CN209170725U - Via hole is set to the flexible circuit board at the back side - Google Patents
Via hole is set to the flexible circuit board at the back side Download PDFInfo
- Publication number
- CN209170725U CN209170725U CN201821525247.5U CN201821525247U CN209170725U CN 209170725 U CN209170725 U CN 209170725U CN 201821525247 U CN201821525247 U CN 201821525247U CN 209170725 U CN209170725 U CN 209170725U
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- China
- Prior art keywords
- via hole
- circuit board
- copper
- back side
- copper plate
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Abstract
The utility model discloses the flexible circuit boards that a kind of via hole is set to the back side, including circuit board body, the front of the circuit board body is provided with BGA pad, and the back side of the circuit board body is provided with the via hole of blind hole structure, and the via hole electrically conducts with the BGA pad；The circuit board body successively includes the first copper plate, first base material layers of copper, FPC PI substrate layer, the second substrate layers of copper and the second copper plate from front to the back side；The side wall of the via hole is equipped with third copper plate, and the third copper plate is connect with the first copper plate first base material layers of copper, the second substrate layers of copper, FPC PI substrate layer and the second copper plate respectively.In the utility model, via hole is arranged in the back side of circuit board body, this structure makes BGA pad smooth, when carrying out BGA welding porose pad with non-porous pad eat tin amount as it is uniform, the problems such as improving part missing solder, blast hole, inclination, to improve the yields of SMT soldering part.
Description
Technical field
The utility model relates to board design manufacturing technology fields, are set to the soft of the back side more particularly to a kind of via hole
Property circuit board.
Background technique
With the diminution of electronic product, the density of circuit board is higher and higher, so many wiring installation teacher (CAD layout
Engager) have no alternative but just be placed in above pad via hole, especially the closely spaced BGA pad (pad) of ball is even more and does not have
Too many space can put via hole.
Via hole is to enable circuit board assembly factory very in pad (vias-in-pad or vias-on-pad)
The problem of headache, especially via hole (via), are placed in BGA(Ball Grind Array, welded ball array encapsulation) pad (pad)
When, but designing unit is often based upon the reasons such as its design space is insufficient or other are difficult to overcome and forces and SMT is required to assemble
Factory complies.
But if by via hole (via) be placed on the pad for needing to eat tin (Vias-in-pad) will to SMT and
Manufacturing engineer brings calamity, because it has very big chance to influence the reliability of product, can also cause following various quality
Problem:
(1) if via hole is placed on BGA pad, it is more likely that form HIP (Head-In-Pillow) (pillow effect
Answer or double end effect), NWO (Non-Wet Open) or soldered ball air entrapment (Bubbles).Since paste solder printing is in via hole
It can be shut away in via hole air seal in via hole, when circuit board flows through the furnace high-temperature region Reflow Soldering (reflow)
Air can then be expanded because of heat and attempt to escape, some air that do not escape not go out will dry in the tin ball of BGA and form hole
Hole (Void/bubble) even will cause the bad phenomenon of pillow effect (head in pillow) if serious；
(2) air accumulated in via hole, when flowing through reflow oven (reflow oven), air can expanded by heating and
There is the danger of blast hole (out-gassing).This usually occurs preheating undesirable reflow profile, when heating is too fast empty
Gas rapid expanding, gas can not be escaped effectively, will finally be produced outside tin ball；
(3) tin cream can flow to inside via hole because of capillary phenomenon (pertaining to capillary), cause to weld
Phenomena such as tin amount that pad surface must weld is insufficient or lacks weldering, tin cream even can flow to plank opposite, cause the situation of short circuit；Such as
Shown in Fig. 1, when being welded, tin cream, which can flow into, causes porose pad and non-porous pad to eat tin amount unevenness in via hole
It is even, lead to part missing solder, blast hole, inclination, influences the yields of SMT soldering part.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, the flexible electrical that a kind of via hole is set to the back side is provided
The back side of circuit board body is arranged in via hole by road plate, solves the problems, such as that via hole setting causes on BGA pad.
The purpose of this utility model is achieved through the following technical solutions: via hole is set to the flexible circuit at the back side
Plate, including circuit board body, the front of the circuit board body are provided with BGA pad, the back side setting of the circuit board body
There is the via hole of blind hole structure, the via hole electrically conducts with the BGA pad.
Preferably, the circuit board body successively includes the first copper plate, first base material layers of copper, FPC from front to the back side
PI substrate layer, the second substrate layers of copper and the second copper plate.
Preferably, the side wall of the via hole be equipped with third copper plate, the third copper plate respectively with the first copper plate
It is connected with the second copper plate.
Preferably, the third copper plate is also connect with first base material layers of copper, the second substrate layers of copper and FPC PI substrate layer.
The beneficial effects of the utility model are: via hole is arranged in the back side of circuit board body in the utility model, this
Kind of structure makes BGA pad smooth, when carrying out BGA welding porose pad with non-porous pad eat tin amount as it is uniform, change
The problems such as being apt to part missing solder, blast hole, inclination, to improve the yields of SMT soldering part.
Detailed description of the invention
Fig. 1 is the position view of via hole on available circuit plate；
Fig. 2 is a kind of structural schematic diagram of the utility model；
In figure, 1-part, 2-BGA pads, 3-via holes, the 4-the first copper plate, 5-first base material layers of copper, 6-
FPC PI substrate layer, the 7-the second substrate layers of copper, the 8-the second copper plate, 9-third copper plates.
Specific embodiment
Below in conjunction with embodiment, the technical solution of the utility model is clearly and completely described, it is clear that retouched
The embodiment stated is only the utility model a part of the embodiment, instead of all the embodiments.Based in the utility model
Embodiment, those skilled in the art's every other embodiment obtained under the premise of not making the creative labor, all belongs to
In the range of the utility model protection.
Referring to Fig.2, present embodiments providing the flexible circuit board that a kind of via hole is set to the back side:
Via hole is set to the flexible circuit board at the back side, including circuit board body, the front of the circuit board body are provided with
BGA pad 2, the back side of the circuit board body are provided with the via hole 3 of blind hole structure, the via hole 3 and the BGA pad
2 electrically conduct.
In the present embodiment, via hole 3 is arranged in the back side of circuit board body, this structure makes BGA pad 2 smooth.
When carrying out BGA welding, part 1 is placed on to the front of circuit board body, part 1 is then welded on BGA pad 2 using tin cream
On, during this porose pad with non-porous pad eat tin amount as it is uniform, unlike tin cream can be flowed into and be led in traditional structure
It causes porose pad and non-porous pad to eat tin amount in through-hole 3 uneven, improves 1 missing solder of part, blast hole, inclination etc. and ask
Topic, to improve the yields of SMT soldering part 1.
As also shown in fig. 2, the circuit board body successively includes the first copper plate 4, first base material copper from front to the back side
Layer 5, FPC PI substrate layer 6(flexible circuit board strengthening course), the second substrate layers of copper 7 and the second copper plate 8, the via hole 3
Side wall be equipped with third copper plate 9, the third copper plate 9 respectively with 4 first base material layers of copper 5 of the first copper plate, the second substrate copper
Layer 7, FPC PI substrate layer 6 and the connection of the second copper plate 8.
The above is only the preferred embodiment of the utility model, it should be understood that the utility model is not limited to herein
Disclosed form, should not be regarded as an exclusion of other examples, and can be used for other combinations, modifications, and environments, and
Can be in contemplated scope described herein, modifications can be made through the above teachings or related fields of technology or knowledge.And this field
The modifications and changes that personnel are carried out do not depart from the spirit and scope of the utility model, then all should be in right appended by the utility model
It is required that protection scope in.
Claims (4)
1. the flexible circuit board that via hole is set to the back side, which is characterized in that including circuit board body, the circuit board body is just
Face is provided with BGA pad (2), and the back side of the circuit board body is provided with the via hole of blind hole structure (3), the via hole
(3) it electrically conducts with the BGA pad (2).
2. the flexible circuit board that via hole according to claim 1 is set to the back side, which is characterized in that the circuit board body
It successively include the first copper plate (4), first base material layers of copper (5), FPC PI substrate layer (6), the second substrate copper from front to the back side
Layer (7) and the second copper plate (8).
3. the flexible circuit board that via hole according to claim 1 is set to the back side, which is characterized in that the via hole (3)
Side wall be equipped with third copper plate (9), the third copper plate (9) respectively with the first copper plate (4) and the second copper plate (8) company
It connects.
4. the flexible circuit board that via hole according to claim 3 is set to the back side, which is characterized in that the third copper plate
(9) it is also connect with first base material layers of copper (5), the second substrate layers of copper (7) and FPC PI substrate layer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821525247.5U CN209170725U (en) | 2018-09-18 | 2018-09-18 | Via hole is set to the flexible circuit board at the back side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821525247.5U CN209170725U (en) | 2018-09-18 | 2018-09-18 | Via hole is set to the flexible circuit board at the back side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209170725U true CN209170725U (en) | 2019-07-26 |
Family
ID=67331627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821525247.5U Active CN209170725U (en) | 2018-09-18 | 2018-09-18 | Via hole is set to the flexible circuit board at the back side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209170725U (en) |
-
2018
- 2018-09-18 CN CN201821525247.5U patent/CN209170725U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |