CN207354233U - A kind of ceramic package adds the quartz-crystal resonator of metal frame - Google Patents
A kind of ceramic package adds the quartz-crystal resonator of metal frame Download PDFInfo
- Publication number
- CN207354233U CN207354233U CN201721637789.7U CN201721637789U CN207354233U CN 207354233 U CN207354233 U CN 207354233U CN 201721637789 U CN201721637789 U CN 201721637789U CN 207354233 U CN207354233 U CN 207354233U
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- ceramic
- upper cover
- becket
- quartz
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A kind of ceramic package adds the quartz-crystal resonator of metal frame, including ceramic upper cover, base of ceramic and resonance main body tuning fork quartz chip, it is characterised in that：The bottom surface outer ring of the ceramics upper cover is provided with becket, and ceramics upper cover, base of ceramic and the becket are fixed together by gluing compound.The utility model installs becket additional between ceramic upper cover and base of ceramic, both are bonded together by becket, in so avoiding directly bonded due to ceramic surface and caused by air-tightness it is inadequate the problem of, the mechanical strength of device is also improved to a certain extent, extends the service life of device.
Description
Technical field
It the utility model is related to quartz crystal oscillator production field, and in particular to a kind of ceramic package adds the quartz crystal of metal frame
Resonator.
Background technology
Quartz-crystal resonator due to its frequency Stability and veracity the characteristics of, hyundai electronics industry such as computer,
The indispensable parts of equipment such as amusement, communication.It is inexpensive, light-duty as market increasingly increases the demand of electronic product
The electronic product of change is the critically important part that dominates the market.A kind of low cost, the ceramic cover of lightness are imperative, ceramics
Lid be fully sealed with base of ceramic together with it is relatively difficult, encapsulation technology be production on problem.
Under normal conditions, surface mounting quartz crystal resonator is made of quartz wafer, base of ceramic and metal lid.For
Reach hermetically sealed working environment, the pressure welding encapsulation of this kind of base of ceramic and metal lid needs special equipment, and this kind of
Equipment is mainly controlled by Japanese manufacturer, and special equipment requirement also increases the production cost of this quasi resonant oscillator.
The content of the invention
The purpose of the utility model is to overcome the defects of existing technology and deficiency, there is provided it is a kind of it is simple in structure, production cost is low,
Effectively durable ceramic package adds the quartz-crystal resonator of metal frame.
In order to achieve the above object, the technical solution of the utility model is：A kind of ceramic package adds the quartz of metal frame
Crystal resonator, including ceramic upper cover, base of ceramic and resonance main body tuning fork quartz chip, it is characterised in that：On the ceramics
The bottom surface outer ring of lid is provided with becket, and ceramics upper cover, base of ceramic and the becket are fixed together by gluing compound.
The gluing compound is non-conductive adhesive.
The ceramics upper cover spill cavity edge and becket surrounding are both provided with chamfering.
The utility model compared with prior art, has the advantage that：
1st, the utility model installs becket additional between ceramic upper cover and base of ceramic, is bonded in both by becket
Together, in so avoiding directly bonded due to ceramic surface and caused by air-tightness it is inadequate the problem of, also to a certain degree
On improve the mechanical strength of device, extend the service life of device.
2nd, the utility model is respectively provided with chamfering at ceramic upper cover spill cavity edge and becket surrounding, can increase viscous
Glue amount, strengthens the air-tightness of encapsulation.
3rd, the gluing compound in the utility model is non-conductive adhesive binding, and this gluing compound volatility when curing is non-
It is often small, it can be ensured that when curing, plybonding effect reaches optimal, and air-tightness reaches highest.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model.
In figure：Ceramic upper cover 1, base of ceramic 2, resonance main body tuning fork quartz chip 3, becket 4.
Embodiment
The utility model is described in further detail below in conjunction with brief description of the drawings and embodiment.
Referring to Fig. 1, a kind of ceramic package adds the quartz-crystal resonator of metal frame, including ceramic upper cover 1, base of ceramic 2
And resonance main body tuning fork quartz chip 3, the inside of ceramic upper cover 1 is spill cavity, which corresponds to ceramic base
The position of resonance main body tuning fork quartz chip 3 on seat 2, forms resonator, ceramic 1 bottom inner edge of upper cover and outside all have down
Angle, it is uniform beneficial to ceramic 1 bottom viscose glue of upper cover, seal ceramic upper cover 1 and becket 4 tighter.The becket 4 is logical
Punching machine punching is crossed, recycles equipment to carry out surrounding bevelling.4 surrounding of becket has chamfering, and four sides of the one side of becket 4 pass through
Viscose glue and ceramic upper cover 1 fit together, and the four side viscose glue of another side and corresponding base of ceramic 2 of metal frame 4, which correspond to, to be pasted.Gold
Belong to ring 4 and be clipped in the leakproofness for being conducive to increase quartz resonator between ceramic upper cover 1 and base of ceramic 2.
The utility model is the progress viscose glue encapsulation under the air-proof condition full of nitrogen, after packaged, be put into oven and consolidate
Change, after curing a period of time, laser welding is carried out to bonding place.
Claims (3)
1. a kind of ceramic package adds the quartz-crystal resonator of metal frame, including ceramic upper cover（1）, base of ceramic（2）And resonance
Main body tuning fork quartz chip（3）, it is characterised in that：The ceramics upper cover（1）Bottom surface outer ring becket is installed（4）, it is described
Ceramic upper cover（1）, base of ceramic（2）And becket（4）It is fixed together by gluing compound.
2. a kind of ceramic package according to claim 1 adds the quartz-crystal resonator of metal frame, it is characterised in that：It is described
Gluing compound be non-conductive adhesive.
3. a kind of ceramic package according to claim 1 adds the quartz-crystal resonator of metal frame, it is characterised in that：It is described
Ceramic upper cover（1）Spill cavity edge and becket（4）Surrounding is both provided with chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721637789.7U CN207354233U (en) | 2017-11-30 | 2017-11-30 | A kind of ceramic package adds the quartz-crystal resonator of metal frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721637789.7U CN207354233U (en) | 2017-11-30 | 2017-11-30 | A kind of ceramic package adds the quartz-crystal resonator of metal frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207354233U true CN207354233U (en) | 2018-05-11 |
Family
ID=62350589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721637789.7U Active CN207354233U (en) | 2017-11-30 | 2017-11-30 | A kind of ceramic package adds the quartz-crystal resonator of metal frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207354233U (en) |
-
2017
- 2017-11-30 CN CN201721637789.7U patent/CN207354233U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 441300 Zengdou Economic Development Zone, Hubei, Suizhou Patentee after: Taijing Technology Co., Ltd Address before: 441300 Zengdou Economic Development Zone, Hubei, Suizhou Patentee before: HUBEI TKD ELECTRONIC TECHNOLOGY Co.,Ltd. |