KR20160029716A - Conductive laminate, electrode and electric device comprising the same - Google Patents
Conductive laminate, electrode and electric device comprising the same Download PDFInfo
- Publication number
- KR20160029716A KR20160029716A KR1020150125701A KR20150125701A KR20160029716A KR 20160029716 A KR20160029716 A KR 20160029716A KR 1020150125701 A KR1020150125701 A KR 1020150125701A KR 20150125701 A KR20150125701 A KR 20150125701A KR 20160029716 A KR20160029716 A KR 20160029716A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- less
- conductive line
- conductive
- adhesive force
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 102
- 229920005989 resin Polymers 0.000 claims description 50
- 239000011347 resin Substances 0.000 claims description 50
- 239000000853 adhesive Substances 0.000 claims description 48
- 230000001070 adhesive effect Effects 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims description 9
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 230000001603 reducing effect Effects 0.000 claims description 7
- 229920001940 conductive polymer Polymers 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 5
- 230000031700 light absorption Effects 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- -1 ester acrylate Chemical class 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 150000001722 carbon compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
Landscapes
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Abstract
TECHNICAL FIELD The present disclosure relates to a conductive laminate, an electrode including the same, and an electronic device.
Description
The present application claims the benefit of priority based on Korean Patent Application No. 10-2014-0119011 filed with the Korean Intellectual Property Office on September 5, 2014, and all contents disclosed in the Korean patent application are incorporated herein by reference .
TECHNICAL FIELD The present disclosure relates to a conductive laminate, an electrode including the same, and an electronic device.
The transparent conductive film means a thin film having high transparency to light and electricity, and can be used for a liquid crystal display, an electrochromic display (ECD), an organic electroluminescence device, a solar cell, a plasma Are widely used as voltage-applying common electrodes and pixel electrodes such as a plasma display panel, a flexible display, an electronic paper, and a touch panel.
ITO (Indium Tin Oxide) can be exemplified as a typical example of the transparent conductive film, but it is difficult to increase the size due to limitations of the manufacturing method, and low yield and high price are formed. In addition, since it is difficult to apply ITO as a flexible film, it is necessary to develop a transparent conductive film which can replace ITO.
The present invention aims at providing a conductive laminate, an electrode including the same, and an electronic device.
According to an embodiment of the present invention, there is provided a semiconductor device comprising: a resin pattern layer including a groove portion and a convex pattern portion spaced apart by the groove portion; A conductive line provided on the trench; And an adhesive force adjusting unit provided between the groove and the conductive line in contact with the groove,
Wherein an average light transmittance of light in a wavelength range of 400 nm to 700 nm of the adhesive force adjusting portion is more than 80% and an adhesive force of the adhesive force adjusting portion and the resin pattern layer is larger than an adhesive force of the adhesive force adjusting portion and the conductive line, And the total thickness of the adhesive force adjusting portion and the conductive line is 5% or more and 50% or less of the maximum depth of the groove portion.
One embodiment of the present disclosure provides an electrode comprising the conductive laminate.
One embodiment of the present disclosure provides an electronic device comprising the electrode.
The conductive laminate according to one embodiment of the present invention has a high light transmittance and a low sheet resistance value, so that it can exert excellent effects when applied to an electronic device.
The conductive laminate according to one embodiment of the present invention is advantageous in that it can be manufactured by a simple process, and can be manufactured with high process efficiency and low process cost.
The conductive laminate according to one embodiment of the present invention has an advantage that it can be manufactured in a large area.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a conductive laminate according to one embodiment of the present invention; Fig.
2 shows a top view of a conductive laminate according to one embodiment of the present invention.
3 is a side cross-sectional view of a conductive laminate according to one embodiment of the present invention.
4 is a side cross-sectional view of a conductive laminate according to an embodiment of the present invention.
When a member is referred to herein as being "on " another member, it includes not only a member in contact with another member but also another member between the two members.
Whenever a component is referred to as "comprising ", it is to be understood that the component may include other components as well, without departing from the scope of the present invention.
Hereinafter, the present invention will be described in more detail.
According to an embodiment of the present invention, there is provided a semiconductor device comprising: a resin pattern layer including a groove portion and a convex pattern portion spaced apart by the groove portion; A conductive line provided on the trench; And an adhesive force adjusting unit provided between the groove and the conductive line in contact with the groove,
Wherein an average light transmittance of light in a wavelength range of 400 nm to 700 nm of the adhesive force adjusting portion is more than 80% and an adhesive force of the adhesive force adjusting portion and the resin pattern layer is larger than an adhesive force of the adhesive force adjusting portion and the conductive line, And the total thickness of the adhesive force adjusting portion and the conductive line is 5% or more and 50% or less of the maximum depth of the groove portion.
As used herein, "conductive" means electrical conductivity.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a conductive laminate according to one embodiment of the present invention; Fig. 1 shows a state in which the resin pattern layer composed of the
2 shows a top view of a conductive laminate according to one embodiment of the present disclosure. Specifically, FIG. 2 shows that the resin pattern layer is partitioned by the
According to one embodiment of the present disclosure, the groove portion may include a dummy portion in which a portion is electrically short-circuited.
The conductive lines provided in the dummy portion are electrically short-circuited, but they may serve to make the apparent pattern appear to be formed. This allows the appearance of the conductive lines to be formed in a repetitive configuration so as not to interfere with visibility.
The present inventors have found that when a conductive line is formed through a sputtering or e-beam deposition method in a groove portion of a fine line width, a conductive line formed in a groove portion is removed together with a conductive layer formed outside the groove portion. Accordingly, the present inventors have solved the problem by adjusting the total thickness of the adhesive force adjusting portion and the conductive line to 5% to 50% or less of the maximum depth of the groove portion.
Wherein the adhesive force adjusting unit and the conductive line may be formed by a chemical vapor deposition or a physical vapor deposition method and the deposition angle of the material for forming the adhesive force adjusting unit and the conductive line layer may be -15 degrees To 15 degrees.
Wherein the adhesion regulating portion separates the resin pattern layer from the conductive line to prevent the conductive line from being oxidized by the resin pattern layer and is provided on the convex pattern portion of the resin pattern layer formed at the time of forming the conductive line The adhesion of the conductive lines can be controlled to facilitate peeling of the conductive lines formed in the groove portions.
When the light transmittance of the adhesive force adjusting portion is 80% or less of the light having a wavelength of 550 nm, the adhesive force adjusting portion formed on the convex pattern portion must be removed to ensure high light transmittance of the conductive laminate.
According to one embodiment of the present invention, since the average light transmittance in the light having a wavelength of 400 nm to 700 nm of the adhesive force adjusting portion is more than 80%, even if the adhesive force adjusting portion formed on the convex pattern portion is not removed altogether, The permeability of the sieve is not greatly influenced.
Therefore, according to one embodiment of the present invention, since the adhesive force between the adhesive force adjusting portion and the resin pattern layer is greater than the adhesive force between the adhesive force adjusting portion and the conductive line, the light transmittance provided on the convex pattern portion is low The layers can be easily removed. In this case, an additional layer made of the same material as the adhesion control layer may remain on the convex pattern portion.
According to an embodiment of the present invention, the adhesive layer may further include an additional layer provided on the convex pattern portion and made of the same material as the adhesive force adjusting portion. Since the average transmittance of the additional layer in the light having a wavelength of 400 nm to 700 nm is more than 80%, the light transmittance of the conductive laminate does not deteriorate even if it remains on the convex pattern portion. That is, there is an advantage that the process time for removing all the additional layers formed on the printed pattern portion is shortened, and the process efficiency and cost can be increased.
The additional layer is formed of the same material at the same time as the adhesion control layer and has low adhesion to a layer made of the same material as that of the conductive line provided on the additional layer. It is easier to remove the layer made of the same material as the first layer.
The additional layer may serve to protect the resin pattern layer that may occur when a layer made of the same material as the conductive line formed on the convex pattern portion is physically removed. Further, since the additional layer has a low adherence to the layer made of the same material as the conductive line, the physical removal time of the layer made of the same material as that of the conductive line formed on the convex pattern portion is shortened, Can be prevented.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a conductive laminate according to one embodiment of the present invention; Fig. More specifically, Fig. 1 shows a case where a resin pattern layer made up of the
According to one embodiment of the present disclosure, the adhesive force regulating portion and the conductive line may each be a single layer or a multilayer structure.
According to one embodiment of the present invention, the side surface of the groove portion may have an inclination angle of -15 degrees or more and 15 degrees or less with respect to the vertical direction of the lower end surface of the resin pattern layer. Specifically, the side surface of the groove portion may have an inclination angle of 0 degree or more and 10 degrees or less, more specifically, 1 degree or more and 5 degrees or less, based on the vertical direction of the lower end surface of the resin pattern layer. The groove portion may have at least two side surfaces, and each side surface of the groove portion may have the same or different inclination angle. The inclination angle may mean an absolute value, and may mean a positive value or a negative value.
When the inclination angle of the side surface of the groove portion is less than 0 degree, the width of the groove bottom surface becomes larger than the width of the upper surface, so that the adhesion force between the mold and the resin for forming the groove portion of the resin pattern layer becomes excessively high, , The process speed may be lowered. In addition, when the inclination angle of the side surface of the groove portion is greater than 15 degrees, the conductive line material formed on the side surface of the groove portion in the process of forming the conductive line, There is a possibility that a problem can be eliminated.
According to an embodiment of the present invention, the maximum width of the groove portion may be 0.1 μm or more and 3 μm or less, and the maximum depth of the groove portion may be 0.2 times or more and twice or less the maximum width of the groove portion.
According to one embodiment of the present invention, the maximum width of the groove portion may be 0.3 占 퐉 or more and 2 占 퐉 or less, or 0.5 占 퐉 or more and 0.9 占 퐉 or less.
If the maximum width of the groove portion is less than 0.1 탆, the line width of the conductive line becomes excessively small, which may increase the resistance and lower the electrical conductivity. In addition, when the maximum width of the groove portion exceeds 3 탆, the line width of the conductive line becomes excessively large, which may cause a problem that the conductive line is recognized in the visual field.
According to an embodiment of the present invention, the maximum depth of the groove portion may be 0.7 times or more and not more than 1 times the maximum width of the groove portion.
The maximum depth of the groove portion means the distance from the lowest point to the highest point of the groove portion and the maximum width of the groove portion means the longest width of the groove portion measured in the horizontal direction of the lower end surface of the resin pattern layer.
When the maximum depth of the groove portion satisfies the above range, the conductive line is easily formed, and the conductive line material formed on the convex pattern portion can be easily removed without damaging the conductive line formed in the groove portion.
According to one embodiment of the present invention, the total area of the upper surface of the conductive line may be 0.1% or more and 5% or less of the total area of the upper surface of the resin pattern layer.
If the total area of the upper surface of the conductive line is more than 5% of the total area of the upper surface of the resin pattern layer, the transparency of the conductive laminate may be impaired by the conductive line. In addition, when the total area of the upper surface of the conductive line is less than 0.1% of the total area of the upper surface of the resin pattern layer, the conductive laminate may not secure sufficient conductivity.
According to one embodiment of the present invention, the average of the total thickness of the adhesive force adjusting portion and the conductive line may be 0.01 탆 or more and 2 탆 or less.
According to one embodiment of the present invention, the line width of the conductive line may be 0.1 mu m or more and 3 mu m or less.
The line width of the conductive line and the adhesive force adjusting portion may be determined by the line width of the groove portion and may be equal to or less than the line width of the groove portion.
According to one embodiment of the present invention, the average light transmittance of light in the wavelength range of 400 nm to 700 nm of the resin pattern layer may be more than 80%.
The resin pattern layer can be formed by forming a resin composition layer and then patterning a plurality of trenches using a resin patterning method known in the art, and the method of forming the resin pattern layer is not particularly limited. Considering the simplicity of the process and the manufacturing cost, it is preferable to use the imprinting method.
According to one embodiment of the present invention, the resin pattern layer may comprise one or more resins selected from the group consisting of resins known in the art, for example, a photocurable resin, a thermosetting resin, a conductive polymer resin, . ≪ / RTI > Further, the resin pattern layer can be formed using a single molecule that is polymerized through a photoinitiator.
