CN212393056U - SMT paster glues solidification equipment - Google Patents

SMT paster glues solidification equipment Download PDF

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Publication number
CN212393056U
CN212393056U CN202021066440.4U CN202021066440U CN212393056U CN 212393056 U CN212393056 U CN 212393056U CN 202021066440 U CN202021066440 U CN 202021066440U CN 212393056 U CN212393056 U CN 212393056U
Authority
CN
China
Prior art keywords
object carrying
air
box
air guide
carrying box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202021066440.4U
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Chinese (zh)
Inventor
谭国华
许红亮
包立全
王斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Guanjun Electronics Co ltd
Original Assignee
Kunshan Guanjun Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Guanjun Electronics Co ltd filed Critical Kunshan Guanjun Electronics Co ltd
Priority to CN202021066440.4U priority Critical patent/CN212393056U/en
Application granted granted Critical
Publication of CN212393056U publication Critical patent/CN212393056U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a solidification equipment is glued to SMT paster, comprises a workbench, the top of workstation is fixed with an air inlet section of thick bamboo, the top of an air inlet section of thick bamboo is provided with the fan, the air guide hole has been seted up on the surface of an air inlet section of thick bamboo, the inner wall of air guide hole is provided with electric heating wire, the top of workstation is fixed with carries the thing box, the intercommunication has the gas-supply pipe between year thing box and the air guide hole, the inner wall bottom of carrying the thing box is equipped with carries the thing board, the bottom welding of carrying the thing board has the regulation pole. This curing equipment is glued to SMT paster puts into through the electronic component with the laminating and carries the thing box, closes the apron this moment, utilizes the division board to reach the effect of sealed louvre, recycles the work of electric heating wire, and the cooperation fan forms the hot-blast that flows with the electric heating wire contact after the heating in going into the air guide hole as the air current, again by the gas-supply pipe get into carry the thing box in, reach the electronic component to the laminating and carry out the effect of high-efficient solidification.

Description

SMT paster glues solidification equipment
Technical Field
The utility model belongs to the technical field of curing equipment, concretely relates to curing equipment is glued to SMT paster.
Background
SMT is a surface mounting technique (surface mount technology), which is the most popular technique and process in the current electronic assembly industry, SMT paster refers to the abbreviation of a series of process flows processed on the basis of PCB (printed circuit board), and paster glue, also called SMT adhesive and SMT red glue, which is adhesive agent with hardener, pigment, solvent and the like uniformly distributed in red paste, is mainly used for fixing components on a printed board, is generally distributed by using a method of dispensing or steel mesh printing, is put into an oven or a reflow machine for heat hardening after being pasted with the components, is different from the so-called soldering paste, and after being heat hardened, the adhesive will not melt after being heated again, that is, the thermosetting process of the adhesive is irreversible, and the using effect of the SMT adhesive can vary according to the thermosetting conditions, the objects to be connected, the equipment used and the operating environment. At present, the equipment for curing the SMT paster glue on the market is generally carried out in a large container, the curing efficiency is low, the temperature of the product after curing is high, the cooling effect is poor, the production efficiency of the product is influenced, and the SMT paster glue curing equipment is needed to solve the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a solidification equipment is glued to SMT paster to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a solidification equipment is glued to SMT paster, includes the workstation, the top of workstation is fixed with an air inlet section of thick bamboo, the top of an air inlet section of thick bamboo is provided with the fan, the air guide hole has been seted up on the surface of an air inlet section of thick bamboo, the inner wall of air guide hole is provided with electric heating wire, the top of workstation is fixed with carries the thing box, it has the gas-supply pipe to communicate between thing box and the air guide hole, the inner wall bottom of carrying the thing box is equipped with carries the thing board, the bottom welding of carrying the thing board has the regulation pole, it runs through and carries the thing box to adjust the pole, and extends to the bottom and spacing piece fixed connection who carries the thing box, the bottom symmetric welding of carrying the thing box has two risers, the louvre has been seted up on the lateral wall of carrying the thing box, the top.
Preferably, the handle is welded on the outer side wall of the cover plate and is arranged close to the end part.
This arrangement serves to improve the convenience in the closing process of the cover panel.
Preferably, the bottom end of the isolation plate is in contact with the top end of the carrying plate, and the size of the carrying plate is equal to that of the bottom end of the inner wall of the carrying box.
Preferably, the air guide holes are arranged on the surface of the air inlet cylinder in an annular equidistant mode, and the number of the air guide holes is matched with the number of the object carrying boxes.
This arrangement serves to improve the processing efficiency of the product.
Preferably, the heat dissipation holes and the air conveying pipes are arranged on two sides of the object carrying box in a reverse direction.
Preferably, the object carrying box and the vertical plate are both bases made of stainless steel, and the object carrying box and the vertical plate are of Contraband-shaped structures formed by welding.
The utility model discloses a technological effect and advantage: the SMT adhesive curing equipment comprises a Surface Mounting Technology (SMT) adhesive curing equipment,
1. the attached electronic element is placed into the carrying box, the cover plate is closed at the moment, the isolation plate is utilized to achieve the effect of sealing the heat dissipation holes, the electric heating wire works again, the fan is matched to convey air into the air inlet cylinder, when the air flows into the air guide holes and contacts with the heated electric heating wire to form flowing hot air, the flowing hot air enters the carrying box through the air conveying pipe, and the effect of efficiently curing the attached electronic element is achieved;
2. through opening the apron, make division board and louvre separation, cancelled electric heating wire's work back, the fan is still to carrying air in the air inlet cylinder, conveniently forms the air admission of normal atmospheric temperature and carries the thing box in, and the cooperation louvre is convenient to convey the outside of carrying the thing box with the electronic component's of laminating heat, realizes the quick refrigerated effect of the electronic component of laminating.
Drawings
Fig. 1 is a top view of the structure of the present invention;
FIG. 2 is an enlarged view of the point A of FIG. 1 according to the present invention;
fig. 3 is a perspective view of the structure of the loading box of the present invention.
In the figure: 1. a work table; 2. an air inlet cylinder; 3. a fan; 4. an air vent; 5. an electric heating wire; 6. a carrying box; 61. a loading plate; 62. adjusting a rod; 63. a limiting sheet; 64. a vertical plate; 65. heat dissipation holes; 66. a rotating shaft; 67. a cover plate; 68. a separator plate; 69. a handle; 7. a gas delivery pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a SMT paster glue curing equipment as shown in figures 1-3, which comprises a workbench 1, wherein an air inlet barrel 2 is fixed on the top end of the workbench 1, a fan 3 is arranged on the top end of the air inlet barrel 2, air guide holes 4 are arranged on the surface of the air inlet barrel 2, concretely, five air guide holes 4 are arranged on the surface of the air inlet barrel 2 in an annular equidistance manner, the number of the air guide holes 4 is matched with that of object carrying boxes 6, an electric heating wire 5 is arranged on the inner wall of the air guide holes 4, the object carrying boxes 6 are fixed on the top end of the workbench 1, concretely, heat dissipation holes 65 and air conveying pipes 7 are reversely arranged on two sides of the object carrying boxes 6, the air conveying pipes 7 are communicated between the object carrying boxes 6 and the air guide holes 4, an object carrying plate 61 is arranged at the bottom end of the inner wall of the object carrying boxes 6, an adjusting rod 62 is welded at the bottom end of the object carrying plate 61, and the, at the moment, the cover plate 67 is closed, the isolation plate 68 is used for sealing the heat dissipation hole 65, the electric heating wire 5 works, the fan 3 is matched for conveying air into the air inlet cylinder 2, the air flows into the air guide hole 4 and contacts with the heated electric heating wire 5 to form flowing hot air, and then the flowing hot air enters the object carrying box 6 through the air conveying pipe 7, so that the effect of efficiently curing the attached electronic element is achieved;
the adjusting rod 62 penetrates through the object carrying box 6 and extends to the bottom end of the object carrying box 6 and is fixedly connected with the limiting sheet 63, two vertical plates 64 are symmetrically welded at the bottom end of the object carrying box 6, specifically, the object carrying box 6 and the vertical plates 64 are both base bodies made of stainless steel, the object carrying box 6 and the vertical plates 64 are in Contraband-shaped structures formed by welding, heat dissipation holes 65 are formed in the outer side wall of the object carrying box 6, a rotating shaft 66 is arranged at the top end of the object carrying box 6, a cover plate 67 is rotatably connected to the rotating shaft 66, specifically, a handle 69 is welded on the outer side wall of the cover plate 67 and is arranged close to the end portion, a separation plate 68 is fixedly welded on the inner side wall of the cover plate 67, specifically, the bottom end of the separation plate 68 is in contact with the top end of the object carrying plate 61, the size of the object carrying plate 61 is equal to the, make division board 68 and louvre 65 separation, cancelled electric heating wire 5's work back, fan 3 still to carrying air in the air inlet cylinder 2, conveniently form the air admission of normal atmospheric temperature and carry the thing box 6 in, the cooperation louvre 65 conveniently conveys the outside of carrying thing box 6 with the electronic component's of laminating heat, realizes the quick refrigerated effect of the electronic component of laminating.
The electrical components presented herein are all electrically connected to the external 220V mains.
When the SMT paster glue curing equipment is used, attached electronic elements are placed into the object carrying box 6, the cover plate 67 is closed at the moment, the isolating plate 68 is used for achieving the effect of sealing the heat dissipation holes 65, the electric heating wire 5 works again, the fan 3 is matched for conveying air into the air inlet cylinder 2, when the air flows into the air guide holes 4 and contacts with the heated electric heating wire 5 to form flowing hot air, and then the air enters the object carrying box 6 through the air conveying pipe 7, so that the effect of efficiently curing the attached electronic elements is achieved; through opening apron 67, make division board 68 and louvre 65 separation, cancelled electric heating wire 5's work back, fan 3 still to carrying air in the air inlet cylinder 2, conveniently form the air admission of normal atmospheric temperature and carry thing box 6 in, the convenient electronic component's of laminating heat transfer that will carry thing box 6's the outside is carried to cooperation louvre 65, realizes the quick refrigerated effect of the electronic component of laminating.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims (6)

