CN207338372U - LED encapsulation structure and display device - Google Patents
LED encapsulation structure and display device Download PDFInfo
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- CN207338372U CN207338372U CN201721274859.7U CN201721274859U CN207338372U CN 207338372 U CN207338372 U CN 207338372U CN 201721274859 U CN201721274859 U CN 201721274859U CN 207338372 U CN207338372 U CN 207338372U
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Abstract
The utility model discloses a kind of LED encapsulation structure and display device, wherein, the LED encapsulation structure includes the encapsulated layer of the multiple pixels and the multiple pixel of encapsulation of pcb board, array in a plate face of the pcb board, each pixel includes an at least LED chip, crisscross groove is offered on the encapsulated layer, the encapsulated layer is divided into the lens section at multiple intervals, and two pixels of groove interval arbitrary neighborhood by the groove；Each lens section corresponds to a pixel and sets, and the corner round and smoothization processing of each lens section.The utility model LED encapsulation structure improves crashworthiness, and the corner for avoiding lens section is easily wounded and causes the phenomenon of local shedding.
Description
Technical field
It the utility model is related to LED technology field, more particularly to a kind of LED encapsulation structure and display device.
Background technology
COB (Chip on Board, chip on board) packaging technology refers to LED chip being directly installed on pcb board, so
The encapsulated layer for covering all LED chips is molded on pcb board afterwards.Since encapsulated layer is in block structure, crashworthiness is poor, edge
Easily it is subject to environmental damage.
Utility model content
The main purpose of the utility model is that provide a kind of LED encapsulation structure, it is intended to improve crashworthiness, avoid corner
Place is impaired.
To achieve the above object, the utility model provides a kind of LED encapsulation structure, including pcb board, array arranged on described
The encapsulated layer of multiple pixels and the multiple pixel of encapsulation in one plate face of pcb board, each pixel are included at least
One LED chip, offers crisscross groove on the encapsulated layer, the encapsulated layer is divided into multiple intervals by the groove
Lens section, and two pixels of groove interval arbitrary neighborhood；Each lens section corresponds to a pixel
Point is set, and the corner round and smoothization processing of each lens section.
Preferably, each lens section is in round table-like, billiard table shape, spherical crown shape, prism-frustum-shaped or cube.
Preferably, the depth of the groove is D, and the thickness of the encapsulated layer is H, wherein, 0.6H≤D ＜ H.
Preferably, the flute surfaces are equipped with light blocking layer.
Preferably, the top of each lens section has a flat top surface, the flat top surface roughening processing.
Preferably, the pcb board includes plate body and array is arranged on multiple solid welding zone domains in a plate face of the plate body,
Each solid welding zone domain includes the first pole pad of cross direction profiles, die bond pad and the second pole pad successively, first pole
Pad is copolar pad, and second pole pad includes the first pad and the second pad of longitudinally spaced distributions；Longitudinally adjacent
First pad in two solid welding zone domains is electrically connected by the first cabling, the second pad is electrically connected by the second cabling；
The plate body further includes a routing layer, and first cabling and the second cabling be formed on the routing layer, it is described solid to be respectively positioned on
The side of brilliant pad and the side for being located at second pole pad respectively.
Preferably, the die bond pad includes spaced two parts.
Preferably, the pcb board includes plate body and waterproof layer, wherein, the plate body have the first plate face, the second plate face with
And the side of connection first plate face and the second plate face, the waterproof layer cover the side.
Preferably, each pixel includes a red light chips, a green light chip and a blue chip.
In addition, to achieve the above object, the utility model also provides a kind of display device, including mounting structure and installing
In the LED encapsulation structure of the mounting structure, the LED encapsulation structure is LED encapsulation structure as described above.
Encapsulated layer is divided into the saturating of multiple intervals by technical solutions of the utility model by opening up groove on encapsulated layer
Mirror portion, and the corner round and smoothization processing of each lens section, so as to improve crashworthiness, avoid the corner of lens section easily quilt
Wound and cause the phenomenon of local shedding.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to the structure shown in these attached drawings.
Fig. 1 is the top view of one embodiment of the utility model LED encapsulation structure；
Fig. 2 is sectional view of the LED encapsulation structure along line A-A in Fig. 1；
Fig. 3 is the structure diagram of the pcb board of LED encapsulation structure in Fig. 1；
Fig. 4 is the sectional view of another embodiment of the utility model LED encapsulation structure.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise
Lower all other embodiments obtained, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each component, motion conditions etc., such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, and it cannot be managed in the utility model such as relating to the description of " first ", " second " etc. is only used for description purpose
Solve to indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " the
One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the skill between each embodiment
Art scheme can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when technical solution
It will be understood that the combination of this technical solution is not present with reference to there is conflicting or can not realize when, also not in the utility model
It is required that protection domain within.
The utility model provides a kind of LED encapsulation structure, refer to Fig. 1 to Fig. 3, in one embodiment, LED encapsulation knots
Structure includes the encapsulated layer of the multiple pixels 2 and the multiple pixels 2 of encapsulation of pcb board 1, array in a plate face of pcb board 1
3, each pixel 2 includes an at least LED chip.Crisscross groove 30 is offered on the encapsulated layer 3, groove 30 will encapsulate
Layer 3 is divided into the lens section 32 at multiple intervals, and groove 30 is spaced two pixels 2 of arbitrary neighborhood.Each lens section 32 is right
A pixel 2 is answered to set, and the corner round and smoothization processing of each lens section 32.
The present embodiment LED encapsulation structure is spaced two of arbitrary neighborhood by opening up groove 30, groove 30 on encapsulated layer 3
Pixel 2, the groove 30 can effectively prevent that optical crosstalk, raising light efficiency occurs between two adjacent pixels 2；Meanwhile groove
Encapsulated layer 3 is divided into multiple lens sections 32 by 30, and corner round and smoothization of each lens section 32 is handled, and avoids the side of lens section 32
Angle easily wounds and causes the phenomenon of local shedding, improves crashworthiness.
It should be noted that in the present embodiment, the cavity design one of injection mold can be passed through in injection molding encapsulated layer 3
And be molded the groove 30, can also first molded package layer 3, be then cut into type groove 30；Lens section 32 is to be surrounded by groove 30
Isolated portions, be only limitted to the part of the slot bottom of prominent groove 30；Moreover, the corner of each lens section 32 include all sides and
All angles；Round and smoothization processing can be radiused, curved or rounding processing, and is not limited to situation about enumerating.
In the present embodiment, further, each lens section 32 is in round table-like, as shown in Figure 2.
Since each lens section 32 is in round estrade, its bottom is big, and top is small, is conducive to anticollision, prevents that the effect of optical crosstalk is good,
And light distribution effect is good.However, in the other embodiment of the utility model, each lens section 32 can also be billiard table shape, spherical crown
Shape, prism-frustum-shaped or cube, but situation about enumerating is not limited to, when each lens section 32 is spherical crown shape, its anti-collision effect is best；When
When each lens section 32 is mesa-shaped body, its bottom is big, and top is small；Alternatively, its bottom is small, top is big.
In the present embodiment, further, the depth of groove 30 is D, and the thickness of encapsulated layer 3 is H, wherein, 0.6H≤D ＜
H。
In the value range, the depth of groove 30 can not only ensure good anti-optical crosstalk effect, but also can ensure good
Packaging effect.Preferably, the depth D=0.6H of groove 30.
Fig. 1 is refer to, in the present embodiment, further, each pixel 2 includes a red light chips, a green light chip
With a blue chip.
Since each pixel 2 has tri- color chips of RGB, and then the present embodiment LED encapsulation structure can realize full-color hair
Light, in the present embodiment, tri- color chips of RGB are positive cartridge chip, bonding wire and pad structure not shown in Fig. 1.However, at this
In the other embodiment of utility model, tri- color chips of RGB can be flip-chip.
Fig. 3 is refer to, in the present embodiment, further, pcb board 1 includes plate body 10 and array is arranged on plate body 10
Multiple solid welding zone domain (non-labels) in one plate face, each solid welding zone domain include the first pole pad 12 of cross direction profiles, solid successively
Brilliant 14 and second pole pad 16 of pad, the first pole pad 12 are copolar pad, and the second pole pad 16 includes longitudinally spaced distributions
First pad 160 and the second pad 162.First pad 160 in the solid welding zone domain of longitudinally adjacent two passes through the electricity of the first cabling 18
Property connection, the second pad 162 is electrically connected by the second cabling 19.Plate body 10 further includes a routing layer, the first cabling 18 and
Two cablings 19 are formed on routing layer, are respectively positioned on the side of die bond pad 14 and are located at the side of the second pole pad 16 respectively.
By setting the first cabling 18 and the second cabling 19 to be located at the side of the second pole pad 16, i.e. the first cabling 18 respectively
It is located at the opposite side of the second pole pad 16, and then the first cabling 18 and positioned at the side of the second pole pad 16 and the second cabling 19
Two cablings 19 can be located on same routing layer and avoid the situation for intersecting short circuit, so as to reduce flaggy, reduce thickness of slab,
And save cost.
In the present embodiment, further, the first pole pad 12 is that positive terminal pad, the second pole pad 16 weld for anode altogether
Disk.
In the present embodiment, further, die bond pad 14 includes spaced two parts.
The die bond pad 14 in each solid welding zone domain includes the two parts being spaced apart on longitudinal direction, i.e. 140 He of Part I
Part II 142.When in 140 die bond red light chips of Part I and in 142 die bond green light chip of Part II and blue chip
When, since Part I 140 and Part II 142 are spaced, and then will not for the elargol of the red light chips of die bond vertical stratification
On salivation to other pads, and avoid polluting the situation of other pads and chip.
Specifically, red light chips, green light chip and blue chip are longitudinally arranged successively, the red light chips die bond of vertical stratification
In Part I 140, its cathode is electrically connected by bonding wire and the first pole pad 12.Green light chip and blue chip die bond are in
Two parts 142, the cathode of green light chip are electrically connected by bonding wire and the first pole pad 12, and anode passes through bonding wire and the first pad
160 are electrically connected；The cathode of blue chip is electrically connected by bonding wire and the first pole pad 12, and anode is welded by bonding wire and second
Disk 162 is electrically connected.
In the present embodiment, further, pcb board 1 includes plate body 10 and waterproof layer (not shown), wherein, plate body 10 has
There are the first plate face, the second plate face and the side of the first plate face of connection and the second plate face, waterproof layer covering side.
The side of the plate body 10 of pcb board 1 is covered with waterproof layer, and then the waterproof layer can effectively prevent steam from edges of boards
Penetrate into, improve the waterproof and dampproof performance of pcb board 1, enhance the stability of pcb board 1, it also avoid pcb board 1 and led because making moist
The short circuit of cause or the situation of plate bursting.
Fig. 4 is refer to, Fig. 4 is the sectional view of another embodiment of the utility model LED encapsulation structure.The present embodiment is above-mentioned
On the basis of embodiment, following improvement has been made：
In the present embodiment, further, 30 surface of groove is equipped with light blocking layer 4.
The surface that light blocking layer 4 is arranged on groove 30 can further improve the effect of anti-optical crosstalk, which can be oil
Layer of ink or foil layer, have the excellent effect that is in the light, while can improve the luminance contrast of LED encapsulation structure.
In the present embodiment, further, the top of each lens section 32 has a flat top surface 320, and flat top surface 320 is coarse
Change is handled.
The processing of 320 roughening of flat top surface can improve the mirror-reflection phenomenon of encapsulated layer 3, make to project in flat top surface 320
Light diffusing reflection occurs, realize matte effect, improve optical quality.
In the present embodiment, further, the roughness of flat top surface 320 is 0.2~0.24 μm.
The utility model also provides a kind of display device, incorporated by reference to Fig. 1 to Fig. 4, in one embodiment, the display device bag
Include mounting structure and be installed in the LED encapsulation structure of mounting structure, the concrete structure of the LED encapsulation structure is with reference to above-mentioned implementation
Example, since the display device of the present embodiment employs whole technical solutions of above-mentioned all embodiments, equally has above-mentioned
All beneficial effects caused by the technical solution of embodiment, this is no longer going to repeat them.
It should be noted that the display device include but not limited to LED display modules, LED display, LED mosaic screens with
And LED floor tile screens.By taking LED display modules as an example, which is housing, and then LED encapsulation structure is installed among housing.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
It is every under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
Change, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of LED encapsulation structure, including pcb board, array are arranged on the multiple pixels and envelope in a plate face of the pcb board
The encapsulated layer of the multiple pixel is filled, each pixel includes an at least LED chip, it is characterised in that
Crisscross groove is offered on the encapsulated layer, the encapsulated layer is divided into the lens at multiple intervals by the groove
Portion, and two pixels of groove interval arbitrary neighborhood；
Each lens section corresponds to a pixel and sets, and the corner round and smoothization processing of each lens section.
2. LED encapsulation structure as claimed in claim 1, it is characterised in that each lens section in round table-like, billiard table shape,
Spherical crown shape, prism-frustum-shaped or cube.
3. LED encapsulation structure as claimed in claim 1, it is characterised in that the depth of the groove is D, the encapsulated layer
Thickness is H, wherein, 0.6H≤D ＜ H.
4. LED encapsulation structure as claimed in claim 1, it is characterised in that the flute surfaces are equipped with light blocking layer.
5. the LED encapsulation structure as described in Claims 1-4 any one, it is characterised in that the top of each lens section
With a flat top surface, the flat top surface roughening processing.
6. LED encapsulation structure as claimed in claim 1, it is characterised in that the pcb board includes plate body and array is arranged on institute
State multiple solid welding zone domains in a plate face of plate body, each solid welding zone domain include successively the first pole pad of cross direction profiles,
Die bond pad and the second pole pad, first pole pad are copolar pad, and second pole pad includes longitudinally spaced distributions
The first pad and the second pad；
First pad in two longitudinally adjacent solid welding zone domains is electrically connected by the first cabling, the second pad passes through second
Cabling is electrically connected；
The plate body further includes a routing layer, and first cabling and the second cabling are formed on the routing layer, are respectively positioned on institute
State the side of die bond pad and be located at the side of second pole pad respectively.
7. LED encapsulation structure as claimed in claim 6, it is characterised in that the die bond pad includes spaced two
Point.
8. LED encapsulation structure as claimed in claim 1, it is characterised in that the pcb board includes plate body and waterproof layer, wherein,
The plate body has the first plate face, the second plate face and the side of connection first plate face and the second plate face, the waterproof layer
Cover the side.
9. LED encapsulation structure as claimed in claim 1, it is characterised in that each pixel includes a red light chips, one
Green light chip and a blue chip.
10. a kind of display device, including mounting structure and the LED encapsulation structure for being installed in the mounting structure, the LED envelopes
Assembling structure is the LED encapsulation structure described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721274859.7U CN207338372U (en) | 2017-09-30 | 2017-09-30 | LED encapsulation structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721274859.7U CN207338372U (en) | 2017-09-30 | 2017-09-30 | LED encapsulation structure and display device |
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| Publication Number | Publication Date |
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| CN207338372U true CN207338372U (en) | 2018-05-08 |
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| CN201721274859.7U Active CN207338372U (en) | 2017-09-30 | 2017-09-30 | LED encapsulation structure and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
-
2017
- 2017-09-30 CN CN201721274859.7U patent/CN207338372U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
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