More specifically, according to one embodiment of the present disclosure, the resin pattern layer is formed of a material selected from the group consisting of urethane acrylate, epoxy acrylate, ester acrylate, polydimethylsiloxane, polyacetylene, polyparaphenylene, polyaniline, , But is not limited thereto.
According to one embodiment of the present disclosure, the conductive lines may be of a shape in which the conductive lines of the stripe shape or the stripe shape intersect in a lattice shape.
According to one embodiment of the present disclosure, the conductive line comprises a metal layer; A conductive metal oxide layer; A conductive polymer layer, and a conductive polymer layer.
According to an embodiment of the present invention, the metal layer may include Ag, Au, Cu, Al, Mo, Ti, Nd, Pd, Bi, Sn, Ni or an alloy of two or more thereof.
According to an embodiment of the present invention, the conductive metal oxide layer may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), Al-doped ZnO, AZO ZnO), SnO 2, and ZnO.
According to an embodiment of the present invention, the conductive polymer layer may include poly (3,4-ethylenedioxythiophene) and / or poly (3,4-ethylenedioxythiophene) -poly (styrenesulfonate) .
According to one embodiment of the present invention, the adhesion control layer may include at least one selected from the group consisting of metal oxides, metal nitrides, and metal oxynitrides. Specifically, according to one embodiment of the present invention, the adhesion-force control layer includes a metal oxide, a metal nitride, and a metal oxide including at least one metal selected from the group consisting of Si, Al, Cu, Zn Ag, Fe, / ≪ / RTI > metal oxynitride. More specifically, according to one embodiment of the present invention, the adhesion-force control layer may include at least one or more of SiN, SiO 2, and Al 2 O 3 .
According to one embodiment of the present invention, the thickness of the adhesive force adjusting portion may be 0.005 탆 or more and 0.3 탆 or less.
When the thickness of the adhesive force adjusting portion is 0.005 mu m or more and 0.3 mu m or less, uniformity of the film can be ensured, and the thickness of the conductive line in the groove can be maximized to minimize the increase in resistance.
The thickness of the adhesive force adjusting portion means the total thickness of the adhesive force adjusting portion, and in the case of a multi-layer structure, it means the total thickness of the multi-layered adhesive force adjusting portion.
According to one embodiment of the present disclosure, the thickness of the conductive line may be 0.005 mu m or more and 2 mu m or less.
When the thickness of the conductive line is 0.005 탆 or more and 2 탆 or less, uniformity of the film can be ensured and excellent electric conductivity can be ensured.
The thickness of the conductive line means the total thickness of the conductive lines, and in the case of a multi-layer structure, it means the total thickness of the multi-layer.
According to an embodiment of the present invention, the light reflection reduction layer may further include an optical reflection reduction layer provided on the conductive line and having an average light absorption rate of 50% or more and 100% or less in a light having a wavelength of 400 nm to 700 nm.
According to one embodiment of the present invention, the light reflection reducing layer may include at least one selected from the group consisting of a carbon compound, a metal, a metal oxide, a metal nitride, and a metal oxynitride. Specifically, according to one embodiment of the present invention, the light reflection reducing layer may include at least one selected from the group consisting of a carbon compound, a metal, a metal oxide, a metal nitride, and a metal oxynitride as a main material.
According to an embodiment of the present invention, the metal, the metal oxide, the metal nitride, and the metal oxynitride are one or two selected from the group consisting of Cu, Al, Mo, Ti, Ag, Ni, Mn, Au, Or more.
According to an embodiment of the present invention, the thickness of the light reflection reducing layer may be 0.01 μm or more and 0.5 μm or less. Specifically, the thickness of the light reflection reducing layer may be 0.02 占 퐉 or more and 0.3 占 퐉 or less, more specifically 0.02 占 퐉 or more and 0.2 占 퐉 or less. When the thickness of the light reflection reducing layer is not less than 0.01 탆 and not more than 0.5 탆, film formation is smooth and sufficient light reflection reducing effect can be exhibited.
According to an embodiment of the present invention, the conductive laminate may further include a planarization layer provided on the resin pattern layer and the conductive line.
