CN207271276U - A kind of micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect - Google Patents

A kind of micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect Download PDF

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Publication number
CN207271276U
CN207271276U CN201721020383.4U CN201721020383U CN207271276U CN 207271276 U CN207271276 U CN 207271276U CN 201721020383 U CN201721020383 U CN 201721020383U CN 207271276 U CN207271276 U CN 207271276U
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liquid
micro
infrabasal plate
fluidic chip
upper substrate
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水玲玲
曹洁萍
金名亮
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Zhaoqing South China Normal University Optoelectronics Industry Research Institute
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Zhaoqing South China Normal University Optoelectronics Industry Research Institute
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Abstract

The utility model provides a kind of micro-fluidic chip of the PLC technology based on liquid liquid electrowetting effect, includes from bottom to top:Infrabasal plate, driving electrode array, infrabasal plate drain insulating layer, at least one drop, upper substrate hydrophobic layer, conductive layer, upper substrate, upper substrate and infrabasal plate surrounding addition cofferdam, form the cavity of closing.Drain insulating layer used in the utility model is by porous polymer film layer and can improve the liquid level of electrowetting performance and forms, there is electrowetting good reversibility, reusable, proof voltage breakdown, high temperature resistant, chemical-resistant reagent and preserve for a long time without influencing its effect, improve the service life, efficiency and application range of device, and in diverse location different drops can quickly be moved, merge, react etc. with operation according to parameter set in advance by being programmed to the pressuring method of driving electrode array.

Description

A kind of micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect
Technical field
Digital microfluidic technical field is the utility model is related to, liquid-liquid electrowetting effect is based on more particularly, to one kind PLC technology micro-fluidic chip.
Background technology
Digital microcurrent-controlled chip refers to the on piece laboratory (Lab that discrete fine droplet is manipulated using microflow control technique On chip), recent decades are quickly grown in laboratory research, commercial Application, life application, due to its sample preparation, instead Should, separation, detection etc. operation concentrate on one piece several square centimeters of chip, have energy consumption is low, required reagent is few, reaction it is fast The features such as speed, fast, accurate response, be widely used in the fields such as biochemical analysis and detection, micro- reaction.
Digital microcurrent-controlled chip based on the electrowetting effect on medium mainly includes upper and lower base plate, dielectric layer, driving electricity Pole, hydrophobic layer etc., the dielectric layer, that is, insulating layer, its dielectric layer and hydrophobic layer can be same substances, i.e. material has at the same time Have insulation and hydrophobic performance, at present using more extensive insulating hydrophobic layer material mainly have Teflon AF, Cytop, Hyflon, polysiloxane acid imide, these materials are mostly easily breakdown, so generally can all select another material conduct Dielectric layer, is then coated with hydrophobic layer, such as patent CN 103592759 uses silica as insulating layer, Teflon The materials such as AF2400, Parylene, polyimides, PMMA need twice technique as hydrophobic material, i.e. making drain insulating layer, General film-forming process needs to heat, and has high temperature resistant requirement to device material, this undoubtedly adds the cost of element manufacturing, it is used Hydrophobic layer material easily after many experiments be contaminated or destroy, shorten the service life of device, even result in whole device Scrap.
The content of the invention
The purpose of this utility model is that in view of the above shortcomings of the prior art, there is provided one kind is imitated based on liquid-liquid electrowetting The micro-fluidic chip for the PLC technology answered, we form solid-liquid composite membrane with porous thin polymer film using liquid and dredge Water insulating layer, has electrowetting good reversibility, reusable, proof voltage breakdown, high temperature resistant, chemical-resistant reagent and long-time The advantages of preserving without influencing its effect, the service life, efficiency and application range of device are improved, while shorten chip manufacturing Technique, and the pressuring method of driving electrode array can be programmed, according to parameter set in advance in diverse location to not The operation such as quickly moved, merge, react with drop.
The purpose of this utility model is achieved through the following technical solutions:
A kind of micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect, the micro-fluidic chip from lower and On include:Infrabasal plate, driving electrode array, infrabasal plate drain insulating layer, at least one drop, upper substrate hydrophobic layer, conductive layer, Upper substrate, upper substrate and infrabasal plate surrounding addition cofferdam, form the cavity of closing, conductive layer connection positive pole, drives Moving electrode array connects power cathode, and the infrabasal plate drain insulating layer is solid-liquid structure of composite membrane, is by porous poly- Compound film layer and the liquid level composition that electrowetting performance can be improved.
The electrod-array connection power cathode of infrabasal plate, the conductive layer connection positive pole of upper substrate, according to experiment needs It is programmed using computer to applying alive mode and realizes that drop is automatically brought into operation in chip.
The drain insulating layer of the utility model can replace in the case of any position of micro fluidic chip device is not damaged, And the performance for replacing micro-fluidic chip after new drain insulating layer again is unaffected.
Preferably, porous thin polymer film is the porosity polytetrafluoroethylene film with insulating hydrophobic, porosity Polycarbonate membrane, porosity polyvinylidene fluoride film, porosity poly (ether sulfone) film, porous polypropylene nitrile film or porosity Combination are fine Tie up one kind in cellulose ester film, the pore size of thin polymer film is the nm of 20 nm ~ 2000, filling and liquid inside thin polymer film Immiscible, nonreactive liquid is dripped, liquid is full of the hole of polymer, and the species of liquid includes the fluorocarbon chain system with lubricating action One kind in row compound, the silicone oil of different viscosities, mineral oil, liquid linear alkane or liquid cyclic alkane;Liquid with it is porous Property thin polymer film form solid-liquid composite porous film drain insulating layer, i.e. infrabasal plate drain insulating layer, solid-liquid be compound porous The thickness of film drain insulating layer is 10 nm ~ 100 μm.
Preferably, the material of the upper substrate is translucency good plastics or glass, and infrabasal plate is sustainable electrode layer material Material film forming and the material of structuring, including silicon, glass, metallic plate or plastic plate.
Preferably, the driving electrode array passes through different modes ordered arrangement, forming face formula or net by some electrodes The two-dimentional driving electrode array of shape or wire;Wherein:Electrode unit figure includes semilune electrode, square electrode, six sides One kind in shape electrode, rectangular electrodes, interdigital electrode;Adjacent electrode spacing is 10 μm ~ 1000 μm;Electrode composition includes One in ITO, IZO, ZnO, gold, silver, platinum, copper, aluminium, nano silver, silver paste, liquid metal, aluminium oxide, iron oxide or alloy material Kind.
Preferably, drop a direction movement thereto can be realized by applying voltage to driving electrode array;Driving electricity The pressuring method of pole array can be programmed, and different drops are quickly moved in diverse location according to parameter set in advance Dynamic, merging, operation.
Preferably, the drop is conductive liquid, including component is single or the biology of multicomponent composition Sample or chemical substance, drop is at least one, is multiple similar drops or the drop of multiple and different classes, each drop is at least Cover the part of one of electrode and adjacent electrode.
Preferably, upper substrate hydrophobic layer for can spin coating unformed fluoropolymer or silicon fluoride, silicon fluoride is perfluor dodecane Base trichlorosilane or octadecyl trichlorosilane alkane.
Preferably, the component of the conductive layer includes ITO, IZO, ZnO, gold, silver, platinum, copper, aluminium, nano silver, silver paste, liquid One kind in state metal, aluminium oxide, iron oxide or alloy material.
Preferably, the material in the cofferdam includes pressure sensitive adhesive, hot-setting adhesive, light-sensitive emulsion, glass, dimethyl silicone polymer with consolidating A kind of in the mixture of agent, epoxide resin material, the height and length in cofferdam meet that drop can touch upper substrate and lower base Plate.
Preferably, the electrod-array connection power cathode of infrabasal plate, the conductive layer connection positive pole of upper substrate, according to reality Test to need to be programmed to applying alive mode using computer and realize that drop is automatically brought into operation in chip.
In the utility model, the electrod-array connection power cathode of the infrabasal plate, the conductive layer connection power supply of upper substrate Anode, the contact angle for being so applied in the region of voltage reduce, and wetability improves, drop movement.
The assemble method of micro-fluidic chip described in the utility model is:The lower base with driving electrodes figure is prepared first Plate, including the cleaning of infrabasal plate, spin coating photoresist, exposure, development, post bake, etch, remove photoresist, obtain carrying driving electrodes figure Substrate, then infrabasal plate drain insulating layer is attached in driving electrode array, covers the upper substrate with upper substrate hydrophobic layer, And in upper substrate and infrabasal plate surrounding addition cofferdam.
Compared with prior art, the utility model has the following advantages that and beneficial effect:
A kind of micro-fluidic chip of PLC technology based on liquid-liquid electrowetting effect of the utility model utilizes porosity For thin polymer film with the solid-liquid composite membrane that liquid is formed as insulating hydrophobic layer, the compound film production of this layer of solid-liquid is simple, shortens Chip fabrication technique, and conveniently take off without damaging device, solve hydrophobic layer and be contaminated or cause whole device after destroying The problem of discarded.
The insulating hydrophobic layer solid-liquid composite membrane of the utility model has electrowetting good reversibility, reusable, proof voltage The advantages of breakdown, high temperature resistant, chemical-resistant reagent and long-time are preserved without influencing its effect, improve device uses the longevity Life, efficiency and application range, can carry out the operations such as quick mobile, merging, the reaction of drop.
A kind of micro-fluidic chip of PLC technology based on liquid-liquid electrowetting effect of the utility model can be to driving electricity The application voltage system of pole is programmed, different drops are quickly moved in diverse location according to parameter set in advance, The operations such as merging, reaction.
Brief description of the drawings
Fig. 1 is that a kind of micro-fluidic chip of PLC technology based on liquid-liquid electrowetting effect of the utility model is basic Structural map.
Fig. 2 is a kind of horizontal stroke of the micro-fluidic chip of PLC technology based on liquid-liquid electrowetting effect of the utility model Sectional view.
Fig. 3 is a kind of base of the micro-fluidic chip of PLC technology based on liquid-liquid electrowetting effect of the utility model This structural map.
Fig. 4 is a kind of band of the micro-fluidic chip of PLC technology based on liquid-liquid electrowetting effect of the utility model There is the infrabasal plate fabrication processing figure of driving electrodes figure.
Fig. 5 is the driving electrode array figure of the utility model embodiment 1.
Fig. 6 is the driving electrode array figure of the implementation 2 of the utility model.
Fig. 7 is the driving electrode array figure of the implementation 3 of the utility model.
Fig. 8 is the driving electrode array figure of the implementation 4 of the utility model.
Embodiment
In order to preferably be illustrated and understand to the utility model, it is further elaborated below by way of example.
Embodiment 1:
As shown in Fig. 1 ~ 3, a kind of micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect, the miniflow Control chip includes from bottom to top:Infrabasal plate 1, driving electrode array 2, infrabasal plate drain insulating layer 3, at least one drop 4, upper base Plate hydrophobic layer 5, conductive layer 6, upper substrate 7, upper substrate and infrabasal plate surrounding addition cofferdam 8, form the cavity of closing, described leads Electric layer 6 connects 10 cathode of power supply, and driving electrode array 2 connects 10 anode of power supply, the infrabasal plate drain insulating layer 3 for it is solid- Liquid structure of composite membrane, is made of porous thin polymer film and the liquid that can improve electrowetting performance.
Electrod-array connection 10 anode of power supply of infrabasal plate, conductive layer connection 10 cathode of power supply of upper substrate, according to experiment Need to be programmed to applying alive mode using computer 11 and realize that drop is automatically brought into operation in chip 9.
Present case is preferably used glass and is driven as upper substrate and infrabasal plate, indium tin oxide (ITO) as infrabasal plate Electrode and upper substrate conductive layer, for AF1600 as upper substrate hydrophobic layer, viscosity is that the silicone oil of 50 cSt is filled into porous gather Tetrafluoroethylene is as drain insulating layer, and Fig. 5 is the driving electrodes figure of embodiment 1, figure of the hexagon as driving electrodes, It can be needed to be properly added number of poles or adjustment electrode arrangement according to different experiments.
Fig. 4 is the technological process for making the infrabasal plate with driving electrodes figure, includes cleaning, the spin coating light of infrabasal plate Photoresist, exposure, development, post bake, etch, remove photoresist.
Its detailed process parameter is as follows:
The ito glass substrate for making electrode pattern is cleaned first, 3% ~ 5% alkali glass cleaning agent cleaning 5 ~ 8 Min, then with 2 ~ 3 min of ultrapure water, the water droplet of glass surface is blown away with nitrogen, then etched and increased with reactive ion etching machine Add adhesiveness.
Gluing, it is even first with desk-top sol evenning machine in one layer of SUN 120P ultraviolet positive photoresist of ito glass surface spin coating The initial speed of glue machine is 500 r/min, continues 5 s;Then 3000 r/min are accelerated to and continue 60 s, obtain film thickness about For 1.6 ~ 1.7 μm.
Front baking, the ito glass for coating photoresist is placed on hot plate 1.5 min is heated at 100 DEG C.
Exposure, takes out ito glass natural cooling at room temperature, the mask plate with driving electrodes figure is pressed in glue-coated It is 27 mW/cm in light intensity on ito glass230 s of exposed under UV light.
Development, the ito glass after exposure is put into 0.5% KOH solution, room temperature rock development 100 s, then spend from Sub- water rinses 40 s, removes the developer solution of adhesion on the surface.
Post bake, is placed on 120 DEG C of 30 min of heating on hot plate, then cooled to room temperature by the slice, thin piece after development.
Etching, removes part ITO with the mixed solution of concentrated nitric acid, concentrated hydrochloric acid, deionized water, leaves electrod-array figure Shape.
Photoresist finally is washed away with absolute ethyl alcohol, and is dried up with nitrogen.
After obtaining the substrate with ITO driving electrodes figures, porosity polytetrafluoroethylene film is close in driving electrodes, Using capillary force make silicone oil filling porosity polytetrafluoroethylene film hole, add the amount of silicone oil just make oil height with it is more Permeability polytetrafluoroethylene film is consistent.Then cofferdam is established in the surrounding of substrate with epoxide-resin glue, the height in cofferdam is according to difference Experiment need adjustable, finally cover the ito glass substrate with AF1600, inward-facing, the chip manufacturing for having AF1600 It is basically completed.
Application voltage system that can be to driving electrodes in subsequent experimental is programmed, according to parameter set in advance not With position different drops quickly moved, merge, react etc. with operation.
Embodiment 2
Glass is preferably used as upper substrate and infrabasal plate in present case, and IZO is as infrabasal plate driving electrodes and upper substrate Conductive layer, as upper substrate hydrophobic layer, carbon fluorine chain compound FC-43 is filled into porous poly- perfluorododecyl trichlorosilane Carbonic ester film is the driving electrodes figure of embodiment 2 as drain insulating layer, Fig. 6, and figure of the semilune as driving electrodes can To be needed to be properly added number of poles or adjustment electrode arrangement according to different experiments.
The idiographic flow of chip manufacturing is described in detail in embodiment 1.
Embodiment 3
Glass is preferably used as upper substrate and infrabasal plate in present case, and ZnO is as infrabasal plate driving electrodes and upper substrate Conductive layer, for octadecyl trichlorosilane alkane as upper substrate hydrophobic layer, hexadecane is filled into porosity polyvinylidene fluoride film as thin Water insulating layer, Fig. 7 are the driving electrodes figure of embodiment 3, and figure of the hexagon as driving electrodes can be according to different experiments Need to be properly added number of poles or adjustment electrode arrangement.
The idiographic flow of chip manufacturing is described in detail in embodiment 1.
Embodiment 4
Glass is preferably used as upper substrate and infrabasal plate in present case, and aluminium is as infrabasal plate driving electrodes and upper substrate Conductive layer, for AF2400 as upper substrate hydrophobic layer, mineral oil is filled into porous polypropylene nitrile film as drain insulating layer, Fig. 8 For the driving electrodes figure of embodiment 4, figure of the square as driving electrodes, can need to be properly added according to different experiments Number of poles or adjustment electrode arrangement.
The idiographic flow of chip manufacturing is described in detail in embodiment 1.

Claims (6)

  1. A kind of 1. micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect, it is characterised in that the micro-fluidic core Piece includes from bottom to top:Infrabasal plate(1), driving electrode array(2), infrabasal plate drain insulating layer(3), at least one drop(4)、 Upper substrate hydrophobic layer(5), conductive layer(6), upper substrate(7), upper substrate and infrabasal plate surrounding add cofferdam(8), sealed for being formed The cavity closed forms micro-fluidic chip(9), the conductive layer(6)Connect power supply(10)Cathode, driving electrode array(2)Connection Power supply(10)Anode, the infrabasal plate drain insulating layer(3)For solid-liquid structure of composite membrane, by porous thin polymer film Layer and the liquid level composition that electrowetting performance can be improved.
  2. 2. micro-fluidic chip according to claim 1, it is characterised in that the pore size of porous thin polymer film is The nm of 20 nm ~ 2000, infrabasal plate drain insulating layer(3)Thickness be 10 nm ~ 100 μm.
  3. 3. micro-fluidic chip according to claim 1, it is characterised in that the driving electrode array(2)By some electrodes By different modes ordered arrangement, forming face formula either netted or wire two-dimentional driving electrode array;Wherein:Electrode unit Figure includes one kind in semilune electrode, square electrode, hexagonal shaped electrodes, rectangular electrodes, interdigital electrode;Adjacent electrode Spacing is 10 μm ~ 1000 μm.
  4. 4. micro-fluidic chip according to claim 1, it is characterised in that by driving electrode array(2)Apply voltage Realize drop(4)Moved toward a direction.
  5. 5. micro-fluidic chip according to claim 1, it is characterised in that the drop(4)For conductive liquid, Drop(4)At least one, each drop at least covers the part of one of electrode and adjacent electrode.
  6. 6. micro-fluidic chip according to claim 1, it is characterised in that cofferdam(8)Height and length meet drop(4) Upper substrate can be touched(7)And infrabasal plate(1).
CN201721020383.4U 2017-08-15 2017-08-15 A kind of micro-fluidic chip of the PLC technology based on liquid-liquid electrowetting effect Active CN207271276U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107335490A (en) * 2017-08-15 2017-11-10 肇庆市华师大光电产业研究院 A kind of micro-fluidic chip of the PLC technology based on liquid liquid electrowetting effect
CN111654206A (en) * 2020-05-20 2020-09-11 华南师范大学 Reverse electrowetting mechanical energy collecting device and mechanical energy collecting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107335490A (en) * 2017-08-15 2017-11-10 肇庆市华师大光电产业研究院 A kind of micro-fluidic chip of the PLC technology based on liquid liquid electrowetting effect
CN111654206A (en) * 2020-05-20 2020-09-11 华南师范大学 Reverse electrowetting mechanical energy collecting device and mechanical energy collecting device
WO2021233256A1 (en) * 2020-05-20 2021-11-25 华南师范大学 Reverse electrowetting mechanical energy collection device and mechanical energy collection apparatus
CN111654206B (en) * 2020-05-20 2023-03-14 华南师范大学 Reverse electrowetting mechanical energy collecting device and mechanical energy collecting device

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