CN207219156U - Printed circuit board (PCB) and the motor-driven vehicle headlight adapter with printed circuit board (PCB) - Google Patents

Printed circuit board (PCB) and the motor-driven vehicle headlight adapter with printed circuit board (PCB) Download PDF

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Publication number
CN207219156U
CN207219156U CN201720072267.0U CN201720072267U CN207219156U CN 207219156 U CN207219156 U CN 207219156U CN 201720072267 U CN201720072267 U CN 201720072267U CN 207219156 U CN207219156 U CN 207219156U
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CN
China
Prior art keywords
pcb
circuit board
printed circuit
conducting shell
dielectric
Prior art date
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Application number
CN201720072267.0U
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Chinese (zh)
Inventor
D.佩特施
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ZKW Group GmbH
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ZKW Group GmbH
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/10—Overvoltage arresters using spark gaps having a single gap or a plurality of gaps in parallel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/026—Spark gaps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)

Abstract

It the utility model is related to a kind of printed circuit board (PCB)（1）, comprise at least：In order to form the conductor row of electricity（2）And the conducting shell of structuring（3）, solid metallic plate（4）With in conducting shell（3）And metallic plate（4）Between the dielectric arranged（5）, wherein, the conducting shell（3）At least one be used as earth lead（3 ＇）The conductor row of construction is by recess（9）Penetrate, the recess passes through dielectric（5）Reach metallic plate（4）It is interior.The utility model further relates to a kind of motor-driven vehicle headlight adapter, has foregoing printed circuit board (PCB)（1）.

Description

Printed circuit board (PCB) and the motor-driven vehicle headlight adapter with printed circuit board (PCB)
Technical field
A kind of printed circuit board (PCB) is the utility model is related to, is comprised at least：In order to form the biography of the conductor row of electricity and structuring Conducting shell, solid metallic plate and the dielectric arranged between conducting shell and metallic plate.The utility model further relates to a kind of motor-driven Car headlight, have according to foregoing printed circuit board (PCB).
Background technology
Such circuit printing plate is as metal-cored circuit printing plate（IMS- plates；Insulating metal substrate）It is known and in machine In terms of tool load capacity and particularly there is outstanding characteristic in terms of resistance to temperature change and the also dissipation in heat.It is based on These reasons, such circuit printing plate is particularly suitable for interconnection power part and is therefore widely used in automobile industry In the application of LED- headlights, in these headlights at LED point by point in other words partly（punktuell）Produce substantial amounts of heat Amount.
Especially, in the manufacture of motor vehicle-headlight therefore the thermal characteristics of IMS- plates is taken seriously and in LED- applications In order to LED radiating preferably by dielectric IMS- printed circuit board (PCB)s with relatively thin layer, for ensureing and printing The LED that the conductor row of circuit board is in electrical contact to the greatest extent may be used to solid metallic plate, the metal-cored of metal-cored circuit printing plate The good heat transfer of energy.
On the other hand the printed circuit board (PCB) for LED- headlights must have very high relative to the electrostatic charge of printed circuit board (PCB) Security.It means that by dielectric the dielectric layer of relative thin must be protected from voltage breakdown, because such hit Wear along with dielectric damage.In the prior art, this is mainly existed in the edge mounting terminal of printed circuit board (PCB), terminal Conducting shell and it is metal-cored between produce potential compensation.However, the installation of terminal not only bring it is attached when producing printed circuit board (PCB) The job step added, and also cause in printed circuit board (PCB) for it is arranged in headlight or in other types of device The unfavorable position relationship of the possibility of edge.
Utility model content
Therefore task of the present utility model is the printed circuit board (PCB) that improves the type that introductory song is mentioned as follows, i.e. can be with Save additional such as the terminal of installation or be similarly used for the part of the potential compensation between conducting shell and solid metal level, i.e., Make also not abandoning in the case of dielectric thin thickness reliably to protect to prevent dielectric electrical breakdown.
In order to solve the task, according to the utility model, the printed circuit board (PCB) for the type mentioned from introductory song, this practicality New feature is, at least one conductor row as earth lead construction of conducting shell（Leiterzug）Worn by a recess Thoroughly, the recess is reached in metallic plate through dielectric.The conducting shell of printed circuit board (PCB) or printed circuit board (PCB) is therefore including at least One conductor row as earth lead construction.In the following way, i.e. the conductor row as earth lead construction of conducting shell （Next for simplicity referred to as " ground mat（Massepad）”）Drilled to form recess, milling or punching Pressure, i.e., do not exempt（Freistellung）Recess, and recess is reached in metallic plate through dielectric, is generated from conducting shell To the gap of metallic plate, can go out at the gap in the case of the corresponding potential difference between conducting shell and metallic plate Show spark discharge and can compensate current potential in the case of no damage is dielectric and in the case of without damage electronic component. The conclusive advantage of the utility model is, additional component need not be installed at printed circuit board (PCB), to complete potential compensation And printed circuit board (PCB) undesirable opening position from dielectric breakdown protection after printed circuit board (PCB) is produced with regard to horse On work and not for example just worked after corresponding terminal is installed.Therefore, packing, transporting and operating the phase Between just protected printed circuit board (PCB) from dielectric breakdown when being for example installed in headlight, be considered as without any plus component Interference.When installing additional according to printed circuit board (PCB) of the present utility model and in motor-driven vehicle headlight adapter in use, also to maintain to protect certainly Shield acts on.Term " solid metallic plate " is interpreted as the metallic plate with the thickness between 1.0 and 3.0mm.
As already mentioned above, recess preferably may be constructed such that drilling, milling portion, or be configured to the recess stamped out.
The utility model improves as follows according to preferred embodiment：Conducting shell, which has, at least one is used as signal conductor The conductor row of construction, wherein, the conductor row of at least one signal conductor of conducting shell connects Zener-diode in centre, especially It is to suppress to be connected with the conductor row as earth lead construction mentioned of conducting shell in the case of diode.It is of the present utility model The modification enable to printed circuit board (PCB) run on the signal conductor according to printed circuit board (PCB) of the present utility model not The high current potential being allowed to from determination, by the previously given value of Zener-diode be transmitted on ground mat, herein, In the case where not damaging the electronic unit of printed circuit board (PCB), can occur by by drilling what is defined according to of the present utility model Potential compensation caused by gap.
Alternatively in or be additional to for Zener-diode, can preferably such as according to printed circuit board (PCB) of the present utility model Improve lowerly：Conducting shell has at least one conductor row as signal conductor construction, wherein, at least one signal of conducting shell The conductor row as earth lead construction mentioned of the conductor row of wire in the case of middle connection capacitor with conducting shell Connection.Capacitor can especially receive the voltage peak of high frequency appearance and be exported to the earth.
Preferably, Zener diode and capacitor are connected in parallel with each other.In this case first capacitor charging and Therefore there is conductive capability.As a result, in the case where reaching Zener-voltage, Zener-diode responds and exports electricity to the earth Lotus.
It is as already mentioned above, for LED- applications in motor-driven vehicle headlight adapter manufacture, preferably in metal-core printed circuit board It is middle using thin dielectric layer, to ensure the distribution as well as possible of the point-by-point heat locally occurred in other words at LED.It is logical Cross the utility model and avoid the shortcomings that dielectric is breakdown in the case of too small thickness, so as to solely according to heat It is required that selection thickness.Therefore, dielectric preferably has the layer from 20 μm to 200 μm, especially 40 μm to 75 μm, especially 50 μm It is thick.
Be characterised by according to motor-driven vehicle headlight adapter of the present utility model, arranged on suitable radiator it is describing just now and And the printed circuit board (PCB) being claimed in the claims.Thus LED heat is distributed on the metallic plate of printed circuit board (PCB) And it is delivered at radiator, wherein, by the gap defined by drilling, dissipated in the state of printed circuit board (PCB) installs Potential difference between hot body and conducting shell can controllably be reduced by the earth lead of conducting shell.
Brief description of the drawings
Next the utility model further illustrates by the embodiment being schematically depicted in the drawings.In the accompanying drawings,
Fig. 1 shows the section view according to printed circuit board (PCB) of the present utility model at the radiator for being arranged in motor-driven vehicle headlight adapter Figure,
Fig. 2 shows the top view according to printed circuit board (PCB) of the present utility model according to Fig. 1,
Fig. 2 a show the bowing according to printed circuit board (PCB) of the present utility model according to preferable modification of the present utility model View, and
Fig. 3 show not figure 1 illustrates radiator the sectional view according to printed circuit board (PCB) of the present utility model.
Embodiment
It is marked in Fig. 1 using 1 according to printed circuit board (PCB) of the present utility model.Printed circuit board (PCB) 1 is included to be formed Electricity conductor row 2 and the conducting shell 3 of structuring, solid metallic plate 4 and arranged between conducting shell 3 and metallic plate 4 electricity Jie Matter 5.The solid metallic plate 4 is also referred to as metal-cored and as described in just now printed circuit board (PCB) 1 and is referred to as metal cored printed circuits Plate（IMS- plates）.Dielectric 5 is used to make the conductor row 2 of conducting shell 3 not cause short circuit by metallic plate 4.In addition, show in Fig. 1 The radiator 6 of unshowned motor-driven vehicle headlight adapter is gone out, the radiator and metallic plate 3 are provided commonly for LED11 shown in figure 2 （Light emitting diode）Effective radiating, when respectively turning on and driving printed circuit board (PCB) 1, the LED is manipulated simultaneously by conductor row 2 And it is provided with electric current.Reference 7 marks Zener-diode, and the Zener-diode is by the conductor of the signal conductor of conducting shell 3 Row is connected with the ＇ of ground mat 3 of conducting shell 3.Zigzag arrow 8 represent the conducting shell 3 of radiator 6 and printed circuit board (PCB) 1 it Between potential difference.From the numerical value of determination, potential difference causes the electric discharge along the gap realized by drilling 9, the gap 10 represent by a dotted line for itself.Gap 10 is caused by following situation, i.e., according to the utility model drilling 9 penetrate conducting shell 3 or Person's conducting shell 3 as the ＇ of earth lead 3 or the ＇ of ground mat 3 conductor row constructed and continues to penetrate electricity in the region of drilling Medium 5 reaches in metallic plate 4 or penetrated in the current situation or even equally metallic plate.By these measures, the ＇ of ground mat 3 is straight Up to the edge of drilling, so as to occur from metallic plate 4 or radiator 6 by dielectric 5 up to the ＇ of earth lead 3 fire Flower electric discharge, if there is sufficiently high potential difference due to electrostatic charge.
In fig. 2 it can be seen that LED11 is connected with two conductor rows 2, and compared to two ＇ of earthing bar 3, the conductor row It can be understood as signal conductor.Ground connection of the signal conductor 2 in the case of connection Zener-diode 7 among difference with conducting shell 3 Pad 3 ＇ connections.In this way, very high voltage can be exported to ground mat and make signal conductor from drilling 9 or Depart from the spark discharge occurred at gap 10（entkoppelt）.In a not shown embodiment, two signal conductors In one, particularly cathode wire may be implemented as earth lead, that is to say, that its can among no connection structure Electric current in the case of part（galvanisch）It is connected with the ＇ of ground mat 3 current potential.
The ＇ of capacitor 7 it has been additionally arranged on a printed circuit in fig. 2 a, the capacitor is as Zener-diode 7 The potential compensation that can be used between signal conductor 2 and the ＇ of ground mat 3.When reaching the ＇ of capacitor 7 maximum capacitor, with electric capacity Zener-diode 7 that the ＇ of device 7 is connected in parallel is responded and is equally used for when reaching the ＇ of capacitor 7 maximum capacitor to greatly putting Electricity.
In figure 3 in shown state, machine is not installed at according to printed circuit board (PCB) 1 of the present utility model yet in a state Install additional in dynamic headlight or additionally, symbolically represented using the ＇ of arrow 8, it is corresponding between conducting shell 3 and metallic plate 4 Potential difference again may be by Zener-diode 7 and export at the ＇ of ground mat 3, can then occur from conducting shell 3 to metallic plate 4 Spark discharge, such as this, 10 show by a dotted line.Potential compensation can occur in this way and dielectric 5 prints in manufacture Uncontrolled electricity has been protected from when being operated during printed circuit board 1 or just when manufacturing unshowned motor-driven vehicle headlight adapter Pressure breakdown.

Claims (10)

1. printed circuit board (PCB)（1）, comprise at least：In order to form the conductor row of electricity（2）And the conducting shell of structuring（3）, it is solid Metallic plate（4）With in conducting shell（3）And metallic plate（4）Between the dielectric arranged（5）, it is characterised in that the conducting shell（3） At least one be used as earth lead（3 ＇）The conductor row of construction is by recess（9）Penetrate, the recess passes through dielectric（5）Reach Metallic plate（4）It is interior.
2. according to the printed circuit board (PCB) described in claim 1, it is characterised in that the recess（9）Be configured to drilling, milling portion or Person is configured to the recess of punching press.
3. according to the printed circuit board (PCB) described in claim 1 or 2, it is characterised in that the conducting shell（3）At least one signal The conductor row of wire（2）Zener-diode is connected in centre（7）In the case of with conducting shell（3）Described be used as earth lead （3 ＇）The conductor row connection of construction.
4. according to the printed circuit board (PCB) described in claim 3, it is characterised in that the Zener-diode（7）It is to suppress two poles Pipe.
5. according to the printed circuit board (PCB) described in claim 3, it is characterised in that the conducting shell（3）At least one signal lead The conductor row of line（2）Capacitor is connected in centre（7 ＇）In the case of with conducting shell（3）Described be used as earth lead（3 ＇）Structure The conductor row connection made.
6. according to the printed circuit board (PCB) described in claim 5, it is characterised in that the Zener-diode（7）With the capacitor （7 ＇）It is connected in parallel with each other.
7. according to the printed circuit board (PCB) described in claim 1 or 2, it is characterised in that the dielectric（5）With from 20 μm to 200 μm of thickness.
8. according to the printed circuit board (PCB) described in claim 7, it is characterised in that the dielectric（5）With from 40 μm to 75 μm Thickness.
9. according to the printed circuit board (PCB) described in claim 8, it is characterised in that the dielectric（5）With 50 μm of thickness.
10. motor-driven vehicle headlight adapter, including at least radiator（6）With in radiator（6）Upper arrangement is appointed according in preceding claims Printed circuit board (PCB) described in one（1）.
CN201720072267.0U 2016-01-22 2017-01-20 Printed circuit board (PCB) and the motor-driven vehicle headlight adapter with printed circuit board (PCB) Active CN207219156U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA50034/2016 2016-01-22
ATA50034/2016A AT518278B1 (en) 2016-01-22 2016-01-22 circuit board

Publications (1)

Publication Number Publication Date
CN207219156U true CN207219156U (en) 2018-04-10

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Application Number Title Priority Date Filing Date
CN201720072267.0U Active CN207219156U (en) 2016-01-22 2017-01-20 Printed circuit board (PCB) and the motor-driven vehicle headlight adapter with printed circuit board (PCB)

Country Status (3)

Country Link
CN (1) CN207219156U (en)
AT (1) AT518278B1 (en)
DE (1) DE202016107434U1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19826023C2 (en) * 1998-06-10 2001-01-25 Siemens Ag Multi-layer electrical circuit arrangement
JP4496298B1 (en) * 2010-02-03 2010-07-07 株式会社東芝 Electronic device and electrostatic discharge countermeasure method
JP2011249374A (en) * 2010-05-24 2011-12-08 Sharp Corp Electronic apparatus

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Publication number Publication date
AT518278A4 (en) 2017-09-15
AT518278B1 (en) 2017-09-15
DE202016107434U1 (en) 2017-01-26

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