CN108459441A - A kind of display device and preparation method thereof - Google Patents
A kind of display device and preparation method thereof Download PDFInfo
- Publication number
- CN108459441A CN108459441A CN201810326827.XA CN201810326827A CN108459441A CN 108459441 A CN108459441 A CN 108459441A CN 201810326827 A CN201810326827 A CN 201810326827A CN 108459441 A CN108459441 A CN 108459441A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- golden finger
- display panel
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract 2
- 239000002245 particle Substances 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims description 57
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 55
- 239000010931 gold Substances 0.000 claims description 55
- 229910052737 gold Inorganic materials 0.000 claims description 55
- 239000002313 adhesive film Substances 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 35
- 230000015556 catabolic process Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 2
- 230000005684 electric field Effects 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a kind of display devices and preparation method thereof, by the way of applying setting voltage between the golden finger connection terminal corresponding with display panel in the first flexible PCB and forming electric field, to puncture conducting particles surface insulation medium in anisotropic conductive film, keep anisotropic conductive film conductive, realize the function of anisotropic conductive film conducting the first flexible PCB and display panel, anisotropic conductive film conduction is realized using pressing mode relative to existing, the position of anisotropic conductive film conduction can be accurately controlled, and the electric field that voltage is formed is set by control, ensure the conducting state between golden finger and connection terminal, to improve the yield of binding.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display device and a manufacturing method thereof.
Background
At present, after a flat panel display panel such as a liquid crystal display panel, an organic electroluminescent display panel, etc. is manufactured, it is necessary to bond and connect with a Flexible Printed Circuit (FPC) so as to access an electrical signal to the display panel through the FPC to control the display. Specifically, the flexible circuit board and the display panel need to be bonded by an Anisotropic Conductive Film (ACF).
The anisotropic conductive film mainly comprises a resin adhesive and conductive particles. At ordinary times, the conductive particles are uniformly distributed in the adhesive and are not contacted with each other, and a layer of insulating medium is wrapped on the outer surface of the conductive particles, so that the anisotropic conductive adhesive film is not conductive. When the anisotropic conductive film is pressurized, the insulating medium on the surface of the conductive particles is broken, so that the anisotropic conductive film is conductive.
When the anisotropic conductive film is used for binding the flexible circuit board and the display panel, a relatively complex debugging stage is required to determine pressure parameters and the like. In the subsequent pressurizing and binding process, the anisotropic conductive adhesive film is conducted in the pressure direction due to the whole surface pressurization, and a large pressure is required to be used for ensuring the conduction of the anisotropic conductive adhesive film, so that devices in the display panel or the flexible circuit board can be damaged. Moreover, due to the fact that the surfaces of the display panel and the flexible circuit board facing the anisotropic conductive film may be uneven, and due to the influences of distribution of conductive particles and impurities inside the anisotropic conductive film, the problem that the local area of the anisotropic conductive film is not smoothly conducted may exist, and the binding yield of the display device is influenced.
Disclosure of Invention
In view of this, embodiments of the present invention provide a display device and a method for manufacturing the same, so as to improve the binding yield of the display device.
The embodiment of the invention provides a manufacturing method of a display device, which comprises the following steps:
adopting an anisotropic conductive adhesive film to correspondingly attach the golden fingers of the first flexible circuit board and the connecting terminals of the display panel one by one;
and applying a set voltage to the golden finger and the corresponding connecting terminal to enable the anisotropic conductive film to conduct the golden finger and the corresponding connecting terminal.
In a possible implementation manner, in the manufacturing method provided in the embodiment of the present invention, the set voltage is greater than a dielectric breakdown voltage of the surface insulating medium of the conductive particle in the anisotropic conductive film.
In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, the applying a set voltage to the gold finger and the corresponding connection terminal specifically includes:
applying a first voltage to the golden finger and the corresponding connecting terminal;
detecting whether the binding resistance between the golden finger and the corresponding connecting terminal is greater than a set resistance or not;
when detecting the binding resistance between the golden finger and the corresponding connecting terminal is greater than the set resistance, applying a second voltage to the golden finger and the corresponding connecting terminal, wherein the second voltage is greater than the first voltage until the binding resistance between the golden finger and the corresponding connecting terminal is determined not to be greater than the set resistance.
In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, the display panel further includes: the voltage-controlled switch comprises a voltage access terminal, a switch terminal and first switch transistors in one-to-one correspondence with the connection terminals; each of the connection terminals is connected to a drain of a corresponding first switching transistor, the voltage access terminal is connected to a source of each of the first switching transistors, and the switching terminal is connected to a gate of each of the first switching transistors;
the first flexible circuit board further includes: the first testing golden finger corresponds to the voltage access terminal, and the second testing golden finger corresponds to the switch terminal;
adopt anisotropic conductive adhesive film, when laminating the golden finger of first flexible circuit board and display panel's connecting terminal one-to-one, still include:
and electrically connecting the first testing golden finger of the first flexible circuit board with the voltage access terminal of the display panel, and electrically connecting the second testing golden finger of the first flexible circuit board with the switch terminal of the display panel.
In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, the applying a set voltage to the gold finger and the corresponding connection terminal specifically includes:
and applying a conducting electric signal to the second testing golden finger, applying a first potential signal to the first testing golden finger, and applying a second potential signal to each golden finger, wherein the set voltage is arranged between the second potential signal and the first potential signal.
In a possible implementation manner, in the manufacturing method provided in the embodiment of the present invention, the first flexible circuit board further includes: the third testing golden finger, the fourth testing golden finger and the second switch transistor which is in one-to-one correspondence with each golden finger; each golden finger is connected with the drain electrode of the corresponding second switch transistor, the third testing golden finger is connected with the source electrode of the corresponding second switch transistor, and the fourth testing golden finger is connected with the grid electrode of the corresponding second switch transistor;
the applying of the second potential signal to each gold finger specifically includes:
and applying a conducting electric signal to the fourth testing golden finger, and applying the second potential signal to the third testing golden finger.
In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, after applying a set voltage to the gold finger and the corresponding connection terminal, the method further includes:
replacing the first flexible circuit board with a second flexible circuit board to be bound with the display panel;
the first flexible circuit board is used as a test circuit board, wherein each golden finger is connected with a fifth test golden finger.
In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, the applying an anisotropic conductive film to correspondingly attach the gold finger of the first flexible circuit board to the connection terminal of the display panel one by one includes:
placing the anisotropic conductive adhesive film between the first flexible circuit board and the display panel;
pressing the first flexible circuit board or the display panel by adopting first pressure to enable the first flexible circuit board to be attached to the display panel through the anisotropic conductive adhesive film;
adopt the second flexible circuit board to replace the first flexible circuit board with display panel binds, specifically includes:
peeling the first flexible circuit board on the anisotropic conductive adhesive film;
placing the second flexible circuit board on the anisotropic conductive adhesive film, so that the golden fingers of the second flexible circuit board correspond to the connecting terminals of the display panel one by one;
pressing the second flexible circuit board or the display panel by adopting a second pressure to enable the second flexible circuit board to be attached to the display panel through the anisotropic conductive adhesive film; wherein,
the second pressure is greater than the first pressure.
On the other hand, an embodiment of the present invention further provides a display device, including: the display device comprises a display panel, a flexible circuit board and an anisotropic conductive adhesive film; wherein,
the display panel comprises a plurality of connecting terminals, and the flexible circuit board comprises golden fingers which are in one-to-one correspondence with the connecting terminals;
the anisotropic conductive film is located between the display panel and the flexible circuit board, and the anisotropic conductive film is only conducted in the area between the golden finger and the corresponding connecting terminal.
In a possible implementation manner, in the display device provided in an embodiment of the present invention, the display panel further includes: the voltage-controlled switch comprises a voltage access terminal, a switch terminal and first switch transistors in one-to-one correspondence with the connection terminals; wherein,
each of the connection terminals is connected to a drain of a corresponding first switching transistor, the voltage access terminal is connected to a source of each of the first switching transistors, and the switching terminal is connected to a gate of each of the first switching transistors.
The embodiment of the invention has the beneficial effects that:
according to the display device and the manufacturing method thereof provided by the embodiment of the invention, the mode that the set voltage is applied between the golden finger of the first flexible circuit board and the corresponding connecting terminal of the display panel to form the electric field is adopted to break down the surface insulating medium of the conductive particle in the anisotropic conductive adhesive film, so that the anisotropic conductive adhesive film is conductive, the function of the anisotropic conductive adhesive film for conducting the first flexible circuit board and the display panel is realized, compared with the existing mode that the anisotropic conductive adhesive film is conductive in a pressing mode, the conductive position of the anisotropic conductive adhesive film can be accurately controlled, and the conductive state between the golden finger and the connecting terminal is ensured by controlling the electric field formed by the set voltage, so that the binding yield is improved.
Drawings
Fig. 1a and fig. 1b are flow charts of a method for manufacturing a display device according to an embodiment of the present invention;
fig. 2 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display panel in a display device according to an embodiment of the present invention;
fig. 4 and fig. 5 are schematic structural diagrams of a first flexible substrate in a display device according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a second flexible substrate in a display device according to an embodiment of the present invention;
fig. 7 to 9 are schematic structural diagrams of a display device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
The manufacturing method of the display device provided by the embodiment of the invention, as shown in fig. 1a, includes the following steps:
s101, correspondingly attaching the golden fingers of the first flexible circuit board and the connecting terminals of the display panel one by adopting an anisotropic conductive adhesive film;
s102, applying a set voltage to the golden finger and the corresponding connecting terminal to enable the anisotropic conductive film to conduct the golden finger and the corresponding connecting terminal.
Specifically, under the action of a strong electric field, the solid dielectric loses the electric insulation capability and changes from an insulation state to a good conduction state. The lowest critical voltage that causes breakdown is called the breakdown voltage. After breakdown of the solid dielectric, a molten or burnt channel or mechanically damaged crack may occur in the solid dielectric due to a large current passing through the solid dielectric. These changes in the solid dielectric are irreversible and do not restore the original insulating properties by themselves. When a brittle solid dielectric is broken down, the material is often cracked, so that the non-metallic material can be broken down by the breakdown effect.
Based on this, in the manufacturing method provided in the embodiment of the present invention, a set voltage is applied between the gold finger of the first flexible circuit board and the corresponding connection terminal of the display panel to form an electric field, so as to break down the surface insulating medium of the conductive particle in the anisotropic conductive adhesive film, so that the anisotropic conductive adhesive film is conductive, thereby implementing a function of the anisotropic conductive adhesive film to conduct the first flexible circuit board and the display panel.
In particular, the magnitude of the breakdown voltage of a solid dielectric is related to the composition, thickness, environmental conditions, and electrode shape, arrangement, etc. of the material. The breakdown voltage (MV/m) per unit thickness of a solid dielectric under a uniform electric field is called the dielectric breakdown field strength, also called the dielectric strength. Breakdown field strength is often reduced when the dielectric contains moisture, air bubbles, and fine impurities.
Optionally, in the manufacturing method provided in the embodiment of the present invention, in a case that the dielectric breakdown voltage of the surface insulating medium of the conductive particle in the anisotropic conductive adhesive film is known after the test, the step S102 may directly apply a set voltage greater than the dielectric breakdown voltage of the surface insulating medium of the conductive particle in the anisotropic conductive adhesive film to the gold finger and the corresponding connection terminal, so that the anisotropic conductive adhesive film conducts the gold finger and the corresponding connection terminal.
Optionally, in the manufacturing method provided in the embodiment of the present invention, in a case that the dielectric breakdown voltage of the insulating medium on the surface of the conductive particle in the anisotropic conductive film is unknown, the step S102 applies a set voltage to the gold finger and the corresponding connection terminal, as shown in fig. 2, and may be implemented by the following steps:
s201, applying a first voltage to the golden finger and the corresponding connecting terminal; specifically, the first voltage may be a voltage with a small value, so as to prevent the display panel or the flexible circuit board from being damaged;
s202, detecting whether the binding resistance between the golden finger and the corresponding connecting terminal is larger than a set resistance or not; if so, indicating that the conductivity of the anisotropic conductive adhesive film cannot meet the requirement, and executing step S203; if not, ending the flow;
s203, applying a second voltage to the golden finger and the corresponding connecting terminal, wherein the second voltage is greater than the first voltage; for example, the second voltage may be increased by a set step size on the basis of the first voltage; thereafter, the process returns to step S202.
Through the continuous circulation of the steps S202 and S203, until it is determined that the binding resistance between the gold finger and the corresponding connection terminal is not greater than the set resistance, the conductive performance of the anisotropic conductive adhesive film is ensured to meet the requirement, and the binding yield of the display device is ensured. And the value of the voltage applied to the golden finger and the corresponding connecting terminal can be recorded and used as the voltage parameter when the products are bound, so that the voltage parameter can be directly used for binding when the products of the same type are manufactured in the following process.
Compared with the existing waste caused by only directly scrapping the product when the conductive performance of the product is detected to be not in accordance with the requirement after the anisotropic conductive film is conductive by adopting a pressing mode, the manufacturing method provided by the embodiment of the invention can continuously increase the voltage until the conductive performance of the anisotropic conductive film meets the requirement, so that the waste caused by directly scrapping the product can be avoided.
