CN207151066U - Has the electronic installation of heat sinking function - Google Patents
Has the electronic installation of heat sinking function Download PDFInfo
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- CN207151066U CN207151066U CN201721078460.1U CN201721078460U CN207151066U CN 207151066 U CN207151066 U CN 207151066U CN 201721078460 U CN201721078460 U CN 201721078460U CN 207151066 U CN207151066 U CN 207151066U
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- accommodation space
- heat
- electronic installation
- sinking function
- conductive assembly
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Abstract
A kind of electronic installation for having heat sinking function, it includes a housing, an electronic building brick and a heat-conductive assembly, there is the first accommodation space and the second accommodation space in housing, housing has the partition wall for separating the first accommodation space and the second accommodation space, the intercommunicating pore of the first accommodation space of connection and the second accommodation space is offered on partition wall, housing offers at least radiating opening externally connected in the position corresponding to the second accommodation space.Electronic building brick is arranged in the first accommodation space.Heat-conductive assembly is located in intercommunicating pore, and the first end position of heat-conductive assembly is in the first accommodation space, and the second end position of heat-conductive assembly is in the second accommodation space.It caused heat energy in electronic building brick operation, can be directed to by heat-conductive assembly in the second accommodation space, and be discharged via the radiating opening on housing, effectively reduce the overall temperature of electronic installation.
Description
Technical field
A kind of electronic installation for having heat sinking function is the utility model is related to, more particularly to one kind using heat-conductive assembly by the
The electronic installation for being thermally conducted to the second accommodation space in one accommodation space.
Background technology
Existing electronic installation, when the electronic building brick internally installed operates, heat energy can be usually produced, causes electronic building brick
Temperature gradually rise, although existing heat sink conception can install the radiating subassemblies such as radiating aluminium sheet additional on electronic building brick, so as to will
Heat energy is discharged into environment caused by electronic building brick, but the space surrounded in electronic device case body still can continue to build up heat
Can, under continued operation, electronic installation overall temperature rise can be caused gradually eventually.
This phenomenon not only influences the efficiency of electronic installation normal operation, and too high temperature more likely causes electronic installation in itself
Not the damage of reversibility, cause user to be burned because the high temperature of surface of electronic device is touched, or even because high temperature lead
Sub-device catching fire is sent a telegraph, causes threat of the property even in personal safety.
For that reason, how effective heat sink conception is provided, be always produce various electronic installation when it is important the problem of it
One.In order to avoid foreign enters inside electronic installation, and influence the normal operation of electronic installation, or avoid finger or other
Conductor is stretched into inside electronic installation, and the problems such as cause user to get an electric shock, existing heat sink conception can be advised by product in safety
Requirement on model, and not in opening up too big heat emission hole on the housing of electronic installation, it is accordingly difficult in general to by internal electron
Heat energy is expelled directly out caused by component operational.
Utility model content
Technical problem to be solved in the utility model is, provides a kind of tool heat sinking function in view of the shortcomings of the prior art
Electronic installation, particularly be used for solve the problems, such as remote circuit board center heat generating component overheat.
In order to solve above-mentioned technical problem, a wherein technical scheme is to provide a kind of tool used by the utility model
The electronic installation of heat sinking function, the electronic installation have a housing, an electronic building brick and a heat-conductive assembly, wherein, it is described
There is in housing one first accommodation space and one second accommodation space, the housing have separation first accommodation space with
And a partition wall of second accommodation space, connection first accommodation space and described the are offered on the partition wall
One intercommunicating pore of two accommodation spaces, the housing offered in the position corresponding to second accommodation space externally connect to
A few radiating opening；The electronic building brick is arranged in first accommodation space；The heat-conductive assembly is located in the connection
Kong Zhong, the first end of the heat-conductive assembly are located in first accommodation space, and the second end of the heat-conductive assembly is positioned at described
In second accommodation space.
Preferably, wherein, the first end of the heat-conductive assembly is thermally connected to the electronic building brick in a manner of face contacts
Surface.In this way, heat energy caused by the electronic building brick immediately can be taken away by the heat-conductive assembly.
Preferably, wherein, the electronic installation also includes a radiating subassembly, and the radiating subassembly is accommodating positioned at described second
In space, and the radiating subassembly is thermally connected to the second end of the heat-conductive assembly.In this way, can be big by the radiating subassembly
Width improves the efficiency that heat energy is released into second accommodation space.
Preferably, wherein, there is a graphene layer on the surface of the radiating subassembly.In this way, by the radiating subassembly
The graphene layer on surface, it can further improve the efficiency that heat energy is released.
Preferably, wherein, the radiating subassembly is a lamellar body, and the first side of the lamellar body is fixed in the heat-conductive assembly
The second end, the graphene layer is located in the second side relative with the first side of the lamellar body.In this way, except that can increase
The area exchanged is heated, most heat energy can also be discharged and cause the position away from the heat-conductive assembly.
Preferably, wherein, the outer outlet body is located at the side of the main body, and the top surface of the main body or bottom surface are corresponding
Heat emission hole is offered in the position of first accommodation space.In this way, the partial heat energy in first accommodation space can also
It is discharged by the heat emission hole for meeting safety standard.
The beneficial effects of the utility model are that the electronics for the tool heat sinking function that the utility model embodiment is provided fills
Put, its can by " electronic building brick is arranged in the first accommodation space ", " housing opens up in the position corresponding to the second accommodation space
Have the radiating opening externally connected " and " the first end position of heat-conductive assembly in the first accommodation space, the second end position of heat-conductive assembly
In the second accommodation space " design, to cause caused heat energy in electronic building brick operation, can be guided by heat-conductive assembly
It is discharged into the second accommodation space, and via the radiating opening on housing, effectively reduces the overall temperature of electronic installation.
Feature of the present utility model and technology contents are further understood that to be enabled, are referred to below in connection with the utility model
Detailed description and accompanying drawing, but the accompanying drawing provided be merely provided for refer to explanation, not be used for the utility model is added
With limitation.
Brief description of the drawings
Fig. 1 is that the group of electronic devices of the utility model embodiment founds schematic diagram.
Fig. 2 is Fig. 1 line II-II diagrammatic cross-section.
Fig. 3 is the enlarged local section schematic diagram at Fig. 2 labels III.
Fig. 4 is the electronic installation decomposing schematic representation of the utility model embodiment.
Fig. 5 is another decomposing schematic representation of electronic installation of the utility model embodiment.
Embodiment
It is to be illustrated by specific instantiation disclosed in the utility model about " electronics of tool heat sinking function fills below
Put " embodiment, the advantages of those skilled in the art can understand the utility model by content disclosed in this specification and effect
Fruit.The utility model can be implemented or applied by other different specific embodiments, the various details in this specification
Different viewpoints and application can be based on, various modifications and change are carried out in the case where not departing from spirit of the present utility model.In addition, this practicality
New accompanying drawing is only simple schematically illustrate, not according to the description of actual size, in advance statement.Following embodiment will enter one
Step describes correlation technique content of the present utility model in detail, but disclosure of that and is not used to limit protection of the present utility model
Scope.
Refer to shown in Fig. 1 and Fig. 2, Fig. 1 is that the group of electronic devices of the utility model embodiment founds schematic diagram.Fig. 2 is Fig. 1
Line II-II diagrammatic cross-section.From in above-mentioned figure, the utility model embodiment provides a kind of electronics for having heat sinking function
Device D, electronic installation D have with housing 1 made of the poor material of plastics or other thermal conductivity, and the inside of housing 1 has the
One accommodation space 21 and the second accommodation space 22, and housing 1 has the first accommodation space 21 of separation and the second accommodation space
22 partition wall W.Radiator structure 3 and electronic building brick 4 are provided with inside electronic installation D.In the utility model embodiment, electronics
Component 4 represent be perform electronic installation D function when, it is necessary to electronic installation D inner workings component, especially refer to
The component of heat energy, such as network communication module, optic module or central processing unit etc. can be produced during running.Due to
Electronic building brick 4 is arranged in the first accommodation space 21, therefore, during electronic building brick 4 operates, produced by electronic building brick 4
Heat energy the temperature in the first accommodation space 21 can be made to increase step by step.
Refer to again shown in Fig. 1 and Fig. 2, in the utility model embodiment, radiator structure 3 include heat-conductive assembly 31 and
Radiating subassembly 32.Wherein, heat-conductive assembly 31 is located in intercommunicating pore 23, and the first end position of heat-conductive assembly 31 is in the first accommodation space
In 21, the second end position of heat-conductive assembly 31 is in the second accommodation space 22.It is accommodating that the first end of heat-conductive assembly 31 can receive first
Heat energy in space 21, and via the mode of heat transfer, by the second end of thermal energy conduction to heat-conductive assembly 31, and discharge to second
In accommodation space 22.
In this preferred embodiment of the present utility model, also there is the radiating of piece shape shape in the second accommodation space 22
Component 32, radiating subassembly 32 it is affixed (such as friction weldering or inlay card fix etc.) in the second end of heat-conductive assembly 31, and with heat conduction group
Part 31 is thermally coupled (can mutual transferring heat energy), to conduct to the heat energy at the second end, Neng Gouyin from the first end of heat-conductive assembly 31
Efficiently discharged into the second accommodation space 22 for radiating subassembly 32.
Furthermore, refer to shown in Fig. 3, Fig. 3 is the enlarged local section schematic diagram at Fig. 2 labels III.At this
In embodiment, radiating subassembly 32 is made up of the graphene layer 32B on base material 32A and base material the 32A surface of demihull shape.Wherein,
Base material 32A first side is fixed in the second end of heat-conductive assembly 31, and graphene layer 32B is then positioned at the second of base material 32A
It is on the another side relative with first side in other words on side.Base material 32A is made up of Heat Conduction Materials such as aluminium alloys,
Because base material 32A is plates, the area of heat exchange can be increased, the graphene layer 32B in base material 32A second sides is then
It can effectively improve and discharge heat energy to the efficiency in the second accommodation space 22, can also in the utility model other embodiment
Make graphene layer 32B into other radiator structures such as radiating fin.In addition, it is that card is designed on housing 1 in the present embodiment
Ditch, and radiator structure 3 is fixed by way of inlay card so that radiating subassembly 32 is vacantly arranged in the second accommodation space 22,
But in the utility model in other possible embodiments, also it is not excluded for abutting in radiating subassembly 32 on housing 1 and corresponds to
The internal face of second accommodation space 22.
Return to refering to shown in Fig. 1 and Fig. 2, although in foregoing preferred embodiment be using heat-conductive assembly 31 and
The radiator structure 3 that radiating subassembly 32 forms discharges the heat energy in the first accommodation space 21 into the second accommodation space 22, still,
In key concept of the present utility model, as long as passing through the heat-conductive assembly 31 being located in intercommunicating pore 23, it becomes possible to make the first appearance
Heat energy in 21 between being empty, via the first end of heat-conductive assembly 31 and the second end of heat-conductive assembly 31, it is released into the second appearance
In 22 between being empty, therefore, under this concept change radiator structure 3 design, or change heat-conductive assembly 31 configuration, with reach with
The effect of this is equivalent, it should be regarded as the change of the utility model key concept.
As foregoing, there is the first accommodation space 21 and the second accommodation space 22 in electronic installation D housing 1, at this
In utility model embodiment, housing 1 offers at least one radiating externally connected in the position corresponding to the second accommodation space 22
Opening 121, by the radiating opening 121 being opened on housing 1, can cause the heat being released into the second accommodation space 22
Can, further it is discharged into by radiating opening 121 in external environment, and then the overall temperature of electronic installation D can be reduced.
It should be strongly noted that although the first end of the heat-conductive assembly 31 of the present embodiment is connect with face as can be seen from Figure 2
Tactile mode is thermally connected to the surface of electronic building brick 4, therefore heat-conductive assembly 31 can directly take away heat caused by electronic building brick 4
Can, still, key concept of the present utility model is not limited thereto, even if heat-conductive assembly 31 not directly with produce heat energy electricity
Sub-component 4 contacts, if the first end position of heat-conductive assembly 31 in the first accommodation space 21, inside the first accommodation space 21
When temperature rises, the heat energy that still can to accumulate in the first accommodation space 21 is released into second by heat-conductive assembly 31
In accommodation space 22.
Next refer to shown in Fig. 4 and Fig. 5, Fig. 4 is the electronic installation decomposing schematic representation of the utility model embodiment, is schemed
5 be another decomposing schematic representation of electronic installation of the utility model embodiment.From in above-mentioned figure, the housing 1 of the present embodiment wraps
A main body 11 and two outer outlet bodies 12 are included, two outer outlet bodies 12 distinguish position in two sides of main body 11, in particular, outer cover
Body 12 is detachably assembled onto on two sides of main body 11.It should be strongly noted that the utility model is not limited to this,
One outer outlet body 12 can also be only set, in addition it is also possible to which outer outlet body 12 is unremovably fixed on the main body 11.
Hold, in the present embodiment, for the first accommodation space 21 in main body 11, two the second accommodation spaces 22 distinguish position
In two outer outlet bodies 12.Shown in figure, before position that the side of main body 11 corresponds to two outer outlet bodies 12 is exactly
The partition wall W mentioned, and each partition wall W offers intercommunicating pore 23 respectively (drawing only sees one of intercommunicating pore 23).
In this embodiment, radiating opening 121 is opened in the side away from partition wall W on outer outlet body 12.
Below by Fig. 4 and Fig. 5, main concept of the present utility model is further repeated once.In the present embodiment,
The part of heat energy can be produced by being provided with the grade of electronic building brick 4 in first accommodation space 21 of main body 11, also be provided with other heating groups
The internal set heat radiation fin 5 (such as graphene fin) in the first accommodation space 21 is put in the heat energy release of part.In holding for electronic building brick 4
Under reforwarding is made, and under the sustained release heat energy of internal set heat radiation fin 5, the temperature in the first accommodation space 21 is gradually increasing, and now, is led
The first end of hot component 31, except because being thermally connected to the surface of electronic building brick 4 in a manner of face contacts, and can be rapidly with the leakage of electricity
Caused by sub-component 4 outside heat energy, also because it is stretched in the first accommodation space 21, and accumulation can be taken away in the first accommodating sky
Between heat energy in 21.After heat energy through the heat-conductive assembly 31 in intercommunicating pore 23 by the second accommodation space 22 is led to, one
Divide directly to overflow and be dissipated in the second accommodation space 22, a part is via radiating subassembly 32 hot linked with heat-conductive assembly 31, high efficiency
Ground is released into the second accommodation space 22.Further, since the graphene layer 32B (as shown in Figure 3) of radiating subassembly 32 is faced
The radiating opening 121 on outer outlet body 12 is opened in away from partition wall W, therefore the heat energy discharged by radiating subassembly 32 can be with
It is discharged to readily through radiating opening 121 outside outer outlet body 12.
Refer to again shown in Fig. 4 and Fig. 5, in the present embodiment, outer outlet body 12 is further opened with an adiabatic opening 122, adiabatic
Opening 122 is opened in the position for pressing close to partition wall W on outer outlet body 12, and adiabatic opening 122 is close to partition wall W top.Herein
Special one is mentioned that, one of key concept of the present utility model, is to distinguish the first accommodation space 21 and using partition wall W
Two accommodation spaces 22, the two chambers formed with temperature difference, and heat-conductive assembly 31 is being utilized by the first accommodation space of high temperature
Heat energy in 21, after being directed to the second accommodation space 22 of low temperature, the radiating of the second accommodation space 22 is corresponded to by being arranged on
Opening 121, expeditiously discharges heat energy.Therefore, herein under a concept, the utility model on outer outlet body 12 by opening up absolutely
Heat opening 122, reduce the sectional area that outer outlet body 12 directly contacts main body 11, be avoided that the high temperature accumulated in main body 11 conduct to
Outer outlet body 12, and discharged by outer outlet body 12 and to the second accommodation space 22, cause the temperature of the second accommodation space 22 to rise.Change speech
It, by the adiabatic opening 122 being opened on outer outlet body 12, helps to maintain the first accommodation space 21 and the second accommodation space 22
Between temperature difference, and can aid in and greatly improve the efficiency that heat energy is directed to the second accommodation space 22 by heat-conductive assembly 31.
Furthermore in the utility model embodiment, adiabatic opening 122 is opened in close to the position on partition wall W tops, it helps
In the presence of thermal convection current so that a part of heat energy is discharged from adiabatic opening 122.
Attached this one is mentioned that in this embodiment, main body 11 includes base 11A and upper lid 11B, and upper lid 11B is opened up
There are multiple heat emission hole H.It should be strongly noted that heat emission hole H restrictive condition is must to open up to correspond to the on the main body 11
The position of one accommodation space 21, still, electronic installation D designer can adjust heat emission hole H and are opened in master according to actual demand
Particular location and arrangement on body 11, for example, in order to improve the efficiency via heat emission hole H heat extractions using thermal convection principle,
Heat emission hole H can be opened in the top surface of main body 11 as shown in drawing；, whereas if it is to pursue U.S. of product shape
See, it is also contemplated that heat emission hole H is opened in the bottom surface of main body 11, the position of opening of the utility model schematic diagram is not this patent model
The limitation enclosed.Further, since heat emission hole H is to open up to correspond to the first accommodation space 21 (being provided with electronic building brick 4) on the main body 11
Position, therefore heat emission hole H conditio n of establishment (such as dimension and shape) has to comply with the safety standard condition of Related product.
The beneficial effects of the utility model are, the electronic installation for the tool heat sinking function that the utility model embodiment is provided
D, its can by " electronic building brick 4 is arranged in the first accommodation space 21 ", " housing 1 is in the position corresponding to the second accommodation space 22
Put offer the radiating opening 121 " that externally connects and " the first end position of heat-conductive assembly 31 in the first accommodation space 21, heat conduction
Second end position of component 31 is in the second accommodation space 22 " design, to cause caused heat in the operation of electronic building brick 4
Can, it can be directed to by heat-conductive assembly 31 in second accommodation space 22, and be discharged via the radiating opening 121 on housing 1,
Effectively reduce the overall temperature of electronic installation D.
Content disclosed above is only preferred possible embodiments of the present utility model, not thereby limits to the utility model
Claims protection domain, so every equivalence techniques for being done with the utility model specification and accompanying drawing content becomes
Change, be both contained in the protection domain of claims of the present utility model.
Claims (10)
1. a kind of electronic installation for having heat sinking function, it is characterised in that the electronic installation of the tool heat sinking function includes：
One housing, there is one first accommodation space and one second accommodation space in it, the housing, which has, separates described first
One partition wall of accommodation space and second accommodation space, connection first accommodation space is offered on the partition wall
And an intercommunicating pore of second accommodation space, the housing offer pair in the position corresponding to second accommodation space
An at least radiating opening for outer connection；
One electronic building brick, it is arranged in first accommodation space；And
One heat-conductive assembly, it is located in the intercommunicating pore, and the first end position of the heat-conductive assembly is in first accommodation space
Interior, the second end position of the heat-conductive assembly is in second accommodation space.
2. the electronic installation of tool heat sinking function according to claim 1, it is characterised in that the first end of the heat-conductive assembly
The surface of the electronic building brick is thermally connected in a manner of face contacts.
3. the electronic installation of tool heat sinking function according to claim 1, it is characterised in that the electronic installation also includes one
Radiating subassembly, the radiating subassembly position is in second accommodation space, and the radiating subassembly is thermally connected to the heat conduction group
Second end of part.
4. the electronic installation of tool heat sinking function according to claim 3, it is characterised in that on the surface of the radiating subassembly
With a graphene layer.
5. the electronic installation of tool heat sinking function according to claim 4, it is characterised in that the radiating subassembly is a piece of
Body, the first side of the lamellar body are fixed in the second end of the heat-conductive assembly, the graphene layer be located at the lamellar body and
In the relative second side of first side.
6. it is according to claim 1 tool heat sinking function electronic installation, it is characterised in that the housing include a main body with
And an outer outlet body, first accommodation space are located in the main body, second accommodation space is located in the outer outlet body, institute
State radiating opening and be opened in the side away from the partition wall on the outer outlet body.
7. the electronic installation of tool heat sinking function according to claim 6, it is characterised in that the outer outlet body is further opened with one
Thermal insulation opening, the thermal insulation is opened in the position for pressing close to the partition wall on the outer outlet body, and the adiabatic opening is leaned on
The top of the nearly partition wall.
8. the electronic installation of tool heat sinking function according to claim 6, it is characterised in that the outer outlet body is located at the master
The side of body, and the top surface of the main body or bottom surface offer heat emission hole in the position corresponding to first accommodation space.
9. the electronic installation of tool heat sinking function according to claim 6, it is characterised in that the housing has two outer covers
Body, two outer outlet bodies are located at the both sides of the main body, have described second to house respectively in two outer outlet bodies respectively
Space, and two sides of corresponding two outer outlet bodies of the main body have the partition wall, two partition wall difference respectively
Offer the intercommunicating pore.
10. the electronic installation of the tool heat sinking function according to any one of claim 6 to 9, it is characterised in that the outer outlet body
It is to be detachably assembled onto in the main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721078460.1U CN207151066U (en) | 2017-08-25 | 2017-08-25 | Has the electronic installation of heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721078460.1U CN207151066U (en) | 2017-08-25 | 2017-08-25 | Has the electronic installation of heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207151066U true CN207151066U (en) | 2018-03-27 |
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ID=61670212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721078460.1U Active CN207151066U (en) | 2017-08-25 | 2017-08-25 | Has the electronic installation of heat sinking function |
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| Country | Link |
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| CN (1) | CN207151066U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996620A (en) * | 2019-12-16 | 2020-04-10 | 宇龙计算机通信科技(深圳)有限公司 | Shell and electronic equipment |
-
2017
- 2017-08-25 CN CN201721078460.1U patent/CN207151066U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996620A (en) * | 2019-12-16 | 2020-04-10 | 宇龙计算机通信科技(深圳)有限公司 | Shell and electronic equipment |
| CN110996620B (en) * | 2019-12-16 | 2021-09-17 | 宇龙计算机通信科技(深圳)有限公司 | Shell and electronic equipment |
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