CN111468821A - Laser heating device and method for hot melt adhesive tape - Google Patents

Laser heating device and method for hot melt adhesive tape Download PDF

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Publication number
CN111468821A
CN111468821A CN202010299414.4A CN202010299414A CN111468821A CN 111468821 A CN111468821 A CN 111468821A CN 202010299414 A CN202010299414 A CN 202010299414A CN 111468821 A CN111468821 A CN 111468821A
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CN
China
Prior art keywords
adhesive tape
plate
hot melt
melt adhesive
module
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Granted
Application number
CN202010299414.4A
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Chinese (zh)
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CN111468821B (en
Inventor
代雨成
曹洪涛
金艳丽
黄旭升
刘亮
杨柯
吕启涛
胡述旭
姚瑶
肖海
郭丽
高云峰
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Han s Laser Technology Industry Group Co Ltd
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Han s Laser Technology Industry Group Co Ltd
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Priority to CN202010299414.4A priority Critical patent/CN111468821B/en
Publication of CN111468821A publication Critical patent/CN111468821A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Abstract

The embodiment of the invention is suitable for the technical field of laser heating, and provides a laser heating device and a laser heating method for a hot melt adhesive tape, wherein the laser heating device comprises the following steps: base, elevating system, X axle moving platform, laser system, pre-compaction module, malleation module and pressure regulation module, laser system installs on elevating system, pre-compaction module and malleation module setting are on X axle moving platform, pre-compaction module is used for pre-compaction hot melt adhesive tape and glass apron together, glass apron and hot melt adhesive tape pre-compaction are accomplished the back, and the malleation module compresses tightly the frame in another bonding side of hot melt adhesive tape, and pressure regulation module is used for adjusting hot melt adhesive tape and glass apron pressfitting and hot melt adhesive tape and the pressure of frame pressfitting. Through the stable pressure supply of pre-compaction module and malleation module, laser provides and lasts stable heating, makes frame and glass apron bond under the effect of hot melt adhesive tape and reach harmless high-efficient stable laser heating effect together.

Description

Laser heating device and method for hot melt adhesive tape
Technical Field
The invention belongs to the technical field of laser heating, and particularly relates to a laser heating device and method for a hot melt adhesive tape.
Background
In the consumer electronics industry, glue dispensing is a common process, and is used for bonding a horn mouth, a key, a plastic layer of a middle frame of a mobile phone and the like, and the glue is bonded in a heating curing mode and the like after the glue dispensing, and in practical application, the two problems exist, namely 1) glue is low in viscosity and easy to overflow, laser removal is needed after the glue overflow, and a process flow is added invisibly; 2) the heating solidification is generally indirect conduction heating, the requirement on a heating head is higher, and the feedback of a temperature monitoring mechanism is slow, so the heating effect is poor, and the phenomenon of 'cold joint' is easy to occur.
The hot melt adhesive tape has the advantages of reliable viscosity, extremely high push-out resistance and peeling strength, extremely high anti-seismic performance and the like, so that the hot melt adhesive tape has wide application space in the consumer electronics industry and has the possibility of replacing a dispensing process. However, the hot melt adhesive has no adhesiveness in the solid state, and how to activate the performance of the hot melt adhesive and achieve the optimal adhesion process has always prevented the application of the hot melt adhesive in the consumer electronics industry.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a device and a method for heating a hot melt adhesive tape by using a laser, which aim to activate the performance of the hot melt adhesive tape and achieve a better bonding effect.
The embodiment of the invention is realized in such a way that a hot melt adhesive tape laser heating device is used for heating a hot melt adhesive tape to complete the bonding of a frame and a glass cover plate, and comprises the following components: the device comprises a base, a lifting mechanism, an X-axis moving platform, a laser system, a pre-pressing module, a positive pressure module and a pressure adjusting module, wherein the lifting mechanism, the X-axis moving platform and the pressure adjusting module are installed on the top surface of the base;
the prepressing module and the positive pressure module are arranged on the X-axis moving platform, the X-axis moving platform drives the prepressing module and the positive pressure module to move to the heating range of the laser system along the X-axis direction, the prepressing module is used for prepressing the hot melt adhesive tape and the glass cover plate together, after the prepressing of the glass cover plate and the hot melt adhesive tape is completed, the positive pressure module compresses the frame on the other bonding side of the hot melt adhesive tape, the laser system is used for heating the hot melt adhesive tape and the hot melt adhesive tape when the hot melt adhesive tape and the frame are pressed, and the pressure adjusting module is used for adjusting the pressure of the hot melt adhesive tape and the glass cover plate and the hot melt adhesive tape and the frame.
Further, hot melt adhesive tape laser heating device still includes temperature monitoring module and industry control display system, the temperature monitoring module with industry control display system fixes on the base, the temperature monitoring module sets up elevating system side, the temperature monitoring module is used for monitoring the temperature of laser system laser heating region, thereby industry control display system is used for adjusting laser parameter control laser heating's temperature.
Furthermore, laser system includes laser instrument, beam expanding lens, shakes camera lens and focusing lens, the laser instrument is used for transmitting laser, laser passes the beam expanding lens, and the warp shake the camera lens reflection after shine focusing lens, the warp see through behind the focusing lens glass apron and focus the facula and be in on the hot melt adhesive tape.
Further, the pre-pressing module comprises a first adjusting plate, a first support, a pre-pressing adsorption plate, a first transfer plate, a first air cylinder and a tape adsorption plate;
the first adjusting plate is provided with two first adjusting plates, the two first adjusting plates are oppositely arranged on the X-axis moving platform, the first support column is vertically fixed on the first adjusting plate, the pre-pressing adsorption plate is fixed at the top of the first support column, the first support column supports the pre-pressing adsorption plate, a first vacuum cavity is arranged in the pre-pressing adsorption plate, the first vacuum cavity is connected with a pneumatic component, the first vacuum cavity generates vacuum through the pneumatic component and adsorbs the glass cover plate at the bottom of the pre-pressing adsorption plate, the first transfer plate is fixed on one side of the pre-pressing adsorption plate, the first air cylinder is fixed on the first transfer plate, the adhesive tape adsorption plate is fixed at the bottom of the first air cylinder, the adhesive tape adsorption plate extends to the bottom of the glass cover plate, and the adhesive tape adsorption plate adsorbs the hot-melting adhesive tape, the first air cylinder drives the adhesive tape adsorption plate to move up and down and tightly press the hot-melt adhesive tape at the bottom of the glass cover plate.
Further, the positive pressure module comprises a second adjusting plate, a second support, a positive pressure adsorption plate, a second adapter plate, a second air cylinder and a positive pressure head;
the two second adjusting plates are arranged on the X-axis moving platform oppositely, the second support column is vertically fixed on the second adjusting plate, the positive pressure adsorption plate is fixed at the top of the second support column and supports the positive pressure adsorption plate, a second vacuum cavity is arranged in the positive pressure adsorption plate, the second vacuum cavity is connected with a pneumatic component, the second vacuum cavity generates vacuum through the pneumatic component and adsorbs the glass cover plate at the bottom of the positive pressure adsorption plate, the second adapter plate is fixed on one side of the positive pressure adsorption plate, the second air cylinder is fixed on the second adapter plate, the positive pressure head is fixed at the bottom of the second air cylinder and extends to the bottom of the glass cover plate, a groove is formed in the top surface of the positive pressure head, and the frame is placed in the groove, and the second cylinder drives the positive pressure head to move up and down and tightly press the frame on the other bonding side of the hot melt adhesive tape.
Further, the pressure adjusting module comprises a mounting plate, a pre-pressing air pressure adjusting valve and a positive pressure air pressure adjusting valve;
the vertical setting of mounting panel is in the base top surface, pre-compaction air pressure regulating valve and malleation air pressure regulating valve are fixed on the face of mounting panel, pre-compaction air pressure regulating valve with the tube coupling of first cylinder, malleation air pressure regulating valve with the tube coupling of second cylinder.
Further, the temperature monitoring module comprises a support, a Y-axis adjusting plate, a Z-axis adjusting plate, a fixing plate and an infrared camera;
the support is vertical to be fixed on the base, the Z axle regulating plate can be installed from top to bottom on the support, the Z axle regulating plate extends along Y axle direction, the Y axle regulating plate can be installed along Y axle direction with adjusting on the Z axle regulating plate, the Y axle regulating plate with the face of Z axle regulating plate is perpendicular, the fixed plate can be followed Y axle regulating plate face is installed with rotating on the Y axle regulating plate, infrared camera fixes on the Y axle regulating plate, infrared camera's camera lens is aimed at the laser heating region.