Alternatively, in the manufacturing method provided by the embodiment of the present invention, there may be a variety of ways to apply the electrical signal to the connection terminal in the display panel in step S102. For example, as shown in fig. 3, the display panel 1 may include, in addition to the connection terminals 11: a voltage access terminal 12, a switch terminal 13, and first switching transistors 14 in one-to-one correspondence with the connection terminals 11; each connection terminal 11 is connected to the drain of a corresponding first switching transistor 14, the voltage access terminal 12 is connected to the source of each first switching transistor 14, and the switching terminal 13 is connected to the gate of each first switching transistor 14. In this way, under the control of the switching terminal 13, the voltage access terminal 12 is connected to each connection terminal 11 through the first switching transistor 14; when the switch terminal 13 is loaded with a conducting signal, the voltage access terminal 12 and each connection terminal 11 can be conducted; when the switch terminal 13 is applied with the off signal, the voltage access terminal 12 and each connection terminal 11 can be disconnected. The control of applying the electric signal to the connection terminal can be realized by the control of applying the electric signal to the switch terminal 13 and the voltage access terminal 12.
Correspondingly, in the above manufacturing method provided in the embodiment of the present invention, as shown in fig. 4 and 5, the first flexible circuit board 2 may further include, in addition to the gold finger 21: a first test gold finger 22 corresponding to the voltage access terminal 12, and a second test gold finger 23 corresponding to the switch terminal 13.
Correspondingly, in the manufacturing method provided by the embodiment of the present invention, in the step S101, the anisotropic conductive film is adopted, and the gold fingers of the first flexible circuit board and the connection terminals of the display panel are correspondingly attached to each other one by one, and the following steps may be further performed:
the first test gold finger 22 of the first flexible circuit board 2 is electrically connected to the voltage access terminal 12 of the display panel 1, and the second test gold finger 23 of the first flexible circuit board 2 is electrically connected to the switch terminal 13 of the display panel 1. Specifically, as shown in fig. 7, the first test gold finger 22 is electrically connected to the voltage access terminal 12 directly without the anisotropic conductive film 3, and the second test gold finger 23 is electrically connected to the switch terminal 13. In this way, the loading of the electrical signals to the switch terminal 13 and the voltage access terminal 12 can be realized by loading the electrical signals to the first test gold finger 22 and the second test gold finger 23.
Based on this, optionally, in the manufacturing method provided by the embodiment of the present invention, the step S102 may specifically be implemented by applying a set voltage to the gold finger and the corresponding connection terminal in the following manner:
an on-signal is applied to the second test gold finger 23, a first potential signal is applied to the first test gold finger 22, and a second potential signal having a set voltage is applied to each gold finger 21.
Optionally, in the manufacturing method provided in the embodiment of the present invention, in order to facilitate applying a voltage to each gold finger in the first flexible circuit board to form an electric field breakdown anisotropic conductive film, and subsequently, each gold finger in the first flexible circuit board provides a required electrical signal to the corresponding connection terminal. As shown in fig. 4, the first flexible circuit board 2 may further include: a third testing gold finger 24, a fourth testing gold finger 25, and second switching transistors 26 corresponding to the gold fingers 21 one to one; each gold finger 21 is connected to the drain of the corresponding second switch transistor 26, the third testing gold finger 24 is connected to the source of each second switch transistor 26, and the fourth testing gold finger 25 is connected to the gate of each second switch transistor 26. Thus, the third test gold finger 24 is connected to each gold finger 21 through the second switching transistor 26 under the control of the fourth test gold finger 25; when the fourth testing golden finger 25 loads the conducting signal, the third testing golden finger 24 and each golden finger 21 can be conducted; when the fourth test gold finger 25 is loaded with the off signal, the third test gold finger 24 may be disconnected from each gold finger 21. The control of applying the electric signal to each gold finger 21 can be realized by the control of applying the electric signal to the third test gold finger 24 and the fourth test gold finger 25. Fig. 7 is a schematic structural diagram of the display panel 1 shown in fig. 3 and the first flexible circuit board 2 shown in fig. 4 after being bound.
Correspondingly, in the manufacturing method provided by the embodiment of the present invention, the applying of the second potential signal to each gold finger 21 may be specifically implemented by the following steps:
a conducting electrical signal is applied to the fourth test gold finger 25 and a second potential signal is applied to the third test gold finger 24.
Correspondingly, in the manufacturing method provided by the embodiment of the invention, when the subsequent display device normally works, the cut-off electric signal is applied to the fourth test golden finger 25.
Or, optionally, in the manufacturing method provided in the embodiment of the present invention, the first flexible circuit substrate 2 may also be used as a test circuit board, which is only used to break down the surface insulating medium of the conductive particles in the anisotropic conductive film 3, and then the second flexible circuit board 2 'is used to replace the first flexible circuit board 2, and the second flexible circuit board 2' is used to input the electrical signal to the display panel.
Based on this, optionally, in the manufacturing method provided in the embodiment of the present invention, after the step S102 applies the set voltage to the gold finger and the corresponding connection terminal, as shown in fig. 1b, the method may further include:
s103, replacing the first flexible circuit board 2 shown in the figure 5 with the second flexible circuit board 2' shown in the figure 6 to be bound with the display panel 1; as shown in fig. 5, the first flexible circuit board 2 is used as a test circuit board, wherein each gold finger 21 is connected to a fifth test gold finger 27, and fig. 8 is a schematic structural diagram of the first flexible circuit board 2 shown in fig. 5 and the display panel 1 shown in fig. 3 after being bound. Fig. 9 is a schematic structural diagram of the second flexible circuit board 2' shown in fig. 6 and the display panel 1 shown in fig. 3 after being bound.
Optionally, in the manufacturing method provided in the embodiment of the present invention, in the step S101, the anisotropic conductive film is adopted to correspondingly attach the gold fingers of the first flexible circuit board to the connection terminals of the display panel one by one, which may specifically be implemented by:
firstly, placing an anisotropic conductive film 3 between a first flexible circuit board 2 and a display panel 1;
then, the first flexible circuit board 2 or the display panel 1 is pressed by the first pressure, so that the first flexible circuit board 2 is attached to the display panel 1 through the anisotropic conductive film 3.
Correspondingly, in step S103, the second flexible circuit board is used to replace the first flexible circuit board to be bound with the display panel, which can be specifically implemented in the following manner:
firstly, stripping a first flexible circuit board 2 on an anisotropic conductive adhesive film 3;
then, the second flexible circuit board 2 ' is placed on the anisotropic conductive film 3, so that the gold fingers 21 ' of the second flexible circuit board 2 ' correspond to the connection terminals 11 of the display panel 1 one by one;
finally, pressing the second flexible circuit board 2 'or the display panel 1 by adopting a second pressure to enable the second flexible circuit board 2' to be attached to the display panel 1 through the anisotropic conductive film 3; wherein the second pressure is greater than the first pressure.
Specifically, the first pressure and the second pressure are both less than the force that can make the anisotropic conductive film 3 conduct in the pressure direction, and only ensure that the first flexible circuit board 2 or the second flexible circuit board 2' is attached to the display panel 1. The first pressure is less than the second pressure, which can facilitate the first flexible circuit board 2 to be peeled from the surface of the anisotropic conductive film 3.
Based on the same inventive concept, the embodiment of the present invention further provides a display device, which may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. The implementation of the display device can refer to the above embodiment of the manufacturing method, and repeated details are not repeated.
Specifically, an embodiment of the present invention provides a display device, as shown in fig. 7 and 9, including: the display device comprises a display panel 1, a flexible circuit board 2 or 2', and an anisotropic conductive film 3; wherein,
the display panel 1 comprises a plurality of connecting terminals 11, and the flexible circuit board 2 comprises golden fingers 21 which correspond to the connecting terminals 11 one by one;
the anisotropic conductive film 3 is located between the display panel 1 and the flexible circuit board 2 or 2', and the anisotropic conductive film 3 is conducted only in the region between the gold finger 11 and the corresponding connection terminal 21.
Optionally, in the display device provided in the embodiment of the present invention, as shown in fig. 7 and 9, the display panel 1 may further include: a voltage access terminal 12, a switch terminal 13, and first switching transistors 14 in one-to-one correspondence with the connection terminals 11; wherein,
each connection terminal 11 is connected to the drain of a corresponding first switching transistor 14, the voltage access terminal 12 is connected to the source of each first switching transistor 14, and the switching terminal 13 is connected to the gate of each first switching transistor 14.
Specifically, in the display device provided in the embodiment of the present invention, the flexible circuit board may specifically adopt the first flexible circuit board 2 shown in fig. 4, or the flexible circuit board may specifically adopt the second flexible circuit board 2' shown in fig. 6, which is not limited herein.
According to the display device and the manufacturing method thereof provided by the embodiment of the invention, the mode that the set voltage is applied between the golden finger of the first flexible circuit board and the corresponding connecting terminal of the display panel to form the electric field is adopted to break down the surface insulating medium of the conductive particle in the anisotropic conductive adhesive film, so that the anisotropic conductive adhesive film is conductive, the function of the anisotropic conductive adhesive film for conducting the first flexible circuit board and the display panel is realized, compared with the existing mode that the anisotropic conductive adhesive film is conductive in a pressing mode, the conductive position of the anisotropic conductive adhesive film can be accurately controlled, and the conductive state between the golden finger and the connecting terminal is ensured by controlling the electric field formed by the set voltage, so that the binding yield is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A method for manufacturing a display device, comprising:
adopting an anisotropic conductive adhesive film to correspondingly attach the golden fingers of the first flexible circuit board and the connecting terminals of the display panel one by one;
and applying a set voltage to the golden finger and the corresponding connecting terminal to enable the anisotropic conductive film to conduct the golden finger and the corresponding connecting terminal.
2. The method according to claim 1, wherein the set voltage is greater than a dielectric breakdown voltage of surface insulating media of the conductive particles in the anisotropic conductive film.
3. The method according to claim 1, wherein applying a set voltage to the gold finger and the corresponding connection terminal comprises:
applying a first voltage to the golden finger and the corresponding connecting terminal;
detecting whether the binding resistance between the golden finger and the corresponding connecting terminal is greater than a set resistance or not;
when detecting the binding resistance between the golden finger and the corresponding connecting terminal is greater than the set resistance, applying a second voltage to the golden finger and the corresponding connecting terminal, wherein the second voltage is greater than the first voltage until the binding resistance between the golden finger and the corresponding connecting terminal is determined not to be greater than the set resistance.
4. The method of manufacturing according to claim 1, wherein the display panel further comprises: the voltage-controlled switch comprises a voltage access terminal, a switch terminal and first switch transistors in one-to-one correspondence with the connection terminals; each of the connection terminals is connected to a drain of a corresponding first switching transistor, the voltage access terminal is connected to a source of each of the first switching transistors, and the switching terminal is connected to a gate of each of the first switching transistors;
the first flexible circuit board further includes: the first testing golden finger corresponds to the voltage access terminal, and the second testing golden finger corresponds to the switch terminal;
adopt anisotropic conductive adhesive film, when laminating the golden finger of first flexible circuit board and display panel's connecting terminal one-to-one, still include:
and electrically connecting the first testing golden finger of the first flexible circuit board with the voltage access terminal of the display panel, and electrically connecting the second testing golden finger of the first flexible circuit board with the switch terminal of the display panel.
5. The method according to claim 4, wherein applying a set voltage to the gold finger and the corresponding connection terminal comprises:
and applying a conducting electric signal to the second testing golden finger, applying a first potential signal to the first testing golden finger, and applying a second potential signal to each golden finger, wherein the set voltage is arranged between the second potential signal and the first potential signal.
6. The method of manufacturing of claim 5, wherein the first flexible circuit board further comprises: the third testing golden finger, the fourth testing golden finger and the second switch transistor which is in one-to-one correspondence with each golden finger; each golden finger is connected with the drain electrode of the corresponding second switch transistor, the third testing golden finger is connected with the source electrode of the corresponding second switch transistor, and the fourth testing golden finger is connected with the grid electrode of the corresponding second switch transistor;
the applying of the second potential signal to each gold finger specifically includes:
and applying a conducting electric signal to the fourth testing golden finger, and applying the second potential signal to the third testing golden finger.
7. The method according to any one of claims 1 to 5, further comprising, after applying a set voltage to the gold finger and the corresponding connection terminal:
replacing the first flexible circuit board with a second flexible circuit board to be bound with the display panel;
the first flexible circuit board is used as a test circuit board, wherein each golden finger is connected with a fifth test golden finger.
8. The manufacturing method according to claim 7, wherein the anisotropic conductive film is used to correspondingly attach the gold fingers of the first flexible circuit board to the connection terminals of the display panel one by one, and the method specifically includes:
placing the anisotropic conductive adhesive film between the first flexible circuit board and the display panel;
pressing the first flexible circuit board or the display panel by adopting first pressure to enable the first flexible circuit board to be attached to the display panel through the anisotropic conductive adhesive film;
adopt the second flexible circuit board to replace the first flexible circuit board with display panel binds, specifically includes:
peeling the first flexible circuit board on the anisotropic conductive adhesive film;
placing the second flexible circuit board on the anisotropic conductive adhesive film, so that the golden fingers of the second flexible circuit board correspond to the connecting terminals of the display panel one by one;
pressing the second flexible circuit board or the display panel by adopting a second pressure to enable the second flexible circuit board to be attached to the display panel through the anisotropic conductive adhesive film; wherein,
the second pressure is greater than the first pressure.
9. A display device, comprising: the display device comprises a display panel, a flexible circuit board and an anisotropic conductive adhesive film; wherein,
the display panel comprises a plurality of connecting terminals, and the flexible circuit board comprises golden fingers which are in one-to-one correspondence with the connecting terminals;
the anisotropic conductive film is located between the display panel and the flexible circuit board, and the anisotropic conductive film is only conducted in the area between the golden finger and the corresponding connecting terminal.
10. The display device according to claim 9, wherein the display panel further comprises: the voltage-controlled switch comprises a voltage access terminal, a switch terminal and first switch transistors in one-to-one correspondence with the connection terminals; wherein,
each of the connection terminals is connected to a drain of a corresponding first switching transistor, the voltage access terminal is connected to a source of each of the first switching transistors, and the switching terminal is connected to a gate of each of the first switching transistors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810326827.XA CN108459441B (en) | 2018-04-12 | 2018-04-12 | Display device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810326827.XA CN108459441B (en) | 2018-04-12 | 2018-04-12 | Display device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108459441A true CN108459441A (en) | 2018-08-28 |
| CN108459441B CN108459441B (en) | 2021-04-09 |
Family
ID=63235343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810326827.XA Active CN108459441B (en) | 2018-04-12 | 2018-04-12 | Display device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108459441B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037998A (en) * | 2018-08-08 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | Electrical connection module and display device, electrically connected method |
| CN109597251A (en) * | 2018-12-03 | 2019-04-09 | 华显光电技术（惠州）有限公司 | LCD binds pin configuration, glass substrate and modular structure |
| CN110416264A (en) * | 2019-07-22 | 2019-11-05 | 武汉华星光电半导体显示技术有限公司 | The binding method and display device of display device |
| CN110505751A (en) * | 2019-08-29 | 2019-11-26 | 武汉天马微电子有限公司 | Flexible circuit board, display panel, display device and test method |
| CN110913573A (en) * | 2019-12-17 | 2020-03-24 | 武汉天马微电子有限公司 | Flexible circuit board |
| CN111211113A (en) * | 2020-01-13 | 2020-05-29 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, detection method thereof and display device |
| CN112867288A (en) * | 2021-01-05 | 2021-05-28 | 江苏特丽亮镀膜科技有限公司 | ACF conductive adhesive film structure, hot pressing method thereof and hot pressing assembly |
| CN118244530A (en) * | 2024-05-23 | 2024-06-25 | 惠科股份有限公司 | Display device and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102655207A (en) * | 2011-03-01 | 2012-09-05 | 日本碍子株式会社 | Terminal electrode forming method and manufacturing method of piezoelectric/electrostrictive element by use thereof |
| US20120299888A1 (en) * | 2011-05-26 | 2012-11-29 | Sung Gyu Kim | Display panel |
| CN105493204A (en) * | 2015-10-29 | 2016-04-13 | 京东方科技集团股份有限公司 | Anisotropic conductive film, bonding structure, and display panel and preparation method thereof |
| CN107479272A (en) * | 2016-06-08 | 2017-12-15 | 三星显示有限公司 | Display device |
-
2018
- 2018-04-12 CN CN201810326827.XA patent/CN108459441B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102655207A (en) * | 2011-03-01 | 2012-09-05 | 日本碍子株式会社 | Terminal electrode forming method and manufacturing method of piezoelectric/electrostrictive element by use thereof |
| US20120299888A1 (en) * | 2011-05-26 | 2012-11-29 | Sung Gyu Kim | Display panel |
| CN105493204A (en) * | 2015-10-29 | 2016-04-13 | 京东方科技集团股份有限公司 | Anisotropic conductive film, bonding structure, and display panel and preparation method thereof |
| CN107479272A (en) * | 2016-06-08 | 2017-12-15 | 三星显示有限公司 | Display device |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037998A (en) * | 2018-08-08 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | Electrical connection module and display device, electrically connected method |
| CN109597251A (en) * | 2018-12-03 | 2019-04-09 | 华显光电技术（惠州）有限公司 | LCD binds pin configuration, glass substrate and modular structure |
| CN109597251B (en) * | 2018-12-03 | 2023-03-31 | 华显光电技术（惠州）有限公司 | LCD binding pin structure, glass substrate and module structure |
| CN110416264A (en) * | 2019-07-22 | 2019-11-05 | 武汉华星光电半导体显示技术有限公司 | The binding method and display device of display device |
| WO2021012337A1 (en) * | 2019-07-22 | 2021-01-28 | 武汉华星光电半导体显示技术有限公司 | Display device bonding method and display device |
| CN110416264B (en) * | 2019-07-22 | 2022-03-01 | 武汉华星光电半导体显示技术有限公司 | Display device and binding method thereof |
| US11417251B2 (en) | 2019-08-29 | 2022-08-16 | Wuhan Tianma Micro-Electronics Co., Ltd. | Flexible circuit board, display panel, display device and test method |
| CN110505751A (en) * | 2019-08-29 | 2019-11-26 | 武汉天马微电子有限公司 | Flexible circuit board, display panel, display device and test method |
| CN110505751B (en) * | 2019-08-29 | 2021-04-13 | 武汉天马微电子有限公司 | Flexible circuit board, display panel, display device and test method |
| CN110913573A (en) * | 2019-12-17 | 2020-03-24 | 武汉天马微电子有限公司 | Flexible circuit board |
| CN111211113A (en) * | 2020-01-13 | 2020-05-29 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, detection method thereof and display device |
| CN111211113B (en) * | 2020-01-13 | 2022-04-15 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, detection method thereof and display device |
| CN112867288A (en) * | 2021-01-05 | 2021-05-28 | 江苏特丽亮镀膜科技有限公司 | ACF conductive adhesive film structure, hot pressing method thereof and hot pressing assembly |
| WO2022148106A1 (en) * | 2021-01-05 | 2022-07-14 | 江苏特丽亮镀膜科技有限公司 | Acf conductive film structure, and hot pressing method and hot pressing assembly therefor |
| US11545283B2 (en) | 2021-01-05 | 2023-01-03 | Jiangsu Telilan Coaling Technology Co., Ltd. | Anisotropic conductive film (ACF) structure and hot-pressing method and hot-pressing assembly thereof |
| CN112867288B (en) * | 2021-01-05 | 2021-08-17 | 江苏特丽亮镀膜科技有限公司 | ACF conductive adhesive film structure, hot pressing method thereof and hot pressing assembly |
| CN118244530A (en) * | 2024-05-23 | 2024-06-25 | 惠科股份有限公司 | Display device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108459441B (en) | 2021-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108459441B (en) | Display device and manufacturing method thereof | |
| CN109342513B (en) | Display panel and crack detection method for display panel | |
| CN106105404A (en) | The manufacture method of pliability mounting module body | |
| KR100713333B1 (en) | Multi-layered anisotropic conductive film | |
| WO2015166222A1 (en) | Method of bonding flexible printed circuits | |
| CN109342512B (en) | Display panel and crack detection method for display panel | |
| CN101446881A (en) | Touch panel | |
| JP4575189B2 (en) | Shield film for shielded flexible printed circuit board and shielded flexible printed circuit board using the same | |
| CN103762204B (en) | Chip-on-film module, display panel and display | |
| US9946136B2 (en) | Display apparatus and manufacturing method thereof | |
| JP2005200521A5 (en) | ||
| KR20190087365A (en) | Manufacturing method of mounting device, connecting method and anisotropic conductive film | |
| CN203365865U (en) | Array substrate, chip on film and displaying device | |
| CN113721093A (en) | Display panel mother board, detection method and system of display panel mother board | |
| US20110147191A1 (en) | Methods of using a conductive composite material | |
| CN106771832A (en) | A kind of circuit checker, circuit detecting method and apply its display device | |
| JP2006286790A (en) | Method of bonding wiring board, structure of bonded part thereof, and electric circuit device with bonded part thereof | |
| CN107615153A (en) | Liquid crystal display panel | |
| CN102087431A (en) | Connected structure and method thereof | |
| CN206162442U (en) | Touch display panel and touch display device | |
| CN105045424A (en) | Touch panel, bonding structure, and flexible printed circuit board | |
| US20190079615A1 (en) | Touch Substrate and Touch Display Device | |
| KR20140148421A (en) | Method for manufacturing connecting body, and method for connecting electronic component | |
| CN104053329B (en) | Electronic module | |
| JP3971325B2 (en) | Anisotropic conductive film connector manufacturing method, anisotropic conductive film connector and touch panel input device using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |