CN207283908U - A kind of durable type wiring board - Google Patents
A kind of durable type wiring board Download PDFInfo
- Publication number
- CN207283908U CN207283908U CN201721194813.4U CN201721194813U CN207283908U CN 207283908 U CN207283908 U CN 207283908U CN 201721194813 U CN201721194813 U CN 201721194813U CN 207283908 U CN207283908 U CN 207283908U
- Authority
- CN
- China
- Prior art keywords
- pin
- solder mask
- wiring board
- copper foil
- scolding tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of durable type wiring board, including substrate and pin, the pin is to be equidistantly spaced through the via on substrate, the pin copper foil that the pin is welded on substrate using scolding tin is fixed, and the side of the pin copper foil is provided with solder mask, the solder mask is set for " L " type, and baffle is provided between the two neighboring solder mask, and the top of the solder mask is both provided with silk-screen layer；By setting " L " type solder mask between the pin copper foil of intensive pin, solve no interval other materials between intensive pin copper foil, spacing is small, and " L " type solder mask can surround scolding tin；And higher baffle is provided between two neighboring solder mask, it is ensured that the problem of scolding tin is not in micro-short circuit under electric field action；Prevent some halogen residues, moisture invasion, tin sweat(ing) or scruff residual also to be easy to cause the not normal hidden danger of electric control function at the same time, improve the service life of wiring board.
Description
Technical field
A kind of board production manufacture technology field is the utility model is related to, more particularly to a kind of durable type wiring board.
Background technology
Circuit board (Printed Circuit Board, abbreviation PCB), also known as wiring board, pcb board, aluminum substrate, high frequency plate,
Ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board mainly by pad, via, mounting hole,
Conducting wire, component, connector, filling, electrical boundary etc. form.Common layer structure includes lamina (Single Layer
PCB), three kinds of doubling plate (Double Layer PCB) and multi-layer board (Multi Layer PCB).Circuit board is contemporary electronic member
Most active industry in part industry, its industry growth rate are generally all higher than 3 percentage points or so of electronic component industry.
Existing circuit board, due to the reason such as cost and production technology precision, to the intensive core of pin spacing on single side PCB
Green oil is not covered between the pin of piece, avoids covering from not causing precisely chip pin copper foil to be infected with green oil, causes tin bad.But
It is very easy to tin one of the main divisions of the male role in traditional opera length, metal electro-migration, auxiliary material occur when device pin spacing or small copper foil spacing to remain to form equivalent electric
The problems such as resistance.Automatically controlled environmental resistance energy force difference is caused, substantially reduces automatically controlled reliability, while this failure is usually than more covert,
Be difficult to find in production and detection, and after product actually uses a period of time, between pin pollution effect start gradually to present,
Circuit malfunction is ultimately caused, reduces the service life of circuit board.
Utility model content
The utility model proposes a kind of durable type wiring board, solves wiring board of the prior art and tin palpus easily occurs
Growth, metal electro-migration, auxiliary material remain to form equivalent resistance, ultimately cause circuit malfunction, reduce the service life of circuit board
Problem.
In order to solve the above-mentioned technical problem, the utility model provides following technical solution：
A kind of durable type wiring board of the utility model, including substrate and pin, the pin are through the via on substrate
It is equidistantly spaced, the pin copper foil that the pin is welded on substrate using scolding tin is fixed, and in the pin copper foil
Side is provided with solder mask, and the solder mask is set for " L " type, and is provided with baffle between the two neighboring solder mask, institute
The top for stating solder mask is both provided with silk-screen layer.
As a kind of optimal technical scheme of the utility model, the solder mask is green oil layer.
As a kind of optimal technical scheme of the utility model, the silk-screen layer is photosensitive type white oil layer or heat curing type white oil
Layer.
As a kind of optimal technical scheme of the utility model, the scolding tin is distributed in the inside of solder mask.
It is consistent with the material of solder mask as a kind of optimal technical scheme of the utility model, the material of the baffle.
As a kind of optimal technical scheme of the utility model, the height of the baffle is slightly larger than solder mask and silk-screen layer
The sum of height.
The beneficial effect that the utility model is reached is：The durable type wiring board of the utility model passes through in intensive pin
" L " type solder mask is set between pin copper foil, solves no interval other materials between intensive pin copper foil, spacing is small, and
And " L " type solder mask can surround scolding tin, avoid scolding tin from easily being migrated under electric field action, cause micro-short circuit between pin
The problem of；And higher baffle is provided between two neighboring solder mask, it is ensured that scolding tin is not under electric field action
The problem of micro-short circuit；Some halogen residues, moisture invasion, tin sweat(ing) or scruff residual is prevented also to be easy to cause electric control function mistake at the same time
Normal hidden danger, improves the service life of wiring board.
Brief description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form the limitation to the utility model.In the accompanying drawings：
Fig. 1 is a kind of subjective structure diagram of durable type wiring board of the utility model；
In figure：1st, substrate；2nd, pin；3rd, scolding tin；4th, pin copper foil；5th, solder mask；6th, baffle；7th, silk-screen layer.
Embodiment
The preferred embodiment of the utility model is illustrated below in conjunction with attached drawing, it will be appreciated that described herein excellent
Select embodiment to be only used for describing and explaining the present invention, be not used to limit the utility model.
Embodiment 1
As shown in Figure 1, the utility model provides a kind of durable type wiring board, including substrate 1 and pin 2, pin 2 be through
Via on substrate 1 is equidistantly spaced, and the pin copper foil 4 that pin 2 is welded on substrate 1 using scolding tin 3 is fixed, and is being drawn
The side of foot copper foil 4 is provided with solder mask 5, and solder mask 5 is set for " L " type, and " L " type sets and can encase scolding tin 3, avoids welding
Tin 3, there is a phenomenon where migrating, and is provided with baffle 6 under the action of electric field between two neighboring solder mask 5, baffle 6 can will
Two group layers 5 separate, and avoid the scolding tin 3 in group layer 5 from contacting, the top of solder mask 5 is both provided with silk-screen layer 7, silk-screen layer 7
It can play the role of obstruction and strengthen hindering, strengthen solder surface contractive effect, reduce company's tin between the pin 2 of device,
It is easy and effective so as to lift welding effect during making.
Solder mask 5 is green oil layer, using photosensitive solder resist technique, by printing liquid photosensitive solder resist ink (or photonasty tree
Fat is heating and curing resin, two-component), green oil layer is completed by flows such as precuring, exposure, development, solidify afterwards make after printing,
Accurately solder mask 5 are formed between pin copper foil 4, realize the effect for strengthening barrier.
Silk-screen layer 7 is photosensitive type white oil layer or heat curing type white oil layer, when silk-screen layer 7 is photosensitive type white oil layer, can precisely be covered
The pin 2 of lid device, can applied to one-sided circuit board and double-sided wiring board；It is more and silk-screen layer 7 is when being heat curing type white oil layer
For one-sided circuit board.
Scolding tin 3 is distributed in the inside of solder mask 5, enables to solder mask 5 to surround scolding tin 3, avoids in electric field
Occurs the phenomenon migrated under effect.
The material of baffle 6 is consistent with the material of solder mask 5, and baffle 6 can strengthen inhibition.
The height of baffle 6 can effectively reach the effect for hindering scolding tin 3 slightly larger than the sum of height of solder mask 5 and silk-screen layer 7
Fruit.
The durable type wiring board of the utility model between the pin copper foil of intensive pin by setting " L " type solder mask, solution
Without interval other materials between the pin copper foil for having determined intensive, spacing is small, and " L " type solder mask can surround scolding tin,
The problem of avoiding scolding tin from easily being migrated under electric field action, causing micro-short circuit between pin；And two neighboring solder mask it
Between be provided with higher baffle, it is ensured that the problem of scolding tin is not in micro-short circuit under electric field action；Prevent some halogen at the same time
Element residual, moisture invasion, tin sweat(ing) or scruff residual also be easy to cause the not normal hidden danger of electric control function, improve the use of wiring board
Service life.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify the technical solution described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.Where within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of durable type wiring board, including substrate (1) and pin (2), the pin (2) is through the via on substrate (1)
It is equidistantly spaced, it is characterised in that the pin (2) is welded in the pin copper foil (4) on substrate (1) using scolding tin (3)
It is fixed, and solder mask (5) is provided with the side of the pin copper foil (4), the solder mask (5) is set for " L " type, and adjacent
Baffle (6) is provided between two solder masks (5), the top of the solder mask (5) is both provided with silk-screen layer (7).
2. a kind of durable type wiring board according to claim 1, it is characterised in that the solder mask (5) is green oil layer.
3. a kind of durable type wiring board according to claim 1, it is characterised in that the silk-screen layer (7) is white for photosensitive type
Oil reservoir or heat curing type white oil layer.
4. a kind of durable type wiring board according to claim 1, it is characterised in that the scolding tin (3) is distributed in welding resistance
The inside of layer (5).
5. a kind of durable type wiring board according to claim 4, it is characterised in that the material and welding resistance of the baffle (6)
The material of layer (5) is consistent.
6. a kind of durable type wiring board according to claim 5, it is characterised in that the height of the baffle (6) is slightly larger than
The sum of height of solder mask (5) and silk-screen layer (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194813.4U CN207283908U (en) | 2017-09-18 | 2017-09-18 | A kind of durable type wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194813.4U CN207283908U (en) | 2017-09-18 | 2017-09-18 | A kind of durable type wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207283908U true CN207283908U (en) | 2018-04-27 |
Family
ID=61982372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721194813.4U Expired - Fee Related CN207283908U (en) | 2017-09-18 | 2017-09-18 | A kind of durable type wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207283908U (en) |
-
2017
- 2017-09-18 CN CN201721194813.4U patent/CN207283908U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180427 Termination date: 20200918 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |