open signal.The control module uses 51 microcontrollers.First air valve 8 and the second air valve 9 use
Solenoid valve.Pcb board 7 is set in 6 between the sealing.
When the present embodiment is implemented, when being welded to pcb board 7, passed by the first temperature sensor 11 and second temperature
Sensor 12 checks 6 top and bottom temperature between sealing, when 6 top and bottom temperature differences are less than threshold value between sealing, that is, thinks
Temperature at this time will not cause a large amount of temperature stresses, then open the first air valve 8 and the second air valve by control device 13
9, thermal current is welded into 6 between sealing.The utility model is realized by being detected the temperature outside sealing 6
Being evenly heated to pcb board 7, avoids the generation of temperature stress, effectively reduces the defect rate of pcb board 7.
Above-described embodiment, the purpose of this utility model, technical solution and beneficial effect have been carried out into
One step describes in detail, it should be understood that the foregoing is merely specific embodiment of the present utility model, is not used to limit
Determine the scope of protection of the utility model, where within the spirit and principles of the present invention, any modification for being made, equally replace
Change, improve, should be included within the scope of protection of this utility model.
Claims (5)
1. it is a kind of lower temperature stress reflow machine, it is characterised in that including body (1), air inlet (2), air outlet (3),
(6), the first air valve (8), the second air valve (9), strut (10), the first temperature pass between air intake blower fan (4), air-out blower fan (5), sealing
Sensor (11), second temperature sensor (12) and control device (13)；The air inlet (2) is arranged at the upper top of body (1),
And air intake blower fan (4) is set on air inlet (2)；The air outlet (3) is arranged at the lower bottom part of body, and is set on air outlet (3)
Put air-out blower fan (5)；(6) are arranged at body (1) inside between the sealing, and are fixedly connected on body (1) by strut (10)
Inner wall；First air valve (8) be arranged at sealing between (6) upper top surface, and between the first air valve (8) communication seals (6) inside
And outside；Second air valve (9) be arranged at sealing between (6) bottom surface, and between the second air valve (9) communication seals (6) it is interior
Portion and outside；First temperature sensor (11) is arranged at the upper top surface of (6) between sealing, the second temperature sensor (12)
It is arranged at the bottom surface of (6) between sealing；The control device (13) is arranged at (6) outer wall between sealing, and the first air valve (8), the
Two air valves (9), the first temperature sensor (11) and second temperature sensor (12) are electrically connected to control device (13).
A kind of 2. reflow machine for lowering temperature stress according to claim 1, it is characterised in that the control device
(13) control module is included；
The control module is used for the temperature signal detected in the first temperature sensor (11) and second temperature sensor (12)
When difference is less than threshold value, open signal is sent to the first air valve (8) and the second air valve (9)；First air valve (8) and the second gas
Valve (9) is opened when receiving open signal.
3. a kind of reflow machine for lowering temperature stress according to claim 2, it is characterised in that the control module is adopted
With 51 microcontrollers.
4. it is according to claim 1 it is a kind of lower temperature stress reflow machine, it is characterised in that the first air valve (8) and
Second air valve (9) uses solenoid valve.
5. a kind of reflow machine for lowering temperature stress according to claim 1, it is characterised in that between the sealing (6)
Interior setting pcb board (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721435221.7U CN207358323U (en) | 2017-10-31 | 2017-10-31 | A kind of reflow machine for lowering temperature stress |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721435221.7U CN207358323U (en) | 2017-10-31 | 2017-10-31 | A kind of reflow machine for lowering temperature stress |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207358323U true CN207358323U (en) | 2018-05-15 |
Family
ID=62344920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721435221.7U Expired - Fee Related CN207358323U (en) | 2017-10-31 | 2017-10-31 | A kind of reflow machine for lowering temperature stress |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207358323U (en) |
-
2017
- 2017-10-31 CN CN201721435221.7U patent/CN207358323U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180515 Termination date: 20181031 |