Further, a hot melt adhesive tape laser heating method applied to the hot melt adhesive tape laser heating device in the scheme is provided, and the method comprises the following steps:
the pre-pressing module pre-presses the hot melt adhesive tape and the glass cover plate together, and the pressure adjusting module adjusts pre-pressing pressure for pre-pressing the hot melt adhesive tape and the glass cover plate;
the X-axis moving platform drives the pre-pressing module to move to a heating range of the laser system, and laser emitted by the laser system penetrates through the glass cover plate and heats a hot melting area of the hot melting adhesive tape;
fixing the pre-pressed glass cover plate on the positive pressure module, tearing off a strip-shaped film of the hot melt adhesive tape, pressing the frame on the other bonding side of the hot melt adhesive tape by the positive pressure module, and adjusting the positive pressure pressed by the frame and the hot melt adhesive tape by the pressure adjusting module;
the X-axis moving platform drives the positive pressure module to move to the heating range of the laser system, and laser emitted by the laser system penetrates through the glass cover plate and heats the hot melting area of the hot melting adhesive tape.
Further, the laser that laser system sent sees through the glass apron and heats the hot melt area of hot melt adhesive tape, still includes:
and the control temperature monitoring module monitors the temperature of the laser heating area of the laser system and adjusts laser parameters through the industrial control display system so as to control the laser heating temperature.
Further, the temperature of a laser heating area of the laser system is controlled to be 110 +/-5 ℃, the pre-pressing pressure is controlled to be 0.1-0.2 MPa, and the positive pressure is controlled to be 0.3-0.4 MPa.
Compared with the prior art, the embodiment of the invention has the advantages that: according to the invention, through stable pressure supply of the pre-pressing module and the positive pressure module, the laser provides continuous and stable heating, so that the frame and the glass cover plate are bonded together under the action of the hot melt adhesive tape, and the glass cannot be damaged in the whole process, thereby achieving the lossless, efficient and stable laser heating effect.
Drawings
Fig. 1 is a schematic overall structure diagram of a hot melt adhesive tape laser heating device provided in an embodiment of the present invention;
FIG. 2 is a schematic diagram of the laser system of FIG. 1;
FIG. 3 is a schematic diagram of the temperature monitoring module of FIG. 1;
FIG. 4 is a schematic structural diagram of the pre-pressing module in FIG. 1;
FIG. 5 is a schematic view of a portion of the structure of FIG. 4;
FIG. 6 is a schematic diagram of the overall configuration of the positive pressure module of FIG. 1;
FIG. 7 is a schematic view of a portion of the structure of FIG. 6;
fig. 8 is a schematic structural view of the pressure regulating module of fig. 1.
In the drawings, each reference numeral denotes:
1. a base; 2. a lifting mechanism; 3. an X-axis moving platform; 4. a laser system; 5. a temperature monitoring module; 6. a pre-pressing module; 7. a positive pressure module; 8. a pressure regulation module; 9. an industrial control display system; 100. hot-melting the adhesive tape; 200. a glass cover plate; 300. a frame; 401. a laser; 402. a beam expander; 403. a vibrating lens; 404. a focusing lens; 501. a support; 502. a fixing plate; 503. a Y-axis adjusting plate; 504. a Z-axis adjusting plate; 505. an infrared camera; 601. a first adjusting plate; 602. a first support; 603. pre-pressing an adsorption plate; 604. a first sealing plate; 605. a first transfer plate; 606. a first cylinder; 607. a tape adsorption plate; 701. a second adjusting plate; 702. a second support; 703. a positive pressure adsorption plate; 704. a second sealing plate; 705. a second adapter plate; 706. a second cylinder; 707. a positive pressure ram; 801. mounting a plate; 802. pre-pressing air pressure regulating valve; 803. a positive pressure air pressure regulating valve.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, a laser heating device for a hot melt adhesive tape according to an embodiment of the present invention includes a base 1, a lifting mechanism 2, an X-axis moving platform 3, a laser system 4, a pre-pressing module 6, a positive pressure module 7, and a pressure adjusting module 8, where the lifting mechanism 2, the X-axis moving platform 3, and the pressure adjusting module 8 are installed on the top surface of the base 1, the laser system 4 is installed on the lifting mechanism 2, and the lifting mechanism 2 drives the laser system 4 to move up and down. The base 1 can ensure the stable and rapid movement of the X-axis moving platform 3 and also ensure the stability of laser heating.
Prepressing module 6 and positive pressure module 7 are arranged on X-axis moving platform 3, X-axis moving platform 3 drives prepressing module 6 and positive pressure module 7 to move to the heating range of laser system 4 along the X-axis direction, prepressing module 6 is used for prepressing hot-melt adhesive tape 100 and glass cover plate 200 together, after prepressing of glass cover plate 200 and hot-melt adhesive tape 100 is completed, positive pressure module 7 compresses frame 300 on the other bonding side of hot-melt adhesive tape 100, laser system 4 heats the hot-melt area of hot-melt adhesive tape 100 when hot-melt adhesive tape 100 and glass cover plate 200 are pressed and hot-melt adhesive tape 100 and frame 300 are pressed, and pressure adjusting module 8 is used for adjusting the pressure of hot-melt adhesive tape 100 and glass cover plate 200 pressed and hot-melt adhesive tape 100 and frame 300 pressed. According to the invention, through stable pressure supply of the pre-pressing module 6 and the positive pressure module 7, continuous and stable heating is provided by laser, so that the frame 300 and the glass cover plate 200 are bonded together under the action of the hot melt adhesive tape 100, the glass cannot be damaged in the whole process, and the lossless, efficient and stable laser heating effect is achieved.
Preferably, the hot melt adhesive tape laser heating device of this embodiment still includes temperature monitoring module 5 and industrial control display system 9, and temperature monitoring module 5 and industrial control display system 9 are fixed on base 1, and temperature monitoring module 5 sets up 2 sides at elevating system, and temperature monitoring module 5 is used for monitoring the temperature in the laser heating region of laser system 4, thereby industrial control display system 9 is used for adjusting laser parameter control laser heating's temperature. The pre-pressing module 6 and the positive pressure module 7 provide stable pressure, the laser provides continuous and stable heating, the temperature of the temperature monitoring module 5 is monitored in real time to ensure constant heating temperature, and the conditions of constant temperature and constant pressure within a certain range are achieved, so that the frame 300 and the glass cover plate 200 can be bonded with high quality under the action of the hot melt adhesive tape 100.
Specifically, as shown in fig. 2, the laser system 4 includes a laser 401, a beam expander 402, a vibration lens 403, and a focusing lens 404, the laser 401 is configured to emit laser, the laser passes through the beam expander 402 and is reflected by the vibration lens 403 to irradiate the focusing lens 404, and laser spots with high energy density are generated by the focusing lens 404, and pass through the glass cover 200 and irradiate on the hot melt adhesive tape 100 according to a pre-stored heating document in the industrial control display system 9, the laser system 4 is mounted on the lifting mechanism 2, and the lifting mechanism 2 can adjust the height of the laser system 4 along the Z-axis direction, so that the hot melt adhesive tape 100 is located at the focal point of the focusing lens 404, thereby completing laser heating.
In this embodiment, as shown in fig. 3, the temperature monitoring module 5 includes a support 501, a Y-axis adjusting plate 503, a Z-axis adjusting plate 504, a fixing plate 502, and an infrared camera 505. A support 501 is vertically fixed on a base 1, a Z-axis adjusting plate 504 is vertically adjustably mounted on the support 501, the Z-axis adjusting plate 504 extends along the Y-axis direction, a Y-axis adjusting plate 503 is adjustably mounted on the Z-axis adjusting plate 504 along the Y-axis direction, the Y-axis adjusting plate 503 is perpendicular to the plate surface of the Z-axis adjusting plate 504, a fixing plate 502 is rotatably mounted on the Y-axis adjusting plate 503 along the plate surface of the Y-axis adjusting plate 503, an infrared camera 505 is fixed on the Y-axis adjusting plate 503, and the lens of the infrared camera 505 is aligned with a laser heating area. Preferably, the infrared camera 505 is a long-wave-band camera, the monitorable wave band is 8-14 μm, the infrared camera 505 monitors the temperature of the surface of the glass cover plate 200 in a temperature compensation mode, the monitoring temperature range is-30 ℃ to 250 ℃, the monitoring precision can reach +/-2 ℃, and the temperature of a heating area to be monitored is controlled at 110 +/-5 ℃.
As shown in fig. 4 and 5, the pre-pressing module 6 includes a first adjusting plate 601, a first support 602, a pre-pressing suction plate 603, a first transfer plate 605, a first cylinder 606, and a tape suction plate 607. First regulating plate 601 has two, and two first regulating plate 601 set up relatively on X axle moving platform 3, and first pillar 602 is vertical to be fixed on first regulating plate 601, and pre-compaction adsorption plate 603 is fixed at first pillar 602 top, and first pillar 602 supports pre-compaction adsorption plate 603, and pre-compaction adsorption plate 603 is inside to have a first vacuum cavity, and first vacuum cavity is connected with pneumatic components and parts, and first vacuum cavity produces the vacuum through pneumatic components and parts and adsorbs glass apron 200 in pre-compaction adsorption plate 603 bottom. The top of the pre-pressing adsorption plate 603 is also provided with a first sealing plate 604 for sealing the first vacuum chamber. The first rotating plate 605 is fixed on one side of the pre-pressing adsorption plate 603, the first cylinder 606 is fixed on the first rotating plate 605, the adhesive tape adsorption plate 607 is fixed at the bottom of the first cylinder 606, the adhesive tape adsorption plate 607 extends to the bottom of the glass cover plate 200, the adhesive tape adsorption plate 607 adsorbs the hot melt adhesive tape 100, the first cylinder 606 drives the adhesive tape adsorption plate 607 to move up and down and compress the hot melt adhesive tape 100 at the bottom of the glass cover plate 200, and the bonding of the hot melt adhesive tape 100 and the glass cover plate 200 is completed, namely, the pre-pressing laser heating process.
As shown in fig. 6 and 7, the positive pressure module 7 includes a second adjusting plate 701, a second support 702, a positive pressure adsorption plate 703, a second adapter plate 705, a second cylinder 706, and a positive pressure ram 707. The two second adjusting plates 701 are arranged on the X-axis moving platform 3, the two second adjusting plates 701 are arranged oppositely, the second support column 702 is vertically fixed on the second adjusting plates 701, the positive pressure adsorption plate 703 is fixed at the top of the second support column 702, the second support column 702 supports the positive pressure adsorption plate 703, a second vacuum cavity is formed in the positive pressure adsorption plate 703, the second vacuum cavity is connected with a pneumatic component, and the second vacuum cavity generates vacuum through the pneumatic component and adsorbs the glass cover plate 200 at the bottom of the positive pressure adsorption plate 703. A second sealing plate 704 is disposed on top of the positive pressure adsorption plate 703 to seal the second vacuum chamber. The second adapter plate 705 is fixed on one side of the positive pressure adsorption plate 703, the second cylinder 706 is fixed on the second adapter plate 705, the positive pressure ram 707 is fixed at the bottom of the second cylinder 706, the positive pressure ram 707 extends to the bottom of the glass cover plate 200, the top surface of the positive pressure ram 707 is provided with a groove, the frame 300 is placed in the groove, the second cylinder 706 drives the positive pressure ram 707 to move up and down and compresses the frame 300 on the other bonding side of the hot melt adhesive tape 100, the bonding of the other bonding side and the edge of the hot melt adhesive tape 100 is completed, namely, the positive pressure laser heating process.
Further, as shown in fig. 8, the pressure adjusting module 8 includes a mounting plate 801, a pre-pressure air pressure adjusting valve 802, and a positive pressure air pressure adjusting valve 803. The mounting plate 801 is vertically arranged on the top surface of the base 1, the prepressing air pressure regulating valve 802 and the positive pressure air pressure regulating valve 803 are fixed on the plate surface of the mounting plate 801, the prepressing air pressure regulating valve 802 is connected with a pipeline of the first air cylinder 606, and the positive pressure air pressure regulating valve 803 is connected with a pipeline of the second air cylinder 706. The air cylinder and the air pressure regulating valve can provide stable pressure, the pressure value of pre-pressing is controlled to be 0.1-0.2 MPa, and the pressure of positive pressure is controlled to be 0.3-0.4 MPa.
Further, a hot melt adhesive tape laser heating method applied to the hot melt adhesive tape laser heating device is provided, which comprises the following steps:
the pre-pressing module 6 pre-presses the hot melt adhesive tape 100 and the glass cover plate 200 together, and the pressure adjusting module 8 adjusts the pre-pressing pressure of the pre-pressing of the hot melt adhesive tape 100 and the glass cover plate 200;
the X-axis moving platform 3 drives the pre-pressing module 6 to move to the heating range of the laser system 4, and laser emitted by the laser system 4 penetrates through the glass cover plate 200 and heats the hot melting area of the hot melting adhesive tape 100;
fixing the pre-pressed glass cover plate 200 on the positive pressure module 7, tearing off a strip-shaped film of the hot melt adhesive tape 100, pressing the frame 300 on the other bonding side of the hot melt adhesive tape 100 by the positive pressure module 7, and adjusting the positive pressure pressed by the frame 300 and the hot melt adhesive tape 100 by the pressure adjusting module 8;
the positive pressure module 7 is driven by the X-axis moving platform 3 to move to the heating range of the laser system 4, and the laser emitted by the laser system 4 penetrates through the glass cover plate 200 and heats the hot melting area of the hot melting adhesive tape 100.
Further, the laser emitted by the laser system 4 penetrates through the glass cover 200 and heats the hot-melt area of the hot-melt adhesive tape 100, and further includes:
the temperature monitoring module 5 is controlled to monitor the temperature of the laser heating area of the laser system 4, and the industrial control display system 9 is used for adjusting laser parameters so as to control the laser heating temperature. The pre-pressing module 6 and the positive pressure module 7 provide stable pressure, the laser provides continuous and stable heating, the temperature of the temperature monitoring module 5 is monitored in real time to ensure constant heating temperature, and the conditions of constant temperature and constant pressure within a certain range are achieved, so that the frame 300 and the glass cover plate 200 can be bonded with high quality under the action of the hot melt adhesive tape 100.
In this embodiment, the temperature of the laser heating area of the laser system 4 is controlled to 110 ℃ ± 5 ℃, the pre-pressing pressure is controlled to 0.1MPa to 0.2MPa, and the positive pressure is controlled to 0.3MPa to 0.4 MPa.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. A hot melt adhesive tape laser heating device is used for heating a hot melt adhesive tape (100) to complete bonding of a frame (300) and a glass cover plate (200), and is characterized by comprising a base (1), a lifting mechanism (2), an X-axis moving platform (3), a laser system (4), a pre-pressing module (6), a positive pressure module (7) and a pressure adjusting module (8), wherein the lifting mechanism (2), the X-axis moving platform (3) and the pressure adjusting module (8) are installed on the top surface of the base (1), the laser system (4) is installed on the lifting mechanism (2), and the lifting mechanism (2) drives the laser system (4) to move up and down;
the prepressing module (6) and the positive pressure module (7) are arranged on the X-axis moving platform (3), the X-axis moving platform (3) drives the prepressing module (6) and the positive pressure module (7) to move to the heating range of the laser system (4) along the X-axis direction, the prepressing module (6) is used for prepressing the hot melt adhesive tape (100) and the glass cover plate (200), the glass cover plate (200) and the hot melt adhesive tape (100) are prepressed, the positive pressure module (7) compresses the frame (300) on the other bonding side of the hot melt adhesive tape (100), the laser system (4) heats the hot melt area of the hot melt adhesive tape (100) during the pressing of the hot melt adhesive tape (100) and the glass cover plate (200) and the pressing of the hot melt adhesive tape (100) and the frame (300), the pressure adjusting module (8) is used for adjusting the pressure of the hot melt adhesive tape (100) and the glass cover plate (200) in pressing fit and the pressure of the hot melt adhesive tape (100) and the frame (300) in pressing fit.
2. The laser heating device for the hot melt adhesive tape according to claim 1, further comprising a temperature monitoring module (5) and an industrial control display system (9), wherein the temperature monitoring module (5) and the industrial control display system (9) are fixed on the base (1), the temperature monitoring module (5) is arranged beside the lifting mechanism (2), the temperature monitoring module (5) is used for monitoring the temperature of the laser heating area of the laser system (4), and the industrial control display system (9) is used for adjusting laser parameters so as to control the temperature of the laser heating.
3. The hot melt adhesive tape laser heating device according to claim 1, wherein the laser system (4) comprises a laser (401), a beam expander (402), a vibration lens (403), and a focusing lens (404), the laser (401) is configured to emit laser, the laser passes through the beam expander (402), is reflected by the vibration lens (403), and then irradiates the focusing lens (404), and after passing through the focusing lens (404), passes through the glass cover plate (200) and focuses on the hot melt adhesive tape (100).
4. The laser heating device for hot melt adhesive tapes according to claim 1, wherein the pre-pressing module (6) comprises a first adjusting plate (601), a first support column (602), a pre-pressing adsorption plate (603), a first transfer plate (605), a first air cylinder (606) and an adhesive tape adsorption plate (607);
the first adjusting plate (601) is provided with two pieces, the two pieces of first adjusting plates (601) are oppositely arranged on the X-axis moving platform (3), the first support column (602) is vertically fixed on the first adjusting plate (601), the pre-pressing adsorption plate (603) is fixed at the top of the first support column (602), the first support column (602) supports the pre-pressing adsorption plate (603), a first vacuum cavity is arranged in the pre-pressing adsorption plate (603), the first vacuum cavity is connected with a pneumatic component, the first vacuum cavity generates vacuum through the pneumatic component and adsorbs the glass cover plate (200) at the bottom of the pre-pressing adsorption plate (603), the first transfer plate (605) is fixed on one side of the pre-pressing adsorption plate (603), the first air cylinder (606) is fixed on the first transfer plate (605), and the adhesive tape adsorption plate (607) is fixed at the bottom of the first air cylinder (606), adhesive tape adsorption plate (607) extend to glass apron (200) bottom, adhesive tape adsorption plate (607) adsorb hot melt adhesive tape (100), first cylinder (606) drive adhesive tape adsorption plate (607) reciprocate and will hot melt adhesive tape (100) compress tightly in glass apron (200) bottom.
5. The hot melt adhesive tape laser heating apparatus according to claim 4, wherein the positive pressure module (7) comprises a second adjusting plate (701), a second support column (702), a positive pressure adsorption plate (703), a second adapter plate (705), a second air cylinder (706), and a positive pressure ram (707);
the second adjusting plate (701) is provided with two blocks, the two blocks of the second adjusting plate (701) are oppositely arranged on the X-axis moving platform (3), the second support column (702) is vertically fixed on the second adjusting plate (701), the positive pressure adsorption plate (703) is fixed at the top of the second support column (702), the positive pressure adsorption plate (703) is supported by the second support column (702), a second vacuum cavity is arranged in the positive pressure adsorption plate (703), the second vacuum cavity is connected with a pneumatic component, the second vacuum cavity generates vacuum through the pneumatic component and adsorbs the glass cover plate (200) at the bottom of the positive pressure adsorption plate (703), the second adapter plate (705) is fixed on one side of the positive pressure adsorption plate (703), the second air cylinder (706) is fixed on the second adapter plate (705), and the positive pressure head (707) is fixed at the bottom of the second air cylinder (706), the positive pressure head (707) extends to the bottom of the glass cover plate (200), a groove is formed in the top surface of the positive pressure head (707), the frame (300) is placed in the groove, and the second air cylinder (706) drives the positive pressure head (707) to move up and down and presses the frame (300) to the other bonding side of the hot melt adhesive tape (100).
6. The laser heating device for hot melt adhesive tapes according to claim 5, wherein the pressure regulating module (8) comprises a mounting plate (801), a pre-pressure air pressure regulating valve (802) and a positive pressure air pressure regulating valve (803);
the vertical setting of mounting panel (801) is in base (1) top surface, pre-compaction air pressure regulating valve (802) and malleation air pressure regulating valve (803) are fixed on the face of mounting panel (801), pre-compaction air pressure regulating valve (802) with the tube coupling of first cylinder (606), malleation air pressure regulating valve (803) with the tube coupling of second cylinder (706).
7. The laser heating device for hot melt adhesive tapes according to claim 2, wherein the temperature monitoring module (5) comprises a support (501), a Y-axis adjusting plate (503), a Z-axis adjusting plate (504), a fixing plate (502) and an infrared camera (505);
support (501) is vertical to be fixed on base (1), install Z axle regulating plate (504) can be adjusted from top to bottom on support (501), Z axle regulating plate (504) extends along Y axle direction, install Y axle regulating plate (503) can be followed Y axle direction and adjusted on Z axle regulating plate (504), Y axle regulating plate (503) with the face of Z axle regulating plate (504) is perpendicular, fixed plate (502) can be followed Y axle regulating plate (503) face is installed rotatoryly on Y axle regulating plate (503), infrared camera (505) are fixed on Y axle regulating plate (503), the camera lens of infrared camera (505) is aimed at the laser heating region.
8. A hot melt adhesive tape laser heating method applied to the hot melt adhesive tape (100) laser heating apparatus according to any one of claims 1 to 7, characterized by comprising the steps of:
the pre-pressing module (6) pre-presses the hot melt adhesive tape (100) and the glass cover plate (200) together, and the pressure adjusting module (8) adjusts pre-pressing pressure for pre-pressing the hot melt adhesive tape (100) and the glass cover plate (200);
the X-axis moving platform (3) drives the pre-pressing module (6) to move to the heating range of the laser system (4), and laser emitted by the laser system (4) penetrates through the glass cover plate (200) and heats a hot melting area of the hot melting adhesive tape (100);
fixing the glass cover plate (200) which is subjected to prepressing on the positive pressure module (7), tearing off a strip-shaped film of the hot-melt adhesive tape (100), pressing the frame (300) on the other bonding side of the hot-melt adhesive tape (100) by the positive pressure module (7), and adjusting the positive pressure pressed by the frame (300) and the hot-melt adhesive tape (100) by the pressure adjusting module (8);
x axle moving platform (3) drive malleation module (7) move to in the heating range of laser system (4), the laser of laser system (4) transmission sees through glass apron (200) and heating the hot melt area of hot melt sticky tape (100).
9. The laser heating method for hot melt adhesive tape according to claim 8, wherein the laser emitted from the laser system (4) penetrates the glass cover plate (200) and heats the hot melt area of the hot melt adhesive tape (100), further comprising:
and a temperature monitoring module (5) is controlled to monitor the temperature of a laser heating area of the laser system (4), and laser parameters are adjusted through an industrial control display system (9) so as to control the temperature of laser heating.
10. The laser heating method of the hot melt adhesive tape according to claim 9, wherein the temperature of the laser heating area of the laser system (4) is controlled at 110 ℃ ± 5 ℃, the pre-pressing pressure is controlled at 0.1MPa to 0.2MPa, and the positive pressure is controlled at 0.3MPa to 0.4 MPa.
CN202010299414.4A 2020-04-16 2020-04-16 Laser heating device and method for hot melt adhesive tape Active CN111468821B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115451681A (en) * 2022-09-14 2022-12-09 苏州德龙激光股份有限公司 Laser dodging baking device and method for battery pole piece

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104942431A (en) * 2015-06-17 2015-09-30 王金 Laser processing device and process for laser hot melt adhesive quick adhesion thereof
CN105859159A (en) * 2016-04-07 2016-08-17 武汉华工激光工程有限责任公司 Technique for integrating metal and glass by using laser
CN106626405A (en) * 2016-12-13 2017-05-10 大族激光科技产业集团股份有限公司 Method and device for packaging flexible OLED screens through laser welding
CN107949178A (en) * 2017-11-24 2018-04-20 苏州市信德威激光科技有限公司 A kind of device and process using package sealing with laser film circuit board
CN207289168U (en) * 2017-08-06 2018-05-01 东莞市众森环保包装材料有限公司 A kind of system for laser machining hot melt adhesive
CN110026676A (en) * 2019-04-12 2019-07-19 大族激光科技产业集团股份有限公司 Laser process equipment and method
CN209756121U (en) * 2018-12-27 2019-12-10 厦门怡钛积科技有限公司 Touch-sensitive screen equipment adhesive pressing device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104942431A (en) * 2015-06-17 2015-09-30 王金 Laser processing device and process for laser hot melt adhesive quick adhesion thereof
CN105859159A (en) * 2016-04-07 2016-08-17 武汉华工激光工程有限责任公司 Technique for integrating metal and glass by using laser
CN106626405A (en) * 2016-12-13 2017-05-10 大族激光科技产业集团股份有限公司 Method and device for packaging flexible OLED screens through laser welding
CN207289168U (en) * 2017-08-06 2018-05-01 东莞市众森环保包装材料有限公司 A kind of system for laser machining hot melt adhesive
CN107949178A (en) * 2017-11-24 2018-04-20 苏州市信德威激光科技有限公司 A kind of device and process using package sealing with laser film circuit board
CN209756121U (en) * 2018-12-27 2019-12-10 厦门怡钛积科技有限公司 Touch-sensitive screen equipment adhesive pressing device
CN110026676A (en) * 2019-04-12 2019-07-19 大族激光科技产业集团股份有限公司 Laser process equipment and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115451681A (en) * 2022-09-14 2022-12-09 苏州德龙激光股份有限公司 Laser dodging baking device and method for battery pole piece

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