1. The utility model provides a solidification equipment is glued to SMT paster, includes workstation (1), its characterized in that: the air inlet tube (2) is fixed at the top end of the workbench (1), the fan (3) is arranged at the top end of the air inlet tube (2), the air guide holes (4) are formed in the surface of the air inlet tube (2), the electric heating wires (5) are arranged on the inner wall of the air guide holes (4), the object carrying box (6) is fixed at the top end of the workbench (1), the air conveying pipe (7) is communicated between the object carrying box (6) and the air guide holes (4), the object carrying plate (61) is arranged at the bottom end of the inner wall of the object carrying box (6), the adjusting rod (62) is welded at the bottom end of the object carrying plate (61), the adjusting rod (62) penetrates through the object carrying box (6) and extends to the bottom end of the object carrying box (6) to be fixedly connected with the limiting sheet (63), the two vertical plates (64) are symmetrically welded at the bottom end of the object carrying box (6, the top of carrying thing box (6) is provided with pivot (66), and rotates on pivot (66) and be connected with apron (67), welded fastening has division board (68) on the inside wall of apron (67).
2. An SMT patch glue curing apparatus according to claim 1, wherein: a handle (69) is welded on the outer side wall of the cover plate (67), and the handle (69) is arranged close to the end part.
3. An SMT patch glue curing apparatus according to claim 1, wherein: the bottom end of the isolation plate (68) is in contact with the top end of the object carrying plate (61), and the size of the object carrying plate (61) is equal to that of the bottom end of the inner wall of the object carrying box (6).
4. An SMT patch glue curing apparatus according to claim 1, wherein: the air guide holes (4) are five in the surface of the air inlet drum (2) in an annular equidistant mode, and the number of the air guide holes (4) is matched with the number of the object carrying boxes (6).
5. An SMT patch glue curing apparatus according to claim 1, wherein: the heat dissipation holes (65) and the air conveying pipe (7) are arranged on two sides of the carrying box (6) in a reverse direction.
6. An SMT patch glue curing apparatus according to claim 1, wherein: the carrying box (6) and the vertical plate (64) are both bases made of stainless steel, and the carrying box (6) and the vertical plate (64) are in Contraband-shaped structures formed by welding.
CN202021066440.4U 2020-06-11 2020-06-11 SMT paster glues solidification equipment Expired - Fee Related CN212393056U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021066440.4U CN212393056U (en) 2020-06-11 2020-06-11 SMT paster glues solidification equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021066440.4U CN212393056U (en) 2020-06-11 2020-06-11 SMT paster glues solidification equipment

Publications (1)

Publication Number Publication Date
CN212393056U true CN212393056U (en) 2021-01-22

Family

ID=74254737

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021066440.4U Expired - Fee Related CN212393056U (en) 2020-06-11 2020-06-11 SMT paster glues solidification equipment

Country Status (1)

Country Link
CN (1) CN212393056U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210122