CN207338374U

CN207338374U - Pcb board, LED encapsulation structure and LED display

Info

Publication number: CN207338374U
Application number: CN201721275062.9U
Authority: CN
Inventors: 李漫铁; 薛元亭
Original assignee: Ledman Optoelectronic Co Ltd
Current assignee: Ledman Optoelectronic Co Ltd
Priority date: 2017-09-30
Filing date: 2017-09-30
Publication date: 2018-05-08
Anticipated expiration: 2027-09-30

Abstract

The utility model discloses a kind of pcb board, LED encapsulation structure and LED display, wherein, the pcb board includes plate body and array is arranged on multiple solid welding zone domains in a plate face of the plate body, each solid welding zone domain includes the first pole pad of cross direction profiles, die bond pad and the second pole pad successively, first pole pad is copolar pad, and second pole pad includes the first pad and the second pad of longitudinally spaced distributions；First pad in two longitudinally adjacent solid welding zone domains is electrically connected by the first cabling, the second pad is electrically connected by the second cabling；The plate body further includes a routing layer, and first cabling and the second cabling are formed on the routing layer, are respectively positioned on the side of the die bond pad and be located at the side of second pole pad respectively.The utility model pcb board changes cabling design, reduces flaggy, reduces thickness of slab, saves cost.

Description

Pcb board, LED encapsulation structure and LED display

Technical field

It the utility model is related to LED technology field, more particularly to a kind of pcb board, LED encapsulation structure and LED display.

Background technology

COB (Chip on Board, chip on board) encapsulation refers to LED chip being directly installed on pcb board, then right LED chip is packaged.Wherein, pcb board is equipped with multiple solid welding zone domains of array distribution, and each solid welding zone domain is used for die bond one A or multiple LED chips, and then each solid welding zone domain has multiple and different pads.

In the prior art, one solid the same straight line in welding zone domain is (vertical or horizontal) is equipped with the first pad and the second pad When, the line of second pad in line two solid welding zone domain adjacent with this of first pad in adjacent two solid welding zone domains needs to be arranged on Different flaggies, is arranged on same flaggy to avoid line and short circuit occurs because of intersection, spatially stagger.However, it is above-mentioned walk Line design adds flaggy, has thickeied thickness of slab, has improved production cost.

Utility model content

The main purpose of the utility model is that provide a kind of pcb board, it is intended to change cabling design, to reduce thickness of slab, subtract Few cost.

To achieve the above object, the utility model provides a kind of pcb board, including plate body and array are arranged on the plate body Multiple solid welding zone domains in one plate face, each solid welding zone domain include the first pole pad, the die bond pad of cross direction profiles successively With the second pole pad, first pole pad is copolar pad, and second pole pad includes the first weldering of longitudinally spaced distributions Disk and the second pad, longitudinally adjacent two first pads for consolidating welding zone domains are electrically connected by the first cabling, the second weldering Disk is electrically connected by the second cabling；The plate body further includes a routing layer, and first cabling and the second cabling are formed at institute State on routing layer, be respectively positioned on the side of the die bond pad and be located at the side of second pole pad respectively.

Preferably, the distance in the gap between the die bond pad and second pole pad is 0.2~0.4mm.

Preferably, first cabling is located at side of second pole pad away from the die bond pad, and described second Cabling is between second pole pad and the die bond pad.

Preferably, first cabling is between second pole pad and the die bond pad, second cabling Positioned at side of second pole pad away from the die bond pad.

Preferably, the routing layer is located between two plate faces of the plate body.

Preferably, the routing layer is located in the same plate face of the plate body with the solid welding zone domain.

Preferably, first pole pad is positive terminal pad, and second pole pad is negative terminal pad.

Preferably, the die bond pad includes the two parts being spaced apart on longitudinal direction.

In addition, to achieve the above object, the utility model also provides a kind of LED encapsulation structure, including pcb board, array are set In multiple pixels on the pcb board and the encapsulated layer of the multiple pixel of encapsulation, the pcb board is as described above Pcb board, each pixel include die bond in the red light chips on the die bond pad in a solid welding zone domain, green light chip and Blue chip.

In addition, to achieve the above object, the utility model also provides a kind of LED display, including mounting structure and The LED encapsulation structure of the mounting structure is installed in, the LED encapsulation structure is LED encapsulation structure as described above.

Technical solutions of the utility model are located at the side of the second pole pad by the first cabling of setting and the second cabling respectively, That is the first cabling is located at the side of the second pole pad and the second cabling is located at the opposite side of the second pole pad, so the first cabling and Second cabling can be located on same routing layer and avoid the situation for intersecting short circuit, so as to reduce flaggy, reduce thickness of slab, And save cost.

Brief description of the drawings

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, other attached drawings can also be obtained according to the structure shown in these attached drawings.

Fig. 1 is the top view of the utility model pcb board first embodiment；

Fig. 2 is the structure diagram of pcb board in Fig. 1；

Fig. 3 is the enlarged drawing of a-quadrant in Fig. 2；

Fig. 4 is the structure diagram of the utility model pcb board second embodiment；

Fig. 5 is the enlarged drawing of B area in Fig. 4；

Fig. 6 is the top view of the utility model pcb board 3rd embodiment；

Fig. 7 is the top view of one embodiment of the utility model LED encapsulation structure；

Fig. 8 is the top view of another embodiment of the utility model LED encapsulation structure.

The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.

Embodiment

The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only the part of the embodiment of the utility model, rather than all Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise Lower all other embodiments obtained, shall fall within the protection scope of the present invention.

It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment It is only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each component, motion conditions etc., such as When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.

In addition, and it cannot be managed in the utility model such as relating to the description of " first ", " second " etc. is only used for description purpose Solve to indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " the One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the skill between each embodiment Art scheme can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when technical solution It will be understood that the combination of this technical solution is not present with reference to there is conflicting or can not realize when, also not in the utility model It is required that protection domain within.

It should be noted that in the utility model embodiment, defined according to the XY coordinate systems established in Fig. 1：Where X-axis Direction is defined as transverse direction, and direction where Y-axis is defined as longitudinal direction.

The utility model provides a kind of pcb board, refer to Fig. 1 to Fig. 3, in the first embodiment, which includes plate Body 10 and array are arranged on multiple solid welding zone domains 12 in a plate face of plate body 10.Each solid welding zone domain 12 includes laterally dividing successively The first pole pad 16, the 14 and second pole pad 18 of die bond pad of cloth, the first pole pad 16 are copolar pad, the second pole pad 18 The first pad 180 and the second pad 182 including longitudinally spaced distributions.Wherein, the of longitudinally adjacent two solid welding zone domains 12 One pad 180 is electrically connected by the first cabling 184, the second pad 182 is electrically connected by the second cabling 186.The plate body 10 A routing layer (non-label) is further included, the first cabling 184 and the second cabling 186 are formed on routing layer, are respectively positioned on die bond pad 14 side and the side for being located at the second pole pad 18 respectively.

First pad 180 in the solid welding zone domain 12 of adjacent the two of the present embodiment pcb board 1 is electrically connected by the first cabling 184, Second pad 182 in adjacent two solid welding zone domains 12 is electrically connected by the second cabling 186, and first positioned at same routing layer walks 184 and second cabling 186 of line is located at the side of the second pole pad 18 respectively, i.e. the first cabling 184 is located at the second pole pad 18 Side and the second cabling 186 are located at the opposite side of the second pole pad 18, and then the first cabling 184 and the second cabling 186 can positions Intersect short-circuit situation in being avoided on same routing layer, so as to reduce flaggy, reduce thickness of slab, and save cost.

It should be noted that in the utility model, the first pole pad 16 can be positive terminal pad, and the second pole pad 18 is right It should be negative terminal pad；Alternatively, the first pole pad 16 is negative terminal pad, the second pole pad 18 corresponds to positive terminal pad.Routing layer can To be arranged between two plate faces of plate body 10 or be arranged on solid welding zone domain 12 the same plate face of plate body 10 according to actual needs On.In addition, the first cabling 184 and the second cabling 186 are located at the side of the second pad 182 respectively, wherein, " side " does not limit to In " side " in plane, " side " spatially can also be, routing layer and plate face where solid welding zone domain 12 can be with after all It is different flaggies.

In the present embodiment, further, the distance in the gap between 14 and second pole pad 18 of die bond pad for 0.2~ 0.4mm。

In order to provide cabling space between 14 and second pole pad 18 of die bond pad, the distance in gap between the two is set Put in 0.2~0.4mm, can meet the requirement of enough cabling space.

In this embodiment, it is preferred that the distance in the gap between 14 and second pole pad 18 of die bond pad is more than 0.24mm, is most preferably 0.265mm, in this way, the density in solid welding zone domain 12 while cabling space is ensured, can be improved.

In the present embodiment, further, the first cabling 184 is located at one of the second pole pad 18 away from die bond pad 14 Side, the second cabling 186 is between the second pole pad 18 and die bond pad 14.

In the present embodiment, further, routing layer is located between two plate faces of plate body 10, i.e. the first cabling 184 and Two cablings 186 are respectively positioned between two plate faces of plate body 10, as shown in Figure 2.

In the present embodiment, further, the first pole pad 16 is positive terminal pad, i.e. the first pole pad 16 is that cathode welds altogether Disk；Second pole pad 18 is that negative terminal pad, i.e. the first pad 180 and the second pad 182 are negative terminal pad.

In the present embodiment, further, the die bond pad 14 in each solid welding zone domain 12 is an overall structure, is used thereon In die bond red light chips, blue chip and green light chip.

Fig. 4 and Fig. 5 are refer to, Fig. 4 is the structure diagram of the utility model pcb board second embodiment, and Fig. 5 is B in Fig. 4 The enlarged drawing in region.The difference of this second embodiment and first embodiment is：

For first cabling 184 between the second pole pad 18 and die bond pad 14, the second cabling 186 is located at the second pole pad 18 sides away from die bond pad 14.

Fig. 6 is refer to, Fig. 6 is the top view of the utility model pcb board 3rd embodiment.This third embodiment is real with first The difference for applying example or second embodiment is：

The die bond pad 14 in each solid welding zone domain 12 includes the two parts being spaced apart on longitudinal direction, i.e. Part I 140 With Part II 142.When in 140 die bond red light chips of Part I and in 142 die bond green light chip of Part II and blue light core During piece, since Part I 140 and Part II 142 are spaced, and then it is used for the elargol of the red light chips of die bond vertical stratification not It can salivate to other pads, and avoid polluting the situation of other pads and chip.

The utility model also provides the fourth embodiment of pcb board, this fourth embodiment and above-mentioned first embodiment, second are in fact The difference for applying example or 3rd embodiment is：

Routing layer is located in the same plate face of plate body 10 with solid welding zone domain 12, i.e. the first cabling 184 and the second cabling 186 are equal It is arranged on solid welding zone domain 12 in the same plate face of plate body 10, can so makes flaggy minimum number, thickness of slab is minimum, and cost is minimum.

The utility model also provides a kind of LED encapsulation structure, refer to Fig. 7, in one embodiment, the LED encapsulation structure The encapsulated layer (not shown) of the multiple pixels 2 and the multiple pixels 2 of encapsulation that are arranged on including pcb board 1, array on pcb board 1. The concrete structure of the pcb board 1 is with reference to above-described embodiment, since the present embodiment LED encapsulation structure employs above-mentioned section Example Whole technical solutions, therefore all beneficial effects caused by the same technical solution with above-described embodiment, herein no longer Repeat one by one.Wherein, each pixel 2 includes die bond in the red light chips on the die bond pad 14 in a solid welding zone domain 12, green light Chip and blue chip.

Specifically, red light chips, green light chip and blue chip are longitudinally arranged successively, and the red light chips of vertical stratification are just Pole is electrically connected by bonding wire and the first pole pad 16；The cathode of green light chip is electrically connected by bonding wire and the first pole pad 16 Connect, anode is electrically connected by bonding wire and the first pad 180；The cathode of blue chip is electrical by bonding wire and the first pole pad 16 Connection, anode are electrically connected by bonding wire and the second pad 182.

Fig. 8 is refer to, Fig. 8 is the top view of another embodiment of the utility model LED encapsulation structure.The LED of the present embodiment The difference of the LED encapsulation structure of encapsulating structure and above-described embodiment is：

Due to the Part I 140 and second including being spaced apart on longitudinal direction of die bond pad 14 in each solid welding zone domain 12 Part 142, and then red light chips die bond is on the Part I 140 of die bond pad 14, green light chip and blue chip die bond in On the Part II 142 of die bond pad 14.So set, the elargol for the red light chips of die bond vertical stratification will not salivate to On other pads, and avoid polluting the situation of other pads and chip.

This implementation is new also to provide a kind of LED display, with reference to Fig. 7 and Fig. 8, in one embodiment, LED display dresses Put including mounting structure and be installed in the LED encapsulation structure of mounting structure.The concrete structure of the LED encapsulation structure is with reference to above-mentioned Embodiment, since the present embodiment LED display employs whole technical solutions of above-mentioned all embodiments, equally has All beneficial effects caused by the technical solution of above-described embodiment, this is no longer going to repeat them.

It should be noted that the LED display includes but not limited to LED display modules, LED display, LED mosaic screens And LED floor tile screens.By taking LED display modules as an example, which is housing, so LED encapsulation structure be installed on housing it In.

The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention, It is every under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes Change, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.

Claims

A kind of 1. pcb board, it is characterised in that the multiple solid welding zones being arranged on including plate body and array in a plate face of the plate body Domain, each solid welding zone domain include the first pole pad of cross direction profiles, die bond pad and the second pole pad successively, and described first Pole pad is copolar pad, and second pole pad includes the first pad and the second pad of longitudinally spaced distributions, its feature exists In,

First pad in two longitudinally adjacent solid welding zone domains is electrically connected by the first cabling, the second pad passes through second Cabling is electrically connected；

The plate body further includes a routing layer, and first cabling and the second cabling are formed on the routing layer, are respectively positioned on institute State the side of die bond pad and be located at the side of second pole pad respectively.
2. pcb board as claimed in claim 1, it is characterised in that between the die bond pad and second pole pad The distance of gap is 0.2~0.4mm.
3. pcb board as claimed in claim 1, it is characterised in that first cabling is located at second pole pad away from institute The side of die bond pad is stated, second cabling is between second pole pad and the die bond pad.
4. pcb board as claimed in claim 1, it is characterised in that first cabling is located at second pole pad and described Between die bond pad, second cabling is located at side of second pole pad away from the die bond pad.
5. pcb board as claimed in claim 1, it is characterised in that the routing layer is located between two plate faces of the plate body.
6. pcb board as claimed in claim 1, it is characterised in that the routing layer is located at the plate body with the solid welding zone domain Same plate face on.
7. pcb board as claimed in claim 1, it is characterised in that first pole pad is positive terminal pad, the second pole weldering Disk is negative terminal pad.
8. the pcb board as described in claim 1 to 7 any one, it is characterised in that the die bond pad includes being spaced on longitudinal direction Separated two parts.
9. a kind of LED encapsulation structure, including the multiple pixels and encapsulation of pcb board, array on the pcb board are described more The encapsulated layer of a pixel, it is characterised in that the pcb board is the pcb board described in claim 1 to 8 any one, Mei Yisuo Stating pixel includes die bond in red light chips, green light chip and blue chip on the die bond pad in a solid welding zone domain.
10. a kind of LED display, including mounting structure and the LED encapsulation structure for being installed in the mounting structure, its feature It is, the LED encapsulation structure is the LED encapsulation structure described in claim 9.