CN207294591U - Sensing system for electronic device - Google Patents

Abstract

The utility model discloses a kind of sensing system (10) for electronic device, it includes sensor (18) and hierarchy, which has at least two layers (12.1 12.3) made of thin glass.If at least one in the layer (12.1 12.3) has hole (14.1,14.2), the hole (14.1,14.2) is through hole in each case.The sensor (18) is arranged in the hole (14.1,14.2) or the lower section of the lowermost surface of the hierarchy.

Description

Sensing system for electronic device

Technical field

The sensing system for electronic device is the utility model is related to, and is related to the electronics comprising the sensing system Device.

Background technology

Fingerprint sensing technology plays booster action in living things feature recognition and authentication processing.In general, fingerprint can be with For uniquely identifying individual in a manner of it easily can not replicate or copy.This outstanding recognition capability is such as being enforced the law Very big effect is obtained with fields such as information securities.

Although the authentication techniques based on fingerprint are not yet in a wide range of interior replacement user name and cipher authentication, Internet user More and more sensitive informations of the information systems such as smart phone are entrusted to exacerbate for than the skill based on password The demand of the more reliable authentication procedure of art.

However, fingerprint sensing technology is a wide range of using with some obstacles.One of these obstacles are to need to be embedded in Or the reliable medium of fingerprint sensor (FPS) is received, which is expected to high reliability, flexibility and optical quality, prevents The medium of water and low material and manufacture cost.

Such FPS embedding mediums are commonly used, it is made of the transparent panel of glass, ceramics or plastic manufacturing, should Plate has the blind hole received or accommodate FPS.However, higher compared to the plate with through hole, the manufacture cost of the plate with blind hole And durability is relatively low.

Utility model content

Aiming at for the utility model overcomes the above problem, and offer has high-durability and stability and low manufacture The sensor of cost is embedded and/or protects medium.

The target is realized by such as the equipment defined in independent claims.Define in the dependent claims specific Embodiment.

According on one side, a kind of sensing system for electronic device the utility model is related to.The sensor system System can include sensor and stacked hierarchy, and the stacked hierarchy is with by thin glass or such as sapphire, transparent At least two layers made of the other materials such as ceramics or combination of different materials.The hierarchy is sandwich construction.One layer Or the glass of each layer is chemically toughened glass either chemical tempering flexible glass or other inorganic non-metallic materials, and One layer or each layer have ion exchange layer；

At least one in the layer of the hierarchy has hole, which is through hole in each case.The sensing Device can be arranged in the hole, or be arranged in the lower section of the lowermost surface of the stacked hierarchy.

According on the other hand, a kind of sensing system for electronic device is the utility model is related to, it includes sensor With the stacked hierarchy with least two layers made of thin glass, wherein the sensing system is in the stacked layering The lower section of the lowermost surface of structure.In the stacked hierarchy, do not provide and the relevant hole of sensor.Alternatively, exist Hole is not provided in the hierarchy.

Herein, term " lower section " is the viewpoint on being in the outside of the sensing system of the electronic device And specify, therefore the position of the lower section of a layer is understood to close to the outer of the sensing system with the electronic device The opposite layer surface in portion.Similarly, the position of the top of a layer is understood to close to the biography towards the electronic device The layer surface of the outside of sensor system.

Preferably, stacked film is arranged between two adjacent layers, which produces particularly by from corresponding glassy layer Give birth to the lamination treatment of the stacked hierarchy and obtain.

Advantageously, the stacked hierarchy has the intensity or stabilization of higher compared with the plate made of single glass layer Property.Meanwhile the layer of the hierarchy can be by thin glass or very thin glass is made, so that the hierarchy can be Thin and flexible, without having any impact to integral strength or stability.It should be noted that the stacked hierarchy can be by thin Or very thin glass, the combination of glass ceramics, sapphire, PMMA or different thin transparent materials are formed.

Preferably, term " thin " refer to have less than 350 μm, preferably less than 330 μm, even more preferably less than 300 μm, very To the layer, piece or paper tinsel of even more preferably less than 280 μm of thickness.Term " very thin " refer to have less than 100 μm, particularly preferably Layer, piece or the paper tinsel of thickness less than 75 μm, 50 μm, 30 μm, 15 μm, 10 μm or 3 μm.Included in the stacked hierarchy Glassy layer or each layer, piece or paper tinsel most preferably have 5,10,15,25,30,35,50,55,70,75,80,100,120, 130th, 145,150,160,180,210,250,280 or 300 μm of thickness.

One layer or each layer are designed to flexibility and/or deformable.Therefore, the hierarchy can be favourable Ground keeps the flexibility and/or deformability of the layer formed.Compared to the thickness similar to the gross thickness of the hierarchy Single glass layer made of plate, the flexibility and/or deformability of the hierarchy are comparable or higher.

It can be advantageous to one hole or multiple holes are formed before being laminated to the hierarchy.Compared to Blind hole is produced in thin glass sheet, the complexity of the processing of generation through hole is relatively low in such layer or piece, and needs complexity Spend relatively low and relatively inexpensive manufacture device.This allows to reduce manufacture cost.

Stacked film can also have hole.The hole is through hole in each case, which preferably ties to the layering Structure is formed before being laminated.It can be formed by using the stacked film of the punching before being laminated to the hierarchy The hole.This means the hole is pre-punched hole.Alternatively, laminating adhesive can be applied to the glassy layer of perforation, so that in glass Adhesive or stacked film are not present at the position in the hole of glass layer.

Compared to plate or single layer structure with blind hole, the durability and stability with the thin glass sheet of through hole significantly change It is kind.In addition, the use of hierarchy extraly improve durability of the structure compared with the single layer structures such as sheet glass and Stability.

If the second layer of the first layer of the hierarchy with hole and the hierarchy is with hole, first layer Hole and the hole of the second layer can be concentric, or can at least have overlapping region.The sensor can be arranged in institute In the hole for stating first layer or the second layer.

Preferably, the sensor is designed to fingerprint sensor (FPS).Alternatively, the sensor can be that light passes Sensor or feeler.

In the hierarchy, the superiors are designed to cap layer, and orlop is designed to bottom cover layer.It is most upper The region of the user interface overlapping with the sensor can be labeled as active region in layer.Therefore, the sensor can be designed For perceiving sensing effect or activation effect when user touches the active region.

Preferably, the hierarchy includes two layers made of thin glass, and the layer is separated by stacked film.

The sensing system in the electronic devices such as cell phone, smart phone or portable computer for making With, especially in the display of the electronic device using particularly advantageous.When arranging the biography in the hole of the bottom During sensor (preferably, FPS), wherein internal stretch or arrangement of the bottom in the electronic device, it is ensured that the sensor pin Enough protections are subject to the impact from the outside of the electronic device.Therefore, the sensing system is arranged to select From for touch screens, display screen, cell phone, smart phone, portable computer, television set, mirror, window, aviation window, furniture with And the purposes of the protective film of white domestic appliances, or for the purposes in electronic locking device or authentication device.

The sensing system-preferably have and be designed to the sensor of FPS-be also advantageously used in for door, Automobile or any other the device or system of safety and user-friendly certification are required before device or system is allowed access into Locking device in purposes.

The hole can be arranged in any layer of the hierarchy, and can be extended across two or several layers. Accordingly, if by the sensor arrangement in such hole, the sensor can have allow the sensor cross-layer A part or across a layer or across several layers extension height or thickness.

Preferably, the stacked hierarchy includes two layers made of thin glass.

Arrange that the sensor (preferably FPS) provides in the hole of the hierarchy to make it possible to from the electronics Realize the option of key function in the outside of device.Such key function is often realized in smart phone by homepage key.

Multiple embodiments are feasible, and are covered by this sensing system.Hereinafter, several examples are introduced.

Example 1

Sensing system includes the double-layer structure of lamination.Top layer can be labeled with the hole or the region of FPS area overlappings The region can be pressed or push for pressing region or homepage key range, user with its finger.Press the homepage key range With at least two effects：

- it causes FPS in the hole in the bottom to sense the fingerprint of user, so that authentication processing is performed, and

- it causes elastic displacement or the bending of cap layer, the displacement realizes user in pressing homepage in smart phone Known homepage effect during key.

Example 2

Sensing system includes the three-decker of lamination, and wherein top layer has the hole overlapping with the hole in the second layer.It is described Homepage key can be received or accommodated in hole in top layer, and FPS can be received or accommodated in the hole in the layer below top layer.User can be with The homepage key is pressed or pushed with its finger, so as to cause

- FPS senses the fingerprint of user and in then execution authentication processing, and

The elastic displacement of the flexible glass of-top layer, to realize the specific homepage effect in smart phone.

Example 3

Sensing system includes the three-decker of lamination, and wherein top layer has the hole overlapping with the hole in the second layer.On FPS The side region overlapping with FPS regions can be marked as homepage key range, and user can touch the homepage key range with its finger. User can navigate to its finger on the homepage key range, so as to touch the region and cause

- FPS senses the fingerprint of user and in then execution authentication processing, and

- authentication processing described in successful execution is based on, specific homepage effect is realized in smart phone.

The sensor-especially FPS-can be preferably implemented as condenser type voltage sensitive sensor, or alternatively real It is now optical sensor, heat sensor or voltage sensitive sensor.For capacitance type sensor, what the layer has Kind of transparency or the layer are transparent or opaque all inessential.This characteristic contributes to manufacture processing and glass material The selection of material, and allow to reduce manufacture cost.

According to another aspect, a kind of electronic device for including sensing system as described above the utility model is related to.

It is related to the description of condenser type FPS-wherein mainly contributed to by cap layer and its material in fingerprint sensing below It manage-can be applicable to other layers of hierarchy.

The cap layer is made of such material：The material is electricity Jie for covering the conductive structures on a site Matter.The each several part of conductive structure and the finger tip for being placed on outer site forms multiple small capacitances, and is formed and contacted with capacitor. The signal detected is to flow through small electric pressure differential deltap U caused by the different skin part of finger tip in low current.The voltage difference by Caused by the different impedances of convex ridge (Low ESR of water) and trench (high impedance of air).

The impedance for reducing cap material is the effective means for the resolution ratio and sensitivity for strengthening FPS.Impedance and sensor The per unit area capacitance of cap material is inversely proportional.Therefore, the sensitivity of sensor and resolution ratio are dependent on the sensor The per unit area capacitance of cap material, and this depends on the permittivity ε ' and thickness of covering material.Permittivity ε ' more High and thick degree is lower, and per unit area capacitance is higher.

In this example, cap material has at least 0.15pF/mm²Per unit area capacitance.Preferably, cap material With at least 0.2pF/mm²Or at least 0.3pF/mm²Or at least 0.5pF/mm²Or at least 0.7pF/mm²Or at least 1.0pF/ mm²Or at least 1.2pF/mm²Or at least 1.5pF/mm²Or at least 1.9pF/mm²Or at least 2.0pF/mm²Or at least 2.5pF/mm²Or at least 3.5pF/mm²Or at least 4.5pF/mm²Or at least 5.0pF/mm²Or at least 10pF/mm²Or at least 20pF/mm²Or at least 50pF/mm²Or at least 100pF/mm²Per unit area capacitance.However, per unit area capacitance Amount also should not be excessive.Therefore, the per unit area capacitance of covering material is preferably no more than for 200pF/mm²。

The high-capacitance of per unit area can be realized by the high-k and/or low thickness of cap material.

Preferably, cap material have be at least 5, even more desirably at least 6, even more desirably at least 6.5, more preferably At least 7, be even more desirably at least 8, even more desirably at least 10, even more desirably at least 12, even more desirably at least 15, more Preferably at least 20, be even more desirably at least 50, even more desirably at least 100, even more desirably at least 200, more preferably At least 500 dielectric constant.Dielectric constant can be according to DIN EN 62631-1:2012-03 is measured.

Preferably, cap material have less than 350 μm, preferably less than 100 μm, particularly preferably be less than 50 μm, 15 μm, 10 μm or 3 μm of thickness.Glassy layer, piece or paper tinsel included in stacked hierarchy most preferably have 5,10,15,25,30, 35th, 50,55,70,80,100,130,145,160,210 or 280 μm of thickness.However, thickness should not be too low, reason is to push up Cover material may rupture.Therefore, thickness is preferably at least 1 μm, even more desirably at least 2 μm, even more desirably at least 5 μ m。

Preferably, loss angle tangent (tan δ) of the cap material under 1MHz frequencies is at most 25x10^-3, more preferably extremely More 10x10^-3, more preferably up to 5x10^-3, more preferably up to 2x10^-3, more preferably up to 1x10^-3, more preferably up to 0.9x10^-3, more preferably up to 0.8x10^-3, more preferably up to 0.7x10^-3, more preferably up to 0.5x10^-3.Excessive damage Consumption angle tangent will equalize voltage difference, and will reduce the resolution ratio of fingerprint sensor.Loss angle tangent can be together with Dielectric constant is measured by standard dielectric spectrum.

In a preferred embodiment, cap material is transparent.It is transparent to refer under 500 μ m thicks in visible-range Transmissivity is at least 80%.When using capping of the transparent cap material as fingerprint sensor, the transparent cap material makes It is combined to obtain the variable visual clue provided in the finger-print region of fingerprint sensing function and device.Come from further, it is also possible to detect The visual information of user, the identity of user is confirmed will pass through additional independent solution.

Preferably, cap material have be at least 1.47, even more desirably at least 1.52, even more desirably at least 1.55, Even more desirably at least 1.59, be even more desirably at least 1.65, even more desirably at least 1.69, even more desirably at least 1.74, Even more desirably at least 1.79, be even more desirably at least 1.84, even more desirably at least 1.89, even more desirably at least 1.94, Even more desirably at least 1.99, it is even more desirably at least 2.04 refractive index.

Preferably, cap material have be at least 20, even more desirably at least 25, even more desirably at least 30, more preferably Ground is at least 40, is even more desirably at least 50, even more desirably at least 55 Abbe number.

Preferably, cap material have be at least 400, even more desirably at least 500, even more desirably at least 550, more Preferably at least 600, be even more desirably at least 650, even more desirably at least 700, even more desirably at least 800 Knoop it is hard Spend (HK_01/20).High Knoop hardness is favourable, and reason is cap material more resistant to mechanical stress, and more resistant to scraping.

In Knoop hardness test, measure with the power of restriction and time the depth of cup separately diamond being pressed against on material Degree.Angle of the diamond surface with 172.5 ° and 130.0 ° of restriction.During diamond is pressed into glass plate, hair Raw elasticity and plasticity deformation.The size of residual indentation depends on the hardness of material, and this is provided by chemical composition.Knoop hardness can Using the following formula, it is calculated by the Diagonal Dimension d of impression：

HK=1.4233x F/d²。

ISO 9385:1990 standards describe the process of measurement for glass.It is (corresponding for 0.9807N according to the standard In 0.1kp) test force and Validity Test time of 20s provide Knoop hardness HK.Test is at room temperature on polished glass surface Upper progress.Hardness Value Data is rounded to 10HK_0.1/20.Microhardness is the function of the size of test force, and is increased with gradual Big test force and reduce.

Preferably, cap material, which has, is at least 60x10³N/mm², even more desirably at least 70x10³N/mm², more preferably Ground is at least 80x10³N/mm², even more desirably at least 90x10³N/mm²Elasticity modulus.However, elasticity modulus should not be excessive. Therefore, the elasticity modulus that cap material has is preferably 200x10³N/mm², be more preferably up to 165x10³N/mm², more Preferably no more than for 150x10³N/mm², be more preferably up to 120x10³N/mm², be more preferably up to 110x10³N/mm²。

Preferably, cap material have be at least 0.15, even more desirably at least 0.16, even more desirably at least 0.17, Even more desirably at least 0.18, it is even more desirably at least 0.19, even more desirably at least 0.20 Poisson's ratio μ.

Preferably, at least one surface of cap material has less than 2nm, is even more preferably less than 1.5nm, more preferably small In the roughness Ra of 1nm.Roughness can be measured by atomic force microscopy.

Preferably, it is at most 11 х 10 that cap material, which has,^-6/ K, be more preferably up to 8 х 10^-6/ K, more preferably extremely Mostly 7 х 10^-6/ K, be more preferably up to 6 х 10^-6/ K, be more preferably up to 5 х 10^-6The thermal coefficient of expansion (CTE) of/K. Preferably, cap material, which has, is at least 2 х 10^-6/ K, even more desirably at least 2.5 х 10^-6/ K, even more desirably at least 2.8 х10^-6The thermal coefficient of expansion (CTE) of/K.When for example using cap material as the cover member of fingerprint sensor, above-mentioned value Be conducive to CTE being adjusted to the CTE of following structure.

Preferably, it is at most ± 20 μm that glass, which has, is more preferably up to ± 15 μm, is more preferably up to ± 10 μm Thickness change.

Cap material can be used among a variety of devices, or the part of the component as device or component, including but not It is limited to smart phone, portable computer, computer wrist-watch, tablet PC, game device, television set, personal computer, logical Letter system, domestic automation system, automobile safety system, 3D imaging systems, gestural control system, touch sensor, fingerprint pass Sensor, diagnostic system, interactive display, 3D sensing systems, household electrical appliance, display device, iris authentication system etc..Therefore, Component can include but is not limited to：Light is electrically interposed in part, hull cell, illuminating device (particularly OLED or back light unit), PCB Or other electrical connections devices, electronic passive component (particularly capacitor), lid camera lens, protective layer and/or MEMS/MOEMS.

It is particularly preferred that cap material is used as the cover member in fingerprint sensor.

Advantageously, cap material has good mechanical stability, resistance to sudden heating and/or scratch resistance, particularly when this It is particularly true that cap material is used as situation during the cover member of fingerprint sensor arrangement.Therefore, cap material preferably can It is chemical and/or hot tempering or chemical and/or hot tempering.It is highly preferred that cap material is chemically tempering, or Person's chemical tempering.Preferably, when cap material by one or more tempering steps in NaNO₃、KNO₃Or different alkali metal salts In the mixture of bath during chemical tempering, ion exchange layer have at least 1 μm, more preferably at least 2 μm, more preferably at least 5 μm, More preferably at least 10 μm, more preferably at least 20 μm, more preferably at least 30 μm, more preferably at least 50 μm of thickness.Glass The ion exchange layer of glass layer has 50%, 40% or 30% layer depth DoL of the thickness equal to or less than the glassy layer.

Preferably, center tension be at most 600MPa, more preferably up to 500MPa, more preferably up to 400MPa, More preferably up to 300MPa, more preferably up to 200MPa, more preferably up to 150MPa, more preferably up to 120MPa, More preferably up to 100MPa, more preferably up to 80MPa.

In principle, it is possible to the component for being subordinated to different inorganic non-metallic materials obtains cap material.However, in some implementations In mode, cap material is borosilicate glass cap material or alumina silicate glass cap material.

Currently-unless otherwise noted-" silicon " refers to Si⁴⁺, " boron " refers to B³⁺, " aluminium " refers to Al³⁺, " phosphorus " refers to P⁵⁺, " lithium " refers to Li⁺, " sodium " refers to Na⁺, " potassium " refers to K⁺, " magnesium " refers to Mg²⁺, " calcium " refers to Ca²⁺, " strontium " refers to Sr²⁺, " barium " is Refer to Ba²⁺, " zinc " refers to Zn²⁺, " titanium " refers to Ti⁴⁺, " zirconium " refers to Zr⁴⁺, " hafnium " refers to Hf⁴⁺, " lanthanum " refers to La³⁺, " gadolinium " refers to Gd³⁺, " yttrium " refers to Y³⁺, " tantalum " refers to Ta⁵⁺, " niobium " refers to Nb⁵⁺, " tungsten " refers to W⁶⁺, " arsenic " refers to As³⁺With As⁵⁺The sum of, " antimony " Refer to Sb³⁺With Sb⁵⁺The sum of, " iron " refers to Fe³⁺With Fe⁴⁺The sum of, " cerium " refers to Ce³⁺With Ce⁴⁺The sum of, " tin " refers to Sn²⁺With Sn^{4 +}The sum of, and " sulphur " is related to the total amount of the sulphur of its all valence states and degree of oxidation.

Unless otherwise stated, Network former refers to the cation selected from the group being made of silicon, boron, aluminium and phosphorus, R⁺ Refer to the cation selected from the group being made of lithium, sodium and potassium, R²⁺Refer to the sun selected from the group that is made of magnesium, calcium, strontium, barium and zinc from Son, and term " high dielectric component " refers to the cation selected from the group being made of titanium, zirconium, hafnium, lanthanum, gadolinium, yttrium, tantalum, niobium and tungsten.

The preferred component of cap material is summarized below.Cap material generally comprises cationic components and anionic group.Top The component of cation will be provided with cation percent (cat.-%) in cover material, i.e. indicate that corresponding cation is opposite The molar ratio of cation integral molar quantity in component.It is preferably based on the integral molar quantity of cation in cap material, head cover material Material includes following components in terms of cat.-%：Network former：25 to 90cat.-%, lithium：0 to 25cat.-%, sodium：0 to 30cat.-%, potassium：0 to 15cat.-%, magnesium：0 to 10cat.-%, calcium：0 to 15cat.-%, strontium：0 to 10cat.-%, barium： 0 to 20cat.-%, zinc：0 to 17cat.-%, titanium：0 to 30cat.-%, zirconium：0 to 7cat.-%, hafnium：0 to 2cat.-%, Lanthanum：0 to 35cat.-%, gadolinium：0 to 6cat.-%, yttrium：0 to 6cat.-%, tantalum：0 to 5cat.-%, niobium：0 to 42cat.-%, Tungsten：0 to 3cat.-%.In a preferred embodiment, the cation in cap material at least 95%, more preferably at least 97%th, by the cation composition described in previous list in most preferably at least 99% degree.In most preferred embodiment, Cationic components in cap material are substantially by above-mentioned cation composition.

As anionic group, cap material is preferably included selected from fluorine (F^-), oxygen (O^2-), chlorine (Cl^-) at least one Kind anion.It is highly preferred that the anion being present in cap material include oxygen up at least 95%, more preferably at least 97%, Most preferably at least 99% degree.In most preferred embodiment, the anionic group of cap material is made of oxygen substantially.

Term as used herein " " refers to without X " and that respectively preferably cap material is not wrapped substantially without component X " Containing the component X, i.e. such component can at most be present in cap material as impurity or pollution, and be not intended as list Only component is added to glass ingredient.It means that not with significant quantity addO-on therapy X.Non-significant amount is less than 100pp, preferably Less than 50ppm and the more preferably less than amount of 10ppm.Therefore, " X " can refer to any component, such as lead cation or arsenic sun Ion.Preferably, glass as described herein is substantially free of any component not referred in this description.

As described above, Network former is selected from the group being made of silicon, boron, aluminium and phosphorus.In a preferred embodiment, network Form body and be selected from the group being made of silicon, boron and aluminium.It is highly preferred that Network former is selected from the group being made of silicon and boron.Optional In embodiment, Network former is phosphorus.

Preferably, cap material includes the silicon that ratio is 2 to 70cat.-%.Silicon is the critical network shape in glass matrix Adult, it is extremely important for glass property.Particularly, chemical resistance, hardness and scratch resistance of the silicon cation for cap material Property is particularly significant.In a preferred embodiment, cap material includes at least silicon of 5cat.-%, more preferably at least The silicon of the silicon of the silicon of 12cat.-%, more preferably at least 20cat.-%, more preferably at least 25cat.-%, and most preferably The ground at least silicon of 30cat.-%.However, excessive silicon cations may cause glass transformation temperature to increase, so that Glass production is uneconomical.It is therefore particularly preferred that the content of silicon cation is at most 65cat.-%, further preferably extremely Mostly 55cat.-%, be more preferably up to 45cat.-%, and is at most most preferably 40cat.-%.

In a preferred embodiment, in addition to silicon cation, cap material contains boron cation as Network former. Preferably, the content of boron is in 0 to 55cat.-% scope.By its network forming matter, boron cation is substantially supported to push up The stability of cover material.In the case where boron cations are too low, it can not ensure stability needed for glass system.Excellent Select in embodiment, cap material includes at least boron of 0.1cat.-%, the more preferably at least boron of 10cat.-%, more preferably The ground at least boron of 15cat.-%, and the most preferably at least boron of 20cat.-%.However, the content of boron cation in glass In the case of excessive, viscosity may substantially reduce, so that must receive the reduction of crystalline stability.It is therefore especially preferred that It is that the content of boron cation is at most 50cat.-%, is at most further preferably 40cat.-%, is more preferably up to 35cat.-%, and be at most most preferably 30cat.-%.

Preferably, in cap material, the summation of silicon cation and boron cation is 25 to 90cat.-%.Preferred real Apply in mode, the summation of silicon cation and boron cation in cap material is at least 30cat.-%, is even more desirably at least 35cat.-%, even more desirably at least 40cat.-%, and most preferably at least 50cat.-%.It is particularly preferred that top In cover material the summation of silicon cation and boron cation be at most 85cat.-%, be at most further preferably 80cat.-%, More preferably up to it is 75cat.-%, and is at most most preferably 72cat.-%.

It has been found that the temperature dependency of refractive index is influenced be subject to Network former aluminium, silicon and the boron in glass.Cause This, it is 0-16 that glass display, which goes out in glass the sum of cation percent of aluminium and boron relative to the ratio of the amount of silicon,.Preferably, should Ratio be from>0 to 5, more preferably from>0.25 to 2, most preferably from 0.3 to 1.

Preferably, aluminium cations are included with 0 to 20cat.-% ratio in cap material.The addition of aluminium cations is led Improved glass forming properties are caused, and generally support the improvement of chemical resistance.In a preferred embodiment, glass includes extremely The aluminium of few 0.1cat.-%, the more preferably at least aluminium of 1cat.-%, the more preferably at least aluminium of 2cat.-%, and most preferably The aluminium of ground 3cat.-%.However, excessive aluminium cations content causes the tendency increase of crystallization.It is therefore particularly preferred that aluminium The content of cation is at most 20cat.-%, is at most further preferably 18cat.-%, is at most further preferably 15cat.-%, be more preferably up to 10cat.-%, and is at most most preferably 8cat.-%.

In alternate embodiments, it is phosphorus that major networks, which form body,.In such embodiment, cap material can include Other Network formers of the amount of most 10cat.-%, particularly silicon, boron and/or aluminium.It is preferable, however, that in such implementation In mode, phosphorus is unique Network former.Preferably, in such embodiment, cap material include 25 to The phosphorus of the amount of 45cat.-%.Preferably, the amount of phosphorus is at least 27cat.-% in cap material, even more desirably at least 30cat.-%.In the case where phosphorus cations are too low, it can not ensure stability needed for glass system.However, phosphorus is positive The content of ion also should not be excessive.Preferably, the content of phosphorus is at most 40cat.-%, is more preferably up to 35cat.-%.

Glass preferably contains fluxing agent to improve melting behaviour, particularly comprising alkali metal cation and/or alkaline earth Metal cation.Preferably, the sum of fluxing agent ∑ { ∑ R²⁺(R=Mg, Ca, Sr, Ba, Zn)+∑ R '⁺(R '=Li, Na, K) } it is excellent Selection of land is 5 to 45cat.-%.In a preferred embodiment, the summation of the amount of fluxing agent is at least 5cat.-%, more excellent in glass Selection of land is at least 7cat.-%, even more desirably at least 12cat.-%, and most preferably at least 15cat.-%.If glass The amount of fluxing agent is excessive in glass, then chemical resistance will reduce.It is particularly preferred that the summation of fluxing agent is at most in glass 40cat.-%, be at most further preferably 35cat.-%, be more preferably up to 30cat.-%, and most preferably extremely Mostly 25cat.-%.

Alkali metal cation improves the meltability of glass, and therefore allows the production of economy.In addition, they are for allowing By ion-exchange treatment and to glass carry out it is chemical enhanced be required.In the production period of cap material, alkali metal sun from Son serves as fluxing agent.The summation of the amount of alkali metal cation lithium, sodium and potassium in glass is preferably 0 to 45cat.-%.Excellent Select in embodiment, the summation of alkali metal cation is at least 5cat.-%, even more desirably at least 7cat.-%, more preferably At least 10cat.-%, and most preferably at least 15cat.-%.If however, the too high levels of alkali metal cation, Then the weatherability of glass may be damaged, and therefore its application range may be limited strongly.It is therefore particularly preferred that alkali metal The summation of cation is at most 40cat.-%, is at most further preferably 35cat.-%, is more preferably up to 30cat.-%, and be at most most preferably 25cat.-%.

Preferably, lithium cation is included with 0 to 25cat.-% ratio in cap material.Lithium serves as fluxing agent, and Strengthening for ion exchange has excellent performance.Therefore, cap material preferably includes at least 1cat.%, more preferably extremely The lithium cation of few 5cat.-%.However, lithium largely influences the chemical stability of glass, therefore its content should be by To limitation.It is particularly preferred that the content of lithium cation is at most 20cat.-%, is at most further preferably 15cat.-%, be more preferably up to 10cat.-%.In addition, in preferable optional embodiment, by otheralkali metal sun Ion substitution lithium so that cap material includes the at most lithium of 1cat.-%, is more preferably even free of lithium cation.

Preferably, sodium cation is included with 0 to 30cat.-% ratio in glass.Sodium is for ion-exchange treatment A kind of good component.But-as all alkali metal ions-amount of the component should not be excessive, reason is its meeting Reduce chemical stability.In a preferred embodiment, glass includes at least sodium of 1cat.-%, more preferably at least 3cat.-% Sodium, the more preferably at least sodium of 5cat.-%, and the most preferably at least sodium of 8cat.-%.It is particularly preferred that sodium is positive The content of ion is at most 25cat.-%, is at most further preferably 22cat.-%, more preferably up to for 20cat.-%, and be at most most preferably 15cat.-%.

Preferably, potassium cationic is included with 0 to 15cat.-% ratio in glass.Compared to otheralkali metal ion, Negative effect of the potassium to chemical stability is smaller.However, potassium is not suitable for ion-exchange treatment.In addition, the content of potassium is preferably It is restricted, reason is that it includes beta-emitting isotope.In a preferred embodiment, cap material includes at least The potassium of the potassium of the potassium of 1cat.-%, more preferably at least 2cat.-%, more preferably at least 3cat.-%, and most preferably extremely The potassium of few 5.5cat.-%.It is particularly preferred that the content of potassium cationic is at most 15cat.-%, further preferably at most It is more preferably up to 12cat.-% for 13cat.-%.

It has been found that by using sodium and potassium at the same time in glass, and the ratio of sodium and potassium is maintained in terms of cat.-% , can be with the range of highest 10, more preferably highest 5, more preferably highest 4, preferably up to 3 and more preferably less than 2 Reduce the leaching tendency of glass.By the way that the ratio is kept relatively low, i.e. sodium is no more than a certain amount of the amount relative to potassium, is glass Glass provides good meltability and excellent chemical resistance and hydrolytic resistance.Specifically, such glass will be according to ISO 719:1989 have HGB1.However, in order to which the viscosity of melt is adjusted to desired value, the ratio of sodium and potassium should be more than 0.5, Preferably more than 0.8, and most preferably at least 1.0.

R²⁺Cation improves the meltability of glass, and thereby allows economical production.In the production process of cap material, it Serve as fluxing agent.R²⁺The summation of cation magnesium, calcium, strontium, barium and zinc in cap material is preferably 0 to 35cat.-%.When R in cap material²⁺When the amount of ion is excessive, the chemical resistance of cap material is affected.Therefore, R in cap material²⁺Ion Summation preferably no more than for 30cat.-%, be at most further preferably 25cat.-%, be more preferably up to 20cat.-%, and be at most most preferably 18cat.-%.However, R²⁺Cation can be used for the viscosity for adjusting glass, special It is not fine setting temperature-viscosity curve.In addition, R²⁺Cation-as alkali metal cation-it may be used as fluxing agent.Therefore, Cap material preferably with least 1cat.-%, more preferably at least 2cat.-%, more preferably at least 5cat.-%, more preferably The ground at least amount of 10cat.-% includes R²⁺Cation.

Preferably, magnesium cation is included with 0 to 10cat.-% ratio in glass.It is particularly preferred that magnesium cation Content be at most 8cat.-%, be more preferably up to 6cat.-%.In a preferred embodiment, glass is free of magnesium.

Preferably, calcium cation is included with 0 to 15cat.-% ratio in glass.It is particularly preferred that calcium cation Content be at most 8cat.-%, be at most further preferably 5cat.-%, be at most further preferably 3cat.-%. In preferred embodiment, glass not calcic.

Preferably, strontium cation is included with 0 to 10cat.-% ratio in glass.It is particularly preferred that strontium cation Content be at most 8cat.-%, be at most further preferably 5cat.-%, be at most further preferably 3cat.-%. In preferred embodiment, glass is free of strontium.

Preferably, barium cation is included with 0 to 23cat.-% ratio in glass.Barium is preferably used for adjusting viscosity Temperature dependency, and for increasing refractive index and dielectric constant.Preferably, the content of barium is at least in cap material 0.1cat.-%, even more desirably at least 1cat.-%, even more desirably at least 5cat.-%.However, the content of barium should not mistake It is high.Preferably, the content of barium cation is at most 22cat.-%, is more preferably up to 20cat.-%, more preferably up to For 15cat.-%, be at most further preferably 10cat.-%.In preferable optional embodiment, cap material includes extremely The barium cation of more 1cat.-%, more preferably not even baric.

Preferably, zinc cation is included with 0 to 17cat.-% ratio in glass.Zinc cation may be embodied in glass As additional fluxing agent in glass, and for targetedly adjusting fusing point.By adding network modified body zinc, can reduce The fusing point of glass.In a preferred embodiment, glass includes at least zinc of 1cat.-%, more preferably at least 2cat.-% The zinc of zinc, more preferably at least 5cat.-%.However, excessive zinc cation content may cause the fusing point of glass to reduce.It is special It is not preferably, the content of zinc cation is at most 15cat.-%, is at most further preferably 10cat.-%.

Preferably, titanium cation is included with 0 to 50cat.-% ratio in glass.To glass add titanium cation with Just its optical property is improved.Particularly, with the help of titanium is added, the refractive index of glass can targetedly be adjusted.Therefore, Refractive index increases with the gradual increased content of the titanium cation of glass.In a preferred embodiment, cap material includes At least titanium of 1cat.-%, the more preferably at least titanium of 2cat.-%, the more preferably at least titanium of 5cat.-%, and most preferably The ground at least titanium of 10cat.-%.However, excessive titanium cations may cause the undesirable crystallization of glass.Therefore, it is special It is not preferably, the content of titanium is at most 46cat.-%, is more preferably up to 30cat.-%, is more preferably up to 25cat.-%, be at most further preferably 20cat.-%.

Preferably, zirconium cation is included with 0 to 8cat.-% ratio in cap material.Zirconium cation can be used for adjusting The refractive index of whole glass.However, excessive zirconium cations may be decreased meltability, and it is particularly likely to cause glass more Strong crystallization.It is particularly preferred that the content of zirconium is at most 7cat.-%, is more preferably up to 5cat.-%, further excellent Selection of land is at most 2cat.-%, is more preferably up to 1cat.-%.In a preferred embodiment, glass is free of zirconium.

Preferably, hafnium cation is included with 0 to 2cat.-% ratio in cap material.Hafnium cation can be used for adjusting The refractive index of whole glass.However, excessive hafnium cations may be decreased meltability, and it is particularly likely to cause glass more Strong crystallization.It is particularly preferred that the content of hafnium is at most 1.5cat.-%, is at most further preferably 1cat.-%, more Preferably no more than for 0.5cat.-%.In a preferred embodiment, glass is free of hafnium.

Preferably, lanthanum cation is included with 0 to 35cat.-% ratio in cap material.Lanthanum cation can be used for Increase the dielectric constant of cap material.However, excessive lanthanum cations may be decreased meltability, and it is particularly likely to cause The stronger crystallization of glass.It is particularly preferred that the content of lanthanum is at most 20cat.-%, is at most further preferably 10cat.-%, be more preferably up to 5cat.-%, be more preferably up to 1cat.-%.In a preferred embodiment, glass Without lanthanum.

Preferably, gadolinium cation is included with 0 to 6cat.-% ratio in cap material.Gadolinium cation can be used for increasing The dielectric constant of big cap material.However, excessive gadolinium cations may be decreased meltability, and it is particularly likely to cause glass The stronger crystallization of glass.It is particularly preferred that the content of gadolinium is at most 2cat.-%, is at most further preferably 1cat.-%, be more preferably up to 0.1cat.-%.In a preferred embodiment, glass is free of gadolinium.

Preferably, yttrium cation is included with 0 to 6cat.-% ratio in cap material.Yttrium cation can be used for Increase the dielectric constant of cap material.However, excessive yttrium cations may be decreased meltability, and it is particularly likely to cause The stronger crystallization of glass.It is particularly preferred that the content of yttrium is at most 5cat.-%, is at most further preferably 2cat.-%, be more preferably up to 1cat.-%.In a preferred embodiment, glass is free of yttrium.

Preferably, tantalum cation is included with 0 to 5cat.-% ratio in cap material.Tantalum cation can be used for increasing The dielectric constant of big cap material.However, excessive tantalum cations may be decreased meltability, and it is particularly likely to cause glass The stronger crystallization of glass.It is particularly preferred that the content of tantalum is at most 4cat.-%, is at most further preferably 2cat.-%, be more preferably up to 1cat.-%.In a preferred embodiment, glass is free of tantalum.

Preferably, niobium cation is included with 0 to 42cat.-% ratio in cap material.Niobium cation can be used for Increase the dielectric constant of cap material.However, excessive niobium cations may be decreased meltability, and it is particularly likely to cause The stronger crystallization of glass.It is particularly preferred that the content of niobium is at most 15cat.-%, is at most further preferably 10cat.-%, be more preferably up to 5cat.-%.In a preferred embodiment, glass is free of niobium.

Preferably, tungsten cation is included with 0 to 3cat.-% ratio in cap material.Tungsten cation can be used for increasing The dielectric constant of big cap material.However, excessive tungsten cations may be decreased meltability, and it is particularly likely to cause glass The stronger crystallization of glass.It is particularly preferred that the content of tungsten is at most 2cat.-%, is at most further preferably 1cat.-%, be more preferably up to 0.1cat.-%.In a preferred embodiment, glass not tungstenic.

Glass can be with most 1cat.-%, more preferably up to 0.5cat.-%, more preferably up to 0.1cat.-% Amount include fining agent.Preferably, with the amount of at least 0.005cat.-%, more preferably 0.01cat.-% in cap material Include fining agent.Preferably, fining agent is selected from the group being made of antimony, arsenic and tin.It is highly preferred that fining agent is selected from by antimony and tin structure Into group.

Cap material can with most 0.5cat.-%, more preferably up to 0.3cat.-%, more preferably up to The amount of 0.2cat.-%, more preferably up to 0.1cat.-%, more preferably up to 0.005cat.-% include cerium.Cerium can be used In the irradiation stability of increase cap material.However, in a preferred embodiment, cap material is free of cerium.

High dielectric component can be used for the dielectric constant for increasing cap material.High dielectric component be selected from by titanium, zirconium, hafnium, The cation for the group that lanthanum, gadolinium, yttrium, tantalum, niobium and tungsten construct.However, high dielectric component reduces meltability, and it is particularly likely to cause The stronger crystallization of glass.Therefore, in a preferred embodiment, cap material includes at most 5cat.-%, more preferably up to The high dielectric component of 3cat.-%, even more preferably less than 1cat.-%.In such embodiment, preferably pass through head cover material The low-down thickness of material realizes higher per unit area capacitance.

However, in the alternative, integral molar quantity of the cap material based on cation in cap material, with Cat.-% meters include following components：25 to 75cat.-% Network former, 0 to 45cat.-% R '⁺, 0 to The R of 35cat.-%²⁺, 9 to 75cat.-% high dielectric component.Particularly preferred optional cap material component is based on cap material The integral molar quantity of middle cation, includes following components in terms of cat.-%：30 to 70cat.-% Network former, 5 to The R ' of 35cat.-%⁺, 5 to 30cat.-% R²⁺, 15 to 60cat.-% high dielectric component.In preferable optional embodiment party In formula, cation in cap material at least 95%, more preferably at least 97%, most preferably at least 99% degree by Cation composition described in previous list.In most preferred embodiment, the cationic components in cap material are substantially by upper State cation composition.

In order to increase the dielectric constant of cap material, high dielectric component can with least 9cat.-%, more preferably at least The amount of 15cat.-%, more preferably at least 20cat.-%, more preferably at least 30cat.-% are present in cap material.So And reduction and stronger crystallization due to meltability, the amount of high dielectric component should not be excessive.Preferably, the height in cap material The content of dielectric component is at most 75cat.-%, is more preferably up to 60cat.-%, is more preferably up to 50cat.-%, be more preferably up to 40cat.-%.

If selecting the remunerative rate of dielectric component and Network former, the high dielectric group of so high amount can be tolerated Point.Preferably, dielectric component (based on cat.-%) and the ratio of Network former (based on cat.-%) be at most 2.5, it is more excellent Selection of land is at most 2.0, is more preferably up to 1.5, is more preferably up to 1.0, is more preferably up to 0.8, more preferably It is at most 0.6.

Preferably, considerably less color absorption is obtained using high grade raw material, this is beneficial to accurate color printing.

A kind of method for being used to produce cap material may comprise steps of：

A) composition is provided,

B) said composition is melted,

C) with plate glass technique productions glass.

This method can include further step.Further step for example can be that chemical or hot steel is carried out to glass Change and/or by Glass Transition into glass ceramics.

As explained above, it is favourable to obtain the glass roof material with low thickness.In principle can be by will be compared with Thick glass grinding obtains thin glass into desired thickness.However, piece thickness low like that desired by cap material is difficult to lead to Cross grinding and polish thicker sheet glass to obtain.On the contrary, very thin glass can be obtained by plate glass technique.Cause This, can by plate glass technique and obtain be cap material an advantage.Plate glass technique is that technical staff institute is ripe Know.Plate glass technique is preferably chosen from pressing, again glass tube down-drawing, daraf(reciprocal of farad), overflow melting, float glass process and rolling.

Another advantage is, due to can be to obtain the manufacture method of cap material, cap material preferably has extremely A few fire polishing surface, particularly two fire polishing surfaces.Fire polishing surface is extremely smooth, i.e. it only shows very low Roughness.With mechanical polishing on the contrary, not being ground in the case of fire polishing to surface, but the material to be polished is added For heat to so high temperature so that making its flowing, this produces smooth surface condition.Therefore, smooth table is produced by fire polishing Cost of the cost in face far below the mechanical polishing surface for producing unusual light.

When referring to cap material without a certain component or not comprising a certain component, it means that the component is at most as miscellaneous Matter and exist.It is, therefore, intended that the component is not intended that addition, and at most exist with non-significant amount.Non-significant amount be with Weight meter is less than 1000ppm, preferably less than 500ppm and the more preferably less than amount of 100ppm.

Unless otherwise stated, in this application, the value of dielectric constant describes the dielectric constant under 1MHz frequencies.

In this description, " thin " this wording can also have the implication of " ultra-thin ".

The glass of cap layer is the thin glass of chemical tempering, it is with high flexibility, resistance to sudden heating, scratch resistance and transparent Degree.The thin glass with less than or equal to 350 μm thickness, have be less than or equal to 40 μm thickness ion exchange layer, And the center tension less than or equal to 140MPa.Thin glass has relatively low thermal coefficient of expansion (CTE) and relatively low Young Modulus, to improve resistance to sudden heating and flexibility.In addition, the relatively low CTE of glass can be well matched with semiconductor devices and The CTE of inorganic material, so as to fulfill excellent performance and more preferable application.

Glass can be alkali-containing glass, such as alkali silicate glass, alkali borosilicate glass, alkali aluminium borosilicate glass, Alkali boron glass, alkali germanate glass, alkali borogermanates glass, with and combinations thereof.

In one embodiment, glass can contain alkali, to allow ion exchange and chemical tempering.Ion exchange layer Depth (DoL) is controlled in less than 40 μm, and CS is controlled below 1200MPa.

In another embodiment, glass, which has, is less than 9.5 × 10^-6The CTE of/K and the Young's modulus less than 84GPa, with Realize excellent resistance to sudden heating and flexibility.

Glass can be via glass tube down-drawing, overflow melting, extraordinary float glass process or daraf(reciprocal of farad) or by being carried out by thicker glass again Grinding is etched to produce.Female glass can be provided in the form of piece or volume.There is female glass roughness Ra to be less than the pure of 2nm Surface, and one or two surface in the surface of glass is subjected to ion exchange and thereby chemical tempering.Chemical tempering it is thin Glass is the ideal chose of reel-to-reel processing.

In another embodiment, one or two surface structuration of thin glass can be made, so as to obtain anti-dazzle (AG) function, the AG functions can be provided with the piece for preferably touching experience and visual adaptability.In yet another embodiment, One or two surface of thin glass sheet can contain Ag+ the or Cu2+ ions of at least 1ppm, to realize antibacterial or antimicrobial Function.In addition, glass can be laminated with polymeric material, to serve as the flexible substrate with excellent vapor water barriers ability.

Particularly, have flexible and scratch resistance such tempering thin glass sheet may be used as cell phone, tablet PC, Portable computer, touch screens, television set, mirror, window, aviation window, the protective film of furniture and white domestic appliances.

Term

Compression (CS)：It is being measured by commercially available stress measurement instrument FSM6000 based on optical principle, by glass table Ion exchange is carried out while face does not deform in glass afterwards to the stress caused by the crowding-out effect of glass network.

Ion exchange layer depth (DoL)：The generation ion exchange of surface layer of glass and the thickness for producing compression.DoL can Measured by the commercially available stress measurement instrument FSM6000 based on optical principle.

Center tension (CT)：It is created in the intermediate layer of glass and offsets and the upper of glass is created on after ion exchange The tension of compression between surface and lower surface.CT can be calculated from the CS and DoL measured.

Mean roughness (Ra)：Roughness refers to that treated surface is uneven with less interval and small peak valley Degree, and average roughness Ra is the arithmetic average of material surface profile variation absolute value in sample length.Ra can be by preferred Land productivity is measured with the atomic force microscope of the light with 670 mum wavelengths.

R.m.s. roughness (Rq)：Be material surface profile variation absolute value in sample length it is square (square count Average value) square root.Rq can be measured by being preferably by the atomic force microscope of the light with 670 mum wavelengths.

Thermal conductivity factor (λ)：The ability of the heat of transmitter.λ can be surveyed by commercially available thermal conductivity measuring instrument Amount.

The strength of materials (σ)：The maximum stress that material can bear in the case where not rupturing.σ can by three-point bending or Four-point bending test measures.In this application, it is defined as the average value measured by one group of experiment.

Material Poisson's ratio (μ)：In force, the transverse strain of material and the ratio of longitudinal strain.μ can be by wherein to material Material applies load and records the test of strain to measure.

Glossiness：Under the same conditions, it is anti-before the front-reflection light quantity from material surface and the surface from on-gauge plate Penetrate the ratio of light quantity.Glossiness can be measured by commercially available gloss measuring device.

Mist degree：The transparency percentage that transparent material is reduced due to light scattering.Mist degree can pass through commercially available mist degree Measuring instrument measures.

Form the details of the glass of layer

If the thickness of sheet glass is thinner than 0.5mm, the processing of glass becomes difficult, and reason essentially consists in the edge of glass Place causes the defects of such as crackle and gap of rupture, and the then general machine such as bending property or impact strength performance Intensity will be remarkably decreased.Typically, for thicker glass, can using numerically-controlled machine tool (CNC) come milled border so as to Defect is removed, but for the thin glass with the thickness less than 0.5mm, mechanical lapping becomes extremely difficult, and especially exists Thickness can not be suitable for this when being less than 0.3mm.It can be a kind of solution party that defect is removed for thin glass that edge, which is performed etching, Case, but the flexibility of thin glass sheet is still limited by the low bending strength of glass in itself, and therefore, the reinforcing of glass is for thin glass pole Its is important.Strengthen and be also known as tempering, can be realized by the coating at surface and edge.However, its of high cost and efficiency is low.

It is subjected to specified chemical tempering program, can be realized with the component containing alkali and aluminium and the particular glass of specific thicknesses High mechanical properties, good flexibility and flexible.

After ion exchange, compressive stress layer can be formed on the surface of the glass.Compression can be bent in glass When offset tension, therefore the intensity of glass is improved, so that glass is physically easier to perform and handles.One glassy layer is every The bearing stress CS of a glassy layer is preferably more than 100MPa, more preferably larger than 200MPa, is even more preferably greater than 300MPa, even more preferably greater than 400MPa.

However, be usually used in chemical tempering, CS the and DoL values recommended for thicker soda-lime glass or alumina silicate glass Thin glass sheet is no longer applicable in.For the thin glass less than 0.5mm, DoL and CT value weight of the DoL and CT values than thicker glass Will much, and if these values are excessive, glass will damage.Therefore, the CT less than 120MPa is chemical tempering thin glass Basic demand.

Silicate glass with special designing component, containing alkali and boron can meet low CS, low DoL and relatively long steel Change the thin glass tempering requirement of time.The component of glass is different from common glass, to realize controllable and suitable chemical tempering knot Fruit.

In the following, it is described that the preferred embodiment of the component of the thin glass of specified thin glass layer.In all embodiment party In formula, such as Nd can be alternatively added₂O₃、Fe₂O₃、CoO、NiO、V₂O₅、MnO₂、TiO₂、CuO、CeO₂、Cr₂O₃Deng coloring oxygen Compound, can add the As of 0-2wt%₂O₃、SB₂O₃、SnO₂、SO₃, Cl, F and/or CeO₂As fining agent, and can also add Add the rare earth oxide of 0-5wt% to introduce magnetic function or photonic functions or optical function, and all the components into sheet glass Total amount be 100wt%.

In one embodiment, thin glass is lithium alumina silicate glass, has following component (in terms of wt%)：

Component	(wt%)
		SiO2	55-69
Al2O3	18-25
		Li2O	3-5
Na2O+K2O	0-30
		MgO+CaO+SrO+BaO	0-5
ZnO	0-4
		TiO2	0-5
ZrO2	0-5
		TiO2+ZrO2+SnO2	2-6
P2O5	0-8
		F	0-1
B2O3	0-2

Preferably, the material of glass sheet or layer has 3.3 to 5.7*10^-6The thermal coefficient of expansion (CTE) of/K.

Lithium alumina silicate glass preferably has following component：

Component	(wt%)
		SiO2	57-66
Al2O3	18-23
		Li2O	3-5
Na2O+K2O	3-25
		MgO+CaO+SrO+BaO	1-4
ZnO	0-4
		TiO2	0-4
ZrO2	0-5
		TiO2+ZrO2+SnO2	2-6
P2O5	0-7
		F	0-1
B2O3	0-2

Preferably, the material of glass sheet or layer has 4.76 to 5.7*10^-6The CTE of/K.

Lithium alumina silicate glass most preferably has following component：

Component	(wt%)
		SiO2	57-63
Al2O3	18-22
		Li2O	3.5-5
Na2O+K2O	5-20
		MgO+CaO+SrO+BaO	0-5
ZnO	0-3
		TiO2	0-3
ZrO2	0-5
		TiO2+ZrO2+SnO2	2-5
P2O5	0-5
		F	0-1
B2O3	0-2

Preferably, the material of glass sheet or layer has -0.068 to 1.16*10^-6/ K or 5 to 7*10^-6The CTE of/K.

In one embodiment, thin glass is soda-lime glass, has following component (in terms of wt%)：

Component	(wt%)
		SiO2	40-81
Al2O3	0-6
		B2O3	0-5
Li2O+Na2O+K2O	5-30
		MgO+CaO+SrO+BaO+ZnO	5-30
TiO2+ZrO2	0-7
		P2O5	0-2

Preferably, the material of glass sheet or layer has 5.53 to 9.77*10^-6The CTE of/K.

Soda-lime glass preferably has following component：

Component	(wt%)
		SiO2	50-81
Al2O3	0-5
		B2O3	0-5
Li2O+Na2O+K2O	5-28
		MgO+CaO+SrO+BaO+ZnO	5-25
TiO2+ZrO2	0-6
		P2O5	0-2

Preferably, the material of glass sheet or layer has 4.94 to 10.25*10^-6The CTE of/K.

Soda-lime glass most preferably has following component：

Component	(wt%)
		SiO2	55-76
Al2O3	0-5
		B2O3	0-5
Li2O+Na2O+K2O	5-25
		MgO+CaO+SrO+BaO+ZnO	5-20
TiO2+ZrO2	0-5
		P2O5	0-2

Preferably, the material of glass sheet or layer has 4.93 to 10.25*10^-6The CTE of/K.

In one embodiment, thin glass is borosilicate glass, has following component (in terms of wt%)：

Component	(wt%)
		SiO2	60-85
Al2O3	0-10
		B2O3	5-20
Li2O+Na2O+K2O	2-16
		MgO+CaO+SrO+BaO+ZnO	0-15
TiO2+ZrO2	0-5
		P2O5	0-2

Preferably, the material of glass sheet or layer has 3.0 to 9.01*10^-6The CTE of/K.

Borosilicate glass more preferably has following component：

Component	(wt%)
		SiO2	63-84
Al2O3	0-8
		B2O3	5-18
Li2O+Na2O+K2O	3-14
		MgO+CaO+SrO+BaO+ZnO	0-12
TiO2+ZrO2	0-4
		P2O5	0-2

Preferably, the material of glass sheet or layer has 2.8 to 7.5*10^-6The CTE of/K.

Borosilicate glass most preferably has following component：

Component	(wt%)
		SiO2	63-83
Al2O3	0-7
		B2O3	5-18
Li2O+Na2O+K2O	4-14
		MgO+CaO+SrO+BaO+ZnO	0-10
TiO2+ZrO2	0-3
		P2O5	0-2

Preferably, the material of glass sheet or layer has 3.18 to 7.5*10^-6The CTE of/K.

In one embodiment, thin glass is alkali aluminosilicate glass, has following component (in terms of wt%)：

Component	(wt%)
		SiO2	40-75
Al2O3	10-30
		B2O3	0-20
Li2O+Na2O+K2O	4-30
		MgO+CaO+SrO+BaO+ZnO	0-15
TiO2+ZrO2	0-15
		P2O5	0-10

Preferably, the material of glass sheet or layer has 3.3 to 10*10^-6The CTE of/K.

Alkali aluminosilicate glass more preferably has following component：

Component	(wt%)
		SiO2	50-70
Al2O3	10-27
		B2O3	0-18
Li2O+Na2O+K2O	5-28
		MgO+CaO+SrO+BaO+ZnO	0-13
TiO2+ZrO2	0-13
		P2O5	0-9

Preferably, the material of glass sheet or layer has 3.99 to 10.22*10^-6The CTE of/K.

Alkali aluminosilicate glass most preferably has following component：

Component	(wt%)
		SiO2	55-68
Al2O3	10-27
		B2O3	0-15
Li2O+Na2O+K2O	4-27
		MgO+CaO+SrO+BaO+ZnO	0-12
TiO2+ZrO2	0-10
		P2O5	0-8

Preferably, the material of glass sheet or layer has 4.5 to 9.08*10^-6The CTE of/K.

In one embodiment, thin glass is low alkali alumina silicate glass, has following component (in terms of wt%)：

Component	(wt.%)
		SiO2	50-75
Al2O3	7-25
		B2O3	0-20
Li2O+Na2O+K2O	0-4
		MgO+CaO+SrO+BaO+ZnO	5-25
TiO2+ZrO2	0-10
		P2O5	0-5

Preferably, the material of glass sheet or layer has 2.8 to 6.5*10^-6The CTE of/K.

Low alkali alumina silicate glass more preferably has following component (in terms of wt%)：

Component	(wt.%)
		SiO2	52-73
Al2O3	7-23
		B2O3	0-18
Li2O+Na2O+K2O	0-4
		MgO+CaO+SrO+BaO+ZnO	5-23
TiO2+ZrO2	0-10
		P2O5	0-5

Preferably, the material of glass sheet or layer has 2.8 to 6.5*10^-6The CTE of/K.

Low alkali alumina silicate glass most preferably has following component (in terms of wt%)：

Component	(wt.%)
		SiO2	53-71
Al2O3	7-22
		B2O3	0-18
Li2O+Na2O+K2O	0-4
		MgO+CaO+SrO+BaO+ZnO	5-22
TiO2+ZrO2	0-8
		P2O5	0-5

Preferably, the material of glass sheet or layer has 2.8 to 6.5*10^-6The CTE of/K.

Table 1 shows several exemplary embodiments of the thin glass containing alkali of chemical tempering to be carried out.

Table 1：Embodiment containing alkali borosilicate glass

Component (wt%)	Example 1	Example 2	Example 3	Example 4	Example 5	Example 6	Example 7	Example 8
									SiO2	80	64	70	61	68	70	67	60
Al2O3	3	7	1	18	9	8	6	7
									LiO	0	0	0	5	0	0	0	0
Na2O	5	6	8	10	5	3	5	8
									K2O	0	6	8	1	2	6	4	5
CaO	0	0	7	1	2	0	0	0
									BaO	0	0	2.5	0	2	0	0	0
ZnO	0	5	2.4	0	0	1	2	0
									ZrO2	0	0	0	3	3	0	0	0
B2O3	12	8	0.1	1	8	12	16	20
									TiO2	0	4	1	0	0	0	0	0

SiO₂、B₂O₃And P₂O₅Serve as glass network former.Its content is no less than 40% for conventional treatment, otherwise glass Glass piece can not form and will tend to become fragile and lose transparency.The SiO of higher₂Content will be wanted during glass production Melting and the operating temperature of higher are sought, and therefore it should usually be less than 90%.To SiO₂Add B₂O₃And P₂O₅It can change Network property and melting and the operating temperature for reducing glass.In addition, glass network former has strong shadow to the CTE of glass Ring.

In addition, the B in glass network₂O₃Two kinds of different polyhedral structures can be formed, the structure is more suitable for coming from Exterior load.Add B₂O₃Relatively low thermal expansion and relatively low Young's modulus are typically resulted in, and this transfers to produce well heat-resisting Impact and slower chemical tempering, it is possible thereby to be readily available low CS and low DoL.Therefore, B is added to thin glass₂O₃Can be with Chemical tempering is substantially improved, and therefore the thin glass of chemical tempering has more practical applications.

Al₂O₃Serve as glass network former and glass network modified body.According to Al₂O₃Amount, the shape in glass network Into [AlO4] tetrahedron and [AlO6] hexahedron, and they can come by varying the size of exchange space in glass network Adjust ion-exchange speed.If Al₂O₃Amount it is excessive, for example, higher than 40%, then the melting temperature and operating temperature of glass Will be very high and tend to crystallize, so as to cause glass loss transparency and flexibility.

Such as K₂O、Na₂O and Li₂The alkali metal oxides such as O serve as glass treatment modified body, and it can be by glass Unbridged oxide is formed in glass network and destroys glass network.Addition alkali metal can reduce treatment temperature and the increase of glass The CTE of glass.The presence of sodium and lithium be for the thin glass of chemical tempering to be carried out it is required, reason be Na+/Li+, Na+/ The ion exchange of K+ and Li+/K+ is the steps necessary of tempering.If alkali metal containing, glass cannot not carry out glass itself Tempering.However, the total amount of alkali metal should not be greater than 30%, otherwise glass network will be totally disrupted without forming glass. Another key factor is that thin glass should have low CTE, and then glass should not contain excessive alkali metal to meet this The requirement of sample.

The alkaline earth element oxide such as MgO, CaO, SrO and BaO serves as network modified body, and can reduce glass Form temperature.These elements can change the CTE and Young's modulus of glass, and alkaline earth element is for the refractive index of change glass To meet that particular/special requirement has very important effect.For example, MgO can reduce the refractive index of glass, and BaO can increase folding Penetrate rate.For glass production, the amount of alkaline earth element should not be greater than 40%.

Some oxidation of interim metal in glass, such as ZnO and ZrO₂Deng having the work(similar to alkaline earth element Energy.Other transition metals, such as Nd₂O₃、Fe₂O₃、CoO、NiO、V₂O₅、MnO₂、TiO₂、CuO、CeO₂And Cr₂O₃Deng serving as Colouring agent, so that glass possesses special photon or shows optical function, for example, color filtering or light conversion.

In general, the thin glass containing alkali metal ion can be produced by being ground or etching from thicker glass. Both approaches easily carry out, but uneconomical.At the same time, surface quality, for example, Ra roughness and percent ripple it is bad.Can be with Thin glass is formed from thicker glass using daraf(reciprocal of farad) again, but its cost is also higher, and be not easy to realize efficient large-scale production.

The production processing of the thin glass sheet containing alkali borosilicate can include glass tube down-drawing, overflow melting and extraordinary float glass process.Drop-down Method and overflow melting are preferable for large-scale production, are economical, so as to produce with great surface quality, thickness from 10 μm to 500 μm of thin glass.Glass tube down-drawing or overflow melt process can produce pure or fire polishing surface, which has small In 2nm, it is preferably less than 1.5nm and the even more preferably less than roughness Ra of 1nm.The r.m.s. roughness (Rq) of glass surface Less than 1nm, preferably less than 0.8nm, and even more preferably less than 0.5nm.For the actual use in electronic device, glass Piece has the thickness change tolerance less than ± 10%.Can also in the range of from 10 μm to 500 μm precise thickness control.It is thin Thickness give glass flexibility.Extraordinary float glass process can produce the thin glass with pure surface, it is also economical and fits Together in large-scale production, but the side for being used as tin side for the glass for passing through float process is different from opposite side.Difference between both sides It is different to cause glass warpage after chemical tempering, and further influence to print since both sides have different surface energies Or coating processes.

Thin glass being capable of the production and processing in the form of piece or volume.Chip size is greater than or equal to 100 × 100 mm²And Preferably more than 400 × 320mm²And more preferably larger than 470 × 370mm²And most preferably more than 550 × 440mm²。 Thin glass volume is with more than 250mm and preferably more than 320mm and more preferably larger than 370mm and most preferably Width more than 440mm.The length of glass volume is longer than 1m and preferably greater than 10m, is more preferably longer than 100m, and most Preferably greater than 500m.

Tempering processing can by by sheet glass and glass volume immerse the salt bath containing monovalention in with inside glass Basic ion swap and realize.Monovalention in salt bath has the diameter of the alkali metal ion bigger than inside glass, Then it can act the compression in glass network after ion exchange.After ion exchange, thin glass it is strong Degree and flexibility are strengthened.In addition, the scratch resistance of glass can be increased by the CS that chemical tempering induces so that the glass of tempering It is not easy to be scraped off, and DoL can increase scratch tolerance limit so that glass is also less likely broken in the case of being scraped off Split.

The salt for being most commonly used for chemical tempering is to contain Na⁺Fused salt or containing K⁺Fused salt, or its mixture.Common salt Including NaNO₃、KNO₃、NaCl、KCl、K₂SO₄、Na₂SO₄And Na₂CO₃, NaOH, KOH and other sodium salts or sylvite or cesium salt etc. add Agent is added to be also used for better controling over the velocity of ion exchange of chemical tempering.Containing Ag⁺Or containing Cu²⁺Salt bath can be used for thin glass Introduce antimicrobial function.

The ion exchange is carried out in the form of online (online) reel-to-reel processing, or to be rolled onto piece processing online Form carries out.In these processing, glass package is downloaded in chemical enhanced bath, and roll or cut into again after this Piece.It is directly installed in alternatively, chemically reinforced glass can be rolled up in cleaning circuit, and rolls or cut into again after this Piece.

Since glass is very thin, does not answer too fast or carry out ion exchange, and the center tension of glass too far CT values are crucial for thin glass, and are represented by following formula：

Wherein σ_CSIt is the value of CS, L_DoLIt is the thickness of DoL, t is the thickness of glass.The unit of stress is MPa, and thickness Unit be μm.Ion exchange should not carry out deeply as thicker glass；And it does not answer too fast progress, in order to provide right The accurate control of chemical toughening process.Deep DoL will cause high CT and cause self rupture of thin glass, or even in thin glass CS is set to disappear without strengthening in the case of the complete ion exchange of glass.In general, do not increase thin glass via the high DoL of chemical tempering Intensity and flexibility.

For thin glass, the thickness t of glass can have the following special relationship with DoL, CS and CT：

The processing of thin glass is also particularly significant for intensity and flexibility, and even resistance to sudden heating is also with handling quality phase Close.The further processing of thin glass includes machine cuts, the heat carried out with diamond blade or cutting wheel or alloy cutting wheel Cutting, laser cutting or water jet cutting.Can in application structure method, such as ultrasonic drilling, sandblasting and edge or Chemical etching on surface etc., to produce structure on the glass sheet.

The laser cutting includes conventional and unconventional laser cutting.Conventional laser cuts through continuous wave (CW) laser (such as CO₂Laser, common green laser, common infrared laser, common UV lasers) realize, and swash The rapid heating of light and subsequent rapid quenching cause glass to rupture and separate.Superlaser can also be utilized, is carried out by laser Directly heat so that material vaporizes, but is carried out with very slow rate of cutting.Both processing all cause undesirable fine fisssure Line and coarse surface smoothness.With conventional laser handle cutting material need post-process so as to remove undesirable edge and Surface damage.For thin glass, edge is difficult to handle, and therefore normally followed by chemical etching work after conventional laser cutting For post processing.

It is unconventional laser cutting the filament based on ultra-short pulse laser, wherein using nanosecond picosecond or femtosecond or Ah 's model Enclose interior ultrashort laser pulse, the laser pulse by pulse laser into the plasma caused by silk or self-focusing decompose come Cutting brittle material.It is this it is unconventional processing ensure that higher-quality cut edge, lower surface roughness, higher it is curved Qu Qiangdu and faster processing.This new pattern laser cutting technique is for chemically reinforced glass and is difficult to be cut with conventional method Other transparent materials cut are especially suitable.

The thermal stress as caused by the temperature difference is the reason for glass ruptures under thermal shock.In addition, the heat induced by heat treatment should Power is also possible to reduction strength of glass, so as to cause glass to become more crisp and lose flexibility.In addition, thin glass than heavy sheet glass to heat Stress is more sensitive.Therefore, resistance to sudden heating and thermal stress are especially relevant each other in the application of thin glass sheet.

In one embodiment, chemical tempering includes quick heating and quenching, and then hot in the processing procedure Impact is inevitable.Usually by chemical tempering salt bath heating to higher than 350 DEG C or even as high as 700 DEG C of temperature, with Salt bath is allowed to melt.When thin glass is immersed in salt bath, temperature gradient, and the gradient are set up between glass and salt bath Also formed in the case of being partly into salt bath of glass in one piece of single inside glass.On the other hand, when will be thin When glass takes out salt bath, it typically is rapid quenching processing.Due to low thickness, thin glass is more held under identical temperature gradient It is easily rupturable.Therefore, when carrying out tempering without its component of special designing to thin glass, heat-shock treatment causes low yield.Although Preheating and after annealing can reduce temperature gradient, but they are time-consuming and energy consumption processing.Therefore, high resistance to sudden heating for Thin glass is highly preferred, to simplify chemical tempering processing and improve yield.In addition to chemical tempering, chemical tempering it Thermal stress can be also induced during the post processing such as rear laser cutting or thermal cutting.

Find out from the explanation above, resistance to sudden heating of female glass before chemical tempering is most important for thin glass Factor, reason are that resistance to sudden heating determines the economic availability of the tempered glass with high quality.Female sheet glass Component also plays key effect in glass manufacture, and should then be directed to each type of described in previous paragraph Glass is well-designed.

Material is characterized the robustness of thermal shock by thermal shock parameter：

Wherein R is resistance to sudden heating；λ is thermal conductivity factor；α is CTE；σ is the strength of materials；E is Young's modulus, and μ is pool Loose ratio.

The R values of higher represent the bigger tolerance level to thermal shock failure.Correspondingly, the thermal stress of glass by from The maximum heating load Δ T of lower formula is determined：

The glass of R with higher will the thermal stress with higher, and therefore have higher resistance to sudden heating.

For actual use, the R of the thin glass sheet of tempering or non-tempering should be above 190W/m, be preferably higher than 250W/m, more preferably above 300W/m, and tempering or the maximum heating load Δ T of thin glass sheet of non-tempering should be above 380 DEG C, preferably higher than 500 DEG C, more preferably above 600 DEG C.

CTE is the key factor of the above-mentioned requirements for the resistance to sudden heating for meeting thin glass.With lower CTE and Young's modulus Glass there is the resistance to sudden heating of higher and more difficult generation is broken caused by temperature gradient, and there is reductionization The advantages of learning the uneven distribution of the thermal stress of tempering processing and coating or cutting etc. in other high-temperature process.Sheet glass exists CTE before or after chemical tempering should be less than 9.5 × 10^-6/ K, usually less than 8 × 10^-6/ K, be preferably lower than 7 × 10^-6/ K, 6 × 10 are more preferably less than^-6/ K, and most preferably less than 5 × 10^-6/K。

Temperature gradient tolerance level (RTG) can be measured by following experiment：Manufactured size is 250 × 250mm first²'s Glass sample, and the temperature for then being heated to limit by sample at the center of plate, are at the same time maintained at room temperature by edge.When When the incidence of rupture in the sample is less than or equal to 5%, temperature difference represents glass between hot plate center and cold edges of boards edge The temperature difference tolerance level.For thin glass application, RTG of the sheet glass before or after chemical tempering is higher than 50K, preferably high In 100K, more preferably above 150K, and most preferably higher than 200K.

It is performed as follows to test the experiment of resistance to sudden heating (RTS)：Manufactured size is 200 × 200mm first²Glass Glass sample, sample is heated in the case where there is circulation air in an oven, the cold (room for the 50ml that hereafter splashes at the center of sample Temperature) water.Resistance to sudden heating value is when rupture incidence in the sample is less than or equal to 5% between hot plate and cold (room temperature) water Temperature difference.For thin glass application, RTS of the sheet glass before or after chemical tempering is higher than 75K, is preferably higher than 115K, more preferably above 150K, and most preferably higher than 200K.

R is to evaluate the calculated value of resistance to sudden heating in the case of without thermal shock experiment.However, glass Resistance to sudden heating also suffer from the influences of other factors, such as influenced be subject to sample shape, thickness and processing history.RTS It is the experimental result for weighing the specific resistance to sudden heating of glass under specified criteria.The property of glass material is received in the calculating of R Among entering consideration, and RTS is related to the other factors in actual use.When other conditions are all identical for glass, RTS and R into Direct ratio.

Δ T is also similar to the calculated value of R, for evaluating glass material in the case where being tested without the temperature difference Temperature difference tolerance level.However, the temperature difference tolerance level of glass is also highly dependent on actual conditions, the size of such as glass sample, glass Thickness and glass processing history.RTG is to weigh under specified criteria glass to the experimental result of the specific tolerance level of the temperature difference. Among when calculating Δ T, the property of glass material is accounted for, and RTG is related to the other factors in actual use.RTG and Δ T is directly proportional, but each other might not be equal.

In one embodiment, the borosilicate glass of relatively low CTE has much higher production for chemical tempering processing Rate (>95%), all alumina silicate glasses are all ruptured due to the higher CT that higher CS and DoL induces.Table 2 is shown The property of embodiment shown in table 1.

Table 2：The property of embodiment

* the strength of glass before it is chemical tempering；It is also influenced be subject to cutting method

The unit of * ε is GPacm³/g

The strength of materials has an effect on resistance to sudden heating, and reason is to rupture as caused by thermal stress and only surpasses in the thermal stress of induction Just occur when crossing the strength of materials.After the suitable chemical tempering with the controlled CT less than 120MPa, the intensity of glass can To be strengthened, and resistance to sudden heating can also be improved.Table 3 shows the chemically toughened glass example corresponding to table 2 Data.

Table 3：The property of embodiment after chemical tempering

* it is the strength of glass after chemical tempering；It is also influenced be subject to cutting method

Also there is thin glass relatively low specific Young's modulus to provide more preferable flexibility.Therefore, thin glass has relatively low firm Degree and preferable crooked behavior, this is for reel-to-reel processing and operates particularly advantageous.The rigidity of glass is defined by specific Young's modulus：

Wherein E is Young's modulus, and the density that ρ is glass.Since the variable density of glass is not considerable for its component, Therefore Young's modulus should be more than 55GPa.The rigidity ε of glass is less than 33.5GPacm³/ g, preferably less than 29.2GPa cm³/ g, and even more preferably less than 27.2GPacm³/g。

The flexible f of glass is characterized by flexible in glass and when not rupturing bending radius (r), and usually Defined by the following formula：

F=1/r.

Bending radius (r) is measured as the incurvature at the bending position of material.Bending radius is defined as rolling in glass Reach the least radius of the arc at the bending position of maximum defluxion before bent or impaired or rupture.The r of smaller means glass The flexibility and amount of deflection of bigger.Bending radius is the parameter determined by thickness of glass, Young's modulus and strength of glass.Chemical steel Changing thin glass has very shallow thickness, low Young's modulus and high intensity.All these three factors both contribute to low bending radius With more preferable flexibility.The head cover glass of tempering has less than 150mm, preferably less than 100mm and even more preferably less than 50mm Bending radius.

Flexible electronic circuit or sensor can be realized to tempering thin glass sheet coating conductive coating.It can be applied to thin glass Cover inorganic coating and organic coating.However, inorganic conductive coatings (for example, common ITO in modern electronics) have not bendable The shortcomings that bent.After bending several times, due to the crackle generated in the deformation process of coating in substrate and thereon, resistance Increase.Therefore, there is the thin glass less than 0.3mm thickness should coat the flexible conductive coatings of non-ITO, such as nano silver wire, Carbon nanotubes, graphene, poly- (3,4- ethene dioxythiophenes)/poly- (styrene sulfonate) (PEDOT/PSS), polyacetylene, polyphenyl Sub- ethene (polyphenylene vinylene), polypyrrole, polythiophene, polyaniline and polyphenylene sulfide.The thickness of conductive coating Between 0.001 μm and 100 μm, it is preferably ranges between 0.1 μm and 10 μm, and more preferably between 0.08 μm and 1 μm Between.Electroconductive polymer coating be it is transparent, it is either translucent or coloured.For coating the method bag of conductive coating Include chemical vapour deposition technique CVD, dip-coating, spin coating, ink-jet, casting, silk-screen printing, application and spraying.

The side of thin glass or whole both sides can scribble flexible coating.Flexible non-ITO conductive coatings, which have, to be less than Or the Young's modulus equal to 50GPa, to ensure that glass-organic double compound will not be too hard.Compound thin glass has from 0% to 90% Adjustable transparent rate, and 300 Ω/sq, the piece electricity of preferably less than 200 Ω/sq and even more preferably less than 150 Ω/sq Resistance, and it is suitable for flexible electronic device, such as copper-indium-gallium-selenium CIGS solar cells and OLED display.

Another advantage using non-ITO conductive coatings is that coating processing carries out at low ambient temperatures.It is usually used Physical vapour deposition (PVD) PVD method is coated with ITO, and glass substrate is heated to the temperature of up to 200 DEG C or even more high.High temperature will The CS of thin glass sheet can be reduced and damage the intensity and reliability of thin slice.Temperature of the non-ITO coatings usually below 150 DEG C applies Cloth, and maintain the intensity and flexibility of ultra-thin glass piece.

Can by being machined, etching, photoetching, laser ablation, Ion Beam Treatment or printing etc., to the reinforcing of coating Thin substrate is further processed, to make the circuit for actually using.

Anti-dazzle (AG) function can be added to head cover glass, for being used under the conditions of unfavorable viewing.It can change A surface of thin glass or two surfaces are handled to realize AG functions before or after learning tempering.Processing method includes Sandblasting or chemical etching.After chemical etching, the surface of thin glass has between 50nm and 300nm, preferably 50nm with Between 400nm, between more preferably 80nm and 300nm and most preferably the roughness between 100nm and 200nm to be to realize most Good AG effects, glossiness under 60 ° of reflection angles is between 30 and 120, preferably 40 and 110, more preferably 50 and 100 it Between；Glossiness under 20 ° of reflection angles is between 30 and 100, between preferably 40 and 90, between more preferably 50 and 80；85° Glossiness under reflection angle is between 20 and 140, between preferably 30 and 130, between more preferably 40 and 120；And AG The mist degree on surface is between 3 and 18, between preferably 5 and 15, and between more preferably 7 and 13.There is the glass of AG Piece is applicable to the surface of any object to provide special touch experience and visual adaptability, particularly in floodlighting environment Under.

Can be by containing Ag⁺Salt bath or containing Cu²⁺Ion exchange is carried out in salt bath and adds antibacterial work(to head cover sheet glass Energy.After ion exchange, the Ag on surface⁺Or Cu2⁺Concentration is higher than 1ppm, preferably higher than 100ppm, and more preferably Higher than 1000pm.The inhibiting rate of bacterium is more than 50%, preferably more than 80%, and more preferably beyond 95%.With antibacterial The thin glass of function is applicable to the Medical Devices used in hospital, such as computer or screen.

Can also be by the Ag ions into AG thin glass or the ion exchange of Cu ions and to having had the function of the top of AG Cover glass adds antibacterial functions.Can also by sandblasting or chemical etching or thermoforming and to have antibacterial functions head cover glass Glass adds AG functions.The thin head cover glass of functionalization can scribble non-ITO coatings, to realize multifunctional unit.

- the chemically tempering thin glass of tempering or non-tempering can be laminated with polymeric material to form protection Film.The polymeric material is selected from the group that following material is formed：Siloxanes (silicone) polymer, collosol-gel polymer, Makrolon (PC), polyether sulfone, polyacrylate, polyimides (PI), inorganic silicon dioxide/polymer hybrid thing, cycloolefin Copolymer, organic siliconresin (silicone resin), polyethylene, polypropylene polyvinyl chloride, polystyrene, styrene-propene Lonitrile copolymer, polymethyl methacrylate (PMMA), vinyl-vinyl acetate copolymer, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide, polyacetals, polyphenylene oxide, polyphenylene sulfide or polyurethane or its mixing Thing.Such stacked film is arranged between two adjacent layers of thin glass, and preferably by selected from by optically clear adhesive (OCA), the group that optical clear resin (OCR), polyvinyl butyral resin (PVB), thermoplastic polyurethane (TPU) or elastomer are formed Material be made.Stacked film is flexible and/or deformable.

The lamination of thin glass and polymer has less than 500 μm, preferably less than 100 μm, even more preferably less than 50 μm simultaneously And more preferably less than 25 μm of thickness.The ratio between the thickness of polymeric material and the thickness of glass are less than 200% and preferably Less than 100%, and 50%, and even more preferably less than 20% is even more preferably less than in some cases, and non- It is less than 10% in the case of Chang Teshu.

Layered product can overcome the common polymer material with very high moisture-vapor transmission (WVTR).Often It is 1~10g/m with the WVTR of polymeric material²/ day, and the electronic device such as OLED requires substrate to have less than 10^-5g/m²/ It WVTR.It was unexpectedly determined that flexible laminate, which has, is less than 5 × 10^-6g/m²The WVTR in/day, this can easily meet this It is required that.In addition, the polymeric layer of layered product can provide some functions not available for glass, such as adhesive power or colour filter work( Energy or polarization function.

In one embodiment, there is peel ply between glass and polymeric material.Peel ply is at its own with gathering There is weak adhesiveness, this causes polymeric material or glass to be easy to depart between compound material or sheet glass.

In actual use, the CTE differential between glass and polymer will cause warpage or the deformation of layered product. In one embodiment, whole both sides of glass are all laminated with polymeric material, to form polymer-glass-polymer three Weight structure, the structure have preferably performance under heat condition.

Laminating method includes the use of or without using adhesive, directly by thin slice and polymeric material film or layers of foil pressure.Other Laminating method includes covering thin glass with liquid to be initially formed polymer precursor, then makes material with UV or hot methods Cure.Using including dip-coating, spin coating, ink-jet, casting, silk-screen printing, application and method in being sprayed on come by polymer precursor It is covered on glass.Finished laminate has the adjustable transparent rate from 0% to 90%.

Layered product can be applied as flexible universal substrate, for electronic devices such as touch sensors, and it is thin Film battery, and display, and solar cell.In one embodiment, the thin borosilicate being laminated with polyimides (PI) Silicate glass has good flexible, good optical transmittance (being~90% for visible wavelength area), and with height Temperature stability, and (300 DEG C) processing of high temperature can be born in practice.

Now, even if the cover glass on cell phone is all superpower and scratch resistance, many people will be intended merely to make device Remain intact and apply protective film on the screen.In most cases, used protective film is by softer and more hold Easily scratch and there are plastics made of the polymer of poor optical transmittance, it reduce the visual quality of screen.In addition, by It is poor higher with the coefficient of kinetic friction in smoothness, therefore the touch experience on plastic foil is good not as glass.Chemical tempering is thin The layered product of sheet glass or glass and polymer can overcome disadvantages mentioned above, and can function well as cell phone or The expendable protective film of the screen of camera or game device.

Touch screens are different from capacitance plate, and need to apply force to realize touch controllable function.Therefore, touch screens are easier to be scraped Wound.The cover material that in the market is used for touch screens is plastics or non-tempering thin glass.Both materials can not meet anti-scratch requirement. Due to its high flexibility, anti-scratch and scratch resistance property, tempering thin glass is highly suitable as the cover material of touch screens.

The layered product of tempering head cover thin slice or glass and polymer is applicable to the surface of other objects, such as tablet meter Calculation machine, portable computer, television set, mirror, window, aviation window, the surface of furniture and white domestic appliances.In all these applications, Using or without using bonding medium, sheet glass is adhered into object.Adhesion method includes contact laminating, pressing and heats, electrostatic With reference to, package sealing with laser or with such as organosilicon (silicone), resin, quick-drying gelatin, epoxy adhesive, UV cure adhesive, The adhesives such as thermoplastic, hotmelt, OCR, OCA, PSA, latex are combined.

Brief description of the drawings

Now by illustrative embodiments, and the utility model is described in more detail in refer to the attached drawing.Attached In figure, identical drawing reference numeral represents identical or corresponding element.In the accompanying drawings：

Fig. 1 a- Fig. 1 d illustrate the layering knot being each based on two thin glass layers and the stacked film being disposed there between The embodiment of structure,

Fig. 2 a- Fig. 2 d illustrate stacked between being each based on having three thin glass layers and being arranged in the glassy layer The embodiment of the hierarchy of film.

Reference numerals list

10 sensing systems

12.1 layers, cap layer

12.2 layers, bottom cover layer

12.3 layers, intermediate layer

13 stacked films

14.1 pass through the hole of a layer

14.2 pass through the hole of two layers

16.1 active regions, homepage key range

16.2 keys, homepage key

18 sensors, fingerprint sensor (FPS)

Embodiment

Fig. 1 a- Fig. 1 d each illustrate the embodiment of the sensing system 10 for electronic device, the sensing system 10 comprising fingerprint sensor (FPS 18) and with include cap layer 12.1 and bottom cover layer 12.2 two made of thin glass The stacked hierarchy of a layer 12.1,12.2.The hierarchy includes the stacked film being arranged between glassy layer 12.1,12.2 13.In each embodiment, user interface is served as in the outer surface of cap layer 12.1.

In fig 1 a, cap layer 12.1 does not have hole, and bottom cover layer 12.2 has through hole 14.1, and the through hole 14.1 is described Formed before the lamination of hierarchy.FPS 18 is arranged in the hole 14.1 of bottom 12.2.

In Figure 1b, cap layer 12.1 and bottom cover layer 12.2 each have through hole 14.1, and the through hole 14.1 is respectively described Formed before the lamination of hierarchy.Hole 14.1 is concentric, but can have different-diameter.FPS 18 is arranged in cap layer 12.1 Hole 14.1 in.The electric wire (not shown) that FPS 18 is connected with electronic device passes through the hole 14.1 in bottom 12.2.

In figure 1 c, cap layer 12.1 and bottom cover layer 12.2 have through hole 14.2, and the through hole 14.2 is also cross the two Layer and formed before the lamination of the hierarchy.FPS 18 is arranged in the bottom in hole 14.2.

In Fig. 1 d, cap layer 12.1 has through hole 14.1.Sensor 18 is arranged in the foot table of stacked hierarchy The lower section in face, i.e. the lower section of the lowermost surface of bottom 12.2.

In Fig. 1 a- Fig. 1 d, overlapped layers 13 has hole, which has the diameter identical with the hole 14.1 in bottom 12.2. The hole of overlapped layers 13 is pre-punched hole, it means that the laminating technology of layer 12.1,12.2 is carried out with the stacked film 13 of pre-punched hole 's.

In the embodiment of Fig. 1 a- Fig. 1 d, by touching or pressing active region or touch with several effects The pressing key effect or homepage key effect in electronic device (for example, smart phone) are realized in region 16.1.

I) fingerprint for causing FPS 18 to sense user is touched or presses, so as to perform authentication processing.

Ii) successful execution authentication processing can cause homepage key effect known to user when pressing homepage key.

Iii) instead of effect ii), pressing can cause the elastic displacement of flexible glass bottom 12.1 in the system of Fig. 1 a, Specific homepage key effect is realized in the displacement in smart phone.

Touch area 16.1 be characterized in that can vision and/or tactilely-perceptible mark, which, which directs the user to, needs Touch to realize the user interface location of pressing key or homepage key effect.

- in fig 1 a, hole is wherein not present in top layer 12.1, with hole 14.1 or the mark of the user interface of FPS area overlappings Or label can vision and/or tactilely-perceptible, therefore provide the guiding of the active region 16.1 to user interface.

- in Fig. 1 b, Fig. 1 c, Fig. 1 d, the hole in top layer 12.1 provides the vision of the active region 16.1 to user interface Guided with tactile.

Fig. 2 a- Fig. 2 d each illustrate the sensing system 10 for electronic device, which includes fingerprint Sensor (FPS 18) and there is being made of thin glass including cap layer 12.1, bottom cover layer 12.2 and intermediate layer 12.3 Three layers 12.1,12.2,12.3 stacked hierarchy.The hierarchy includes and is each arranged in glassy layer 12.1,12.2 And two stacked films 13 between 12.2,12.3.In each embodiment, user interface is served as in the outer surface of top layer 12.1.

In the embodiment of Fig. 2 a, two (intermediate layer 12.3 and bottom cover layers 12.2) in three layers each have Through hole 14.1.The hole of layer 12.2,12.3 has different-diameter due to concentric and overlapping.FPS 18 is arranged in intermediate layer 12.3 Hole 14.1 in.The electric wire (not shown) that FPS 18 is connected with electronic device passes through the hole 14.1 in bottom 12.2.

In the embodiment of Fig. 2 b, only cap layer 12.1 has through hole 14.1；Other two layer 12.2,12.3 does not have With 18 relevant hole of sensor.Sensor 18 is arranged in the lower section of the lowermost surface of hierarchy, i.e. orlop 12.2 is most The lower section of lower surface.One of two overlapped layers 13 have hole.

In the embodiment of Fig. 2 c, formed through each layer in two layers (cap layer 12.1 and intermediate layer 12.3) Hole 14.1.In addition, bottom cover layer 12.2 also has hole 14.1.Overlapped layers 13 between cap layer 12.1 and intermediate layer 12.3 does not have There is hole.Overlapped layers 13 between bottom cover layer 12.2 and intermediate layer 12.3 has the continuous hole in hole with intermediate layer 12.3.Intermediate layer 13 and the hole 14.1 of bottom cover layer 12.2 be concentric, but there is different-diameter.The electric wire that FPS 18 is connected with electronic device is (not Show) pass through bottom 12.2 in hole 14.1.

In the embodiment of Fig. 2 d, the hole 14.2 through two layers (bottom cover layer 12.2 and intermediate layer 12.3) is formed.This Outside, cap layer 12.1 also has hole 14.1.However, the hole 14.1 of cap layer 12.1 and having through the hole 14.2 of layer 12.2,12.3 There are different diameter and overlapping, but decentraction.Overlapped layers 13 between adjacent glassy layer 12.3,12.2 have with The 14.2 continuous hole of hole of interbed 12.3 and bottom cover layer 12.2.

The tops of FPS 18 and the region 16.1 of the user interface of FPS area overlappings are marked as homepage key range 16.1.User The region can be touched or press, so as to cause the pressing key effect or homepage key in electronic device (for example, smart phone) Effect.Homepage key effect can be discussed further below.

I) touch or press and may cause to the fingerprint that FPS 18 senses user, so as to perform authentication processing.

Ii) successful execution authentication processing can cause homepage key effect known to user when pressing homepage key.

Iii) instead of effect ii), pressing can Fig. 2 c, Fig. 2 d system in cause the movement of key 16.2, the movement The flexibility that can again lead to be arranged between cap layer 12.1 and intermediate layer 12.3 is stacked the elastic displacement of film 13, the displacement Specific homepage key effect is realized in smart phone.

In all illustrated embodiments, glassy layer be all it is chemical enhanced, and the hole in glassy layer strengthen and It is made before lamination treatment, reason is to cut layer after strengthening or drill will be strong to the machinery of layer and total Degree has negative effect.Therefore, the hole in glassy layer is generally made before the reinforcing and lamination of layer.

The utility model further includes the electronic device with above-mentioned such sensing system.

It should be appreciated that the utility model is not limited to the combination of features described above, technical staff arbitrarily will combine or make With all features of the utility model, as long as rationally and without departing from the scope of the utility model.Other embodiment is also It is possible.

Claims (54)

1. a kind of sensing system (10) for electronic device, including sensor (18) and stacked hierarchy, this stacked point Rotating fields have at least two layers (12.1-12.3) made of thin glass, at least one tool in the layer (12.1-12.3) There is hole (14.1,14.2), the hole (14.1,14.2) is through hole in each case, it is characterised in that the sensor (18) It is arranged in the hole (14.1,14.2) or the lower section of the lowermost surface of the hierarchy.

2. sensing system (10) according to claim 1, it is characterised in that the sensor (18) is fingerprint sensing Device.

3. sensing system (10) according to claim 1, it is characterised in that the sensor (18) be optical sensor or Feeler.

4. sensing system (10) according to claim 1, it is characterised in that the stacked hierarchy is included by thin glass Two layers (12.1,12.2) made of glass.

5. sensing system (10) according to claim 1, it is characterised in that the stacked hierarchy is included by thin glass At least three layers (12.1-12.3) made of glass.

6. sensing system (10) according to claim 1, it is characterised in that the superiors are designed to cap layer (12.1)。

7. sensing system (10) according to claim 1, it is characterised in that orlop is designed to bottom cover layer (12.2)。

8. sensing system (10) according to claim 6, it is characterised in that the topmost area of the cap layer (12.1) Domain or perimeter are designed to user interface.

9. sensing system (10) according to claim 8, it is characterised in that the user interface and the sensor (18) overlapping region is marked as active region (16.1), wherein the sensor (18) is when user touches the active region The sensor of sensing effect or activation effect is perceived during domain (16.1).

10. sensing system (10) according to claim 1, it is characterised in that layer (12.1) or each layer be it is flexible and/ Or deformable layer；And/or

The hierarchy is flexible and/or deformable structure.

11. sensing system (10) according to claim 7, it is characterised in that the neighbouring bottom of the sensor (18) Cap rock (12.2) is arranged below.

12. sensing system (10) according to claim 9, it is characterised in that the cap layer (12.1) is in user Elastic deformation or bending are produced when pressing the active region (16.1) and the active region (16.1) therefore realize to press Press the layer of key function or homepage key function.

13. sensing system (10) according to claim 1, it is characterised in that the thickness of the sensor (18) is more than The thickness of layer with the hole for therefrom arranging the sensor (18)；Or

The thickness of layer with the hole for therefrom arranging the sensor (18) is more than the thickness of the sensor (18).

14. sensing system (10) according to claim 1, it is characterised in that the hole (14.1,14.2) is to described Hierarchy is laminated the hole formed before；And/or

If at least two layers (12.1-12.3) has hole, the hole is concentric or at least has overlapping region.

15. sensing system (10) according to claim 1, it is characterised in that the sensor (18) is arranged in outermost In the hole (14.1,14.2) of layer (12.1,12.2)；Or

The sensor (18) be arranged in be not outermost layer hole (14.1,14.2) in.

16. sensing system (10) according to claim 1, it is characterised in that at most except the layer (12.1-12.3) One of beyond all layers there is hole；Or

The hole (14.2) is the through hole formed through all layers (12.1-12.3) of the hierarchy.

17. sensing system (10) according to claim 7, it is characterised in that with least two layers and at least one In the hierarchy in a hole, the sensing system is in a position, wherein the hierarchy is via the bottom cover layer (12.2) to exterior space open.

18. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 350 μm and more than 1 μm.

19. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 300 μm and more than 1 μm.

20. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 250 μm and more than 1 μm.

21. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 210 μm and more than 1 μm.

22. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 180 μm and more than 1 μm.

23. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 150 μm and more than 1 μm.

24. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 100 μm and more than 1 μm.

25. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 75 μm and more than 1 μm.

26. the sensing system (10) according to any one of claim 1-17, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 50 μm and more than 1 μm.

27. the sensing system (10) according to any one of claim 1-17, it is characterised in that stacked film (13) arrangement Between two adjacent layers (12.1-12.3)；And

The stacked film (13) is flexible and/or deformable film.

28. the sensing system (10) according to any one of claim 1-17 a, it is characterised in that layer or each layer (12.1-12.3) has ion exchange layer；And

There is the ion exchange layer of one layer layer depth DoL, layer depth DoL to be equal to or less than the thickness of layer (12.1-12.3) 50%.

29. the sensing system (10) according to any one of claim 1-17 a, it is characterised in that layer or each layer (12.1-12.3) has ion exchange layer；And

There is the ion exchange layer of one layer layer depth DoL, layer depth DoL to be equal to or less than the thickness of layer (12.1-12.3) 40%.

30. the sensing system (10) according to any one of claim 1-17 a, it is characterised in that layer or each layer (12.1-12.3) has ion exchange layer；And

There is the ion exchange layer of one layer layer depth DoL, layer depth DoL to be equal to or less than the thickness of layer (12.1-12.3) 30%.

31. a kind of sensing system (10) for electronic device, including sensor (18) and hierarchy, hierarchy tool There is at least two layers (12.1-12.3) made of thin glass, it is characterised in that the sensor (18) is arranged in the layering The lower section of the lowermost surface of structure.

32. sensing system (10) according to claim 31, it is characterised in that the sensor (18) is fingerprint sensing Device.

33. sensing system (10) according to claim 31, it is characterised in that the sensor (18) is optical sensor Or feeler.

34. sensing system (10) according to claim 31, it is characterised in that the hierarchy is included by thin glass Two layers (12.1,12.2) made of glass.

35. sensing system (10) according to claim 31, it is characterised in that the hierarchy is included by thin glass Manufactured at least three layers (12.1-12.3).

36. sensing system (10) according to claim 31, it is characterised in that the superiors are designed to cap layer (12.1)。

37. sensing system (10) according to claim 31, it is characterised in that orlop is designed to bottom cover layer (12.2)。

38. sensing system (10) according to claim 36, it is characterised in that the topmost of the cap layer (12.1) Region or perimeter are designed to user interface.

39. the sensing system (10) according to claim 38, it is characterised in that the user interface and the sensor (18) overlapping region is marked as active region (16.1), wherein the sensor (18) is when user touches the active region The sensor of sensing effect or activation effect is perceived during domain (16.1).

40. sensing system (10) according to claim 31, it is characterised in that layer (12.1) or each layer are flexible And/or deformable layer；And/or

The hierarchy is flexible and/or deformable structure.

41. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 350 μm and more than 1 μm.

42. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 300 μm and more than 1 μm.

43. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 250 μm and more than 1 μm.

44. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 210 μm and more than 1 μm.

45. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 180 μm and more than 1 μm.

46. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 150 μm and more than 1 μm.

47. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 100 μm and more than 1 μm.

48. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 75 μm and more than 1 μm.

49. the sensing system (10) according to any one of claim 31-40, it is characterised in that layer (12.1-12.3) Thickness be equal to or less than 50 μm and more than 1 μm.

50. the sensing system (10) according to any one of claim 31-40, it is characterised in that stacked film (13) cloth Put between two adjacent layers (12.1-12.3)；And

The stacked film (13) is flexible and/or deformable film.

51. the sensing system (10) according to any one of claim 31-40 a, it is characterised in that layer is each Layer (12.1-12.3) has ion exchange layer；And

There is the ion exchange layer of one layer layer depth DoL, layer depth DoL to be equal to or less than the thickness of layer (12.1-12.3) 50%.

52. the sensing system (10) according to any one of claim 31-40 a, it is characterised in that layer is each Layer (12.1-12.3) has ion exchange layer；And

There is the ion exchange layer of one layer layer depth DoL, layer depth DoL to be equal to or less than the thickness of layer (12.1-12.3) 40%.

53. the sensing system (10) according to any one of claim 31-40 a, it is characterised in that layer is each Layer (12.1-12.3) has ion exchange layer；And

There is the ion exchange layer of one layer layer depth DoL, layer depth DoL to be equal to or less than the thickness of layer (12.1-12.3) 30%.

54. a kind of electronic device, it is characterised in that it includes the sensing system according to any one of claim 1-53 (10)。