CN207118219U - A kind of radiating subassembly - Google Patents

A kind of radiating subassembly Download PDF

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Publication number
CN207118219U
CN207118219U CN201721146523.2U CN201721146523U CN207118219U CN 207118219 U CN207118219 U CN 207118219U CN 201721146523 U CN201721146523 U CN 201721146523U CN 207118219 U CN207118219 U CN 207118219U
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China
Prior art keywords
fin
pcb
stud
radiating
utility
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Active
Application number
CN201721146523.2U
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Chinese (zh)
Inventor
石瑞
綦振伟
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Taicang T&W Electronics Co Ltd
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Taicang T&W Electronics Co Ltd
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Priority to CN201721146523.2U priority Critical patent/CN207118219U/en
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Publication of CN207118219U publication Critical patent/CN207118219U/en
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Anticipated expiration legal-status Critical

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Abstract

It the utility model is related to a kind of radiating subassembly, treated including being arranged in PCB the top of heat radiation chip and with the fin treated heat radiation chip and abutted against, and it is fixedly installed on the radiating fin above the fin, the fin is fixedly connected with the PCB by some studs, some mounting holes are offered on the bottom wall of the fin, one end of the stud is arranged at by screw thread in corresponding mounting hole, and the other end is welded and fixed with the PCB.The utility model has reliable ground, repeatable the characteristics of utilizing, conveniently dismantling and be cost-effective.

Description

A kind of radiating subassembly
Technical field
It the utility model is related to technical field of heat exchange, more particularly to a kind of radiating subassembly.
Background technology
Fin has application, such as the housed device such as set top box, router in many miniaturized electronics.In fin Material on, because of metal its thermal conductivity factor is high, and intensity is high, and the characteristic such as plasticity height is widely used.But due to the conduction of metal Characteristic, being frequently encountered electromagnetic interference noise can cause product can not be by EMC correlation by metal fin to external radiation Regulation test request.So metal fin usually requires the reliability for considering ground connection and ground connection, " ground connection " here refers to The electrical properties of the reference planes of electronic product.Common earthing mode, which has, is fixed to fin in PCB by screw, Or by the way that fin is welded in PCB.When fin is screwed, need manually by screw means, spiral shell The loosening of silk is easily caused the unreliable of ground connection, not up to standard so as to cause EMC relevant laws and regulations to test;And when metal fin passes through After being welded and fixed, when electronic product needs repairing, it is necessary to melt tin dismounting fin with flatiron, and because the thermal conductivity of metal is fast The characteristics of, flatiron does not melt tin also when dismantling fin, i.e., cooled, so as to cause fin dismounting difficult.
Utility model content
The purpose of this utility model is to be directed to above-mentioned the deficiencies in the prior art, there is provided a kind of radiating subassembly, it is grounded jail Gu and it is readily disassembled when repairing.
To solve the above problems, technical solution adopted in the utility model is:
A kind of radiating subassembly, it is characterised in that:It is arranged in PCB and treats to wait to dissipate above heat radiation chip and with described The fin that hot chip abuts against, and be fixedly installed on the radiating fin above the fin, the fin with it is described PCB is fixedly connected by some studs, offers some mounting holes on the bottom wall of the fin, and the one of the stud End is arranged at by screw thread in corresponding mounting hole, and the other end is welded and fixed with the PCB.
Further technical scheme is that some support columns, the support column are fixedly installed on the fin bottom wall The other end abutted against with the PCB.
Further technical scheme is that the fin is square, and the corner of square radiating plate is provided with 1-2 Mounting hole.
Further technical scheme is that the mounting hole extends to form embedded hole to depths, and the stud is set after extending It is placed in the embedded hole.
It is using beneficial effect caused by above-mentioned technical proposal:The utility model using Stud connection fin with PCB, by screw thread in corresponding mounting hole, the other end welds with the PCB for one end of the stud Fixation is connect, it is achieved thereby that reliable ground, using Stud connection fin and PCB, when disassembly is desired, uses cutting nippers Directly cut stud, dismantle the shaft residued in PCB again afterwards, it is easier to dismantle, when avoiding dismounting by Problem not easy to remove caused by the influence of fin quick heat radiating;The mounting hole extends to form embedded hole to depths, described Stud is arranged in the embedded hole after extending, and the setting of the embedded hole extends the length of stud, is stored in it pre-buried It is standby in hole, after stud is cut, it is thus only necessary to unscrew the stud in embedded hole, the stud length outside embedded hole is reached PCB After length requirement between circuit board and fin, you can the other end of stud is directly welded in PCB, with this reality Now to the recycling of stud, avoid maintenance every time and be required for the stud more renewed;It is fixedly installed on the fin bottom wall There are some support columns, the other end of the support column abuts against with the PCB, and the presence of support column passing through tin During stove wave-soldering, fin will not be caused fin discontinuity and caused fin to tilt due to pushing for welding carrier, So that fin reaches more preferable radiating effect with treating that heat radiation chip fully contacts.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is use state figure of the present utility model.
Fig. 3 is the structural representation of fin in one preferred embodiment of the utility model.
In figure:1st, fin;2nd, radiating fin;3rd, support column;4th, stud;5th, PCB;
6th, heat radiation chip is treated;7th, mounting hole;8th, embedded hole.
Embodiment
Embodiment of the present utility model is described in further detail with reference to the accompanying drawings and examples.Following examples For illustrating the utility model, but can not be used for limiting the scope of the utility model.
A kind of one embodiment of radiating subassembly of the utility model as shown in Figure 1-2, including it is arranged at PCB 5 On treat the top of heat radiation chip 6 and with the fin 1 and be fixedly installed on the fin 1 for treating that heat radiation chip 6 abuts against The radiating fin 2 of top, the fin 1 are fixedly connected with the PCB 5 by some studs 4, the fin 1 Bottom wall on offer some mounting holes 7, one end of the stud 4 is arranged at by screw thread in corresponding mounting hole 7, another End is welded and fixed with the PCB 5.The utility model connects fin 1 and PCB 5, the spiral shell using stud 4 By screw thread in corresponding mounting hole 7, the other end is welded and fixed with the PCB 5 for one end of post 4, so as to real Reliable ground is showed;When fin 1 needs dismounting, stud 4 is directly cut using cutting nippers, PCB is dismantled again after removing fin 1 The nubbin of the upper stud 4 of circuit board 5, it is more convenient for dismantling fin 1, by the quick heat radiating of fin 1 when avoiding dismounting Problem not easy to remove caused by influence.
Further, be fixedly installed some support columns 3 on the bottom wall of fin 1, the other end of the support column 3 with The PCB 5 abuts against, and some support columns 3 are uniformly arranged on the edge of the fin 1, and the presence of support column 3 causes When by tin stove wave-soldering, fin 1 will not be caused the discontinuity of fin 1 and caused scattered due to pushing for welding carrier Backing 1 tilts, so that abundant contact of the fin 1 with treating heat radiation chip 6 reaches more preferable radiating effect.
Further, the fin 1 is square, and the corner of square radiating plate 1 is provided with 1-2 mounting hole 7, institute The outside that stud 4 is arranged at the support column 3 is stated, can conveniently be welded located at outside, and keeps balance, also may be used in dismounting It is more convenient.
According to an a kind of preferred embodiment of radiating subassembly of the present utility model, as shown in figure 3, the mounting hole 7 to Depths extends to form embedded hole 8, and the stud 4 is arranged in the embedded hole 8 after extending.
Further, the length of the embedded hole 8 is more than the spacing between the PCB 5 and the fin 1. The setting of the utility model embedded hole 8 extends the length of stud 4, the stud 4 after extension be stored in it is standby in embedded hole 8, when After cutting stud 4, it is thus only necessary to unscrew the stud 4 in embedded hole 8, you can the other end of stud 4 is directly welded in into PCB circuits On plate 5, the recycling of stud 4 is realized, maintenance every time is avoided and is required for the stud 4 more renewed, in addition, working as embedded hole 8 , can also be by the remaining stud 4 of fin 1 when its curtailment is to be welded in PCB 5 after interior stud 4 unscrews Screw off, the stud 4 more renewed.
Finally it should be noted that:Above example is only to illustrate the technical solution of the utility model, rather than its limitations; Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that: It can still be modified to the technical scheme described in previous embodiment, or which part technical characteristic is equal Replace;And these modifications or replacement, the essence of appropriate technical solution is departed from the utility model embodiment technical scheme Spirit and scope.

Claims (4)

  1. A kind of 1. radiating subassembly, it is characterised in that:The top, simultaneously of heat radiation chip (6) is treated in PCB (5) including being arranged at With the fin (1) treated heat radiation chip (6) and abutted against, and the radiating fin above the fin (1) is fixedly installed on Piece (2), the fin (1) are fixedly connected with the PCB (5) by some studs (4), the fin (1) Some mounting holes (7) are offered on bottom wall, one end of the stud (4) is arranged in corresponding mounting hole (7) by screw thread, The other end is welded and fixed with the PCB (5).
  2. A kind of 2. radiating subassembly according to claim 1, it is characterised in that:It is fixedly installed on fin (1) bottom wall There are some support columns (3), the other end and the PCB (5) of the support column (3) abut against.
  3. A kind of 3. radiating subassembly according to claim 1, it is characterised in that:The fin (1) is square, square radiating The corner of piece (1) is provided with 1-2 mounting hole (7).
  4. A kind of 4. radiating subassembly according to claim 1, it is characterised in that:The mounting hole (7) extends to be formed to depths Embedded hole (8), the stud (4) are arranged at after extending in the embedded hole (8).
CN201721146523.2U 2017-09-08 2017-09-08 A kind of radiating subassembly Active CN207118219U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721146523.2U CN207118219U (en) 2017-09-08 2017-09-08 A kind of radiating subassembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721146523.2U CN207118219U (en) 2017-09-08 2017-09-08 A kind of radiating subassembly

Publications (1)

Publication Number Publication Date
CN207118219U true CN207118219U (en) 2018-03-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721146523.2U Active CN207118219U (en) 2017-09-08 2017-09-08 A kind of radiating subassembly

Country Status (1)

Country Link
CN (1) CN207118219U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109275003A (en) * 2018-11-16 2019-01-25 江苏德联达智能科技有限公司 Multifunctional set top box
WO2019183979A1 (en) * 2018-03-31 2019-10-03 Intel Corporation Cooling system assembly for compute devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019183979A1 (en) * 2018-03-31 2019-10-03 Intel Corporation Cooling system assembly for compute devices
CN109275003A (en) * 2018-11-16 2019-01-25 江苏德联达智能科技有限公司 Multifunctional set top box

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