CN207219167U - Board structure of circuit and electric capacity printed board - Google Patents
Board structure of circuit and electric capacity printed board Download PDFInfo
- Publication number
- CN207219167U CN207219167U CN201721059144.XU CN201721059144U CN207219167U CN 207219167 U CN207219167 U CN 207219167U CN 201721059144 U CN201721059144 U CN 201721059144U CN 207219167 U CN207219167 U CN 207219167U
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- CN
- China
- Prior art keywords
- circuit
- board structure
- protection materials
- line
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of board structure of circuit, including：Substrate, the substrate include pad area, line areas and logicalnot circuit area, covered with protection materials on the line areas and logicalnot circuit area；Or covered with protection materials on the substrate, and protection materials open a window in pad area opening position.The invention also discloses a kind of electric capacity printed board, including capacity cell and foregoing circuit harden structure.By covering protection materials on the line areas of substrate and logicalnot circuit area; or protection materials are covered on substrate and are opened a window in pad area; when needing in tin cream on pad area; the circuit on line areas is avoided to be stained with tin cream; cause line short to scrap, it also avoid the circuit on line areas and scrapped in welding process caused by artificial scratch；Or avoid the plate face in logicalnot circuit area from being stained with tin cream, the phenomenon for causing circuit not etch, improve the qualification rate of product.
Description
Technical field
Electronic applications are the utility model is related to, more particularly, to a kind of board structure of circuit and electric capacity printed board.
Background technology
As electronic product develops rapidly to the direction of miniaturization, densification, high integration and multifunction, to printing
Wiring board requirement also more and more higher, except densification, high layering and complicated outside the pale of civilization, also require embedded and bury
Resistance component is perhaps buried to reach stable signal transmission, not only saves space, and unfailing performance is excellent.
At present in industry, the printed board of high density embedded capacitance not is whole plate in the capacitance component that inner layer circuit board welds
It is required for welding, but capacitance component of burn-oning at specific part pad, other positions are still circuit or substrate regions.By
When Reflow Soldering, in tin cream on to specific pads, tin cream is easy to stick in the other optional positions of plate face, and especially tin cream sticks in two
Adjacent intensive line region causes short circuit, and this layer circuit board after the completion of paster be because that can not use AOI and electrical measurement to be detected, only
There is to main plate line the electrical measurement after passing by just to detect that inner layer circuit board short circuit is scrapped, and is influenceed huge.
Utility model content
Based on this, the utility model is to overcome prior art to stick in circuit board in tin cream on the pad on to circuit board
A kind of the defects of face other positions cause short circuit, there is provided board structure of circuit and electric capacity printed board.
Its technical scheme is as follows：
A kind of board structure of circuit, including：Substrate, the substrate include pad area, line areas and logicalnot circuit area, the circuit
Covered with protection materials in area and logicalnot circuit area；Or covered with protection materials on the substrate, and protection materials are in pad area
Opening position opens a window.
The technical program covers protection materials on the line areas of substrate and logicalnot circuit area, or protected material is covered on substrate
Expect and opened a window in pad area, when needing in tin cream on pad area, avoid the circuit on line areas from being stained with tin cream, cause circuit short
Road is scrapped, and be it also avoid the circuit on line areas and is scrapped in welding process caused by artificial scratch；Or avoid logicalnot circuit
The plate face in area is stained with tin cream, the phenomenon for causing circuit not etch, and improves the qualification rate of product.
In one of the embodiments, the protection materials include superstructure and understructure, and the understructure is
Glue-line.
In one of the embodiments, the superstructure is high-temperature-resistant layer.
In one of the embodiments, the glue-line is high temperature resistant glue-line.
In one of the embodiments, the superstructure is polyimide layer.
In one of the embodiments, the thickness of the glue-line is more than the thickness of line areas.
In one of the embodiments, the windowing is shaped as circular or rectangle.
In one of the embodiments, the diameter of the windowing or cornerwise size range are 0.2mm-5.0mm.
In one of the embodiments, the diameter of the windowing or cornerwise size range are less than or equal to 2.0mm.
The technical program also provides a kind of electric capacity printed board, including capacity cell and board structure of circuit, the circuit are hardened
Structure is the board structure of circuit described in any of the above-described embodiment, and the pad area of the capacity cell and the board structure of circuit welds
Connect, and the thickness of the protection materials is less than the thickness of the capacity cell.
The electric capacity printed board of the technical program uses foregoing circuit harden structure, protect line areas in electric capacity printed board and
Logicalnot circuit area is not polluted by tin cream, meanwhile, the thickness of protection materials is less than the thickness of capacity cell, facilitates capacity cell opening a window
Welded with pad area position.
The beneficial effects of the utility model are：
The utility model covers protection materials on the line areas of substrate and logicalnot circuit area, or protected material is covered on substrate
Expect and opened a window in pad area, when needing in tin cream on pad area, avoid the circuit on line areas from being stained with tin cream, cause circuit short
Scrap on road；Or avoid the plate face in logicalnot circuit area from being stained with tin cream, the phenomenon for causing circuit not etch, improve the qualified of product
Rate.
Electric capacity printed board of the present utility model uses foregoing circuit harden structure, protect line areas in electric capacity printed board and
Logicalnot circuit area is not polluted by tin cream, meanwhile, the thickness of protection materials is less than the thickness of capacity cell, facilitates capacity cell opening a window
Welded with pad area position.
Brief description of the drawings
Fig. 1 is the schematic diagram of board structure of circuit of the present utility model；
Fig. 2 is the schematic diagram one of electric capacity printed board of the present utility model；
Fig. 3 is the schematic diagram two of electric capacity printed board of the present utility model.
Description of reference numerals：
10th, substrate；20th, pad area；30th, line areas；40th, logicalnot circuit area；50th, protection materials；51st, superstructure；52nd, under
Rotating fields；60th, capacity cell.
Embodiment
It is below in conjunction with accompanying drawing and specifically real for the purpose of this utility model, technical scheme and advantage is more clearly understood
Mode is applied, the utility model is described in further detail.It should be appreciated that embodiment described herein
Only to explain the utility model, the scope of protection of the utility model is not limited.
A kind of board structure of circuit as shown in Figure 1, including：Substrate 10, the substrate 10 include pad area 20, line areas 30
With logicalnot circuit area 40, covered with protection materials 50 on the line areas 30 and logicalnot circuit area 40；Or covered on the substrate 10
There are protection materials 50, and protection materials 50 open a window in the opening position of pad area 20.
Present embodiment covers protection materials 50 on the line areas 30 of substrate 10 and logicalnot circuit area 40, or on the substrate 10
Covering protection material 50 and opened a window in pad area 20, when needing in tin cream on pad area 20, avoid the circuit on line areas 30
Tin cream is stained with, causes line short to scrap, the circuit on line areas 30 is it also avoid and is caused in welding process by artificial scuffing
Scrap；Or avoid the plate face in logicalnot circuit area 40 from being stained with tin cream, the phenomenon for causing circuit not etch, improve the qualified of product
Rate.
Further, the protection materials 50 include superstructure 51 and understructure 52, and the understructure 52 is glue
Layer.Protection materials 50 are attached on substrate 10 using glue-line, ensure that protection materials 50 will not be offset easily.
Further, the superstructure 51 is high-temperature-resistant layer.The superstructure of high-temperature-resistant layer causes board structure of circuit to exist
It will not melt in reflow process because temperature is too high, so as to influence the product quality of circuit board.Preferably, this implementation
Mode is using polyimide layer as superstructure 51.
Further, the glue-line is high temperature resistant glue-line.High temperature resistant glue-line will not be because of temperature mistake in reflow process
It is high and lose activity, influence its adhesion effect.And the thickness of the glue-line is more than the thickness of line areas 30, makes glue-line in circuit
Area 30 and logicalnot circuit area 40 can be preferably bonded with substrate, ensure that the adhesion effect of glue-line.
Further, the windowing of the protection materials 50 is shaped as circular or rectangle, the diameter of the windowing or diagonal
The size range of line is 0.2mm-5.0mm.Preferably, the diameter of the windowing or cornerwise size range be less than or equal to
2.0mm.In present embodiment, the windowing of protection materials 50 is opened a window using rectangle, and the length of the most long-diagonal of rectangle windowing exists
Within 2.0mm.
Present embodiment also provides a kind of electric capacity printed board, including capacity cell 60 and board structure of circuit, the circuit board
Structure is the pad area of the board structure of circuit described in any of the above-described embodiment, the capacity cell 60 and the board structure of circuit
20 welding, and the thickness of the protection materials 50 is less than the thickness of the capacity cell 60.
The electric capacity printed board of present embodiment uses foregoing circuit harden structure, protects the line areas 30 in electric capacity printed board
Do not polluted with logicalnot circuit area 40 by tin cream, meanwhile, the thickness of protection materials 50 is less than the thickness of capacity cell 60, facilitates electric capacity first
Part 60 is welded in windowing position with pad area 20.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of board structure of circuit, including：Substrate, the substrate include pad area, line areas and logicalnot circuit area, and its feature exists
In covered with protection materials on the line areas and logicalnot circuit area；Or covered with protection materials on the substrate, and protect
Material opens a window in pad area opening position.
2. board structure of circuit according to claim 1, it is characterised in that the protection materials include superstructure and lower floor
Structure, the understructure are glue-line.
3. board structure of circuit according to claim 2, it is characterised in that the superstructure is high-temperature-resistant layer.
4. board structure of circuit according to claim 2, it is characterised in that the glue-line is high temperature resistant glue-line.
5. board structure of circuit according to claim 2, it is characterised in that the superstructure is polyimide layer.
6. board structure of circuit according to claim 2, it is characterised in that the thickness of the glue-line is more than the thickness of line areas
Degree.
7. according to the board structure of circuit described in claim any one of 1-6, it is characterised in that the windowing be shaped as it is circular or
Rectangle.
8. board structure of circuit according to claim 7, it is characterised in that the diameter of the windowing or cornerwise size model
Enclose for 0.2mm-5.0mm.
9. board structure of circuit according to claim 8, it is characterised in that the diameter of the windowing or cornerwise size model
Enclose for less than or equal to 2.0mm.
10. a kind of electric capacity printed board, it is characterised in that including capacity cell and board structure of circuit, the board structure of circuit is power
Profit requires the board structure of circuit described in any one of 1-9, and the pad area of the capacity cell and the board structure of circuit welds, and institute
The thickness for stating protection materials is less than the thickness of the capacity cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721059144.XU CN207219167U (en) | 2017-08-23 | 2017-08-23 | Board structure of circuit and electric capacity printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721059144.XU CN207219167U (en) | 2017-08-23 | 2017-08-23 | Board structure of circuit and electric capacity printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207219167U true CN207219167U (en) | 2018-04-10 |
Family
ID=61816233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721059144.XU Expired - Fee Related CN207219167U (en) | 2017-08-23 | 2017-08-23 | Board structure of circuit and electric capacity printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207219167U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113325295A (en) * | 2021-05-13 | 2021-08-31 | 江苏普诺威电子股份有限公司 | Reliability test method for planar buried capacitor substrate micro short circuit |
-
2017
- 2017-08-23 CN CN201721059144.XU patent/CN207219167U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113325295A (en) * | 2021-05-13 | 2021-08-31 | 江苏普诺威电子股份有限公司 | Reliability test method for planar buried capacitor substrate micro short circuit |
| CN113325295B (en) * | 2021-05-13 | 2022-07-19 | 江苏普诺威电子股份有限公司 | Reliability test method for planar buried capacitor substrate micro short circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |