CN207217511U - A kind of DFN encapsulation - Google Patents
A kind of DFN encapsulation Download PDFInfo
- Publication number
- CN207217511U CN207217511U CN201721294305.3U CN201721294305U CN207217511U CN 207217511 U CN207217511 U CN 207217511U CN 201721294305 U CN201721294305 U CN 201721294305U CN 207217511 U CN207217511 U CN 207217511U
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- CN
- China
- Prior art keywords
- chip
- fin
- thermally conductive
- parcel
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of DFN encapsulation,Including chip,Chip is connected with the insulation glue-line wrapped up,The chip-side is connected with fin,The side of the fin contacts with external environment condition,The fin is fixedly connected with four parcel being made from a material that be thermally conductive grooves in the one side of chip,The parcel groove wraps up the corner of chip,The utility model is connected with four parcel grooves with Thermal conductivity in the one side of chip with fin and wraps up the corner of chip,Chip can be more firmly connected with fin,So that both are not easily separate,Because wrapping up groove has the performance of radiating,Therefore heat caused by chip operation can be oriented to fin by it,So as to which the heat on chip is more efficiently conducted to fin,Strengthen heat dispersion,And parcel groove is set to wrap up four angles of chip,And fin and thermally conductive sheet is set to surround chip in the both sides of parcel groove,Strengthen the effect of the protection to chip.
Description
Technical field
Electronic Packaging field is the utility model is related to, more specifically it is related to a kind of DFN encapsulation.
Background technology
The internal resistance of metal-oxide-semiconductor encapsulation at this stage is of a relatively high, weak heat-dissipating.Can be significantly using new ultra-thin DFN encapsulating structures
Internal resistance is reduced, heat dispersion is improved significantly, and application field is more extensive.
At present, Application No. application publication number is that CN102842550A Chinese patent document discloses in the prior art
A kind of DFN encapsulating structures of power mosfet chip, it is by setting radiating area and then being set between radiating area and chip soft
Solder layer connection is so that heat derives on chip be radiated.
The prior art mainly by contact and being radiated with the environment in the external world, but the radiator structure of the prior art and
Therefore heat dispersion is more general for the limited area of external world's contact.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of DFN encapsulation, it is advantageous that
Can component more effectively radiated.
To achieve the above object, the utility model provides following technical scheme：A kind of DFN encapsulation, including chip, chip
The insulation glue-line wrapped up is connected with, the chip-side is connected with fin, the side of the fin and external environment condition
Contact, the fin are fixedly connected with four parcel being made from a material that be thermally conductive grooves, the parcel in the one side of chip
Groove wraps up the corner of chip.
By using above-mentioned technical proposal, fin is connected with four in the one side of chip has Thermal conductivity
Parcel groove the corner of chip is wrapped up, chip can be more firmly connected with fin so that both are not easily separate,
Because parcel groove, which has, preferably heat dispersion, therefore heat caused by chip operation can be oriented to fin by it, from
And more efficiently conduct the heat on chip to fin, strengthen heat dispersion.
The utility model is further arranged to：It is provided with the insulation glue-line by the fully wrapped around heat conduction of insulation glue-line
Piece, the thermally conductive sheet are made from a material that be thermally conductive and contacted with four parcel grooves.
By using above-mentioned technical proposal, thermally conductive sheet is set in the glue-line that insulate, because the thermally conductive sheet is by Heat Conduction Material
Therefore being made can be disperseed by wrapping up groove and conducting caused heat on chip into thermally conductive sheet；Because thermally conductive sheet and fin
It is arranged on the both sides of chip and is connected by wrapping up groove, therefore thermally conductive sheet, fin is being connected the structure to be formed just with parcel groove
It is good to wrap up chip wherein, reinforcement protection is carried out to chip.
The utility model is further arranged to：The thermally conductive sheet is provided with the one side of chip and its opposite face and led
Hot groove.
By using above-mentioned technical proposal, heat conduction groove can by conducted on chip come heat evenly be dispersed to absolutely
In edge glue-line, and heat conduction groove add thermally conductive sheet with insulate glue-line contact area so that both be connected it is more firm, more
Not readily disengage from.
The utility model is further arranged to：Continuous radiating is offered on the side of the insulation glue-line away from chip
Groove.
By using above-mentioned technical proposal, continuous radiating groove is offered on side of the insulation glue-line away from chip, is increased
Insulation glue-line and extraneous contact area are added, so as to enhance the heat dispersion of component.
The utility model is further arranged to：Radiating salient point is provided with the one side that the thermally conductive sheet contacts with the external world.
By using above-mentioned technical proposal, be provided with the one side that thermally conductive sheet contact with the external world salient point that radiates add it is scattered
The contact area of backing and external environment, so as to enhance the heat dispersion of component.
The utility model is further arranged to：Connector is fixed with the fin, the connection sheet passes through insulating cement
Layer is fixedly connected on fin and thermally conductive sheet.
By using above-mentioned technical proposal, connector one end is set to be fixedly connected with fin, the other end is consolidated with thermally conductive sheet
Fixed connection, so as to by fin with thermally conductive sheet is stronger be connected to together with.
In summary, the utility model has the advantages that：1st, by increasing each radiator structure and external environment
Contact area, so as to enhance the heat dispersion to chip；2nd, by setting parcel groove to wrap up four angles of chip, and
Fin and thermally conductive sheet are set in the both sides of parcel groove, chip can be enclosed between fin and thermally conductive sheet, so as to increase
By force to the protection of chip.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the present embodiment；
Fig. 2 is the configuration schematic diagram of the present embodiment；
Fig. 3 is the overall structure diagram at another visual angle of the present embodiment.
Description of reference numerals：1st, chip；2nd, insulate glue-line；3rd, fin；4th, pin；5th, groove is wrapped up；6th, side plate；7th, L-shaped
Plate；8th, thermally conductive sheet；9th, heat conduction groove；10th, radiating groove；11st, radiate salient point；12nd, connector.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Present embodiment discloses a kind of DFN encapsulation, and as shown in Figure 1, 2, including chip 1, chip 1 are provided with insulating cement layer outside
2 are wrapped up, and the side of chip 1 is connected with the metal fin 3 being bonded with it, and insulation glue-line 2 is wrapped up by fin 3 only to be left
One side away from chip 1 contacts with the external world, and both sides are connected with the pin 4 for being electrically connected with external circuitry on chip 1.
As shown in Figure 1, 2, fin 3 is fixedly connected with four by Heat Conduction Material on a face corner location of chip 1
Manufactured parcel groove 5, parcel groove 5 include two blocks of perpendicular side plates 6, and two blocks of side plates 6 are vertical with fin 3, set on side plate 6
There is L shaped plate 7, and L shaped plate 7 is fixed with the two pieces of sides of side plate 6 away from fin 3, and four parcel grooves 5 are just by chip 1
Four corner parcels.Chip 1 is more firmly connected by parcel groove 5 with fin 3 so that both are not easily separate, and wrap up groove 5
It is made up of heat sink material, its caused heat that chip 1 can work is oriented to fin 3, so that by the heat on chip 1 more
Efficient conduction is added to strengthen heat dispersion to fin 3.
As shown in figure 1, setting square thermally conductive sheet 8 in a insulating layer, thermally conductive sheet 8 is made up of metal thermal conductive material, and
It is fixedly connected with four corners for wrapping up groove 5.Therefore caused heat can be transferred to thermally conductive sheet 8 by wrapping up groove 5 on chip 1
In, thermally conductive sheet 8 offers heat conduction groove 9 in the one side of chip 1 and its opposite face.Heat conduction groove 9 can increase heat conduction
The contact area of piece 8 and insulation glue-line 2, so that both connect more firm, more difficult disengaging, and by chip 1
Heat be more uniformly dispersed to insulation glue-line 2 in.
As shown in Figure 2,3, continuous radiating groove 10 is offered on side of the insulation glue-line 2 away from chip 1, radiating groove 10 is
Deep-slotted chip breaker, radiating groove 10 add insulation glue-line 2 and the contact area of external environment, while contacted in thermally conductive sheet 8 with the external world
The radiating salient point 11 that array arrangement is presented is fixed with simultaneously, radiating salient point 11 adds fin 3 and extraneous contact area
Enhance the heat dispersion of component.
As shown in Figure 2,3, more firmly it is fixed with connector on fin 3 to make fin 3 be connected with thermally conductive sheet 8
12, connector 12 is rendered as ］ shape, connector 12 passes through insulating cement layer 2 in the other two sides of setting pin 4, and one end is fixed
On fin 3, the other end is fixed on thermally conductive sheet 8.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, it is all in this practicality
Within new design concept, any modification, equivalent substitution and improvements made etc., protection of the present utility model should be included in
Within the scope of.
Claims (6)
1. a kind of DFN encapsulation, including chip (1), chip (1) are connected with the insulation glue-line (2) wrapped up, the chip (1)
Side is connected with fin (3), and the side of the fin (3) contacts with external environment condition, it is characterised in that：The fin
(3) four parcel being made from a material that be thermally conductive grooves (5) are fixedly connected with the one side of chip (1), the parcel groove (5) will
The corner parcel of chip (1).
A kind of 2. DFN encapsulation according to claim 1, it is characterised in that：It is provided with and is insulated in the insulation glue-line (2)
The fully wrapped around thermally conductive sheet (8) of glue-line (2), the thermally conductive sheet (8) are made from a material that be thermally conductive and connect with four parcel grooves (5)
Touch.
A kind of 3. DFN encapsulation according to claim 2, it is characterised in that：The one of the close chip (1) of the thermally conductive sheet (8)
Heat conduction groove (9) is provided with face and its opposite face.
A kind of 4. DFN encapsulation according to claim 1, it is characterised in that：The remote chip (1) of insulation glue-line (2)
Continuous radiating groove (10) is offered on side.
A kind of 5. DFN encapsulation according to claim 2, it is characterised in that：The one side that the thermally conductive sheet (8) contacts with the external world
On be provided with radiating salient point (11).
A kind of 6. DFN encapsulation according to claim 5, it is characterised in that：Connector is fixed with the fin (3)
(12), the connector (12) is fixedly connected on fin (3) and thermally conductive sheet (8) through insulation glue-line (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294305.3U CN207217511U (en) | 2017-10-09 | 2017-10-09 | A kind of DFN encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294305.3U CN207217511U (en) | 2017-10-09 | 2017-10-09 | A kind of DFN encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217511U true CN207217511U (en) | 2018-04-10 |
Family
ID=61820534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721294305.3U Expired - Fee Related CN207217511U (en) | 2017-10-09 | 2017-10-09 | A kind of DFN encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217511U (en) |
-
2017
- 2017-10-09 CN CN201721294305.3U patent/CN207217511U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20191009 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |