CN207289168U - A kind of system for laser machining hot melt adhesive - Google Patents

A kind of system for laser machining hot melt adhesive Download PDF

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Publication number
CN207289168U
CN207289168U CN201720972081.0U CN201720972081U CN207289168U CN 207289168 U CN207289168 U CN 207289168U CN 201720972081 U CN201720972081 U CN 201720972081U CN 207289168 U CN207289168 U CN 207289168U
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CN
China
Prior art keywords
laser
hot melt
melt adhesive
adhesive tape
path
Prior art date
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Expired - Fee Related
Application number
CN201720972081.0U
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Chinese (zh)
Inventor
王长征
李超
黄升友
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Dongguan Johnson Environmental Protection Packaging Material Co Ltd
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Dongguan Johnson Environmental Protection Packaging Material Co Ltd
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Priority to CN201720972081.0U priority Critical patent/CN207289168U/en
Application granted granted Critical
Publication of CN207289168U publication Critical patent/CN207289168U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model embodiment is related to field of laser processing, discloses a kind of system for laser machining hot melt adhesive, including:Frock clamp, the frock clamp clamps mobile phone glass screen, mobile phone frame and Hot melt adhesive tape, and pressurization is fixed;CCD camera for the paste position for obtaining the mobile phone frame and the Hot melt adhesive tape, is arranged at the top of the frock clamp;Laser;For planning the processor in the path of laser irradiation according to the paste position, it is electrically connected with the CCD camera and galvanometer scanning device;Galvanometer scanning device, including X galvanometers and Y galvanometers, the X galvanometers and Y galvanometers are arranged on the path of laser propagation.Through the above way, the utility model embodiment can realize that zero-waiting is processed, and can realize that laser is accurately irradiated on Hot melt adhesive tape by path planning, and frame can be made to reach the effect of narrower in width, the quality of production and efficiency are improved, reduces production cost.

Description

A kind of system for laser machining hot melt adhesive
Technical field
The utility model embodiment is related to field of laser processing, and what it is more particularly to a kind of Laser Processing hot melt adhesive is System.
Background technology
Since touch-screen mobile phone is born, border width just becomes the big key factor for influencing visual effect, with system The continuous development of technique is made, cell phone manufacturer has used diversified technological means to manufacture narrow frame mobile phone.Therein one Kind technological means is to reduce the width of mobile phone frame adhesive, and frame adhesive is hot melt glue.
The foam base plate of hot melt adhesive part is thicker, and material is softer, although wherein cutter cross cutting can be by frame adhesive band Cut out the width of 0.5mm or so, but the method for existing processing mobile phone frame hot melt adhesive is pressure sintering, its side for below 1mm Frame glue can not accomplish finely to paste alignment, it needs external heat after pasting alignment and carry out prolonged pressurization to fix, during pressurize Between be 6-8h, process time is longer, and each mobile phone workpiece needs a dull moulds of industrial equipment, adds substantial amounts of industrial production Cost.
Utility model content
The utility model embodiment is mainly solving the technical problems that provide a kind of system for laser machining hot melt adhesive, energy Enough solve the problems, such as that the stand-by period is long during the processing of mobile phone frame, frame is wider.
In order to solve the above technical problems, the technical solution that the utility model embodiment uses is:There is provided a kind of sharp The system that light processes hot melt adhesive, including:Frock clamp, the frock clamp clamp mobile phone glass screen, mobile phone frame and hot melt adhesive Band, and pressurization is fixed;CCD camera for the paste position for obtaining the mobile phone frame and the Hot melt adhesive tape, is set In the top of the frock clamp;Laser;For planning the processor in the path of laser irradiation according to the paste position, It is electrically connected with the CCD camera and galvanometer scanning device;Galvanometer scanning device, including X galvanometers and Y galvanometers, the X galvanometers and Y Galvanometer is arranged on the path of laser propagation, and the X galvanometers and Y galvanometers include scan module and optical reflecting lens, described Scan module is connected with the optical reflecting lens, and the scan module is electrically connected with the processor, and the scanning electricity Machine can drive the optical reflecting lens to carry out yaw motion so that laser beam along the path that the laser irradiates to the hot melt Adhesive tape, which is irradiated, melts the Hot melt adhesive tape.
Preferably, the processor includes generating the generation module of position coordinates and according to described according to the paste position Position coordinates, cooks up the planning module in the path of laser irradiation, and the generation module is connected with the planning module.
Preferably, the equipment further includes:Collimator apparatus, is arranged on the path of laser propagation, and is located at the laser Between device and the galvanometer scanning device;Focusing arrangement, is arranged on the path of laser propagation, and is filled positioned at the vibration mirror scanning Put between the Hot melt adhesive tape.
Preferably, the equipment further includes:Light source, is arranged above the Hot melt adhesive tape, and positioned at the CCD camera and Between Hot melt adhesive tape.
The beneficial effect of the utility model embodiment is:It is different from the situation of the prior art, the utility model embodiment party Formula provides a kind of system for laser machining hot melt adhesive, and the paste position of mobile phone frame and Hot melt adhesive tape is got by CCD camera, Then processor according to this paste position carry out planning laser irradiate path, make galvanometer scanning device by laser beam according to Path Hot melt adhesive tape is irradiated and melted, and whole process is all fast and accurate progress, realizes that zero-waiting is processed, And it can realize that laser is accurately irradiated on Hot melt adhesive tape by path planning, frame can be made to reach the effect of narrower in width Fruit, improves the quality of production and efficiency, reduces production cost.
Brief description of the drawings
, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing is briefly described needed in description, it should be apparent that, drawings in the following description are only that this practicality is new Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of schematic diagram of system for laser machining hot melt adhesive provided by the utility model.
Embodiment
For the ease of understanding the utility model, with reference to the accompanying drawings and detailed description, the utility model is carried out more Detailed description.It should be noted that when element is expressed " being fixed on " another element, it can be directly in another element Above or therebetween there may be one or more elements placed in the middle.When an element is expressed " connection " another element, it can To be directly to another element or there may be one or more elements placed in the middle therebetween.This specification is used Term " vertical ", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, the skill of technical and scientific term all used in this specification with belonging to the utility model The normally understood implication of technical staff in art field is identical.In the art used in the description of the utility model in this specification Language is intended merely to the purpose of description specific embodiment, is not intended to limitation the utility model.Art used in this specification Language "and/or" includes the arbitrary and all combination of one or more relevant Listed Items.
The method of Laser Processing hot melt adhesive provided by the utility model can be applied to screen and the side of any mobile terminal The processing bonded between frame, is not limited only to the processing bonded between the screen of mobile phone and frame, the type of the mobile terminal Including but not limited to:Mobile phone, tablet computer, intelligent watch and laptop etc., in the utility model embodiment, merely with Mobile phone is illustrated.
Referring to Fig. 1, the schematic diagram of the system for the Laser Processing hot melt adhesive that the utility model embodiment provides, the system Including:Frock clamp 31, for clamp mobile phone glass screen, mobile phone frame and be pasted on the mobile phone glass screen and mobile phone frame it Between Hot melt adhesive tape, and pressurization is fixed;CCD camera 32, is arranged at the top of the frock clamp 21, described for obtaining The paste position of mobile phone frame and the Hot melt adhesive tape;Laser 33, for it is counter go out laser, make Hot melt adhesive tape heating fusing;Place Manage device(It is not shown), it is electrically connected with the CCD camera 32 and galvanometer scanning device, for according to the paste position, cooking up Path after planning is simultaneously sent to the galvanometer scanning device 34 by the path of laser irradiation;Galvanometer scanning device 34, including X shake Mirror and Y galvanometers are arranged on the path of laser propagation, and the X galvanometers and Y galvanometers include scan module and optical reflecting lens, The scan module is connected with the optical reflecting lens, and the scan module is electrically connected with the processor, and described is swept Retouching motor can drive the optical reflecting lens to carry out yaw motion, for making laser beam along the path that the laser irradiates to institute State Hot melt adhesive tape to be irradiated, and melt the Hot melt adhesive tape.
Wherein, the pixel of CCD camera 32 is higher than the pixel of other general cameras, can accurately be caught using CCD camera 32 Paste position is grasped, the paste position for obtaining the mobile phone frame and Hot melt adhesive tape is to concentrate to the paste position Handled, and be also prevented from processing procedure by mistake destroying other positions, add cost.
After CCD camera 32 captures paste position, the paste position is sent on processor, processor is according to The position of paste position and laser, plans the route of laser irradiation, and carrying out path planning using processor can be fast Speed, accurately plan outbound path, so saves the time, and improve work efficiency.After processor has planned path, by road Footpath is sent to galvanometer scanning device, and galvanometer scanning device is moved according to the path, so as to launch light beam in laser The paste position can be accurately irradiated to when passing through galvanometer scanning device.
The galvanometer scanning device 34 has the advantages that corresponding speed is fast, movement velocity is fast and kinematic accuracy is high, is being connected to Behind the path of processor, it can be rapidly performed by operating, save the time, improve work efficiency.
The hot melt adhesive is Thermoplastic hot melt glue, i.e., can soften flowing when the hot melt adhesive heats, be hardened after cooling, and can To be repeated.After laser irradiation hot melt adhesive causes it all to melt, laser stops heating.After laser 33 stops irradiation, The hot melt adhesive of fusing can condense, and mobile phone frame and mobile phone glass screen can be firmly bonded at this time, if it find that mobile phone frame and hand The bonding of machine glass screen is bad, can be again started up laser and be irradiated, hot melt adhesive is melted, cause mobile phone frame and Mobile phone glass screen is firmly bonded together.
In the utility model embodiment, the paste position of mobile phone frame and Hot melt adhesive tape is got by CCD camera, so Preprocessor carries out the path of planning laser irradiation according to this paste position, makes galvanometer scanning device by laser beam according to road Footpath Hot melt adhesive tape is irradiated and melted, and whole process is all fast and accurate progress, realizes that zero-waiting is processed, and And can realize that laser is accurately irradiated on Hot melt adhesive tape by path planning, frame can be made to reach the effect of narrower in width Fruit, improves the quality of production and efficiency, reduces production cost.
Specifically, the processor includes generating the generation module of position coordinates and according to described according to the paste position Position coordinates, cooks up the planning module in the path of laser irradiation, and the generation module is connected with the planning module.
The path cooked up is the path that laser 33 arrives the paste position, and the coordinate of laser 33 is to be previously recorded in In processor, after CCD camera 32 gets paste position, generation position coordinates is located, then sends out position coordinates Processor is given, processor carries out path planning according to coordinate.
Further, the system also includes:Collimator apparatus 35, is arranged on the path of laser propagation, and positioned at described Between laser and the galvanometer scanning device, for carrying out collimation processing to the laser sent, to improve the transmission of laser spy Property and focus characteristics;
Focusing arrangement 36, is arranged on the path of laser propagation, and is located at the galvanometer scanning device and the hot melt adhesive Between band, for making laser beam consistent in the laser facula characteristic of a certain flat focus to point, laser beam is set to carry out Voice segment;
Light source 37, is arranged above the Hot melt adhesive tape, and between the CCD camera 32 and Hot melt adhesive tape, is used for Polishing illumination is carried out to the Hot melt adhesive tape.
It should be noted that in the utility model embodiment, the laser 31 used for optical fiber laser, and In other alternate embodiments, laser can also be other types laser.
Further, the system also includes:Electric control system 38, the electric control system connect with laser 31 Connect, for providing power supply to laser 31, control the way of output of laser beam.
The operation principle of the utility model embodiment:CCD camera 32 is first to the hand on frock clamp 31 The paste position of machine frame and the Hot melt adhesive tape is caught, and then the paste position captured is sent on processor, Processor carries out analysis calculating to paste position, the path that laser 31 arrives the paste position is cooked up, by the road after planning Footpath is sent to galvanometer scanning device 34, X galvanometers and Y galvanometers in galvanometer scanning device 34, the scanning electricity in X galvanometers and Y galvanometers Machine drives optical reflecting lens to carry out yaw motion so that X galvanometers and Y galvanometers run to phase according to the paste position respectively Position is answered, starts laser 31, laser 31 launches laser beam, and collimator apparatus 35 carries out collimation processing to laser beam, then swashs Light beam is irradiated on galvanometer scanning device 34, makes laser beam along pre-designed path by the deflection of X galvanometers and Y galvanometers Into horizontal deflection, focusing arrangement 36 causes laser beam to be accurately irradiated to the position of required stickup, i.e. heat laser beam focus processing On melten gel band, melt Hot melt adhesive tape, after Hot melt adhesive tape is completely melt, laser stops irradiation, after Hot melt adhesive tape condensation Mobile phone frame and mobile phone glass screen is set to be fully bonded to together.
In the utility model embodiment, by getting the paste position of mobile phone frame and Hot melt adhesive tape, then basis This paste position carries out the path of planning laser irradiation, makes laser beam according to path Hot melt adhesive tape is irradiated and melted Change, and whole process is all fast and accurate progress, realizes that zero-waiting is processed, and can be realized by path planning sharp Light is accurately irradiated on Hot melt adhesive tape, and frame can be made to reach the effect of narrower in width, improves the quality of production and efficiency, drop Low production cost.
The foregoing is merely the embodiment of the utility model, it does not limit the scope of the patent of the present invention, all It is equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, directly or indirectly uses In other related technical areas, it is equally included in the patent within the scope of the utility model.

Claims (4)

  1. A kind of 1. system for laser machining hot melt adhesive, it is characterised in that including:
    Frock clamp, the frock clamp clamps mobile phone glass screen, mobile phone frame and Hot melt adhesive tape, and pressurization is fixed;
    CCD camera for the paste position for obtaining the mobile phone frame and the Hot melt adhesive tape, is arranged at the frock clamp Top;
    Laser;
    For planning the processor in the path of laser irradiation according to the paste position, with the CCD camera and vibration mirror scanning Device is electrically connected;
    Galvanometer scanning device, including X galvanometers and Y galvanometers, the X galvanometers and Y galvanometers are arranged on the path of laser propagation, described X galvanometers and Y galvanometers include scan module and optical reflecting lens, and the scan module is connected with the optical reflecting lens, The scan module is electrically connected with the processor, and the scan module can drive the optical reflecting lens into horizontal deflection Movement, melts the Hot melt adhesive tape so that laser beam is irradiated the Hot melt adhesive tape along the path that the laser irradiates.
  2. 2. system according to claim 1, it is characterised in that
    The processor includes generating the generation module of position coordinates and according to the position coordinates, rule according to the paste position The planning module in the path of laser irradiation is marked, the generation module is connected with the planning module.
  3. 3. system according to claim 2, it is characterised in that the system also includes:
    Collimator apparatus, is arranged on the path of laser propagation, and between the laser and the galvanometer scanning device;
    Focusing arrangement, is arranged on the path of laser propagation, and between the galvanometer scanning device and the Hot melt adhesive tape.
  4. 4. system according to claim 1, it is characterised in that the system also includes:
    Light source, is arranged above the Hot melt adhesive tape, and between the CCD camera and Hot melt adhesive tape.
CN201720972081.0U 2017-08-06 2017-08-06 A kind of system for laser machining hot melt adhesive Expired - Fee Related CN207289168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720972081.0U CN207289168U (en) 2017-08-06 2017-08-06 A kind of system for laser machining hot melt adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720972081.0U CN207289168U (en) 2017-08-06 2017-08-06 A kind of system for laser machining hot melt adhesive

Publications (1)

Publication Number Publication Date
CN207289168U true CN207289168U (en) 2018-05-01

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109664017A (en) * 2018-12-25 2019-04-23 中国科学院西安光学精密机械研究所 Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning
CN111286278A (en) * 2020-02-19 2020-06-16 闻泰通讯股份有限公司 Flexible screen bonding method and electronic equipment
CN111468821A (en) * 2020-04-16 2020-07-31 大族激光科技产业集团股份有限公司 Laser heating device and method for hot melt adhesive tape
CN112756938A (en) * 2021-01-20 2021-05-07 深圳市鑫镭创科自动化科技有限公司 Double-beam laser screen-disassembling method and device based on mobile phone software control

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109664017A (en) * 2018-12-25 2019-04-23 中国科学院西安光学精密机械研究所 Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning
CN111286278A (en) * 2020-02-19 2020-06-16 闻泰通讯股份有限公司 Flexible screen bonding method and electronic equipment
CN111468821A (en) * 2020-04-16 2020-07-31 大族激光科技产业集团股份有限公司 Laser heating device and method for hot melt adhesive tape
CN112756938A (en) * 2021-01-20 2021-05-07 深圳市鑫镭创科自动化科技有限公司 Double-beam laser screen-disassembling method and device based on mobile phone software control
CN112756938B (en) * 2021-01-20 2022-05-06 深圳市鑫镭创科自动化科技有限公司 Double-beam laser screen-disassembling method and device based on mobile phone software control

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20180501

Termination date: 20180806