CN207163007U - A kind of semiconductor dual chip refrigeration system - Google Patents
A kind of semiconductor dual chip refrigeration system Download PDFInfo
- Publication number
- CN207163007U CN207163007U CN201721200357.XU CN201721200357U CN207163007U CN 207163007 U CN207163007 U CN 207163007U CN 201721200357 U CN201721200357 U CN 201721200357U CN 207163007 U CN207163007 U CN 207163007U
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- CN
- China
- Prior art keywords
- refrigeration system
- semiconductor
- connection frame
- radiation aluminium
- cold
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of semiconductor dual chip refrigeration system, including：Semiconductor chip, one end of the semiconductor chip is provided with cold scattering aluminum, the other end of the semiconductor chip is provided with radiation aluminium, thermal insulation layer is provided between the cold scattering aluminum and radiation aluminium, connection frame is provided with above the radiation aluminium, the connection frame is provided with locating dowel with radiation aluminium link position, and another link position of the connection frame and radiation aluminium is provided with mounting hole；Pass through the connection frame in the utility model, heat insulation loop is installed and fixes one independent refrigeration system of composition with hot aluminium, the function that refrigeration system is fixed with box body mounting base is taken into account again, after being fixed by the mounting seat in semiconductor dual chip refrigeration system and casing, function is connection frame and cold alumiseal on the inside of sealing ring in system, outside function seals for connection frame and mounting seat, prevents that condensed water is flowed into refrigeration system in case, improves system service life.
Description
Technical field
The utility model belongs to household electrical appliances, refrigeration appliance and wine freezer technical field, and in particular to a kind of semiconductor twin-core
Piece refrigeration system.
Background technology
Refrigeration, is the temperature of a certain space or object is fallen below ambient temperature, and be maintained at regulation low temperature shape
The a science technology of state, it is continued to develop with requirement of the people to cryogenic conditions and the raising of social productive forces.Refrigeration
Exactly make a certain space or object reaches temperature less than its surrounding medium, and maintain the process of this low temperature.Work
Principle is to be based on Peltier principle, and the effect was found first in 1834 by J.A.C Peltier, i.e., using when two kinds of differences
Conductor A and B composition circuit and when being connected with direct current, certain other heat can be also discharged in addition to Joule heat in joint
Amount, and another joint then absorbs heat, and this phenomenon caused by peltier effect is reversible, changes the sense of current
When, the joint of heat release and heat absorption also changes therewith, absorbs and liberated heat is directly proportional to current strength I [A], and led with two kinds
The property of body and the temperature in hot junction are relevant, and semi-conducting material is then much better than, thus obtains the thermoelectric refrigerator of practical application
Part is all made of semi-conducting material.In people's lives, domestic refrigerator, the application of air conditioner are increasing, in China city
Town, refrigerator and air conditioner widely Jin Ren families, quickly, development prospect is very optimistic for growth rate in recent years.
Existing semiconductor dual chip refrigeration system, possess the semiconductor dual chip refrigerant system configurations complexity of in the market,
Assembly process is more, and efficiency of assembling is low, and internal system thermal insulation designs bad, insulating layer thickness of thin, and refrigerating efficiency is not high
The problem of, it is this it is proposed that a kind of semiconductor dual chip refrigeration system.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor dual chip refrigeration system, to solve in above-mentioned background technology
Existing semiconductor dual chip refrigeration system is proposed, possesses the semiconductor dual chip refrigerant system configurations complexity of in the market, assembling
Process is more, and efficiency of assembling is low, and internal system thermal insulation designs bad, insulating layer thickness of thin, and refrigerating efficiency is not high to ask
Topic.
To achieve the above object, the utility model provides following technical scheme：A kind of semiconductor dual chip refrigeration system, bag
Include：Semiconductor chip, one end of the semiconductor chip are provided with cold scattering aluminum, and the other end of the semiconductor chip is provided with scattered
Hot aluminium, thermal insulation layer is provided between the cold scattering aluminum and radiation aluminium, connection frame, the connection are provided with above the radiation aluminium
Frame is provided with locating dowel with radiation aluminium link position, and another link position of the connection frame and radiation aluminium is provided with mounting hole,
The cold scattering aluminum is provided with mounting groove with being connected the link position of frame, and the inner surface setting of the mounting groove has sealing ring, described
Mounting seat is provided with the outside of connection frame, one end of the connection frame is provided with connecting lugs, and the inside of the connection frame is set
There is neck, fixture block is provided with the inside of the neck, the link position of the fixture block and neck is provided with fixing hole.
Preferably, the semiconductor chip is provided with cold and hot two sides, and huyashi-chuuka (cold chinese-style noodles) is connected with cold scattering aluminum, and hot face connects with radiation aluminium
Connect.
Preferably, the connection frame is fixedly connected with radiation aluminium by mounting hole and locating dowel.
Preferably, the sealing ring is fixedly connected on connection frame by mounting groove.
Preferably, the semiconductor chip is provided with two altogether, and two semiconductor chips be separately mounted to cold scattering aluminum with
Between radiation aluminium.
Preferably, the thermal insulation layer is provided with three altogether, and three thermal insulation layers are respectively and fixedly installed to two semiconductor cores
Between piece and both ends.
Compared with prior art, the beneficial effects of the utility model are：By the connection frame in the utility model, frame is connected
It is simple in construction, heat insulation loop is installed and fixes one independent refrigeration system of composition with hot aluminium, refrigeration system is taken into account again and pacifies with casing
The function that seat is fixed is filled, after being fixed by the mounting seat on semiconductor dual chip refrigeration system and casing, the sealing ring in system
Inner side function is connection frame and cold alumiseal, and outside function seals for connection frame and mounting seat, so as to realize chip on semiconductor
Refrigeration system and box sealing, prevent that condensed water is flowed into refrigeration system in case, improves system service life, this arrangement simplifies
System architecture, so the comparison that thermal insulation layer can be done is thick, strengthen the heat-blocking action before refrigeration system cold scattering aluminum and radiation aluminium, its
Material can use heat insulation foam, can also use eps foam, by the way that connection frame is arranged to separate structure, can make sealing ring
More stablizing for connection, can also facilitate the replacing of sealing ring.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is fractionation structural representation of the present utility model；
Fig. 3 is section structural representation of the present utility model；
Fig. 4 is connection mount structure schematic diagram of the present utility model；
Fig. 5 is connection frame section of the present utility model structural representation；
In figure：1- cold scattering aluminums, 2- sealing rings, 3- thermal insulation layers, 4- connections frame, 5- radiation aluminiums, 6- semiconductor chips, 7- installations
Seat, 8- mounting grooves, 9- mounting holes, 10- connecting lugs, 11- fixture blocks, 12- fixing holes, 13- necks, 14- locating dowels.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5 are referred to, the utility model provides a kind of semiconductor dual chip refrigeration system technology
Scheme：A kind of semiconductor dual chip refrigeration system, including：Semiconductor chip 6, one end of semiconductor chip 6 are provided with cold scattering aluminum
1, the other end of semiconductor chip 6 is provided with radiation aluminium 5, and thermal insulation layer 3, radiation aluminium 5 are provided between cold scattering aluminum 1 and radiation aluminium 5
Top be provided with connection frame 4, connection frame 4 and the link position of radiation aluminium 5 are provided with locating dowel 14, connection frame 4 and radiation aluminium 5
Another link position is provided with mounting hole 9, and cold scattering aluminum 1 is provided with mounting groove 8 with being connected the link position of frame 4, mounting groove 8 it is interior
Surface is provided with sealing ring 2, and the outside of connection frame 4 is provided with mounting seat 7, and one end of connection frame 4 is provided with connecting lugs 10, even
Connect frame 4 is internally provided with neck 13, and the inner side of neck 13 is provided with fixture block 11, and the link position of fixture block 11 and neck 13 is set
There is fixing hole 12.
In order that the link position for obtaining cold scattering aluminum 1 and radiation aluminium 5 is clear and definite, in the present embodiment, it is preferred that semiconductor chip 6
Cold and hot two sides is provided with, and huyashi-chuuka (cold chinese-style noodles) is connected with cold scattering aluminum 1, hot face is connected with radiation aluminium 5.
In order that the connection that must connect frame 4 and radiation aluminium 5 is more stable, in the present embodiment, it is preferred that connection frame 4 is with dissipating
Hot aluminium 5 is fixedly connected by mounting hole 9 with locating dowel 14.
In order that the easy to connect of sealing ring 2 is obtained, in the present embodiment, it is preferred that sealing ring 2 passes through mounting groove 8 and fixes company
It is connected on connection frame 4.
In order that refrigeration it is more preferable, in the present embodiment, it is preferred that semiconductor chip 6 is provided with two, and two altogether
Semiconductor chip 6 is separately mounted between cold scattering aluminum 1 and radiation aluminium 5.
In order that the heat transfer obtained between cold scattering aluminum 1 and radiation aluminium 5 is reduced, in the present embodiment, it is preferred that thermal insulation layer 3 is common
Three are provided with, and three thermal insulation layers 3 are respectively and fixedly installed between two semiconductor chips 6 and both ends.
It is fixed on before mounting seat foaming in the utility model in casing, passes through the heat-insulation foam materials such as pentamethylene and casing
Fixed, semiconductor dual chip refrigeration system is fixed by screw and mounting seat, semiconductor dual chip refrigeration system is arranged on case
On body, refrigeration system is sealed with casing by the sealing ring in the mounting seat and refrigeration system on casing, prevents product system
Cold leaks after cold.
Operation principle and process for using of the present utility model：After the utility model installation, it is possible to use, during use
Cold scattering aluminum 1 and radiation aluminium 5 are connected to the cold and hot both ends of semiconductor chip 6, the side of sealing ring 2 and the outward flange of cold scattering aluminum 1
Contact, opposite side are exposed at the edge of cold scattering aluminum 1, and the exposed parts of sealing ring 2 coordinate with other parts, close with regard to that can complete refrigeration system
Envelope, is freezed by absorbing electric heating, a few minutes can small range knot last layer frost.The operation principle of semiconductor cooling device
It is to be based on Peltier principle, when using the circuit formed as two kinds of different conductor A and B and being connected with direct current, is removed in joint
Certain other heat can be also discharged beyond Joule heat, and another joint then absorbs heat, and peltier effect is drawn
This phenomenon risen is reversible, and when changing the sense of current, the joint of heat release and heat absorption also changes therewith, the heat for absorbing and releasing
Amount is directly proportional to current strength I [A], and relevant with the temperature of the property of two kinds of conductors and hot junction.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of semiconductor dual chip refrigeration system, including：Semiconductor chip (6), it is characterised in that：The semiconductor chip
(6) one end is provided with cold scattering aluminum (1), and the other end of the semiconductor chip (6) is provided with radiation aluminium (5), the cold scattering aluminum
(1) thermal insulation layer (3) is provided between radiation aluminium (5), connection frame (4), the connection are provided with above the radiation aluminium (5)
Frame (4) is provided with locating dowel (14), the connection frame (4) and another connection position of radiation aluminium (5) with radiation aluminium (5) link position
Install and be equipped with mounting hole (9), the cold scattering aluminum (1) is provided with mounting groove (8), the installation with being connected the link position of frame (4)
The inner surface setting of groove (8) has sealing ring (2), and mounting seat (7), the connection frame (4) are provided with the outside of the connection frame (4)
One end be provided with connecting lugs (10), the connection frame (4) is internally provided with neck (13), the inner side of the neck (13)
Fixture block (11) is provided with, the fixture block (11) and the link position of neck (13) are provided with fixing hole (12).
A kind of 2. semiconductor dual chip refrigeration system according to claim 1, it is characterised in that：The semiconductor chip
(6) cold and hot two sides is provided with, and huyashi-chuuka (cold chinese-style noodles) is connected with cold scattering aluminum (1), hot face is connected with radiation aluminium (5).
A kind of 3. semiconductor dual chip refrigeration system according to claim 1, it is characterised in that：It is described connection frame (4) with
Radiation aluminium (5) is fixedly connected by mounting hole (9) with locating dowel (14).
A kind of 4. semiconductor dual chip refrigeration system according to claim 1, it is characterised in that：The sealing ring (2) is logical
Mounting groove (8) is crossed to be fixedly connected on connection frame (4).
A kind of 5. semiconductor dual chip refrigeration system according to claim 1, it is characterised in that：The semiconductor chip
(6) two are provided with altogether, and two semiconductor chips (6) are separately mounted between cold scattering aluminum (1) and radiation aluminium (5).
A kind of 6. semiconductor dual chip refrigeration system according to claim 1, it is characterised in that：The thermal insulation layer (3) is altogether
Three are provided with, and three thermal insulation layers (3) are respectively and fixedly installed between two semiconductor chips (6) and both ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721200357.XU CN207163007U (en) | 2017-09-19 | 2017-09-19 | A kind of semiconductor dual chip refrigeration system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721200357.XU CN207163007U (en) | 2017-09-19 | 2017-09-19 | A kind of semiconductor dual chip refrigeration system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207163007U true CN207163007U (en) | 2018-03-30 |
Family
ID=61722478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721200357.XU Expired - Fee Related CN207163007U (en) | 2017-09-19 | 2017-09-19 | A kind of semiconductor dual chip refrigeration system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207163007U (en) |
-
2017
- 2017-09-19 CN CN201721200357.XU patent/CN207163007U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180330 Termination date: 20200919 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |