CN108459441A - A kind of display device and preparation method thereof - Google Patents

A kind of display device and preparation method thereof Download PDF

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Publication number
CN108459441A
CN108459441A CN201810326827.XA CN201810326827A CN108459441A CN 108459441 A CN108459441 A CN 108459441A CN 201810326827 A CN201810326827 A CN 201810326827A CN 108459441 A CN108459441 A CN 108459441A
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CN
China
Prior art keywords
golden finger
flexible pcb
display panel
connection terminal
conductive film
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Granted
Application number
CN201810326827.XA
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Chinese (zh)
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CN108459441B (en
Inventor
陈义鹏
刘利宾
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN201810326827.XA priority Critical patent/CN108459441B/en
Publication of CN108459441A publication Critical patent/CN108459441A/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13452Conductors connecting driver circuitry and terminals of panels
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306Circuit arrangements or driving methods for the control of single liquid crystal cells
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

The invention discloses a kind of display devices and preparation method thereof, by the way of applying setting voltage between the golden finger connection terminal corresponding with display panel in the first flexible PCB and forming electric field, to puncture conducting particles surface insulation medium in anisotropic conductive film, keep anisotropic conductive film conductive, realize the function of anisotropic conductive film conducting the first flexible PCB and display panel, anisotropic conductive film conduction is realized using pressing mode relative to existing, the position of anisotropic conductive film conduction can be accurately controlled, and the electric field that voltage is formed is set by control, ensure the conducting state between golden finger and connection terminal, to improve the yield of binding.

Description

A kind of display device and preparation method thereof
Technical field
The present invention relates to display technology fields more particularly to a kind of display device and preparation method thereof.
Background technology
Currently, such as liquid crystal display panel, the panel display boards such as organic EL display panel after completing, It needs to carry out binding connection with flexible PCB (FPC, Flexible Printed Circuit), will pass through flexible PCB It is controlled to display panel access electric signal to be shown.Specifically, flexible PCB needs to pass through anisotropy with display panel Conductive adhesive film (ACF, Anisotropic Conductive Film) is bound.
Anisotropic conductive film includes mainly resin adhesive agent and conducting particles two large divisions.Usually conducting particles is binding It is uniformly distributed, is not in contact with each other in agent, and one layer of dielectric is enclosed in conducting particles outer surface, therefore anisotropy is conductive Glued membrane is non-conductive.When pressurizeing to anisotropic conductive film, the dielectric on conducting particles surface ruptures, and makes anisotropic conductive adhesive paste Film is conductive.
When carrying out the binding of flexible PCB and display panel using anisotropic conductive film, need to carry out complex The debugging stage, to determine pressure parameter etc..In subsequently pressurization binding procedure, since whole face is pressurizeed, so that anisotropy is conductive Glued membrane is connected in pressure direction, to ensure that anisotropic conductive film is connected, needs to use larger pressure, may be damaged display surface Device in plate or flexible PCB.Also, due to the surface of display panel and flexible PCB towards anisotropic conductive film May out-of-flatness and the influences such as anisotropic conductive film inner conductive particle distribution and impurity, may have anisotropy Unsmooth problem is connected in conductive adhesive film regional area, and influences the binding yield of display device.
Invention content
In view of this, an embodiment of the present invention provides a kind of display device and preparation method thereof, to improve display device Binding yield.
An embodiment of the present invention provides a kind of production methods of display device, including:
It is using anisotropic conductive film, the connection terminal one of the golden finger of the first flexible PCB and display panel is a pair of It should be bonded;
Setting voltage is applied with the corresponding connection terminal to the golden finger, the anisotropic conductive film is made to be connected The golden finger and the corresponding connection terminal.
In one possible implementation, in above-mentioned production method provided in an embodiment of the present invention, the setting electricity Pressure is more than the dielectric breakdown voltage of conducting particles surface insulation medium in the anisotropic conductive film.
In one possible implementation, described to described in above-mentioned production method provided in an embodiment of the present invention Golden finger applies setting voltage with the corresponding connection terminal, specifically includes:
First voltage is applied with the corresponding connection terminal to the golden finger;
Detect whether the binding resistance between the golden finger and the corresponding connection terminal is more than setting resistance;
When detecting the binding resistance between the golden finger and the corresponding connection terminal more than setting resistance, to institute It states golden finger and applies second voltage with the corresponding connection terminal, the second voltage is more than the first voltage, until really Until fixed binding resistance between the golden finger and the corresponding connection terminal is no more than the setting resistance.
In one possible implementation, in above-mentioned production method provided in an embodiment of the present invention, the display surface Plate further includes:Voltage access terminal, switch terminal, and with the one-to-one first switch transistor of the connection terminal;Its In, each connection terminal and the drain electrode of corresponding first switch transistor are connected, the voltage access terminal and each described the The source electrode of one switching transistor is connected, and the switch terminal is connected with the grid of each first switch transistor;
First flexible PCB further includes:The first test golden finger corresponding with voltage access terminal, and The second test golden finger corresponding with the switch terminal;
It is described to use anisotropic conductive film, by the connection terminal one of the golden finger of the first flexible PCB and display panel While one correspondence fitting, further include:
First test golden finger of first flexible PCB and the voltage access terminal of the display panel are electrically connected It connects, the second test golden finger of first flexible PCB is electrically connected with the switch terminal of the display panel.
In one possible implementation, described to described in above-mentioned production method provided in an embodiment of the present invention Golden finger applies setting voltage with the corresponding connection terminal, specifically includes:
Conducting electric signal is applied to the second test golden finger, the first current potential letter is applied to the first test golden finger Number, the second electric potential signal is applied to each golden finger, is had between second electric potential signal and first electric potential signal The setting voltage.
In one possible implementation, in above-mentioned production method provided in an embodiment of the present invention, described first is soft Property circuit board further includes:Third test golden finger, the 4th test golden finger and with each golden finger one-to-one second Switching transistor;Wherein, each golden finger is connected with the drain electrode of the corresponding second switch transistor, the third test Golden finger is connected with the source electrode of each second switch transistor, the 4th test golden finger and each second switch crystal The grid of pipe is connected;
It is described that second electric potential signal is applied to each golden finger, it specifically includes:
Conducting electric signal is applied to the 4th test golden finger, second electricity is applied to third test golden finger Position signal.
In one possible implementation, in above-mentioned production method provided in an embodiment of the present invention, described to institute Golden finger is stated with after the corresponding connection terminal application setting voltage, further includes:
First flexible PCB is replaced using the second flexible PCB to be bound with the display panel;
First flexible PCB is as test circuit plate, wherein each golden finger and the 5th test golden finger phase Even.
In one possible implementation, described using different in above-mentioned production method provided in an embodiment of the present invention The golden finger of first flexible PCB is bonded by property conductive adhesive film in side's with the connection terminal of display panel one-to-one correspondence, specific to wrap It includes:
The anisotropic conductive film is positioned between first flexible PCB and the display panel;
First flexible PCB or the display panel are pressed using first pressure, make first flexible PCB It is bonded by the anisotropic conductive film with the display panel;
It is described to be bound with the display panel using the second flexible PCB replacement first flexible PCB, have Body includes:
First flexible PCB is removed on the anisotropic conductive film;
Second flexible PCB is positioned on the anisotropic conductive film, second flexible PCB is made It is corresponded with the connection terminal of display panel described in golden finger;
Second flexible PCB or the display panel are pressed using second pressure, make second flexible PCB It is bonded by the anisotropic conductive film with the display panel;Wherein,
The second pressure is more than the first pressure.
On the other hand, the embodiment of the present invention additionally provides a kind of display device, including:Display panel, flexible PCB, with And anisotropic conductive film;Wherein,
The display panel includes multiple connection terminals, and the flexible PCB includes being corresponded with the connection terminal Golden finger;
For the anisotropic conductive film between the display panel and the flexible PCB, the anisotropy is conductive Region conducting of the glued membrane only between the golden finger and the corresponding connection terminal.
In one possible implementation, in above-mentioned display device provided in an embodiment of the present invention, the display surface Plate further includes:Voltage access terminal, switch terminal, and with the one-to-one first switch transistor of the connection terminal;Its In,
Each connection terminal is connected with the drain electrode of corresponding first switch transistor, the voltage access terminal and each institute The source electrode for stating first switch transistor is connected, and the switch terminal is connected with the grid of each first switch transistor.
The advantageous effect of the embodiment of the present invention includes:
A kind of display device provided in an embodiment of the present invention and preparation method thereof, using the golden hand in the first flexible PCB Application sets the mode that voltage forms electric field between referring to connection terminal corresponding with display panel, to puncture anisotropic conductive film Middle conducting particles surface insulation medium keeps anisotropic conductive film conductive, realizes that the first flexible electrical is connected in anisotropic conductive film The function of road plate and display panel realizes anisotropic conductive film conduction relative to existing using pressing mode, can be accurate The position of anisotropic conductive film conduction is controlled, and the electric field that voltage is formed is set by control, ensures golden finger and connecting pin Conducting state between son, to improve the yield of binding.
Description of the drawings
Fig. 1 a and Fig. 1 b are respectively the flow chart of the production method of display device provided in an embodiment of the present invention;
Fig. 2 is the particular flow sheet of the production method of display device provided in an embodiment of the present invention;
Fig. 3 is the structural schematic diagram of display panel in display device provided in an embodiment of the present invention;
Fig. 4 and Fig. 5 is respectively the structural schematic diagram of first flexible substrate in display device provided in an embodiment of the present invention;
Fig. 6 is the structural schematic diagram of second flexible substrate in display device provided in an embodiment of the present invention;
Fig. 7 to Fig. 9 is respectively the structural schematic diagram of display device provided in an embodiment of the present invention.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into It is described in detail to one step, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments. Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts all Other embodiments shall fall within the protection scope of the present invention.
The shapes and sizes of each component do not reflect that actual proportions, purpose are schematically illustrate the content of present invention in attached drawing.
A kind of production method of display device provided in an embodiment of the present invention includes the following steps as shown in Figure 1a:
S101, using anisotropic conductive film, by the connection terminal of the golden finger of the first flexible PCB and display panel Correspond fitting;
S102, setting voltage is applied with corresponding connection terminal to golden finger, makes anisotropic conductive film that golden finger be connected With corresponding connection terminal.
Specifically, under forceful electric power field action, solid dielectric can lose electrical isolation capabilities and be sported by state of insulation good Conduction state.The minimum critical voltage caused punch through is known as breakdown voltage.It is huge due to having after solid dielectric punctures Electric current passes through, and fusing or the channel burnt is will appear in solid dielectric, or the crackle of mechanical damage occur.Solid dielectric These variations are irreversible, oneself cannot restore original insulation performance.When brittle solid dielectric is breakdown, often occur The fragmentation of material, therefore nonmetallic materials can be crushed with punch-through effect.
Based on this, in above-mentioned production method provided in an embodiment of the present invention, using the golden finger in the first flexible PCB Apply the mode that setting voltage forms electric field between connection terminal corresponding with display panel, to puncture in anisotropic conductive film Conducting particles surface insulation medium keeps anisotropic conductive film conductive, realizes that the first flexible circuit is connected in anisotropic conductive film The function of plate and display panel is realized anisotropic conductive film conduction using pressing mode relative to existing, can accurately be controlled The position of anisotropic conductive film conduction processed, and the electric field that voltage is formed is set by control, ensure golden finger and connection terminal Between conducting state, to improve binding (Bonding) yield.
Specifically, composition, thickness, environmental condition and the electrode shape of the breakdown voltage size of solid dielectric and material, Arrangement etc. is related.Under uniform electric field, the breakdown voltage (MV/m) of the solid dielectric of unit thickness is known as dielectric breakdown field By force, also known as dielectric strength.When containing moisture, bubble and fine impurity in dielectric, often disruptive field intensity is made to reduce.
Optionally, in above-mentioned production method provided in an embodiment of the present invention, in the known anisotropy conduction after test In glued membrane in the case of the dielectric breakdown voltage of conducting particles surface insulation medium, above-mentioned steps S102 can be directly to golden finger It is applied more than the dielectric breakdown voltage of conducting particles surface insulation medium in anisotropic conductive film with corresponding connection terminal Voltage is set, so that anisotropic conductive film conducting golden finger and corresponding connection terminal.
Optionally, conductive in unknown anisotropic conductive film in above-mentioned production method provided in an embodiment of the present invention In the case of the dielectric breakdown voltage of particle surface dielectric, above-mentioned steps S102 applies golden finger with corresponding connection terminal Constant voltage is added, as shown in Fig. 2, following steps realization may be used:
S201, first voltage is applied with corresponding connection terminal to golden finger;Specifically, which can be a number The smaller voltage of value, in order to avoid cause the damage of display panel or flexible PCB;
Whether the binding resistance between S202, detection golden finger and corresponding connection terminal is more than setting resistance;If so, Illustrate that the electric conductivity of anisotropic conductive film cannot be met the requirements, executes step S203;If it is not, then terminating flow;
S203, second voltage is applied with corresponding connection terminal to golden finger, second voltage is more than first voltage;For example, Second voltage can be to increase setting step-length on the basis of first voltage;Return to step S202 later.
The continuous cycle of S202 and S203 through the above steps, until determining between golden finger and corresponding connection terminal It is aobvious to ensure to ensure that the electric conductivity of anisotropic conductive film is met the requirements until resistance is bound no more than setting resistance The binding yield of showing device.Alive numerical value finally is applied with corresponding connection terminal to golden finger and it is possible to record, as Voltage parameter when such product is bound, is directly bound using voltage parameter subsequently to make when similar product.
After realizing anisotropic conductive film conduction relative to existing use pressing mode, in the electric conductivity for detecting product When can be undesirable, can only directly it waste caused by scrap products, using above-mentioned production method provided in an embodiment of the present invention, Voltage can be constantly increasing until the electric conductivity of anisotropic conductive film is met the requirements, therefore can be straight to avoid product It is informed of a case caused by giving up and wastes.
Optionally, in above-mentioned production method provided in an embodiment of the present invention, in display panel in above-mentioned steps S102 Connection terminal apply electric signal mode can there are many.For example, as shown in figure 3, in addition to connection terminal in display panel 1 Except 11, can also include:Voltage accesses terminal 12, switch terminal 13, and is opened with connection terminal 11 one-to-one first Close transistor 14;Wherein, each connection terminal 11 is connected with the drain electrode of corresponding first switch transistor 14, and voltage accesses terminal 12 It is connected with the source electrode of each first switch transistor 14, switch terminal 13 is connected with the grid of each first switch transistor 14.In this way, Under the control of switch terminal 13, voltage access terminal 12 is connect with each connection terminal 11 by first switch transistor 14; When switch terminal 13 loads Continuity signal, terminal 12 and each connection terminal 11 can be accessed with conducting voltage;When switch terminal 13 When loading pick-off signal, terminal 12 and each connection terminal 11 can be accessed with off voltage.By being connect to switch terminal 13 and voltage Enter the control that terminal 12 loads electric signal, the control for applying electric signal to connection terminal may be implemented.
Accordingly, in above-mentioned production method provided in an embodiment of the present invention, as shown in Figure 4 and Figure 5, in the first flexible electrical In road plate 2 other than golden finger 21, can also include:First test golden finger 22 corresponding with voltage access terminal 12, with And second test golden finger 23 corresponding with switch terminal 13.
Accordingly, in above-mentioned production method provided in an embodiment of the present invention, above-mentioned steps S101 is conductive using anisotropy Glued membrane can also be held while being bonded the golden finger of the first flexible PCB with the connection terminal of display panel one-to-one correspondence Row following steps:
First test golden finger 22 of the first flexible PCB 2 is electrically connected with the voltage of display panel 1 access terminal 12, Second test golden finger 23 of the first flexible PCB 2 is electrically connected with the switch terminal 13 of display panel 1.Specifically, such as Fig. 7 It is shown, the first test golden finger 22 is not directly accessed with voltage by terminal 12 by anisotropic conductive film 3 and is electrically connected, by second Test golden finger 23 is electrically connected with switch terminal 13.In this way, can be by the first golden hand of the test test of golden finger 22 and second The mode for referring to 23 load electric signals is realized and loads electric signal to switch terminal 13 and voltage access terminal 12.
Based on this, optionally, in above-mentioned production method provided in an embodiment of the present invention, above-mentioned steps S102 is to golden finger Apply setting voltage with corresponding connection terminal, following manner realization specifically may be used:
Conducting electric signal is applied to the second test golden finger 23, the first electric potential signal is applied to the first test golden finger 22, Second electric potential signal is applied to each golden finger 21, there is setting voltage between the second electric potential signal and the first electric potential signal.
Optionally, in above-mentioned production method provided in an embodiment of the present invention, for the ease of in the first flexible PCB Each golden finger on-load voltage form each golden finger in electric field breakdown anisotropic conductive film and follow-up first flexible PCB Required electric signal is provided to corresponding connection terminal.As shown in figure 4, the first flexible PCB 2 can also include:Third is tested Golden finger the 24, the 4th test golden finger 25 and with 21 one-to-one second switch transistor 26 of each golden finger;Wherein, respectively Golden finger 21 is connected with the drain electrode of corresponding second switch transistor 26, and third tests golden finger 24 and each second switch transistor 26 source electrode is connected, and the 4th test golden finger 25 is connected with the grid of each second switch transistor 26.In this way, in the 4th test gold Under the control of finger 25, third test golden finger 24 is connect with each golden finger 21 by second switch transistor 26;When the 4th When testing the load Continuity signal of golden finger 25, third test golden finger 24 and each golden finger 21 can be connected;When the 4th test gold When finger 25 loads pick-off signal, third test golden finger 24 and each golden finger 21 can be disconnected.By testing golden hand to third Refer to 24 and the 4th and test the control that golden finger 25 loads electric signal, the control for applying electric signal to each golden finger 21 may be implemented. Fig. 7 is the structural schematic diagram after being bound using the first flexible PCB 2 shown in Fig. 4 and display panel shown in Fig. 31.
Accordingly, in above-mentioned production method provided in an embodiment of the present invention, the second current potential letter is applied to each golden finger 21 Number, following manner realization specifically may be used:
Conducting electric signal is applied to the 4th test golden finger 25, the second electric potential signal is applied to third test golden finger 24.
Accordingly, right when follow-up display device works normally in above-mentioned production method provided in an embodiment of the present invention 4th test golden finger 25 applies cut-off electric signal.
Alternatively, optionally, in above-mentioned production method provided in an embodiment of the present invention, the first flexible circuit can also be used Substrate 2 is used as test circuit plate, is used only as conducting particles surface insulation medium in breakdown anisotropic conductive film 3, is subsequently adopting The first flexible PCB 2 is replaced with the second flexible PCB 2 ', telecommunications is inputted to display panel using the second flexible PCB 2 ' Number.
Based on this, optionally, in above-mentioned production method provided in an embodiment of the present invention, in above-mentioned steps S102 to golden hand Refer to after applying setting voltage with corresponding connection terminal, as shown in Figure 1 b, can also include:
S103, replaced using the second flexible PCB 2 ' as shown in FIG. 6 the first flexible PCB 2 as shown in Figure 5 with Display panel 1 is bound;As shown in figure 5, the first flexible PCB 2 is used as test circuit plate, wherein each golden finger 21 and the Five test golden fingers 27 are connected, and Fig. 8 is that the first flexible PCB 2 as shown in Figure 5 is bound with display panel 1 as shown in Figure 3 Structural schematic diagram afterwards.Fig. 9 is after the second flexible PCB 2 ' as shown in FIG. 6 is bound with display panel 1 as shown in Figure 3 Structural schematic diagram.
Optionally, in above-mentioned production method provided in an embodiment of the present invention, above-mentioned steps S101 is conductive using anisotropy The connection terminal one-to-one correspondence of the golden finger of first flexible PCB and display panel is bonded by glued membrane, specifically can by with Under type is realized:
First, anisotropic conductive film 3 is positioned between the first flexible PCB 2 and display panel 1;
Then, the first flexible PCB 2 or display panel 1 are pressed using first pressure, makes the first flexible PCB 2 and shows Show that panel 1 is bonded by anisotropic conductive film 3.
Accordingly, above-mentioned steps S103 replaces the first flexible PCB using the second flexible PCB and is carried out with display panel Binding, can specifically be accomplished by the following way:
First, the first flexible PCB 2 is removed on anisotropic conductive film 3;
Then, the second flexible PCB 2 ' is positioned on anisotropic conductive film 3, makes the gold of the second flexible PCB 2 ' Finger 21 ' and the connection terminal 11 of display panel 1 correspond;
Finally, 2 ' plate of the second flexible circuit or display panel 1 are pressed using second pressure, make the second flexible PCB 2 ' with Display panel 1 is bonded by anisotropic conductive film 3;Wherein, second pressure is more than first pressure.
Specifically, first pressure and second pressure, which are respectively less than, can be such that anisotropic conductive film 3 is connected in pressure direction Power is only to ensure that the first flexible PCB 2 or the second flexible PCB 2 ' are bonded with display panel 1.First pressure is less than second Pressure, can be in order to which the first flexible PCB 2 be from 3 sur-face peeling of anisotropic conductive film.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of display device, which can be:Hand Any product with display function such as machine, tablet computer, television set, display, laptop, Digital Frame, navigator Or component.The implementation of the display device may refer to the embodiment of above-mentioned production method, and overlaps will not be repeated.
Specifically, a kind of display device provided in an embodiment of the present invention, as shown in figures 7 and 9, including:Display panel 1, Flexible PCB 2 or 2 ' and anisotropic conductive film 3;Wherein,
Display panel 1 includes multiple connection terminals 11, and flexible PCB 2 includes and the one-to-one golden hand of connection terminal 11 Refer to 21;
Anisotropic conductive film 3 is located at display panel 1 and flexible PCB 2 or 2 ' between, anisotropic conductive film 3 only exists Region conducting between golden finger 11 and corresponding connection terminal 21.
Optionally, in above-mentioned display device provided in an embodiment of the present invention, as shown in figures 7 and 9, display panel 1 is also May include:Voltage access terminal 12, switch terminal 13, and with 11 one-to-one first switch transistor of connection terminal 14;Wherein,
Each connection terminal 11 is connected with the drain electrode of corresponding first switch transistor 14, and voltage accesses terminal 12 and each first The source electrode of switching transistor 14 is connected, and switch terminal 13 is connected with the grid of each first switch transistor 14.
Specifically, in above-mentioned display device provided in an embodiment of the present invention, Fig. 4 institutes specifically may be used in flexible PCB The first flexible PCB 2 shown, alternatively, the second flexible PCB 2 ' shown in fig. 6 specifically may be used in flexible PCB, herein It does not limit.
Above-mentioned display device provided in an embodiment of the present invention and preparation method thereof, using the golden hand in the first flexible PCB Application sets the mode that voltage forms electric field between referring to connection terminal corresponding with display panel, to puncture anisotropic conductive film Middle conducting particles surface insulation medium keeps anisotropic conductive film conductive, realizes that the first flexible electrical is connected in anisotropic conductive film The function of road plate and display panel realizes anisotropic conductive film conduction relative to existing using pressing mode, can be accurate The position of anisotropic conductive film conduction is controlled, and the electric field that voltage is formed is set by control, ensures golden finger and connecting pin Conducting state between son, to improve the yield of binding.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies Within, then the present invention is also intended to include these modifications and variations.

Claims (10)

1. a kind of production method of display device, which is characterized in that including:
Using anisotropic conductive film, the connection terminal of the golden finger of the first flexible PCB and display panel is corresponded and is pasted It closes;
Setting voltage is applied with the corresponding connection terminal to the golden finger, is made described in the anisotropic conductive film conducting Golden finger and the corresponding connection terminal.
2. production method as described in claim 1, which is characterized in that the setting voltage is more than the anisotropic conductive film The dielectric breakdown voltage of middle conducting particles surface insulation medium.
3. production method as described in claim 1, which is characterized in that described to the golden finger and the corresponding connecting pin Son applies setting voltage, specifically includes:
First voltage is applied with the corresponding connection terminal to the golden finger;
Detect whether the binding resistance between the golden finger and the corresponding connection terminal is more than setting resistance;
When detecting the binding resistance between the golden finger and the corresponding connection terminal more than setting resistance, to the gold Finger applies second voltage with the corresponding connection terminal, and the second voltage is more than the first voltage, until determining institute The binding resistance between golden finger and the corresponding connection terminal is stated no more than until the setting resistance.