The planarization layer can prevent oxidation of the conductive line, improve the scratch resistance of the conductive laminate, and minimize light scattering due to the shape of the resin pattern layer.
4 is a side cross-sectional view of a conductive laminate according to an embodiment of the present invention. 4 illustrates the adhesive
According to an embodiment of the present invention, the difference between the refractive index of the planarizing layer and the refractive index of the resin pattern layer may be 0.1 or less.
According to an embodiment of the present invention, the planarization layer is formed of a material having a refractive index difference of 0.1 or less with respect to the resin pattern layer-forming material. When the refractive index difference between the planarization layer and the resin pattern layer is increased, light is refracted, reflected, or scattered while being transmitted, and haze is generated. As a result, transparency may be lowered.
According to one embodiment of the present disclosure, the planarization layer may be formed using a transparent adhesive, a pressure-sensitive adhesive, or a UV resin.
According to an embodiment of the present invention, the conductive laminate further includes a substrate provided below the resin pattern layer.
The substrate may be a substrate having excellent transparency, surface smoothness, ease of handling, and waterproofness. Specifically, a glass substrate, a thin film glass substrate, or a transparent plastic substrate can be used. The plastic substrate may include films such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PEEK (polyether ether ketone), PC (poly carbonate), cellulose and PI (polyimide) in a single layer or a multilayer. In addition, the substrate may have a light scattering function in the substrate itself. However, the substrate is not limited thereto, and a substrate commonly used in an electronic device can be used.
According to an embodiment of the present invention, the difference between the refractive index of the substrate and the refractive index of the resin pattern layer may be 0.3 or less. When the difference between the refractive index of the substrate and the refractive index of the resin pattern layer increases, the light is refracted, reflected, or scattered while being transmitted through, resulting in haze, and as a result, transparency may be deteriorated.
According to one embodiment of the present invention, the sheet resistance of the conductive laminate may be 0.01 Ω / □ or more and 100 Ω / □ or less.
One embodiment of the present disclosure provides an electrode comprising the conductive laminate.
In addition, one embodiment of the present disclosure provides an electronic device including the electrode. Specifically, the electronic device may be a touch panel, a light emitting glass, a light emitting device, a solar cell, or a transistor.
The touch panel, the light emitting glass, the light emitting device, the solar cell, and the transistor may be those generally known in the art.
101: Groove
201: convex pattern portion
301: Adhesion force adjusting section
401: Conductive line
501: planarization layer
601: Additional layer
Claims (21)
A conductive line provided on the trench;
And an adhesive force adjusting unit provided between the groove and the conductive line in contact with the groove,
The average light transmittance of light in the wavelength range of 400 nm to 700 nm of the adhesive force controlling portion is more than 80%
The adhesion force between the adhesive force adjusting portion and the resin pattern layer is larger than the adhesive force between the adhesive force adjusting portion and the conductive line,
Wherein the total thickness of the adhesive force adjusting portion and the conductive line is 5% or more and 50% or less of the maximum depth of the groove portion.
And an additional layer provided in contact with the convex pattern portion and made of the same material as the adhesion force adjusting portion.
Wherein the adhesive force adjusting portion and the conductive line are each a single layer or a multilayer structure.
Wherein a side surface of the groove portion forms an inclination angle of 15 degrees or more and 15 degrees or less with respect to a vertical direction of the lower end surface of the resin pattern layer.
The maximum width of the groove portion is not less than 0.1 mu m and not more than 3 mu m,
And the maximum depth of the groove portion is 0.2 times or more and 2 times or less the maximum width of the groove portion.
Wherein the total area of the upper surface of the conductive line is 0.1% or more and 5% or less of the total area of the upper surface of the resin pattern layer.
Wherein the average of the total thickness of the adhesive force adjusting portion and the conductive line is 0.01 占 퐉 or more and 2 占 퐉 or less.
Wherein a line width of the conductive line is 0.1 占 퐉 or more and 3 占 퐉 or less.
Wherein the resin pattern layer has an average light transmittance of more than 80% at a wavelength of 400 nm to 700 nm.
The conductive line comprising a metal layer; A conductive metal oxide layer; And at least one layer selected from the group consisting of a conductive polymer layer and a conductive polymer layer.
Wherein the thickness of the adhesive force adjusting portion is 0.005 mu m or more and 0.3 mu m or less.
Wherein the conductive line has a thickness of 0.005 mu m or more and 2 mu m or less.
Further comprising a light reflection reduction layer provided on the conductive line and having an average light absorption rate of 50% or more and 100% or less in light of a wavelength of 400 nm to 700 nm.
Wherein the thickness of the light reflection reducing layer is 0.01 占 퐉 or more and 0.5 占 퐉 or less.
Wherein the conductive laminate further comprises a planarization layer provided on the resin pattern layer and the conductive line.
Wherein the difference between the light refractive index of the planarizing layer and the light refractive index of the resin pattern layer is 0.1 or less.
Wherein the conductive laminate further comprises a substrate provided below the resin pattern layer.
Wherein a difference between a light refractive index of the substrate and a light refractive index of the resin pattern layer is 0.3 or less.
Wherein the sheet resistance of the conductive laminate is 0.01? /? And 100? /? Or less.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140119011 | 2014-09-05 | ||
| KR20140119011 | 2014-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160029716A true KR20160029716A (en) | 2016-03-15 |
| KR101748033B1 KR101748033B1 (en) | 2017-06-15 |
Family
ID=55542211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150125701A KR101748033B1 (en) | 2014-09-05 | 2015-09-04 | Conductive laminate, electrode and electric device comprising the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101748033B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102629350B1 (en) | 2018-12-12 | 2024-01-25 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100007605A (en) | 2008-07-14 | 2010-01-22 | 주식회사 엘지화학 | Conductive laminate and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003198184A (en) * | 2001-12-25 | 2003-07-11 | Dainippon Printing Co Ltd | Electromagnetic wave shielding sheet and method for manufacturing the same |
| KR100922810B1 (en) * | 2007-12-11 | 2009-10-21 | 주식회사 잉크테크 | A method for fabricating blackened conductive patterns |
-
2015
- 2015-09-04 KR KR1020150125701A patent/KR101748033B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100007605A (en) | 2008-07-14 | 2010-01-22 | 주식회사 엘지화학 | Conductive laminate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101748033B1 (en) | 2017-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102458678B1 (en) | Flexible display apparatus | |
| TWI459449B (en) | Stacked structure for touch panel | |
| KR102545420B1 (en) | Touch sensor integrated with oled and oled display device comprising the same | |
| KR101879220B1 (en) | Transparent electrode pattern structure and touch screen panel having the same | |
| CN105446508A (en) | Touch control display device | |
| CN112068740A (en) | Touch window and touch device | |
| TWI545594B (en) | Transparent conductive film | |
| KR101865685B1 (en) | Transparent electrode pattern structure and touch screen panel having the same | |
| CN205594603U (en) | Touch panel | |
| CN103364941A (en) | Display device and fabricating method thereof | |
| EP2966549B1 (en) | Electrode member and touch window including the same | |
| CN107850959B (en) | Conductive structure, manufacturing method thereof, touch panel comprising conductive structure and display device comprising conductive structure | |
| CN104777951A (en) | Touch panel | |
| CN106575187A (en) | Touch window | |
| KR102430032B1 (en) | Transparent electrode laminate and method of fabricating the same | |
| CN105204694B (en) | Nano-silver thread touch panel | |
| KR102040647B1 (en) | Oled display device having touch sensor and method of fabricating the same | |
| KR20120110885A (en) | Touch sensor intergrated with a polarizer and display device comprising the same | |
| KR101748033B1 (en) | Conductive laminate, electrode and electric device comprising the same | |
| KR102108828B1 (en) | Electrode Plate and Electrochomic Mirror Using the Same | |
| KR102100534B1 (en) | Conductive structure body and method for manufacturing the same | |
| CN203706173U (en) | Touch control display module and touch control screen thereof | |
| CN203930766U (en) | Nano-silver thread contact panel | |
| KR20170090895A (en) | Superb optical characteristics silver nanowire, coating film and preparing method of the same | |
| JP2016057712A (en) | Transparent electrode pattern laminate and touchscreen panel including the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |