CN207184918U - A kind of radiator structure of circuit board - Google Patents
A kind of radiator structure of circuit board Download PDFInfo
- Publication number
- CN207184918U CN207184918U CN201721203481.1U CN201721203481U CN207184918U CN 207184918 U CN207184918 U CN 207184918U CN 201721203481 U CN201721203481 U CN 201721203481U CN 207184918 U CN207184918 U CN 207184918U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- support plate
- insulation support
- heat sink
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It the utility model is related to a kind of radiator structure of circuit board, including the circuit board provided with circuit chip, insulation support plate and heat sink are sequentially provided with side where the circuit board corresponding circuits chip, the insulation support plate is resisted against between circuit board and heat sink, fixed between circuit board and insulation support plate by independent fixed mechanism, fixed between insulation support plate and heat sink by independent fixed mechanism, the heat sink is close to the surface of circuit chip.Insulation support plate of the present utility model is individually fixed with circuit board, heat sink installation; insulation support plate is set to be respectively supported between circuit board, radiating plate surface; coupling mechanism force will not be acted on circuit chip; being capable of preferably protection circuit chip; improve its yields and service life; enterprise need not be equipped with the high tightening device of precision and be assembled, and reduce manufacturing cost.
Description
Technical field
A kind of circuit board is the utility model is related to, specifically a kind of radiator structure of circuit board.
Background technology
As shown in figure 1, in the prior art, circuit chip 101 can be provided with circuit board 100, circuit chip 101 is generally by half
Conductor material is made, and therefore, it can produce substantial amounts of heat at work.In order to improve the service life of circuit chip 101, lead to
Often heat sink 102 can be set on the surface of circuit board 100, circuit board 100 is directly fixed with heat sink 102 by screw 103, in order to
Prevent that damaging circuit chip 101 by pressure also needs to set limited post 104 in circuit board 100 and heat sink 102.
In existing technology, when the coupling mechanism force of screw 103 is too small, heat sink 102 is difficult uniformly close with circuit chip 101
Contact, cause radiating effect poor, and tighten power it is excessive when, heat sink 102 still can damage circuit chip 101 by pressure, cause circuit
The yields of plate 100 is low, service life is short；And to improve accurately coupling mechanism force, it is necessary to using the high tightening device of precision
Assembled, cause manufacturing cost to remain high.
The content of the invention
It is high, suitable that the purpose of this utility model aims to provide a kind of simple, rational in infrastructure design, good heat dissipation effect, yields
With the radiator structure of the low circuit board of long lifespan, cost, to solve weak point of the prior art.
By a kind of radiator structure of circuit board of this purpose design, including the circuit board provided with circuit chip, the circuit
Insulation support plate and heat sink are sequentially provided with side where plate corresponding circuits chip, the insulation support plate is resisted against circuit
Between plate and heat sink, fixed between circuit board and insulation support plate by independent fixed mechanism, insulation support plate and radiating
Fixed between plate by independent fixed mechanism, the heat sink is close to the surface of circuit chip.
The thickness of the insulation support plate is suitable with the height of circuit chip projection circuit board.
The insulation support plate is in latticed, and the position where corresponding circuits chip offers some mesh thereon.
The fixed mechanism is lock, Elastic buckle, screw or combinations thereof.
The utility model is had the advantages that by above-mentioned technological improvement：
Insulation support plate is individually fixed with circuit board, heat sink installation, insulation support plate is respectively supported at circuit
Between plate, radiating plate surface, coupling mechanism force will not be acted on circuit chip, can preferably protection circuit chip, it is good to improve its
Product rate and service life, enterprise need not be equipped with the high tightening device of precision and be assembled, and reduce manufacturing cost.
The utility model can be applied in the conventional household electrical appliance such as electric fan, food processor, air conditioner, television set
On, have a wide range of application.
Brief description of the drawings
Fig. 1 is the structure chart of this circuit board cooling structure in the prior art.
Fig. 2 is the structure chart of the embodiment of the utility model one.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Referring to Fig. 2, the radiator structure of this circuit board, including the circuit board 1 provided with circuit chip 11, the circuit board 1 is right
Answer and be sequentially provided with insulation support plate 2 and heat sink 3 on the side at the place of circuit chip 11, the insulation support plate 2 is resisted against electricity
Between road plate 1 and heat sink 3, fixed between circuit board 1 and insulation support plate 2 by independent fixed mechanism, insulation support plate 2
Fixed between heat sink 3 by independent fixed mechanism, the heat sink 3 is close to the surface of circuit chip 11.The technology
Scheme makes insulation support plate 2 individually be fixed with circuit board 1, the installation of heat sink 3, insulation support plate 2 is not influenceed by coupling mechanism force
It can be respectively supported between circuit board 1, the surface of heat sink 3, coupling mechanism force is only acted upon on insulation support plate 2, will not acted on
On circuit chip 11, can preferably protection circuit chip 11, its yields and service life are improved, without accurately locking
Power is assembled, i.e., enterprise need not be equipped with the high tightening device of precision and be assembled, and reduces manufacturing cost, improves product competitiveness.
The height of the thickness circuit board 1 raised with circuit chip 11 of the insulation support plate 2 is suitable, i.e. insulation support plate 2
The height of the height of support circuit board 1 raised with circuit chip 11 is suitable, can preferably protection circuit chip 11,.
The insulation support plate 2 is in latticed, and the position where corresponding circuits chip 11 offers some mesh 21 thereon,
The Area of bearing of insulation support plate 2 is bigger, when the coupling mechanism force avoided because of fixed mechanism has differences, and causes circuit board 1, dissipates
The deformation of hot plate 3, yields is higher, and mesh 21 can avoid circuit chip 11, and the protection to circuit chip 11 is more preferable.
The fixed mechanism is lock, Elastic buckle, screw 4 or combinations thereof, the present embodiment only with screw 4 side
Case, those skilled in the art are appreciated that.
Above disclosed is only preferred embodiment of the present utility model, rather than of the present utility model to limit with this
Claims, according to the equivalent variations made in scope of protection of the utility model, still belong to what the utility model was protected
Scope.
Claims (4)
1. a kind of radiator structure of circuit board, including provided with circuit chip（11）Circuit board（1）, it is characterised in that the electricity
Road plate（1）Corresponding circuits chip（11）Insulation support plate is sequentially provided with the side at place（2）And heat sink（3）, the insulation
Supporting plate（2）It is resisted against circuit board（1）And heat sink（3）Between, circuit board（1）With insulation support plate（2）Between pass through independence
Fixed mechanism fix, insulation support plate（2）With heat sink（3）Between fixed by independent fixed mechanism, the heat sink
（3）With circuit chip（11）Surface be close to.
2. the radiator structure of circuit board according to claim 1, it is characterised in that：The insulation support plate（2）Thickness with
Circuit chip（11）Raised circuit board（1）Height it is suitable.
3. the radiator structure of circuit board according to claim 1, it is characterised in that：The insulation support plate（2）In latticed,
Corresponding circuits chip thereon（11）The position at place offers some mesh（21）.
4. according to the radiator structure of any one of the claim 1-3 circuit boards, it is characterised in that：The fixed mechanism is lock
Button, Elastic buckle, screw（4）Or combinations thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721203481.1U CN207184918U (en) | 2017-09-18 | 2017-09-18 | A kind of radiator structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721203481.1U CN207184918U (en) | 2017-09-18 | 2017-09-18 | A kind of radiator structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207184918U true CN207184918U (en) | 2018-04-03 |
Family
ID=61746934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721203481.1U Expired - Fee Related CN207184918U (en) | 2017-09-18 | 2017-09-18 | A kind of radiator structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207184918U (en) |
-
2017
- 2017-09-18 CN CN201721203481.1U patent/CN207184918U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |