CN207181146U - A kind of microbonding point THM coupling experimental provision - Google Patents
A kind of microbonding point THM coupling experimental provision Download PDFInfo
- Publication number
- CN207181146U CN207181146U CN201721194355.4U CN201721194355U CN207181146U CN 207181146 U CN207181146 U CN 207181146U CN 201721194355 U CN201721194355 U CN 201721194355U CN 207181146 U CN207181146 U CN 207181146U
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- Prior art keywords
- temperature
- groove
- screw
- controlled cabinet
- ball
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The utility model belongs to microwelding technical field, more particularly to a kind of microbonding point THM coupling experimental provision, including temperature environment, the stress loading system and D.C. regulated power supply controller analog current loading system of moving simulation of ball-screw that fixture, the temperature-controlled cabinet being made up of movable block and fixed block are simulated.The present apparatus is simple in construction, easy to operate, and pulling force, size of current and temperature height are adjustable suffered by experimental enviroment microbonding point, more conform to the requirement of the actual military service operating mode of microelectronic product.
Description
Technical field
The utility model belongs to microwelding technical field, and in particular to one kind microbonding point performance under heating power electricity THM coupling
Detection means.
Background technology
At present, the more and more needs of electronic product are applied in more rugged environment, to be subjected to temperature, humidity, outer loading
The effect of many factors such as lotus, electric current, magnetic field.The solder joint of electronic product is often in multi- scenarios method working environment, people
Compound microstructure Lead-Free Solder Joint interface metal under the conditions of generally only single thermophoresis, electromigration, magnetic field, stress etc.,
Chemical composition, mechanical property and growth change rule conduct a research, and can not thus meet situation complicated and changeable in practice, and
Lack again suitable for the microbonding point test device under the conditions of multi- scenarios method now.
The content of the invention
Part in order to overcome the above-mentioned deficiencies of the prior art, the utility model provide a kind of microbonding point THM coupling experiment dress
Put.
The utility model is achieved by the following technical solution：A kind of microbonding point THM coupling experimental provision, including temperature
Control cabinet is spent, temperature-controlled cabinet is controlled by temperature controller, and ball-screw, temperature-controlled cabinet are provided with described temperature-controlled cabinet
Inside it is additionally provided with the guide rail to match with ball-screw；One end of described ball-screw is connected with stepper motor by shaft coupling,
Stepper motor is fixed on the outside of temperature-controlled cabinet；The other end of described ball-screw is set with fixed block, and fixed block passes through
Fixed plate is mutually fixed with temperature-controlled cabinet；Movable block is also set with described ball-screw, movable block is sleeved on guide rail simultaneously
On；Be provided with groove I on the outside of described movable block, be provided with groove II on the outside of described fixed block, the groove I of described movable block and
The groove II of fixed block is engaged the fixture to be formed and can fix test specimen；Described groove I surrounding is posted with groove II surrounding
Potsherd, test specimen both sides are connected by the two poles of the earth of wire respectively with D.C. regulated power supply controller, and described fixed block is in groove
II opposite side is provided with S-shaped force cell, and S-shaped force cell is connected with dynamometric system controller.
Further, described temperature controller, D.C. regulated power supply controller and dynamometric system controller are integrated in control
One is formed in device processed.
Further, described ball-screw both sides are respectively equipped with a guide rail.
Further, described groove I and groove II are T-slot.
The beneficial effects of the utility model are：This experimental rig simulation electronic product is in thermal field, the field of force and three, electric field
In the complex environment of coupling, reality of the sample under three kinds of different temperatures, different stress and different electric currents alternation operating modes can be realized
Test.The present apparatus is simple in construction, easy to operate, and pulling force, size of current and temperature height are adjustable suffered by experimental enviroment microbonding point,
More conform to the requirement of the actual military service operating mode of microelectronic product.
Brief description of the drawings
Fig. 1 is the utility model front view；
Fig. 2 is the utility model controller architecture schematic diagram；
In figure, 1, stepper motor, 2, temperature-controlled cabinet, 3, controller, 4, guide rail, 5, shaft coupling, 6, ball-screw, 7, living
Motion block, 8, groove I, 9, fixed block, 10, groove II, 11, fixed plate, 12, S-shaped force cell, 13, temperature controller, 14,
D.C. regulated power supply controller, 15, dynamometric system controller.
Embodiment
The utility model is further illustrated below according to drawings and examples.
As depicted in figs. 1 and 2, a kind of microbonding point THM coupling experimental provision, including temperature-controlled cabinet 2, temperature-controlled cabinet 2
Temperature value controlled by temperature controller 13, is provided with ball-screw 6 in described temperature-controlled cabinet 2, meanwhile, in temperature-controlled cabinet
Some guide rails 4 to match with ball-screw 6 are additionally provided with 2；One end of described ball-screw 6 is connected with by shaft coupling 5
Stepper motor 1, stepper motor 1 provide power source to ball-screw 6, and the outside that stepper motor 1 is fixed on temperature-controlled cabinet 2 avoids
Temperature is too high and influence the normal use of stepper motor in temperature-controlled cabinet 2 when being tested；Described ball-screw 6 it is another
End is set with fixed block 9, and fixed block 9 is fixed by fixed plate 11 and the phase of temperature-controlled cabinet 2 so that ball-screw 6 is consolidated when rotating
Determine block 9 and relative displacement does not occur；Movable block 7 is also set with described ball-screw 6, movable block 7 is sleeved on guide rail 4 simultaneously
On, when ball-screw 6 rotates, movable block 7 can produce axial movement；The described outside of movable block 7 is provided with groove I 8, described
The outside of fixed block 9 is provided with groove II 10, and the groove I 8 of described movable block 7 is engaged to form energy with the groove II 10 of fixed block 9
The fixture that test specimen is fixed；Test specimen in the groove I 8 of movable block 7 and the test specimen in the groove II 10 of fixed block 9 point
It is not connected extremely with wherein the one of D.C. regulated power supply controller 14 by wire and forms a closed-loop path, described groove I 8 four
Week posts potsherd with the surrounding of groove II 10, and being provided with potsherd in groove prevents electric current from being passed to by movable block 7 and fixed block 9
The accuracy of experiment is influenceed on to miscellaneous part, while electric current is exposed may damage the electronic components such as stepper motor, it is described
Fixed block 9 be provided with S-shaped force cell 12 in the opposite side of groove II 10, S-shaped force cell 12 is attached to fixed plate 11
Side, S-shaped force cell 12 are connected with dynamometric system controller 15.The utility model controls temperature by temperature controller 13
Temperature change in control cabinet 2, the temperature value in temperature-controlled cabinet 2 are read by temperature controller 13；Pass through the defeated of stepper motor 1
The different rotating speeds gone out control speed of the movable block 7 away from fixed block 9, the difference of speed so that test specimen can be applied it is different should
Power, stress value are transferred on dynamometric system controller 15 by S-shaped force cell 12；Pass through D.C. regulated power supply controller 14
Change the electric current for the voltage change inflow test specimen for being added in test specimen two ends, current value passes through the electricity on D.C. regulated power supply controller 14
Pressure value obtains indirectly；Answering for thermal field, the field of force and electric field THM coupling is in by the value simulation electronic product for changing heat, power and electricity
In heterocycle border, experiment of the sample under three kinds of different temperatures, different stress and different electric currents alternation operating modes can be realized.
As shown in Fig. 2 the improvement as the present embodiment, by described temperature controller 13, D.C. regulated power supply controller
14 and dynamometric system controller 15 be all integrated in be formed in controller 3 and be integrally easy to experimental implementation person to control whole experimental provision.
As shown in figure 1, the improvement as the present embodiment, the described both sides of ball-screw 6 are respectively equipped with a guide rail 4, make
Obtaining the both sides that movable block 7 is located at ball-screw 6 has guide rail 4 to carry out guiding movement.
Further, described groove I 8 and groove II 10 are T-slot, and test specimen is stuck in T-slot and is fixed.
Two T-shaped test specimens are formed into I-shaped test specimen by Welding together, the both sides of I-shaped test specimen are distinguished
Be stuck in the groove I 8 of movable block 7 with the groove II 10 of fixed block 9, then adjusted respectively by controller 3 temperature, stress and
Electric current so that test specimen is tested under the complex environment for the heating power electricity THM coupling that this experimental provision is simulated, and verifies microbonding point
Combination property.
Claims (4)
- A kind of 1. microbonding point THM coupling experimental provision, it is characterised in that：Including temperature-controlled cabinet（2）, temperature-controlled cabinet（2）By Temperature controller（13）Control, described temperature-controlled cabinet（2）It is interior to be provided with ball-screw（6）, temperature-controlled cabinet（2）Inside it is additionally provided with With ball-screw（6）The guide rail to match（4）；Described ball-screw（6）One end pass through shaft coupling（5）It is connected with stepping electricity Machine（1）, stepper motor（1）It is fixed on temperature-controlled cabinet（2）Outside；Described ball-screw（6）The other end be set with it is solid Determine block（9）, fixed block（9）Pass through fixed plate（11）With temperature-controlled cabinet（2）It is mutually fixed；Described ball-screw（6）On also cover Equipped with movable block（7）, movable block（7）It is sleeved on guide rail simultaneously（4）On；Described movable block（7）Outside is provided with groove I（8）, institute The fixed block stated（9）Outside is provided with groove II（10）, described movable block（7）Groove I（8）With fixed block（9）Groove II （10）It is engaged the fixture to be formed and test specimen can be fixed；Described groove I（8）Surrounding and groove II（10）Surrounding posts ceramics Piece, test specimen both sides by wire respectively with D.C. regulated power supply controller（14）The two poles of the earth be connected, described fixed block（9）Recessed Groove II（10）Opposite side be provided with S-shaped force cell（12）, S-shaped force cell（12）With dynamometric system controller（15）Phase Even.
- A kind of 2. microbonding point THM coupling experimental provision according to claim 1, it is characterised in that：Described temperature control Device（13）, D.C. regulated power supply controller（14）With dynamometric system controller（15）It is integrated in controller（3）It is interior to form one.
- A kind of 3. microbonding point THM coupling experimental provision according to claim 1, it is characterised in that：Described ball-screw （6）Both sides are respectively equipped with a guide rail（4）.
- A kind of 4. microbonding point THM coupling experimental provision according to claim 1, it is characterised in that：Described groove I（8） With groove II（10）It is T-slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194355.4U CN207181146U (en) | 2017-09-18 | 2017-09-18 | A kind of microbonding point THM coupling experimental provision |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194355.4U CN207181146U (en) | 2017-09-18 | 2017-09-18 | A kind of microbonding point THM coupling experimental provision |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207181146U true CN207181146U (en) | 2018-04-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721194355.4U Expired - Fee Related CN207181146U (en) | 2017-09-18 | 2017-09-18 | A kind of microbonding point THM coupling experimental provision |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207181146U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109030235A (en) * | 2018-09-25 | 2018-12-18 | 北京工业大学 | The preparation and test method of miniature solder joint under the conditions of power coupled thermomechanics |
| CN113176196A (en) * | 2021-04-28 | 2021-07-27 | 东南大学 | Integrated testing device under multi-field coupling environment |
-
2017
- 2017-09-18 CN CN201721194355.4U patent/CN207181146U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109030235A (en) * | 2018-09-25 | 2018-12-18 | 北京工业大学 | The preparation and test method of miniature solder joint under the conditions of power coupled thermomechanics |
| CN113176196A (en) * | 2021-04-28 | 2021-07-27 | 东南大学 | Integrated testing device under multi-field coupling environment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20200918 |
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| CF01 | Termination of patent right due to non-payment of annual fee |