4. production method as described in claim 1, which is characterized in that the display panel further includes:Voltage accesses terminal, opens Close terminal, and with the one-to-one first switch transistor of the connection terminal;Wherein, each connection terminal with it is corresponding The drain electrode of first switch transistor is connected, and the voltage access terminal is connected with the source electrode of each first switch transistor, institute Switch terminal is stated with the grid of each first switch transistor to be connected;
First flexible PCB further includes:With the voltage access terminal it is corresponding first test golden finger, and with institute State the corresponding second test golden finger of switch terminal;
It is described to use anisotropic conductive film, the connection terminal one of the golden finger of the first flexible PCB and display panel is a pair of While should being bonded, further include:
First test golden finger of first flexible PCB is electrically connected with the voltage of display panel access terminal, it will Second test golden finger of first flexible PCB is electrically connected with the switch terminal of the display panel.
5. production method as claimed in claim 4, which is characterized in that described to the golden finger and the corresponding connecting pin Son applies setting voltage, specifically includes:
Conducting electric signal is applied to the second test golden finger, the first electric potential signal is applied to the first test golden finger, Second electric potential signal is applied to each golden finger, is had between second electric potential signal and first electric potential signal described Set voltage.
6. production method as claimed in claim 5, which is characterized in that first flexible PCB further includes:Third is tested Golden finger, the 4th test golden finger and with each one-to-one second switch transistor of golden finger;Wherein, each described Golden finger is connected with the drain electrode of the corresponding second switch transistor, the third test golden finger and each second switch The source electrode of transistor is connected, and the 4th test golden finger is connected with the grid of each second switch transistor;
It is described that second electric potential signal is applied to each golden finger, it specifically includes:
Conducting electric signal is applied to the 4th test golden finger, applying second current potential to third test golden finger believes Number.
7. production method as described in any one in claim 1-5, which is characterized in that it is described to the golden finger with it is corresponding After the connection terminal applies setting voltage, further include:
First flexible PCB is replaced using the second flexible PCB to be bound with the display panel;
First flexible PCB is as test circuit plate, wherein each golden finger is connected with the 5th test golden finger.
8. production method as claimed in claim 7, which is characterized in that it is described to use anisotropic conductive film, by the first flexibility The golden finger of circuit board is bonded with the connection terminal of display panel one-to-one correspondence, is specifically included:
The anisotropic conductive film is positioned between first flexible PCB and the display panel;
First flexible PCB or the display panel are pressed using first pressure, make first flexible PCB and institute Display panel is stated to be bonded by the anisotropic conductive film;
It is described to be bound with the display panel using the second flexible PCB replacement first flexible PCB, it is specific to wrap It includes:
First flexible PCB is removed on the anisotropic conductive film;
Second flexible PCB is positioned on the anisotropic conductive film, the golden hand of second flexible PCB is made Refer to the connection terminal with display panel to correspond;
Second flexible PCB or the display panel are pressed using second pressure, make second flexible PCB and institute Display panel is stated to be bonded by the anisotropic conductive film;Wherein,
The second pressure is more than the first pressure.
9. a kind of display device, which is characterized in that including:Display panel, flexible PCB and anisotropic conductive film;Its In,
The display panel includes multiple connection terminals, and the flexible PCB includes golden correspondingly with the connection terminal Finger;
The anisotropic conductive film is between the display panel and the flexible PCB, the anisotropic conductive film Region conducting only between the golden finger and the corresponding connection terminal.
10. display device as claimed in claim 9, which is characterized in that the display panel further includes:Voltage accesses terminal, Switch terminal, and with the one-to-one first switch transistor of the connection terminal;Wherein,
Each connection terminal and the drain electrode of corresponding first switch transistor are connected, the voltage access terminal and each described the The source electrode of one switching transistor is connected, and the switch terminal is connected with the grid of each first switch transistor.
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CN112867288B (en) * 2021-01-05 2021-08-17 江苏特丽亮镀膜科技有限公司 ACF conductive adhesive film structure, hot pressing method thereof and hot pressing assembly

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