CN207223702U - A kind of lapping liquid center fed system - Google Patents
A kind of lapping liquid center fed system Download PDFInfo
- Publication number
- CN207223702U CN207223702U CN201720487908.9U CN201720487908U CN207223702U CN 207223702 U CN207223702 U CN 207223702U CN 201720487908 U CN201720487908 U CN 201720487908U CN 207223702 U CN207223702 U CN 207223702U
- Authority
- CN
- China
- Prior art keywords
- lapping liquid
- discharging pipeline
- mixing arrangement
- model
- center fed
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- 239000007788 liquid Substances 0.000 claims abstract description 51
- 238000007599 discharging Methods 0.000 claims abstract description 36
- 238000002156 mixing Methods 0.000 claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 15
- 239000002002 slurry Substances 0.000 claims abstract description 14
- 238000000227 grinding Methods 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000011010 flushing procedure Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006396 nitration reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229960002163 hydrogen peroxide Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The manufacturing field of semiconductor is the utility model is related to, particularly a kind of lapping liquid center fed system, a kind of lapping liquid center fed system, including it is connected in sequence by pipeline：Raw material liquid supply unit, lapping liquid mixing arrangement, slurry supply apparatus, some chemical mechanical grinding stations, first discharging pipeline and the first circuit connect raw material liquid supply unit and lapping liquid mixing arrangement respectively, second discharging pipeline and second servo loop connect lapping liquid mixing arrangement and slurry supply apparatus respectively, and the 3rd discharging pipeline is connected with tertiary circuit and forms complete loops.The beneficial effects of the utility model are：The technical solution of the utility model can make full use of existing former supply system, as the increase of supply without establishing larger center mixes liquid liquid-supplying system, save cost；Using flexible, lapping liquid supply pipe system need at least half a year to shut down flushing, using the utility model, local provisioning system segment can be cleaned, it is not necessary to cause whole pipeline to stop.
Description
Technical field
The manufacturing field of semiconductor is the utility model is related to, particularly a kind of lapping liquid center fed system.
Background technology
Existing lapping liquid center fed system is by raw material feeding unit（It is normally placed at one layer of dust free room）, nitration mixture bucket or mixed
The integral bucket of acid supply（Two layers of dust free room is normally placed at, is the nitration mixture bucket of more than 3L）, VMB（It is placed on three layers of dust free room）Composition, is fitted
For most of lapping liquids.With the continuous progress of processing procedure, the requirement to lapping liquid freshness is higher and higher, and lapping liquid is mixed
Afterwards, it is necessary to use up within a very short time（Time depend on lapping liquid it is mixed after deteriorating time or hydrogenperoxide steam generator volatilization
Speed）.In addition, the flexibility of this supply system is very poor, if running into lapping liquid quality problems, it is desirable to carry out whole device
Rinse, it is necessary to which whole production line stops line progress.Therefore, invention one kind can improve lapping liquid utilization rate and convenient part is shut down clearly
The supply system washed is particularly important.
The content of the invention
For above-mentioned deficiency, the purpose of this utility model is to provide a kind of lapping liquid center fed system.
The technical scheme in the invention for solving the technical problem is：
A kind of lapping liquid center fed system, including it is connected in sequence by pipeline：
One raw material liquid supply unit, including the first discharging pipeline and the first circuit；
One lapping liquid mixing arrangement, including the second discharging pipeline and second servo loop；
One slurry supply apparatus, including the 3rd discharging pipeline and tertiary circuit；
Some chemical mechanical grinding stations, the chemical mechanical grinding station are arranged in parallel by the described 3rd discharging pipeline；
The first discharging pipeline and first circuit connect the raw material liquid supply unit and the lapping liquid respectively
Mixing arrangement, the second discharging pipeline and the second servo loop connect the lapping liquid mixing arrangement and the lapping liquid respectively
Feeding mechanism, the 3rd discharging pipeline are connected with the tertiary circuit and form complete loops.
Preferably, the first discharging pipeline is connected to the lapping liquid mixing arrangement by lapping liquid measuring flume.
Preferably, the second discharging pipeline is connected to the grinding by specific weight measurer and pH measuring devices respectively
Liquid supply unit.
Preferably, the lapping liquid mixing arrangement has further included deionized water measuring flume and chemicals measuring flume.
Preferably, the 3rd discharging pipeline is connected to the chemical mechanical grinding station by least one pump housing.
Preferably, the slurry supply apparatus further includes deionized water and adds groove and nitrogen addition groove.
The beneficial effects of the utility model are：When being reequiped to the prior art, the technical solution of the utility model can
Existing former supply system is made full use of, as the increase of supply without establishing larger center mixes liquid liquid-supplying system,
Save cost；Using flexible, lapping liquid supply pipe system need at least half a year to shut down flushing, can be to this using the present invention
Ground supply system segmented cleaning, it is not necessary to cause whole pipeline to stop.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model.
Wherein：1 raw material liquid supply unit, 11 first discharging pipelines, 12 first circuits, 13 lapping liquid measuring flumes, 2 lapping liquids
Mixing arrangement, 21 second discharging pipelines, 22 second servo loops, 23 specific weight measurers, 24pH measuring devices, the measurement of 25 deionized waters
Groove, 26 chemicals measuring flumes, 3 slurry supply apparatus, 31 the 3rd discharging pipelines, 32 tertiary circuits, 33 pump housings, 34 deionizations
Water adds groove, 35 nitrogen add groove, 4 chemical mechanical grinding stations.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, instead of all the embodiments.Usually here described in attached drawing and
The component of the utility model embodiment shown can be arranged and designed with a variety of configurations.Therefore, below to attached
The detailed description of the embodiment of the utility model provided in figure is not intended to limit claimed the scope of the utility model,
But it is merely representative of the selected embodiment of the utility model.Based on the embodiment in the utility model, ordinary skill people
Member's all other embodiments obtained without creative efforts, belong to the model of the utility model protection
Enclose.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
, it is necessary to explanation in the description of the utility model, term " " center ", " on ", " under ", it is "left", "right", " perpendicular
Directly ", the orientation of the instruction such as " level ", " interior ", " outer " or position relationship be based on orientation shown in the drawings or position relationship, or
The utility model product using when the orientation usually put or position relationship, be for only for ease of description the utility model and letter
Change description, rather than instruction or imply signified device or element must have specific orientation, with specific azimuth configuration and
Operation, therefore it is not intended that limitation to the utility model.In addition, term " first ", " second ", " the 3rd " etc. are only used for area
Divide description, and it is not intended that instruction or hint relative importance.Being for term " pipeline " used in the description can
It is used interchangeably, and these terms " pipeline " can be related to traditionally apply in transmission liquid (including lapping liquid) and/or gas
Any pattern, size or the configuration of body material fluid line in combination.
As shown in Figure 1, a kind of lapping liquid center fed system, including it is connected in sequence by pipeline：Material liquid supply dress
Put the 1, including first 11 and first circuit 12 of discharging pipeline；Lapping liquid mixing arrangement 2, including the second discharging pipeline 21 and second time
Road 22；Slurry supply apparatus 3, including the 3rd discharging pipeline 31 and tertiary circuit 32；Some chemical mechanical grinding stations 4, it is described
Chemical mechanical grinding station 4 is arranged in parallel by the described 3rd discharging pipeline 31；The first discharging pipeline 11 and first time described
Road 12 connects the raw material liquid supply unit 1 and the lapping liquid mixing arrangement 2 respectively, the second discharging pipeline 21 and described
Second servo loop 22 connects the lapping liquid mixing arrangement 2 and the slurry supply apparatus 3, the 3rd discharging pipeline 31 respectively
It is connected with the tertiary circuit 32 and forms complete loops.
Further, the first discharging pipeline 11 is connected to the lapping liquid mixing arrangement by lapping liquid measuring flume 13
2。
Further, the second discharging pipeline 21 is connected to by specific weight measurer 23 and pH measuring devices 24 respectively
The slurry supply apparatus 3.
Further, the lapping liquid mixing arrangement 2 has further included deionized water measuring flume 25 and chemicals measuring flume
26。
Further, the 3rd discharging pipeline 31 is connected to the chemical mechanical grinding station by least one pump housing 33
4。
Further, the slurry supply apparatus 3 further includes deionized water and adds groove 34 and nitrogen addition groove 35.
When specifically used, the number and model of slurry supply apparatus 3 can make adjustment according to actual conditions, existing
The model for having technical increased slurry supply apparatus 3 may be provided within 6mm*9mm, the volume of raw material liquid supply unit 1
Should not be too big, it is preferably 1L, can so ensures the utilization ratio of lapping liquid, prevent that lapping liquid is expired and fails.
Above-mentioned embodiment is only the specific case of the utility model, and the scope of patent protection of the utility model includes
But the product form and style of above-mentioned embodiment are not limited to, it is any to meet claims of the present invention and any affiliated skill
The appropriate change or modification that the those of ordinary skill in art field does it, should all fall into the scope of patent protection of the present invention.
Claims (6)
1. a kind of lapping liquid center fed system, it is characterised in that including connected in sequence by pipeline：
One raw material liquid supply unit, including the first discharging pipeline and the first circuit；
One lapping liquid mixing arrangement, including the second discharging pipeline and second servo loop；
One slurry supply apparatus, including the 3rd discharging pipeline and tertiary circuit；
Some chemical mechanical grinding stations, the chemical mechanical grinding station are arranged in parallel by the described 3rd discharging pipeline；
The first discharging pipeline and first circuit connect the raw material liquid supply unit and lapping liquid mixing respectively
Device, the second discharging pipeline and the second servo loop connect the lapping liquid mixing arrangement and the lapping liquid supply pipe respectively
Device, the 3rd discharging pipeline are connected with the tertiary circuit and form complete loops；The raw material liquid supply unit
Volume be 1L.
2. a kind of lapping liquid center fed system according to claim 1, it is characterised in that the first discharging pipeline leads to
Cross lapping liquid measuring flume and be connected to the lapping liquid mixing arrangement.
A kind of 3. lapping liquid center fed system according to claim 1, it is characterised in that the second discharging pipeline point
The slurry supply apparatus is not connected to by specific weight measurer and pH measuring devices.
A kind of 4. lapping liquid center fed system according to claim 1, it is characterised in that the lapping liquid mixing arrangement
Deionized water measuring flume and chemicals measuring flume are further included.
5. a kind of lapping liquid center fed system according to claim 1, it is characterised in that the 3rd discharging pipeline leads to
Cross at least one pump housing and be connected to the chemical mechanical grinding station.
A kind of 6. lapping liquid center fed system according to claim 1, it is characterised in that the slurry supply apparatus
Further include deionized water and add groove and nitrogen addition groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720487908.9U CN207223702U (en) | 2017-05-04 | 2017-05-04 | A kind of lapping liquid center fed system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720487908.9U CN207223702U (en) | 2017-05-04 | 2017-05-04 | A kind of lapping liquid center fed system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207223702U true CN207223702U (en) | 2018-04-13 |
Family
ID=61838783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720487908.9U Active CN207223702U (en) | 2017-05-04 | 2017-05-04 | A kind of lapping liquid center fed system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207223702U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021164674A1 (en) * | 2020-02-18 | 2021-08-26 | 长鑫存储技术有限公司 | Polishing liquid feeding system |
-
2017
- 2017-05-04 CN CN201720487908.9U patent/CN207223702U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021164674A1 (en) * | 2020-02-18 | 2021-08-26 | 长鑫存储技术有限公司 | Polishing liquid feeding system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 1 Jingxiang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd. Country or region after: China Address before: 214000 No.209, Zhangjing east section, Xigang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Patentee before: GMC SEMITECH Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |